Uniform temperature plate capillary lap joint structure

Abstract

The application provides a kind of capillary lap joint structure of uniform temperature plate, including a upper plate, a lower plate, a first capillary structure, a second capillary structure;The upper plate has a first side and a second side;The lower plate has a third side and a fourth side, the third side protrudes a boss to the fourth side, and a groove is formed at the third side, the groove has a bottom side, the bottom side around extends a slope to connect the third side, the upper and lower plate body corresponds to cover and forms a gas-tight chamber and is filled with working liquid;The first capillary structure has a first body on the third side surface of the aforementioned lower plate, the first body extends a first extension to the slope;The second capillary structure has a second body around extending to form a second extension, the second body is arranged on the bottom side surface of the groove, and the second extension is arranged on the surface of the aforementioned slope, the first and second extensions are arranged on the slope, thereby increasing the capillary force and vapor flow space.

Description

Technical Field

[0001] This invention relates to a capillary overlap structure for a heat exchanger, and more particularly to a capillary overlap structure for a heat exchanger that can increase the capillary force between capillary structures and increase the flow space of vapor within the heat exchanger. Background Technology

[0002] A vapor chamber is a common heat-conducting element that provides rapid heat conduction through the principle of two-phase flow. The vapor chamber contains a working fluid (water, refrigerant, methanol, acetone, liquid ammonia, etc.), and the outer shell is often made of copper or stainless steel. Because the working fluid inside undergoes a phase change latent heat mechanism for heat conduction, its conductivity reaches 10,000℃ / W. Its superconducting ability has been widely used in industries such as electronics, aerospace, military, and petrochemicals.

[0003] like Figure 1 As shown, the heat spreader consists of upper and lower plates A1 and A2 that overlap each other to form an airtight chamber for gas-liquid circulation. In addition, to accommodate heat sources of different heights or to increase the water content space inside the chamber, a protrusion A structure is provided on the side in contact with the heat source. A capillary structure C is provided on the surface of the side of the protrusion A corresponding to the airtight chamber B. In addition to providing more water content to the protrusion A part to prevent dry burning, the protrusion A structure can also be used to directly attach lower heat sources.

[0004] The temperature distribution plate with a boss A structure has a groove D corresponding to the airtight chamber. Since the boss A is the main part that comes into contact with the heat source, some manufacturers have set a thicker capillary structure C in the groove D on the inner side of the boss A to prevent the boss A from dry burning due to high temperature. This increases the water content of the part and avoids dry burning.

[0005] The vapor chamber plate is mainly for vertical heat conduction. When the liquid working fluid is heated, it evaporates and diffuses upwards. After condensing on the upper surface of the airtight chamber, it drips back to the capillary structure on the lower side by gravity to circulate again. Some manufacturers do not set capillary structures on the inclined part of the groove D connecting the plate body. Therefore, the capillary structure at the lower plate is not connected to the capillary structure C in the groove D. As a result, the returned liquid working fluid can only drip down by gravity and just land on the capillary structure C in the groove D. This can still easily cause insufficient liquid working fluid in the groove D and dry burning.

[0006] To address the aforementioned shortcomings, some manufacturers extend the capillary structure E of the lower plate A2 into the inclined surface of the groove D, making it contact the capillary structure C installed in the groove D. This connects the two capillary structures C and E, allowing for the horizontal transfer of liquid working fluid into the groove D. However, this design results in only slight contact between the two capillary structures C and E, leading to poor transfer efficiency. Other manufacturers extend the capillary structure C in the groove D to the capillary structure E on the surface of the lower plate A2, and combine them by overlapping. While this provides better capillary force than the previous method of slight contact, it thickens the capillary structure E on the surface of the lower plate A2. When the capillary structure E on the surface of the lower plate A2 becomes thicker, it reduces the volume ratio of the airtight chamber, decreasing the space originally provided for vapor diffusion. This creates resistance, reducing the efficiency of vapor diffusion and also reducing the two-phase vapor-liquid circulation efficiency inside the heat exchanger.

[0007] Therefore, the primary goal is to improve the horizontal water return capacity inside the temperature distribution plate while also providing sufficient steam diffusion space. Summary of the Invention

[0008] Therefore, in order to effectively solve the above problems, the main objective of this invention is to provide a capillary overlap structure for a heat spreader that can improve the horizontal water return efficiency inside the heat spreader and maintain the space of the steam diffusion channel to prevent impedance.

[0009] To achieve the above objectives, the present invention provides a heat spreader capillary overlap structure, comprising an upper plate, a lower plate, a first capillary structure, and a second capillary structure.

[0010] The upper plate has a first side and a second side; the lower plate has a third side and a fourth side, the third side protruding from the fourth side with a boss and forming a groove on the third side, the groove having a bottom side, and an upwardly extending inclined surface around the bottom side connecting to the third side, the upper and lower plates correspondingly covering each other to form an airtight chamber filled with a working fluid; the first capillary structure has a first body disposed on the third side surface of the aforementioned lower plate, the first body extending towards the inclined surface with a first extension portion; the second capillary structure has a second body extending around it to form a second extension portion, the second body being disposed on the bottom side surface of the groove, the second extension portion being disposed on the surface of the aforementioned inclined surface, the first and second extension portions overlapping each other at the inclined surface to form an overlapping portion.

[0011] The inclined surface has a first section, a second section, and a third section. The second section connects to the first and third sections at both ends. The first section connects to the third side surface of the lower plate. The third section connects to the bottom side of the groove. The first and second capillary structures are selected at the second or third section to form the overlapping part.

[0012] The thickness of the overlapping portion is greater than that of the other unoverlapping portions of the first and second capillary structures.

[0013] The first and second capillary structures can be any one of sintered powder, woven mesh, grid body, and fiber body, and the first and second capillary structures can be capillary structures with the same or different properties.

[0014] The second side of the upper plate and the third side of the lower plate are respectively covered to form an airtight chamber.

[0015] The present invention provides a method for transferring capillary force by overlapping two capillary structures on the inclined surface of a groove without reducing the vapor diffusion space of the airtight chamber. Attached Figure Description

[0016] Figure 1 This is a cross-sectional view of an existing heat exchanger structure.

[0017] Figure 2 This is a detailed anatomical view of the first embodiment of the heat exchanger capillary overlap structure of the present invention;

[0018] Figure 3 This is a combined cross-sectional view of the first embodiment of the heat exchanger capillary overlap structure of the present invention.

[0019] Explanation of reference numerals in the attached drawings: Upper plate 1; First side 11; Second side 12; Lower plate 2; Third side 21; Groove 211; Bottom side 2111; Inclined surface 2112; First section 2112a; Second section 2112b; Third section 2112c; Fourth side 22; Airtight chamber 23; Boss 24; First capillary structure 3; First body 31; First extension 32; Overlapping part 33; Second capillary structure 4; Second body 41; Second extension 42; Working fluid 5. Detailed Implementation

[0020] The above-mentioned objectives of the present invention and its structural and functional characteristics will be described with reference to the preferred embodiments shown in the accompanying drawings.

[0021] Please see Figure 2 , Figure 3 As shown, these are respectively a sectional view and a combined sectional view of the capillary overlap structure of the heat exchange plate of the present invention. As shown in the figure, the present invention provides a capillary overlap structure of a heat exchange plate, comprising: an upper plate 1, a lower plate 2, a first capillary structure 3, and a second capillary structure 4.

[0022] The upper plate 1 has a first side 11 and a second side 12, which are respectively disposed on the upper and lower sides of the upper plate 1; the lower plate 2 has a third side 21 and a fourth side 22, which are respectively disposed on the upper and lower sides of the lower plate 2. The third side 21 protrudes a boss 24 towards the fourth side 22 and forms a groove 211 at the third side 21. The groove 211 has a bottom side 2111, which is formed by the recess of the third side 21 towards the fourth side 22. A slope 2112 extends upward around the bottom side 2111 to connect with the third side 21. The upper and lower plates 1 and 2 are respectively covered to form an airtight chamber 23 and filled with a working fluid 5.

[0023] The inclined surface 2112 has a first section 2112a, a second section 2112b, and a third section 2112c. The second section 2112b connects the first and third sections 2112a and 2112c at both ends. The first section 2112a connects to the third side 21 surface of the lower plate 2. The third section 2112c connects to the bottom side 2111 of the groove 211. The upper and lower plates 1 and 2 are made of copper, aluminum, stainless steel, titanium alloy, or other thermally conductive materials.

[0024] The first capillary structure 3 has a first body 31 disposed on the third side 21 surface of the aforementioned lower plate 2, and the first body 31 extends toward the inclined surface 2112 and is provided with a first extension portion 32 disposed on the surface of the aforementioned inclined surface 2112. The second capillary structure 4 has a second body 41, which extends to form a second extension 42. The second body 41 is disposed on the bottom side 2111 surface of the groove 211, and the second extension 42 is disposed on the surface of the aforementioned inclined surface 2112. The first and second extensions 32 and 42 are overlapped at the inclined surface 2112 to form an overlap 33. The first and second capillary structures 3 and 4 are selected to form the overlap 33 at the second section 2112b or the third section 2112c of the inclined surface 2112. In this way, the thickness of the first and second capillary structures 3 and 4 after overlap is only formed in the space inside the groove 211 and will not affect other spaces in the airtight chamber 23 inside the heat spreader, thereby keeping the vapor diffusion space in the airtight chamber 23 smooth and unobstructed.

[0025] Furthermore, when the overlapping portion 33 formed by the overlapping of the first and second extensions 32 and 42 is provided at the inclined surface 2112, the gravity provided by the inclined surface 2112 can accelerate the return of the liquid working fluid to the second body 41 of the second capillary structure 4. In addition to not creating a diffusion channel that hinders vapor evaporation, the overlapping portion at the inclined surface 2112 can significantly increase the thickness of the capillary structure and increase its water-holding capacity.

[0026] As current vapor chamber structures are designed to be thinner, the height of the internal airtight chamber is also reduced considerably. In this limited height, at least one capillary structure must be installed. Therefore, if the two capillary structures are joined by overlapping, the space available for vapor diffusion in the airtight chamber will be compressed. Therefore, this invention places the overlapping part of the two capillary structures on the inclined surface. This not only prevents the overlapping capillary structure from blocking the diffusion path of the vaporized working fluid, but also allows the liquid working fluid to quickly flow back to the bottom of the groove for continued circulation through gravity.

[0027] The present invention has been described in detail above, but the above description is only a preferred embodiment of the present invention and should not be construed as limiting the scope of the present invention. All equivalent changes and modifications made based on the present invention should still fall within the patent coverage of the present invention.

Claims

1. A capillary overlap structure for a heat spreader, characterized in that, Include: The upper plate has a first side and a second side; The lower plate has a third side and a fourth side. A boss protrudes from the third side to the fourth side and a groove is formed on the third side. The groove has a bottom side and an inclined surface extends upward from the bottom side to connect to the third side. The upper plate and the lower plate are correspondingly closed to form an airtight chamber and are filled with a working fluid. A first capillary structure having a first body disposed on the third side surface of the aforementioned lower plate, the first body extending toward the inclined surface with a first extension portion; and A second capillary structure having a second body, with a second extension extending around the second body, the second body being disposed on the bottom side surface of the groove, the second extension being disposed on the surface of the aforementioned inclined surface, and the first extension and the second extension being overlapped at the inclined surface to form an overlap portion.

2. The capillary overlap structure of the heat spreader as described in claim 1, characterized in that, The inclined surface has a first section, a second section, and a third section. The second section connects the first and third sections at both ends. The first section connects to the third side surface of the lower plate, and the third section connects to the bottom side of the groove. The first capillary structure and the second capillary structure form the overlapping part at the second or third section.

3. The capillary overlap structure of the heat spreader as described in claim 1, characterized in that, The thickness of the overlapping portion is greater than the non-overlapping portions of the first capillary structure and the second capillary structure.

4. The capillary overlap structure of the heat spreader as described in claim 1, characterized in that, The first capillary structure and the second capillary structure are any one of sintered powder, woven mesh, grid body, and fiber body, and the first capillary structure and the second capillary structure are capillary structures with the same or different properties.

5. The capillary overlap structure of the heat spreader as described in claim 1, characterized in that, The second side of the upper plate and the third side of the lower plate are fitted together to form an airtight chamber.

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