Uniform flow liquid jet structure for TGV electroplating system and TGV electroplating system

Abstract

The present application relates to the technical field of TGV electroplating process, and particularly relates to a uniform flow liquid spraying structure for a TGV electroplating system and the TGV electroplating system. The uniform flow liquid spraying structure comprises a mounting seat and a uniform flow plate. The uniform flow plate is arranged in a box of the TGV electroplating system through the mounting seat and is arranged correspondingly to a wafer in the box. The uniform flow plate is movably connected to the box through the mounting seat and can reciprocate relative to the wafer. The uniform flow plate comprises a plurality of shunt pipelines. All the shunt pipelines are in communication with an external liquid supply device. A plurality of liquid spraying holes are formed on the pipe wall of each shunt pipeline. All the liquid spraying holes are arranged at intervals along the extension direction of the shunt pipeline. All the liquid spraying holes are arranged on the side of the shunt pipeline facing the wafer, so that the electroplating liquid can be sprayed into the through hole of the wafer through the liquid spraying hole. In this way, the surface electroplating uniformity of the wafer and the high efficiency of the hole electroplating can be simultaneously satisfied. The cost of the modification of the uniform flow liquid spraying structure is low, and the economic benefit is also high.

Description

Technical Field

[0001] This invention relates to the field of TGV electroplating technology, and particularly to a uniform flow spray structure for a TGV electroplating system and a TGV electroplating system. Background Technology

[0002] TGV (Through Glass Via) plating is an advanced technology for forming conductive vias on glass substrates. Specifically, it involves creating vias on the glass substrate and then filling them with a conductive material (such as copper) through electroplating to achieve vertical electrical interconnection. Due to the high aspect ratio of TGV vias, the flow of the plating solution within the via is extremely slow. Copper ions in the plating solution are rapidly consumed within the via and difficult to replenish in time, resulting in a copper deposition rate within the via that much slower than on the wafer surface. This not only reduces production efficiency but also easily leads to voids or incomplete filling within the via, severely impacting product yield.

[0003] Related technologies employ a stirring device within the electroplating tank to enhance the flow of the electroplating solution. This allows for timely replenishment of the electroplating solution within the holes to a certain extent. However, the flow field created after stirring may be unevenly distributed between the wafer edges and the center, resulting in an inability to guarantee the uniformity of the plating surface across the entire wafer. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to overcome the defect that the uniformity of the coating surface of the wafer cannot be guaranteed in the TGV electroplating process of the prior art, and to provide a uniform flow spray structure for TGV electroplating system and TGV electroplating system.

[0005] The present invention solves the above-mentioned technical problems through the following technical solution:

[0006] In a first aspect, the present invention provides a uniform flow spraying structure for a TGV electroplating system, comprising a mounting base and a uniform flow plate. The uniform flow plate is disposed within the housing of the TGV electroplating system via the mounting base and is correspondingly disposed with respect to a wafer within the housing. The uniform flow plate is movably connected to the housing via the mounting base so as to be reciprocally movable relative to the wafer. The uniform flow plate includes a plurality of branch pipes, all of which can be connected to an external liquid supply device. Each branch pipe has a plurality of spray holes on its wall, and all the spray holes are spaced apart along the extension direction of the branch pipes. Furthermore, all the spray holes are disposed on the side of the branch pipes facing the wafer, so that the electroplating solution can be sprayed into the through-hole of the wafer through the spray holes.

[0007] The uniform flow spray structure provided by this invention, by setting a uniform flow plate that can reciprocate relative to the wafer within the TGV electroplating system's housing, not only agitates the electroplating solution within the housing but also creates a stable flow field on the wafer surface. This ensures high uniformity of the electroplating thickness across all locations on the wafer surface, thereby improving the overall electroplating quality. Furthermore, the uniform flow plate includes several distribution pipes with spray holes on their walls facing the wafer. This allows for the generation of directional high-speed jets, directly and effectively injecting the electroplating solution deep into the vias on the wafer. This maintains the electroplating solution concentration within the vias, significantly increasing the deposition rate and effectively solving the problems of low flow rate and poor exchange of the electroplating solution inside the vias. Therefore, it simultaneously satisfies the requirements for uniform surface electroplating and high efficiency of in-hole electroplating. Moreover, the modification cost of the uniform flow spray structure is low, resulting in high economic benefits.

[0008] Preferably, there are multiple flow equalization plates, which are arranged parallel to each other and spaced apart along a first direction; the first direction is perpendicular to the surface of the flow equalization plate. This arrangement can achieve a better flow equalization effect.

[0009] Preferably, the uniform flow spraying structure further includes a driving mechanism, and at least a portion of the uniform flow plate is movably connected to the mounting base via the driving mechanism to reciprocate relative to the wafer.

[0010] This configuration allows for adjustments to the speed or amplitude of the flow uniform plate relative to the wafer, enhancing the flexibility of the flow uniform spray structure. Furthermore, the distance between each flow uniform plate and the wafer can be adjusted via the drive mechanism to regulate the flow field near the wafer, making it more suitable for the electroplating process and further improving the electroplating effect of the flow uniform spray structure on the wafer.

[0011] Preferably, the driving mechanism includes a transmission assembly, which includes a transmission plate and a transmission column. The transmission plate and the flow equalizer are arranged parallel to each other. The transmission column extends along the first direction, and its two ends are respectively connected to the transmission plate and the flow equalizer. The driving mechanism also includes a drive motor, the drive end of which is connected to the transmission plate to drive the transmission plate to reciprocate along the first direction, and to drive the flow equalizer to reciprocate along the first direction via the transmission column.

[0012] This configuration serves two purposes. First, the drive motor facilitates the movement of each flow equalizer plate by controlling the motor through the control system, simplifying operation. Second, the power transmission from the drive motor to the flow equalizer plate via the transmission plate and transmission column ensures smoother movement of the plate, thereby guaranteeing better flow equalization performance.

[0013] Preferably, there are two driving mechanisms, each connected to two adjacent flow equalizers. One of the driving mechanisms has a first through hole on its transmission column, and the flow equalizer connected to the driving mechanism has a second through hole. Both the first and second through holes are arranged through the central axis of the transmission column. The transmission column of the other driving mechanism passes through the first and second through holes in sequence and is movable along the extension direction of the first and second through holes.

[0014] This configuration allows two adjacent flow equalizers to move independently without mutual constraint, and also saves space required for the transmission components.

[0015] Preferably, all the diversion pipes are arranged parallel to each other; and / or, all the diversion pipes extend along the height direction of the flow equalization plate, and all the diversion pipes are evenly distributed along the width direction of the flow equalization plate.

[0016] This setup can further improve the uniformity of the electroplating solution sprayed onto the wafer surface by the flow equalizer.

[0017] Preferably, at least a portion of the spray holes are configured to correspond horizontally with the through holes on the wafer.

[0018] This configuration allows the spray nozzles to more effectively spray plating solution into the through-holes, thereby increasing the replenishment rate of plating solution inside the through-holes and ensuring the plating effect on the through-holes.

[0019] Preferably, the shape of the flow equalizer is used to match the shape of the wafer.

[0020] This setup allows for a better match between the flow field generated by the agitation of the flow equalizer and the wafer, thereby further improving the uniformity of the electroplating solution distribution on the wafer surface and the replenishment speed.

[0021] Preferably, the flow equalization plate further includes a main pipe for connecting to an external liquid supply device; the main pipe extends to form a ring structure, all the branch pipes are arranged inside the ring structure and are spaced apart along the width direction of the ring structure, and both ends of all the branch pipes are connected to the main pipe.

[0022] This configuration allows for the simultaneous injection of electroplating solution into all branch pipes. Compared to connecting each branch pipe to an external liquid supply device separately, this design is simpler and ensures a sufficient liquid supply rate.

[0023] Secondly, the present invention provides a TGV electroplating system, which includes the uniform flow spray structure described above.

[0024] The TGV electroplating system described in this invention has the same beneficial effects as the above-mentioned uniform flow spray structure, and will not be repeated here.

[0025] Preferably, the TGV electroplating system includes a housing and a wafer clamp, and the uniform flow spray structure is located on one side of the wafer clamp and is correspondingly arranged to the wafer clamp.

[0026] Based on common knowledge in the field, the above-mentioned preferred conditions can be combined arbitrarily to obtain various preferred embodiments of the present invention. Attached Figure Description

[0027] Figure 1 This is a front view of a uniform flow spray structure provided in an embodiment of the present invention.

[0028] Figure 2 This is a cross-sectional schematic diagram of a uniform flow spray structure along the AA direction, provided in an embodiment of the present invention.

[0029] Figure 3 for Figure 2 A partial structural diagram of part B.

[0030] Figure 4 This is a rear view of a uniform flow spray structure provided in an embodiment of the present invention.

[0031] Figure 5 This is a top view of a uniform flow spray structure provided in an embodiment of the present invention.

[0032] Figure 6 This is a schematic diagram of the flow equalization plate of a flow equalization spray structure provided in an embodiment of the present invention.

[0033] Figure 7 This is a front view of another uniform flow spray structure provided in an embodiment of the present invention.

[0034] Explanation of reference numerals in the attached figures:

[0035] 1. Mounting base; 2. Flow equalizer; 21. Diversion pipe; 21a. Spray hole; 22. Main pipe; 23. Connecting part; 24. Second through hole; 3. Drive mechanism; 31. Transmission assembly; 311. Transmission plate; 312. Transmission column; 313. First through hole; 32. Drive motor; 4. Fastener; 5. Liquid inlet pipe;

[0036] a. First direction. Detailed Implementation

[0037] The present invention will be further illustrated by way of embodiments below, but the present invention is not limited to the scope of the embodiments described herein.

[0038] As mentioned in the background section, TGV electroplating in related technologies typically employs a stirring device within the plating tank to enhance the flow of the plating solution. This allows for timely replenishment of the plating solution within the holes to a certain extent. However, the flow field formed after stirring may be unevenly distributed between the wafer edges and the center, resulting in an inability to guarantee the uniformity of the plating surface across the entire wafer.

[0039] Based on the above, the applicant of this invention has proposed a technical solution in the embodiments of this application. Specifically, by designing a uniform flow spray structure for a TGV electroplating system, the electroplating solution can be distributed more evenly on the wafer surface, and the electroplating solution can be replenished into the through holes on the wafer in a timely manner, thereby further improving the electroplating effect.

[0040] The above is the core idea of ​​this invention. The technical solutions in the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0041] like Figures 1-7 As shown, this embodiment of the invention provides a uniform flow spray structure for a TGV electroplating system, which includes a mounting base and a uniform flow plate. The uniform flow plate is used to be installed in the housing of the TGV electroplating system via the mounting base and is correspondingly arranged with respect to the wafers in the housing.

[0042] Specifically, the TGV electroplating system's housing is used to hold wafers. Wafer clamps can be installed inside the housing to position the wafers within a predetermined orientation. For example, in this embodiment, the wafers are placed vertically inside the housing. Therefore, the aforementioned flow equalizer is correspondingly positioned to the wafers inside the housing; it can be understood that when the wafers are placed vertically, the flow equalizer is also placed vertically. Furthermore, in other embodiments, when the wafers are placed in other orientations (e.g., horizontally), the flow equalizer corresponds to another orientation parallel to the wafers. Further, the flow equalizer is mounted inside the housing via a mounting base; that is, the flow equalizer is mounted on the mounting base, and its position relative to the housing is fixed by connecting the mounting base to the housing. For example, the connection between the mounting base and the housing can be achieved through bolting or snap-fitting, or any other method that allows for relative fixation. Additionally, the mounting base can be connected to the housing wall or the top cover of the housing, depending on design requirements.

[0043] Based on the above, the flow equalization plate of the uniform flow spray structure is used to be movably connected to the housing via a mounting base so that it can reciprocate relative to the wafer.

[0044] Specifically, the flow equalizer can reciprocate relative to the wafer via the mounting base. In other words, the flow equalizer and the mounting base, or the flow equalizer and the housing via the mounting base, are in a movable connection state, allowing the flow equalizer to reciprocate relative to the wafer. This means that the flow equalizer can agitate the electroplating solution at the corresponding position on the wafer surface. As a result, a certain flow field is generated in the electroplating solution at the wafer surface. This flow field can form a uniform and stable flow state on the wafer surface, thereby not only ensuring that the electroplating solution at the wafer surface position is replaced and replenished in a timely manner, but also ensuring the uniformity of the flow of the electroplating solution at various positions on the wafer surface, thus ensuring the uniformity of electroplating on the wafer surface.

[0045] Furthermore, the flow equalization plate includes several flow distribution pipes, all of which can be connected to an external liquid supply device. Several spray holes are opened on the pipe wall of each flow distribution pipe. All spray holes are arranged at intervals along the extension direction of the flow distribution pipe. In addition, all spray holes are located on the side of the flow distribution pipe facing the wafer, so that the electroplating solution can be sprayed into the through hole of the wafer through the spray holes.

[0046] All the distribution pipes can be connected to an external liquid supply device, and each distribution pipe has several spray holes on the side facing the wafer. This design allows the electroplating solution to enter all the distribution pipes and be sprayed onto the wafer surface through the spray holes. Since there are several through holes on the wafer surface, spraying the electroplating solution onto the wafer surface through the spray holes creates an enhanced local jet in certain areas of the surface. This allows the electroplating solution to be specifically replenished into the through holes. This not only ensures sufficient electroplating solution supply inside the through holes, guaranteeing the integrity of the electroplating inside the through holes, but also increases the electroplating rate inside the holes, solving the problem of slow deposition inside the holes.

[0047] In summary, the uniform flow spray structure provided in this embodiment of the invention, by setting a uniform flow plate and enabling the uniform flow plate to reciprocate relative to the wafer within the TGV electroplating system chamber, not only agitates the electroplating solution within the chamber but also forms a stable flow field on the wafer surface. This ensures that the electroplating thickness remains highly uniform across all locations on the wafer surface, thereby improving the overall electroplating quality of the wafer surface. Furthermore, the uniform flow plate includes several distribution pipes, and the pipe walls of these distribution pipes have several spray holes facing the wafer. This allows for the generation of directional high-speed jets through the spray holes, directly and effectively injecting the electroplating solution deep into the vias on the wafer. This maintains the concentration of the electroplating solution within the vias, significantly increasing the deposition rate within the vias and effectively solving the problems of low flow rate and poor exchange of the electroplating solution inside the vias. Therefore, the uniform flow spray structure provided in this embodiment of the invention can simultaneously satisfy the requirements of uniform surface electroplating on the wafer and high efficiency of electroplating within the vias. Moreover, the modification cost of the uniform flow spray structure is low, resulting in high economic benefits.

[0048] Furthermore, to improve the electroplating effect of the uniform flow spray structure on the wafer, in some embodiments, the number of uniform flow plates can be set to multiple, arranged parallel to each other and spaced apart along a first direction. The first direction is perpendicular to the surface of the uniform flow plate; for example, when both the uniform flow plate and the wafer are placed vertically, the first direction is horizontal. This arrangement achieves a better uniform flow effect.

[0049] In practice, the gaps between multiple flow equalizers can be set according to actual needs. For example, each pair of adjacent flow equalizers forms an installation gap. In one specific implementation, for two adjacent installation gaps, the width of the installation gap farther from the wafer is twice the width of the installation gap closer to the wafer.

[0050] In other words, the mounting gap gradually decreases along the direction closer to the wafer. This increases the constant flow component in the flow field and reduces turbulence, thus making it more conducive to the jet entering the vias on the wafer surface. It should be noted that the width of the mounting gap refers to the width along the thickness direction of the wafer and the flow uniform plate.

[0051] In this embodiment, three flow equalizers are used as an example for illustration. Of course, in other embodiments, the number of flow equalizers can be set to other numbers, as long as the flow equalizers are parallel and spaced apart.

[0052] Furthermore, in some embodiments, the uniform flow spraying structure also includes a driving mechanism, with at least a portion of the uniform flow plates movably connected to the mounting base via the driving mechanism to reciprocate relative to the wafer. In other words, the uniform flow plates reciprocate relative to the wafer via the driving mechanism. This configuration facilitates adjustments to the speed or amplitude of the uniform flow plates' movement relative to the wafer, enhancing the flexibility of the uniform flow spraying structure. Furthermore, the driving mechanism allows for adjustment of the distance between each uniform flow plate and the wafer, thereby adjusting the flow field near the wafer to better suit the electroplating conditions and further improve the electroplating effect of the uniform flow spraying structure on the wafer.

[0053] This embodiment uses the example of two of the three flow equalizers being connected to the mounting base via a drive mechanism. In other embodiments, all flow equalizers may be movably connected to the mounting base via a drive mechanism, or only one flow equalizer may be movably connected to the mounting base via a drive mechanism; the specific configuration can be adjusted according to the actual situation.

[0054] Please see details. Figure 2 As shown. Of the three flow equalizers, the two flow equalizers furthest from the wafer are movably connected to the mounting base via a drive mechanism. The flow equalizer closest to the wafer can be fixedly connected to the mounting base to maintain a fixed position relative to the wafer.

[0055] Regarding how the flow equalizer is movably connected relative to the mounting base via a drive mechanism, in one possible embodiment, the drive mechanism includes a transmission assembly comprising a transmission plate and a transmission column. The transmission plate and the flow equalizer are arranged parallel to each other, the transmission column extends along a first direction, and both ends of the transmission column are respectively connected to the transmission plate and the flow equalizer.

[0056] Based on this, the drive mechanism also includes a drive motor, the drive end of which is connected to the transmission plate to drive the transmission plate to reciprocate along the first direction, and to drive the flow equalization plate to reciprocate along the first direction through the transmission column.

[0057] For details, please refer to Figure 1 and Figure 4As shown, the drive motor can be installed on the top of the mounting base. Its drive end can convert the rotation drive into the lateral movement of the lead screw through a rotating lead screw structure. The lead screw is further connected to the transmission plate, thereby driving the transmission plate and the transmission column to reciprocate along the first direction.

[0058] This configuration serves two purposes. First, the drive motor facilitates the movement of each flow equalizer plate by controlling the motor through the control system, simplifying operation. Second, the power transmission from the drive motor to the flow equalizer plate via the transmission plate and transmission column ensures smoother movement of the plate, thereby guaranteeing better flow equalization performance.

[0059] In practice, multiple transmission columns can be set, and these multiple rotating columns can be evenly distributed along the circumference of the transmission plate or the height direction of the flow equalizer to achieve a smoother transmission effect.

[0060] Of course, in other feasible ways, the drive mechanism can also adopt other transmission methods. In specific implementation, the type of drive mechanism can be adaptively adjusted according to the setting requirements.

[0061] When at least two flow equalizers are movably connected to the mounting base via a drive mechanism, the number of drive mechanisms can be set to at least two, so that each flow equalizer can be connected to the mounting base via one drive mechanism. In this embodiment, the example is described with two drive mechanisms, each connected to two adjacent flow equalizers to make the two adjacent flow equalizers movable. For details, please refer to [link to relevant documentation]. Figure 2 and Figure 3 As shown.

[0062] Furthermore, a first through hole is provided on the transmission column of one of the driving mechanisms, and a second through hole is provided on the flow equalization plate connected to one of the driving mechanisms. Both the first and second through holes are arranged to pass through the central axis of the transmission column. The transmission column of the other driving mechanism passes through the first and second through holes in sequence and is movable along the extension direction of the first and second through holes.

[0063] This configuration allows two adjacent flow equalizers to move independently without mutual constraint, and also saves space required for the transmission components.

[0064] Of course, in other embodiments, more than two flow equalizers can also be moved by a drive mechanism. The specific configuration of the drive mechanism can be adapted according to the actual situation.

[0065] like Figure 2 and Figure 6As shown, in some embodiments, the flow equalization plate also includes a main pipe, the extension shape of which is a ring structure. All the branch pipes are arranged inside the ring structure formed by the main pipe and are spaced apart along the width direction of the ring structure. Furthermore, both ends of all the branch pipes are connected to the main pipe.

[0066] In other words, all the branch pipes are connected to the main pipe. In this way, by introducing electroplating solution into the main pipe, the electroplating solution can flow into each branch pipe separately. This allows for the simultaneous injection of electroplating solution into all branch pipes with a relatively simple structure. Compared to connecting each branch pipe to an external liquid supply device separately, the structure is simpler and can also ensure a sufficient liquid supply rate.

[0067] In practice, the extension shape of the main pipeline can be rectangular; please refer to [link / reference needed]. Figure 1 As shown. The left and right sides of the rectangle extend vertically, and the top and bottom sides extend horizontally. Correspondingly, all branch pipes extend vertically. Furthermore, as... Figure 7 As shown, in another possible implementation, the extension shape of the main pipe can be set to a circle, with all branch pipes extending vertically inside the circle.

[0068] Of course, in other embodiments, the main pipe can be extended to form other shapes, as long as the main pipe is connected to all branch pipes and the electroplating solution can flow evenly into each branch pipe through the main pipe.

[0069] like Figure 3 As shown, for example, for the flow equalization plate near the wafer side, a connecting part can also be provided on the circumferential outer side of the main channel. The flow equalization plate and the mounting base can be connected and fixed by mating along the thickness direction through the connecting part and by connecting members. In specific implementation, holes can be made at corresponding positions on the flow equalization plate and the mounting base, and fasteners can be inserted into the holes on both to achieve mutual connection.

[0070] Based on the above, when setting up the distribution pipes, all distribution pipes can be evenly distributed on the inner side of the circle and symmetrically arranged along the center line of the main pipe. This can further improve the liquid supply speed and the balance of the amount of electroplating solution in each distribution pipe.

[0071] like Figure 1 As shown, based on the above, the flow equalization plate is also equipped with a liquid inlet pipe, the two ends of which are connected to an external liquid supply device and a main pipe, respectively, so as to supply liquid into the main pipe.

[0072] For the setting of diversion pipes, such as Figure 1 and Figure 6As shown, in some embodiments, all the diversion channels can be arranged parallel to each other and extend along the height direction of the flow equalizer, and all the diversion channels are evenly distributed along the width direction of the flow equalizer. This arrangement not only further improves the uniformity of the electroplating solution sprayed onto the wafer surface by the flow equalizer, but also further improves the stirring effect and uniformity of the electroplating solution by the flow equalizer. Of course, in other embodiments, the diversion channels can simply be arranged in a parallel manner, or simply extended along the height direction, both of which can improve the spraying effect on the wafer to a certain extent.

[0073] For example, the diameter of the spray nozzle can be set to 0.1mm-0.5mm, which can form a miniature nozzle. This allows the electroplating solution in the distribution pipe to be transformed into a high-speed, concentrated micro-jet under pressure, which can be quickly sprayed onto the wafer surface to quickly replenish the electroplating solution on the wafer surface and improve the electroplating effect on the through-hole.

[0074] Furthermore, the spacing between two adjacent spray nozzles can be set to 0.5mm-2mm. This further prevents the electroplating solution sprayed from adjacent nozzles from interfering with each other and generating eddies or turbulence that are detrimental to the formation of a uniform flow field for the electroplating solution.

[0075] Furthermore, in one feasible approach, at least some of the spray holes can be arranged to correspond horizontally with the vias on the wafer, thereby enabling targeted spraying of the plating solution into the vias and further improving the replenishment rate of the plating solution inside the vias, ensuring the plating effect on the vias.

[0076] Furthermore, in one feasible approach, the shape of the flow uniform plate can be matched with the shape of the wafer. This allows for a better match between the flow field generated by the flow uniform plate and the wafer, thereby further improving the uniformity of the electroplating solution distribution on the wafer surface and the replenishment rate.

[0077] In response to the aforementioned uniform flow spraying structure, this embodiment also provides a TGV electroplating system, which includes a housing and the aforementioned uniform flow spraying structure, wherein the uniform flow spraying structure is disposed inside the housing via a mounting base. The uniform flow spraying structure has already been described in detail in the above embodiments and will not be repeated here.

[0078] In some embodiments, the TGV electroplating system further includes a wafer clamp, which is also disposed inside the housing, and a uniform flow spray structure is disposed on one side of the wafer clamp and corresponds to the wafer clamp.

[0079] Specifically, the wafer jig has wafer clamping positions formed on it, for example, by an adjustable-size slot structure on the jig, where the edge of the wafer can be clamped in the slot to fix the wafer inside the housing. Alternatively, in one implementation, a vacuum chuck can be provided on the wafer jig to adsorb the wafer onto the jig, thereby keeping the wafer structurally fixed.

[0080] Correspondingly, the uniform flow spray structure corresponds to the wafer clamp, specifically to the wafer clamping position on the wafer clamp, so that in the final state, the uniform flow plate 1 and the wafer can be set parallel to each other.

[0081] It should be noted that the TGV electroplating system provided in this embodiment should also include other modules or components that enable the TGV electroplating system to operate normally. Here, the other modules or components included in the TGV electroplating system provided in this embodiment will not be described one by one.

[0082] The TGV electroplating system provided in this embodiment achieves better electroplating results by employing the uniform flow spray structure device described above.

[0083] While specific embodiments of the present invention have been described above, those skilled in the art should understand that these are merely illustrative examples, and the scope of protection of the present invention is defined by the appended claims. Those skilled in the art can make various changes or modifications to these embodiments without departing from the principles and essence of the present invention, but all such changes and modifications fall within the scope of protection of the present invention.

Claims

1. A uniform flow spray structure for a TGV electroplating system, characterized in that, It includes a mounting base and a flow equalizer, wherein the flow equalizer is used to be mounted in the housing of the TGV electroplating system via the mounting base and is configured to correspond to the wafers in the housing; The flow equalization plate is movably connected to the housing via the mounting base so that it can reciprocate relative to the wafer; The flow equalization plate includes several flow distribution pipes, all of which can be connected to an external liquid supply device. Each flow distribution pipe has several spray holes on its wall. All the spray holes are spaced apart along the extension direction of the flow distribution pipe. Furthermore, all the spray holes are located on the side of the flow distribution pipe facing the wafer, so that the electroplating solution can be sprayed into the through hole of the wafer through the spray holes.

2. The uniform flow spray structure as described in claim 1, characterized in that, The number of flow equalization plates is multiple, and the multiple flow equalization plates are arranged in parallel to each other and spaced apart along the first direction; The first direction is perpendicular to the surface of the flow equalization plate.

3. The uniform flow spray structure as described in claim 2, characterized in that, The uniform flow spraying structure also includes a driving mechanism, and at least a portion of the uniform flow plate is movably connected to the mounting base through the driving mechanism to reciprocate relative to the wafer.

4. The uniform flow spray structure as described in claim 3, characterized in that, The driving mechanism includes a transmission assembly, which includes a transmission plate and a transmission column. The transmission plate and the flow equalization plate are arranged parallel to each other. The transmission column extends along the first direction, and both ends of the transmission column are respectively connected to the transmission plate and the flow equalization plate. The driving mechanism further includes a drive motor, the drive end of which is connected to the transmission plate to drive the transmission plate to reciprocate along the first direction, and to drive the flow equalization plate to reciprocate along the first direction via the transmission column.

5. The uniform flow spray structure as described in claim 4, characterized in that, The number of driving mechanisms is two, and the two driving mechanisms are respectively connected to two adjacent flow equalizers; Furthermore, a first through hole is provided on the transmission column of one of the driving mechanisms, and a second through hole is provided on the flow equalization plate connected to one of the driving mechanisms. Both the first through hole and the second through hole are arranged to pass through the central axis of the transmission column. The transmission column of the other driving mechanism passes through the first through hole and the second through hole in sequence, and is movable along the extension direction of the first through hole and the second through hole.

6. The uniform flow spray structure as described in any one of claims 1-5, characterized in that, All the aforementioned branch pipes are arranged parallel to each other; and / or, All the diversion pipes extend along the height direction of the flow equalization plate, and all the diversion pipes are evenly distributed along the width direction of the flow equalization plate.

7. The uniform flow spray structure as described in claim 1, characterized in that, At least a portion of the spray holes are configured to correspond horizontally with the through holes on the wafer; And / or, the shape of the flow equalizer is used to match the shape of the wafer.

8. The uniform flow spray structure as described in any one of claims 1-5, characterized in that, The flow equalizer also includes a main pipe, which is used to connect to an external liquid supply device; The main pipeline extends to form a ring structure, and all the branch pipes are arranged inside the ring structure and are spaced apart along the width direction of the ring structure. Furthermore, both ends of all the branch pipes are connected to the main pipeline.

9. A TGV electroplating system, characterized in that, Includes the uniform flow spray structure as described in any one of claims 1-8.

10. The TGV electroplating system as described in claim 9, characterized in that, The TGV electroplating system includes a housing and a wafer clamp. The uniform flow spray structure is located on one side of the wafer clamp and is correspondingly arranged to the wafer clamp. The number of flow equalization plates is multiple, and the multiple flow equalization plates are arranged in parallel to each other and spaced apart along the first direction. Furthermore, an installation gap is formed between each pair of adjacent flow equalization plates. For two adjacent mounting gaps, the width of the mounting gap furthest from the wafer clamp is twice the width of the mounting gap closest to the wafer clamp.

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