A solid-state refrigeration device and a solid-state refrigeration system based on torsional elastic card effect

Abstract

The application discloses a solid-state refrigeration device and a solid-state refrigeration system based on a torsional elastic card effect, which comprise a frame, a refrigeration unit and a torsion unit; the refrigeration unit is fixed to the frame, the refrigeration unit comprises a shape memory alloy and a heat exchange pipeline, the shape memory alloy is arranged in the heat exchange pipeline in a length direction of the heat exchange pipeline, a second end of the shape memory alloy is fixedly connected with the heat exchange pipeline, and a first end of the shape memory alloy is arranged to pass through the heat exchange pipeline; the heat exchange pipeline is used for receiving and outputting a heat exchange medium; the torsion unit is fixed to the frame, the torsion unit comprises a first clamping piece and a driving piece, the first clamping piece clamps and fixes the first end, and the driving piece drives the first clamping piece to rotate relative to the frame so as to drive the shape memory alloy to twist around an axis of the shape memory alloy; the shape memory alloy is twisted by the driving piece and the first clamping piece, a heat absorption and release of the shape memory alloy is quickly realized, and the refrigeration efficiency of the shape memory alloy is greatly improved.

Description

Technical Field

[0001] This invention relates to the field of solid-state refrigeration technology, and in particular to a solid-state refrigeration device and system based on the torsional elliptic effect. Background Technology

[0002] Traditional vapor compression refrigeration technology relies heavily on refrigerants such as Freon, which are generally characterized by high greenhouse gas emission potential and high energy consumption. Solid-state refrigeration technology, however, has become a research hotspot due to its zero-carbon emissions and high energy efficiency. Among these technologies, refrigeration based on the shape memory alloy spring-loaded effect is considered a highly promising development direction.

[0003] However, existing spring-loaded cooling technologies are mostly focused on the stretching drive mode of shape memory alloys. These technologies suffer from drawbacks such as short material fatigue life, large hysteresis loss, and high driving force requirements. Furthermore, in the existing stretching drive mode, the drive structure needs to occupy a large amount of space in the length direction, and the drive structure is relatively complex, making it difficult to simultaneously drive the stretching of multiple shape memory alloys, which in turn leads to low cooling efficiency. Summary of the Invention

[0004] The purpose of this invention is to overcome the above-mentioned technical deficiencies and propose a solid-state refrigeration device based on the torsional spring effect, which solves the technical problems of complex drive structure, high drive force requirement and low refrigeration efficiency in the prior art.

[0005] To achieve the above-mentioned technical objectives, the present invention adopts the following technical solution: In a first aspect, the present invention provides a solid-state refrigeration device based on the torsional spring effect, comprising a frame, a refrigeration unit and a torsional unit; The refrigeration unit is fixedly mounted on the frame. The refrigeration unit includes a shape memory alloy and a heat exchange pipe. The shape memory alloy extends along the length of the heat exchange pipe and is disposed within the heat exchange pipe. A second end of the shape memory alloy is fixedly connected to the heat exchange pipe, and a first end of the shape memory alloy protrudes from the heat exchange pipe. The heat exchange pipe is used to receive and output the heat exchange medium. The torsion unit is fixedly disposed on the frame. The torsion unit includes a first clamping member and a driving member. The first clamping member is used to clamp and fix the first end. The driving member is used to drive the first clamping member to rotate relative to the frame so as to drive the shape memory alloy to torsion about its axis.

[0006] In some embodiments, the heat exchange pipe is provided with an inlet connector and an outlet connector at both ends, the inlet connector being used to input the heat exchange medium into the heat exchange pipe, and the outlet connector being used to output the heat exchange medium.

[0007] In some embodiments, the frame includes a second mounting base, a first mounting base, and a column, wherein the column is fixedly disposed between the second mounting base and the first mounting base to limit the relative position of the second mounting base and the first mounting base; The refrigeration unit is fixedly disposed between the second mounting base and the first mounting base; the torsion unit is fixedly disposed on the side of the first mounting base away from the refrigeration unit.

[0008] In some embodiments, multiple cooling units are provided, and multiple first clamping members are provided corresponding to the cooling units.

[0009] In some embodiments, the plurality of cooling units are arranged circumferentially and evenly.

[0010] In some embodiments, the driving component includes a servo motor, a driving component, and a driven gear, with multiple driven gears corresponding to the refrigeration unit; the servo motor is fixedly mounted on the frame, the servo motor drives and connects to the driving component, the driving component meshes with the driven gear, and the driven gear is fixedly connected to the first clamping component.

[0011] In some embodiments, a plurality of the refrigeration units are arranged in parallel.

[0012] In some embodiments, the first clamping member includes a first clamping block and a second clamping block disposed opposite to each other, a clamping gap being provided between the first clamping block and the second clamping block to clamp and fix the first end; a locking bolt is provided between the first clamping block and the second clamping block.

[0013] In some embodiments, the torsion unit includes a second clamping member disposed on the side of the heat exchange pipe away from the first clamping member. The second clamping member is fixedly disposed on the frame and is used to clamp and fix the second end protruding from the heat exchange pipe. Secondly, the present invention also provides a solid-state refrigeration system based on the torsional spring effect, including the solid-state refrigeration device based on the torsional spring effect described above, a pump body, and a functional unit and a control unit, wherein the pump body is connected to the heat exchange pipe to input a heat exchange medium into the heat exchange pipe. The functional unit includes a cooling device and a heat dissipation device. The cooling device connects the solid-state cooling device based on the torsional spring effect to the pump body. The heat dissipation device connects the solid-state cooling device based on the torsional spring effect to the pump body. The control unit includes a control board, a temperature sensor, and a controllable three-way valve. The temperature sensor is installed in the heat exchange pipe to detect the temperature of the heat exchange medium output from the heat exchange pipe. The controllable three-way valve is connected to the refrigeration device, the heat dissipation device, and the solid-state refrigeration device based on the torsional spring effect. The control board is electrically connected to the temperature sensor, the controllable three-way valve, the drive component, and the pump body. The control board is used to receive the temperature signal from the temperature sensor and control the conduction state of the controllable three-way valve and the movement state of the drive component.

[0014] Compared with the prior art, the solid-state refrigeration device based on the torsional spring effect provided by the present invention can quickly realize the heat absorption and release of shape memory alloy by torsion of the shape memory alloy in a smaller space and with a smaller driving force through the cooperation of the driving component and the first clamping component, thereby greatly improving the refrigeration efficiency of the shape memory alloy. Attached Figure Description

[0015] Figure 1 This is a perspective view of a solid-state refrigeration device based on the torsional elastic-car effect provided in an embodiment of the present invention; Figure 2 This is a cross-sectional view of a solid-state refrigeration device based on the torsional elastic effect provided in an embodiment of the present invention; Figure 3 This is a top view of the drive component of the solid-state refrigeration device based on the torsional spring-loaded effect provided in an embodiment of the present invention; Figure 4 This is a perspective view of the first clamping component of the solid-state refrigeration device based on the torsional spring-loaded effect provided in an embodiment of the present invention; Figure 5 This is a simplified structural diagram of a solid-state refrigeration system based on the torsional spring effect provided in an embodiment of the present invention.

[0016] Figure labeling: 100, Solid-state refrigeration device based on torsional elastic effect; 1. Frame; 11. First mounting base; 12. Second mounting base; 13. Column; 2. Refrigeration unit; 21. Shape memory alloy; 211. First end; 212. Second end; 22. Heat exchange pipe; 221. Water inlet connector; 222. Water outlet connector; 3. Torsion unit; 31. First clamping component; 311. First clamping block; 312. Second clamping block; 313. Locking bolt; 32. Driving component; 321. Servo motor; 322. Driving component; 323. Driven gear; 33. Second clamping component; 200. Pump body; 300. Functional components; 301. Refrigeration unit; 302. Heat dissipation unit; 400. Control unit; 401. Control board; 402. Temperature sensor; 403. Controllable three-way valve. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. Obviously, the described embodiments are only some, not all, of the embodiments described in this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0018] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used in the description of this application is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms "comprising" and "having," and any variations thereof, in the description, claims, and accompanying drawings of this application are intended to cover non-exclusive inclusion. The terms "second," "first," etc., in the description, claims, or accompanying drawings of this application are used to distinguish different objects, and not to describe a particular order, hierarchy, or importance of components.

[0019] It should be noted that, unless otherwise specified, the use of terms such as "upper," "lower," "left," "right," "center," "inner," and "outer" to indicate orientation or positional relationships in the description of specific embodiments of the present invention is based on the orientation or positional relationships shown in the accompanying drawings, or the orientation or positional relationship in which the product / equipment / device is typically placed during use. These terms are merely for the purpose of facilitating the description of the present invention or simplifying the description in specific embodiments, enabling those skilled in the art to quickly understand the solution, and do not indicate or imply that a specific device / component / element must have a specific orientation, or be constructed and operated in a specific positional relationship. Therefore, they should not be construed as limitations on the present invention. Furthermore, the use of terms such as "horizontal," "vertical," and "suspended" does not imply that the corresponding device / component / element must be absolutely horizontal, vertical, or suspended, but rather that it can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," not that the structure must be completely horizontal, but can be slightly tilted. Alternatively, it can be simplified to mean that the corresponding device / component / element, positioned in a specific orientation such as "horizontal," "vertical," or "suspended," can have an error / deviation of ±10% relative to that orientation, more preferably within ±8%, more preferably within ±6%, more preferably within ±5%, and more preferably within ±4%. As long as the corresponding device / component / element is within the error / deviation range, it can still fulfill its function in the present invention.

[0020] In this application, the reference to "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a mutually exclusive, independent, or alternative embodiment. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described in this application can be combined with other embodiments.

[0021] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "attachment" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0022] In this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, in this application, the character " / " generally indicates that the preceding and following related objects have an "or" relationship.

[0023] To address the technical problems of complex drive structures and low cooling efficiency, this invention provides a solid-state cooling device based on the torsional spring effect, which can achieve efficient cooling in a smaller space and with less driving force.

[0024] It should be noted that the solid-state refrigeration device based on the torsional elliptic effect described in this invention is used for, but not limited to, indoor refrigeration. For ease of explanation, this invention will only use the application of the solid-state refrigeration device based on the torsional elliptic effect in indoor refrigeration as an example. The principle of the solid-state refrigeration device based on the torsional elliptic effect in other types of refrigeration or heating schemes is essentially the same as that in indoor refrigeration, and will not be described in detail here.

[0025] Please see Figure 1 , Figure 1 This is a schematic diagram of a solid-state refrigeration device based on the torsional spring effect in one embodiment of the present invention, wherein the solid-state refrigeration device 100 based on the torsional spring effect includes a frame 1, a refrigeration unit 2 and a torsional unit 3.

[0026] The refrigeration unit 2 is fixedly installed on the frame 1. The refrigeration unit 2 includes a shape memory alloy 21 and a heat exchange pipe 22. The shape memory alloy 21 extends along the length of the heat exchange pipe 22 and is installed inside the heat exchange pipe 22. The second end 212 of the shape memory alloy 21 is fixedly connected to the heat exchange pipe 22, and the first end 211 of the shape memory alloy 21 extends out of the heat exchange pipe 22. The heat exchange pipe 22 is used to receive and output the heat exchange medium.

[0027] The torsion unit 3 is fixedly mounted on the frame 1. The torsion unit 3 includes a first clamping member 31 and a driving member 32. The first clamping member 31 is used to clamp and fix the first end 211, and the driving member 32 is used to drive the first clamping member 31 to rotate relative to the frame 1 so as to drive the shape memory alloy 21 to torsion around its axis.

[0028] In this embodiment, when the shape memory alloy 21 is twisted, it releases a large amount of latent heat. When the external driving force is removed, the shape memory alloy 21 unwinds and absorbs a large amount of heat, thus achieving cooling. The shape memory alloy 21 is disposed within the heat exchange pipe 22, allowing it to fully contact the heat exchange medium. This enables it to absorb heat from the heat exchange medium more quickly when cooling is needed, thereby rapidly reducing the temperature of the heat exchange medium and achieving cooling. Compared to the stretching drive mode in traditional devices, cooling is achieved simply by twisting the shape memory alloy 21 to change its state. During this process, the shape memory alloy 21 does not change in the length direction, which reduces the required operating space of the drive structure and greatly improves the space utilization of the drive component 32. This allows the solid-state cooling device 100 based on the torsional spring effect to be suitable for more confined environments. Furthermore, in the traditional stretching drive mode, when the clamping member holds the shape memory alloy 21 and stretches it along its length, if the pulling force is too large or the number of uses is too many, the end of the shape memory alloy 21 is prone to detaching from the clamping state, as well as material fatigue. This makes the working state of the traditional solid-state refrigeration device 100 based on the torsional spring effect extremely unstable and difficult to adapt to harsher working environments. In this embodiment, the shape memory alloy 21 is driven to twist by the first clamping member 31. Since the force applied to the shape memory alloy 21 is perpendicular to the clamping surface, the force is not only more reasonable, but the end of the shape memory alloy 21 is also less likely to detach. When inspecting and replacing the shape memory alloy 21, only the size of the clamping gap of the first clamping member 31 needs to be adjusted to quickly complete the inspection and replacement. At the same time, the shape memory alloy 21 also has a longer material fatigue life and lower hysteresis loss.

[0029] Furthermore, in this embodiment, the first end 211 of the shape memory alloy 21 extends through the heat exchange pipe 22 and is clamped and fixed by the first clamping member 31. Compared with the scheme where the shape memory alloy 21 is completely enclosed in the heat exchange pipe 22 and then the shape memory alloy 21 is rotated by the rotation of the end base of the heat exchange pipe 22, the sealing surface to be processed in this embodiment is smaller, the overall structure is simpler, the processing and manufacturing cost is lower, and the use is more stable and reliable. The first end 211 of the shape memory alloy 21 is directly clamped and fixed by the first clamping member 31 and driven to rotate, and it is less likely to slip or the rotation angle will deviate. The rotation process and unrotation process of the shape memory alloy 21 are more accurate and reliable.

[0030] It should also be noted that in this embodiment, the shape memory alloy 21 is preferably made of nickel-titanium alloy. In other embodiments, other materials of shape memory alloy 21 can also be used, as long as they have the spring-loaded effect. When nickel-titanium alloy is used, the inner diameter of the heat exchange pipe 22 is 1.2 to 1.5 times the diameter of the shape memory alloy 21. Under this size ratio, the shape memory alloy 21 has the highest efficiency in absorbing heat from the heat exchange medium when it unwinds. If the size of the heat exchange pipe 22 is too large, the temperature of the heat exchange medium will be difficult to drop to the expected value quickly. If the size of the heat exchange pipe 22 is too small, the heat absorption efficiency of the shape memory alloy 21 will easily decrease, making it difficult to fully utilize the heat absorption capacity of the spring-loaded effect when the shape memory alloy 21 unwinds.

[0031] In one embodiment, please refer to Figure 1 and Figure 2 The heat exchange pipe 22 is provided with an inlet connector 221 and an outlet connector 222 at both ends. The inlet connector 221 is used to input the heat exchange medium into the heat exchange pipe 22, and the outlet connector 222 is used to output the heat exchange medium.

[0032] In this embodiment, the two ends of the heat exchange pipe 22 are fixedly connected to the frame 1 through the inlet connector 221 and the outlet connector 222. The inlet connector 221 and the outlet connector 222 are respectively provided with inlet and outlet for outputting and inputting heat exchange medium. In this embodiment, both the inlet connector 221 and the outlet connector 222 adopt T-type tee connectors. In addition to the inlet / outlet and the interface connected to the heat exchange pipe 22, the connector is also provided with an interface for the end of the shape memory alloy 21 to pass through. This part of the interface can be designed according to the size of the shape memory alloy 21 and in conjunction with the frame 1 to specifically set the sealing groove, sealing ring or sealing protrusion and other structures. The design and processing of the entire sealing structure is simpler and more reliable, the sealing effect is more stable and reliable, and it is also easy to inspect and replace the shape memory alloy 21.

[0033] It is understandable that the inlet of the water inlet interface is connected to an external structure such as the pump body 200 or a chamber for storing heat exchange medium through a pipe, while the outlet of the water outlet connector 222 is connected to a heat dissipation component or a cooling component through a pipe. This part is described in the system section below and will not be repeated here.

[0034] In one embodiment, please refer to Figure 1 The frame 1 includes a second mounting base 12, a first mounting base 11, and a column 13. The column 13 is fixedly disposed between the second mounting base 12 and the first mounting base 11 to limit the relative position of the second mounting base 12 and the first mounting base 11. A cooling unit 2 is fixedly disposed between the second mounting base 12 and the first mounting base 11; a torsion unit 3 is fixedly disposed on the side of the first mounting base 11 away from the cooling unit 2.

[0035] In this embodiment, the frame 1 is divided into upper and lower parts. The second mounting base 12 and the first mounting base 11 are used to install the water inlet connector 221 and the water outlet connector 222, respectively, thereby limiting and fixing the heat exchange pipe 22. Multiple columns 13 are provided to limit the relative position of the second mounting base 12 and the first mounting base 11, thereby providing an installation foundation for the heat exchange pipe 22, ensuring the stability and reliability of the position of the heat exchange pipe 22, and thus improving the stability of the entire solid-state refrigeration device 100 based on the torsional spring effect.

[0036] In one embodiment, please refer to Figure 1 Multiple cooling units 2 are provided, and multiple first clamping members 31 are provided corresponding to the cooling units 2.

[0037] In this embodiment, the driving component 32 drives multiple first clamping components 31 to rotate synchronously, thereby synchronously driving the shape memory alloys 21 in multiple refrigeration units 2 to twist, so as to release a large amount of heat. When de-twisting, the multiple shape memory alloys 21 can absorb a large amount of heat in a short time when they de-twisted synchronously, thereby greatly improving the refrigeration efficiency of the entire solid-state refrigeration device 100 based on the torsional spring effect.

[0038] In one specific embodiment, five cooling units 2 and five first clamping members 31 are provided. In other embodiments, the number of cooling units 2 and the number of first clamping members 31 can be increased or decreased according to cooling needs to adapt to different working environments and requirements.

[0039] In one embodiment, please refer to Figure 1 Multiple refrigeration units are evenly arranged in two directions.

[0040] In this embodiment, multiple refrigeration units 2 are arranged in a circular pattern. This structure can reduce the space occupied by the entire solid-state refrigeration device 100 based on the torsional spring effect while ensuring a large heat exchange medium flow rate, thereby enabling the solid-state refrigeration device 100 based on the torsional spring effect to maintain higher refrigeration efficiency in a smaller space.

[0041] Of course, in other embodiments, due to the different installation environments of the solid-state refrigeration device 100 based on the torsional spring effect, multiple refrigeration units 2 can also be arranged linearly in sequence, so that the solid-state refrigeration device 100 based on the torsional spring effect can be used in narrow installation environments.

[0042] In one embodiment, please refer to Figures 1 to 3The driving component 32 includes a servo motor 321, a driving component 322, and a driven gear 323. Multiple driven gears 323 are provided for the cooling unit 2. The servo motor 321 is fixedly mounted on the frame 1. The servo motor 321 drives and connects to the driving component 322. The driving component 322 meshes with the driven gear 323. The driven gear 323 is fixedly connected to the first clamping component 31.

[0043] In this embodiment, the servo motor 321 is mounted on the side of the first mounting base 11 away from the heat exchange pipe 22 via a motor mount. The output shaft of the servo motor 321 is connected to the driving member 322, driving the driving member 322 to rotate. The driving member 322 then synchronously drives multiple driven gears 323 to rotate, thereby driving the first clamping member 31 and the shape memory alloy 21 to rotate. This achieves synchronous torsion and de-torsion of the multiple shape memory alloys 21, ultimately improving the cooling efficiency. In a specific embodiment, five driven gears and five cooling units are arranged circumferentially. When it is necessary to further improve the cooling efficiency, the number of driven gears 323 can be increased, thereby increasing the number of cooling units 2 and realizing the modular expansion of the cooling units 2. The driven gears 323 are mounted on the first mounting base 11 via bearings.

[0044] It should be further explained that the driving element 322 can be either a gear structure or a rack structure. Depending on the requirements, when multiple cooling units 2 are arranged circumferentially, the driving element 322 adopts a gear structure of the driving wheel. In this case, multiple driven gears 323 are evenly distributed around the central axis of the driving wheel. The servo motor 321 drives the driving wheel to rotate, thereby synchronously driving the multiple driven gears 323 and the first clamping member 31 to rotate, realizing the synchronous torsion of multiple shape memory alloys 21. However, when facing a narrow installation and usage environment, multiple cooling units 2 need to be arranged linearly. In this case, the driving element 322 can be a driving rack. By setting a groove on the first mounting base 11 to limit the movement direction of the driving rack, the servo motor 321 drives the rack to reciprocate along its length direction, thereby synchronously driving the multiple driven gears 323 to rotate forward and reverse, thereby realizing the torsion and de-torsion of the shape memory alloys 21.

[0045] It should be understood that, depending on the requirements, the drive unit 32 may also include a reducer, a power supply, and a power control board 401, etc., which will not be described in detail here.

[0046] In one embodiment, please refer to Figure 1 Multiple refrigeration units 2 are connected in parallel.

[0047] In this embodiment, the heat exchange pipes 22 in multiple refrigeration units 2 are arranged in parallel. The inlets of all heat exchange pipes 22 inlet joints 221 are connected to a unified external water inlet pipe, and the outlets of all heat exchange pipes 22 outlet joints 222 are connected to a unified external water outlet pipe. The heat exchange medium is input into multiple heat exchange pipes 22 simultaneously, and multiple shape memory alloys 21 are twisted and untwisted simultaneously, so that a large amount of low-temperature heat exchange medium after heat absorption can be output at the same time, ultimately achieving an increase in refrigeration power.

[0048] In one embodiment, please refer to Figure 4 The first clamping member 31 includes a second clamping block 312 and a first clamping block 311 disposed opposite to each other. A clamping gap is provided between the second clamping block 312 and the first clamping block 311 to clamp and fix the first end 211. A locking bolt 313 is provided between the second clamping block 312 and the first clamping block 311.

[0049] In this embodiment, the first clamping member 31 is disposed on the first mounting base 11 and rotatably connected to the first mounting base 11. The first clamping member 31 can rotate relative to the first mounting base 11 under the drive of the driven gear 323, thereby realizing the torsion and de-torsion of the shape memory alloy 21. The first clamping member 31 adopts a split cylindrical clamping structure, wherein the second clamping block 312 and the first clamping block 311 are two semi-circular blocks arranged opposite each other. This structure facilitates the rotation of the first clamping member 31 relative to the first mounting base 11. In addition, the relative distance between the second clamping block 312 and the first clamping block 311 can be adjusted by the locking bolt 313, thereby adjusting the size of the clamping gap, so as to be suitable for clamping shape memory alloys 21 of different sizes. At the same time, it can also adjust the magnitude of the clamping force on the first end 211 of the shape memory alloy 21. Especially when the structure becomes loose and unstable after long-term use, the clamping state of the shape memory alloy 21 can be quickly adjusted by the locking bolt 313 to quickly complete maintenance, thereby improving the service life of the entire equipment.

[0050] It is understandable that a seal is provided between the first clamping member 31 and the first mounting base 11 to prevent leakage of the heat exchange medium.

[0051] In one embodiment, please refer to Figure 4 The torsion unit 3 includes a second clamping member 33, which is disposed on the side of the heat exchange pipe 22 away from the first clamping member 31. The second clamping member 33 is fixedly disposed on the frame 1 and is used to clamp and fix the second end 212 that protrudes from the heat exchange pipe 22.

[0052] In this embodiment, the second end 212 of the shape memory alloy 21 also extends through the top of the heat exchange pipe 22 and is clamped and fixed by the second clamping member 33. The structure of the second clamping member 33 is the same as that of the first clamping member 31, and the second clamping member 33 is fixed on the side of the second mounting base 12 facing the heat exchange pipe 22. By clamping and fixing the second end 212 of the shape memory alloy 21 by the second clamping member 33, and cooperating with the first clamping member 31 to drive the shape memory alloy 21 to rotate, the twisting and untwisting of the shape memory alloy 21 can be realized.

[0053] It is clear that the second clamping member 33 is fixedly set on the second mounting base 12 and clamps the second end 212 of the shape memory alloy 21. Compared with the structure that fixes the second end 212 of the shape memory alloy 21 inside the heat exchange pipe 22, it is simpler and cheaper in terms of manufacturing difficulty and cost, and easier to inspect and replace. When the shape memory alloy 21 has a problem, it is only necessary to release the second clamping member 33 and the first clamping member 31 at the same time to pull out the shape memory alloy 21 from the heat exchange pipe 22 and replace it, without having to replace the entire refrigeration unit 2. Subsequent inspection and maintenance are also simpler and the maintenance cost is lower.

[0054] In addition, please see Figure 5 The present invention also provides a solid-state refrigeration system based on the torsional spring effect, which includes the solid-state refrigeration device 100 based on the torsional spring effect described above, as well as a pump body 200, a functional unit 300 and a control unit 400. The pump body 200 is connected to a heat exchange pipe 22 to input a heat exchange medium into the heat exchange pipe 22. The functional unit 300 includes a cooling device 301 and a heat dissipation device 302. The cooling device 301 is connected to the solid-state cooling device 100 based on the torsional spring effect and the pump body 200; the heat dissipation device 302 is connected to the solid-state cooling device 100 based on the torsional spring effect and the pump body 200. The control unit 400 includes a control board 401, a temperature sensor 402, and a controllable three-way valve 403. The temperature sensor 402 is installed in the heat exchange pipe 22 to detect the temperature of the heat exchange medium output from the heat exchange pipe 22. The controllable three-way valve 403 is connected to the refrigeration device 301, the heat dissipation device 302, and the solid-state refrigeration device 100 based on the torsional spring effect. The control board 401 is electrically connected to the temperature sensor 402, the controllable three-way valve 403, the drive unit 32, and the pump body 200. The control board 401 is used to receive the temperature signal from the temperature sensor 402 and control the conduction state of the controllable three-way valve 403 and the movement state of the drive unit 32.

[0055] In this process, the pump body 200 synchronously delivers heat exchange medium to multiple heat exchange pipes 22 in the solid-state refrigeration device 100 based on the torsional elastic effect through pipelines. Then, depending on whether the shape memory alloy 21 is in the torsion process or the de-torsion process, the heat exchange medium absorbs or releases heat in the heat exchange pipes 22 to form high-temperature heat exchange medium and low-temperature heat exchange medium, which are then output to the functional unit 300. According to the different output heat exchange medium, the controllable three-way valve 403 adjusts its conduction state to deliver the high-temperature heat exchange medium to the heat dissipation device 302 and the low-temperature heat exchange medium to the refrigeration device 301, thereby realizing refrigeration or heating. Temperature sensor 402 is installed between the solid-state refrigeration device 100 based on the torsional spring effect and the functional unit 300. Specifically, it can be installed at the outlet of the water outlet joint 222 of the heat exchange pipe 22, so as to accurately detect the temperature of the heat exchange medium output by the solid-state refrigeration device 100 based on the torsional spring effect. Then, the control board 401 collects the temperature signal of temperature sensor 402 and controls the running state of servo motor 321 in drive unit 32 and the conduction state of controllable three-way valve 403 in sequence, so as to achieve stable cooling and heating.

[0056] In one specific embodiment, the control board 401 is equipped with a closed-loop automation control system developed based on LabVIEW. In other embodiments, other algorithm systems can be used to achieve closed-loop control, which will not be described in detail here.

[0057] It is understandable that, depending on the requirements, the solid-state refrigeration system based on the torsional spring effect may also include a storage compartment for storing heat exchange structures and connected to the pump body 200 and the functional unit 300.

[0058] To better understand this invention, the following is combined with... Figures 1 to 5 The technical solution of the present invention will be described in detail below: Specifically, the technical solution of the present invention includes two alternating working stages: a torsion heating stage and a detorsion cooling stage. In the torsion heating stage, the servo motor 321 drives the driven gear 323 and the first clamping member 31 to rotate rapidly through the active member 322, thereby driving the shape memory alloy 21 to rotate rapidly, inducing the shape memory alloy 21 to undergo a martensitic phase transformation and release heat. At this time, the heat exchange medium pumped into the heat exchange pipe 22 by the pump body 200 absorbs heat and forms a high-temperature heat exchange medium. When the temperature sensor 402 detects that the temperature of the high-temperature heat exchange medium reaches the set heat release peak threshold, the control board 401 sends a control signal to the controllable three-way valve 403 and adjusts the conduction state of the controllable three-way valve 403 to the heat dissipation state. At this time, the high-temperature heat exchange medium is transported to the heat dissipation device 302 for heat dissipation. This part of the heat can be directly dissipated or used for some equipment or structures that need heating. The heat exchange medium after heat dissipation flows back to the pump body 200 or the storage bin for reuse. During the unwinding and cooling phase, as the temperature of the heat exchange medium decreases, when the temperature sensor 402 detects that the temperature of the heat exchange medium has fallen back to the set threshold, the control board 401 controls the servo motor 321 to reverse, thereby driving the driven gear 323 and the first clamping member 31 to reverse, which in turn drives the shape memory alloy 21 to unwind, inducing the shape memory alloy 21 to absorb heat through reverse phase change. At this time, the energy of the heat exchange medium pumped into the heat exchange pipe 22 by the pump body 200 is absorbed and forms a low-temperature heat exchange medium. When the temperature sensor 402 detects that the temperature of the low-temperature heat exchange medium reaches the set cooling threshold, the control board 401 sends a control signal to the controllable three-way valve 403 and adjusts the conduction state of the controllable three-way valve 403 to the cooling state. At this time, the low-temperature heat exchange medium is transported to the cooling device 301 for cooling. Then, when the temperature of the heat exchange medium rises back to the initial temperature, a complete cycle is completed.

[0059] It is understood that the high-temperature heat exchange medium in the technical solution of this invention is only used to distinguish it from the low-temperature heat exchange medium, and does not limit its specific temperature.

[0060] The above description is merely a preferred embodiment of the present invention and does not constitute a limitation on the scope of protection of the present invention. Any other corresponding changes and modifications made in accordance with the technical concept of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A solid-state refrigeration device based on the torsional elastic-carbide effect, characterized in that, include: frame; A refrigeration unit, fixedly mounted on the frame, includes a shape memory alloy and a heat exchange pipe. The shape memory alloy extends along the length of the heat exchange pipe and is disposed within it. A second end of the shape memory alloy is fixedly connected to the heat exchange pipe, and a first end of the shape memory alloy protrudes from the heat exchange pipe. The heat exchange pipe is used to receive and output the heat exchange medium. A torsion unit is fixedly disposed on the frame. The torsion unit includes a first clamping member and a driving member. The first clamping member is used to clamp and fix the first end, and the driving member is used to drive the first clamping member to rotate relative to the frame so as to cause the shape memory alloy to torsion about its axis.

2. The solid-state refrigeration device based on the torsional elastic effect according to claim 1, characterized in that, The heat exchange pipe is provided with an inlet connector and an outlet connector at both ends. The inlet connector is used to input the heat exchange medium into the heat exchange pipe, and the outlet connector is used to output the heat exchange medium.

3. The solid-state refrigeration device based on the torsional elastic effect according to claim 1, characterized in that, The frame includes a second mounting base, a first mounting base, and a column. The column is fixedly disposed between the second mounting base and the first mounting base to limit the relative position of the second mounting base and the first mounting base. The refrigeration unit is fixedly disposed between the second mounting base and the first mounting base; the torsion unit is fixedly disposed on the side of the first mounting base away from the refrigeration unit.

4. The solid-state refrigeration device based on the torsional elastic effect according to claim 1, characterized in that, The cooling unit is provided in multiple ways, and the first clamping member is provided in multiple ways corresponding to the cooling unit.

5. The solid-state refrigeration device based on the torsional elastic-carrying effect according to claim 4, characterized in that, The multiple refrigeration units are evenly arranged circumferentially.

6. The solid-state refrigeration device based on the torsional elastic-carrying effect according to claim 5, characterized in that, The driving component includes a servo motor, a driving component, and a driven gear. Multiple driven gears are provided corresponding to the refrigeration unit. The servo motor is fixedly mounted on the frame and drives the driving component. The driving component meshes with the driven gear, and the driven gear is fixedly connected to the first clamping component.

7. The solid-state refrigeration device based on the torsional elastic-carrying effect according to claim 4, characterized in that, Multiple refrigeration units are connected in parallel.

8. The solid-state refrigeration device based on the torsional elastic-carrying effect according to claim 1, characterized in that, The first clamping member includes a first clamping block and a second clamping block disposed opposite to each other, and a clamping gap is provided between the first clamping block and the second clamping block to clamp and fix the first end; a locking bolt is provided between the first clamping block and the second clamping block.

9. The solid-state refrigeration device based on the torsional elastic-carrying effect according to claim 1, characterized in that, The torsion unit includes a second clamping member, which is disposed on the side of the heat exchange pipe away from the first clamping member. The second clamping member is fixedly disposed on the frame and is used to clamp and fix the second end that protrudes from the heat exchange pipe.

10. A solid-state refrigeration system based on the torsional elastic-carrier effect, characterized in that, The solid-state refrigeration device based on the torsional elastic effect as described in any one of claims 1-9 further includes: A pump body connected to the heat exchange pipe to input a heat exchange medium into the heat exchange pipe; The functional unit includes a cooling device and a heat dissipation device. The cooling device is connected to the solid-state cooling device based on the torsional spring effect and the pump body. The control unit includes a control board, a temperature sensor, and a controllable three-way valve. The temperature sensor is installed in the heat exchange pipe to detect the temperature of the heat exchange medium output from the heat exchange pipe. The controllable three-way valve is connected to the refrigeration device, the heat dissipation device, and the solid-state refrigeration device based on the torsional spring effect. The control board is electrically connected to the temperature sensor, the controllable three-way valve, the drive component, and the pump body. The control board receives the temperature signal from the temperature sensor and controls the conduction state of the controllable three-way valve and the movement state of the drive component.

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