半导体设备外壳涂层的结合强度无损检测方法
By setting an acoustic coupling medium on the surface of the coating of a semiconductor device housing and using pulsed laser shock to generate acoustic signals, and calculating the change in reflection coefficient, the problem of non-destructive and rapid detection of coating bonding strength in existing technologies is solved, achieving non-destructive, rapid, and accurate detection results.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- BEIJING HAOHAI JIAYE MASCH TECH CO LTD
- Filing Date
- 2026-04-29
- Publication Date
- 2026-07-17
AI Technical Summary
Existing destructive testing methods cannot meet the requirements for piece-by-piece, non-destructive, and rapid testing of the bonding strength of semiconductor device casing coatings, as they pose a risk of missed detections and are cumbersome to operate.
An acoustic coupling medium is placed on the surface of the coating of a semiconductor device housing, and an acoustic signal is generated by pulsed laser shock. The first echo signal and the second echo signal are collected to calculate the acoustic pressure reflection coefficient and its change. The bonding strength between the coating and the substrate is determined by combining the average value of the calculated reflection coefficient change.
It enables non-destructive, rapid, and reliable testing of the bonding strength of the coating on the finished product casing. The test results are consistent with those of destructive methods, eliminating the risk of missed detections and meeting the high-throughput requirements of semiconductor production lines.
Smart Images
Figure QLYQS_11