Fault location method, monitoring device, and program product

Abstract

The application discloses a fault positioning method, a monitoring device and a program product, and relates to the technical field of fault detection. The method comprises the following steps: in the case that a fault occurs in a high-voltage loop, a first time when a first monitoring device detects a fault signal is acquired, and a second time when a second monitoring device detects the fault signal is acquired; based on the difference between the first time and the second time, a detection time difference of the fault signal detected by the first monitoring device and the second monitoring device is determined; based on the detection time difference and test signal transmission parameters corresponding to at least part of local cables in the high-voltage loop, position information of a fault point generating the fault signal in the high-voltage loop is determined; wherein the test signal transmission parameters comprise at least two of the following: transmission time, transmission speed and length information of the test signal on the local cable. According to the embodiment of the application, the fault positioning in the high-voltage loop can be accurately realized.

Description

Technical Field

[0001] This application belongs to the field of fault detection technology, and in particular relates to a fault location method, monitoring equipment and program product. Background Technology

[0002] In the field of scanning electron microscopy (SEM), the normal operation of the electron gun and the entire instrument cluster relies on a stable high-voltage power supply. This high-voltage power supply not only provides the high voltage required to accelerate the electron beam but also provides the necessary electrical energy for the entire instrument cluster's operation. Furthermore, the performance of the chamber and its components, such as vacuum level and pressure resistance, plays a crucial role in the final image quality. Therefore, the stability of the high-voltage power supply and the performance of the chamber and its components are of paramount importance to the final image quality.

[0003] Currently, in the performance measurement of individual power supply equipment, a paper feed analyzer is typically used for fault detection. The paper feed analyzer can provide a preliminary assessment of whether the system has insulation degradation or leakage. After the entire machine is assembled, the current monitoring function built into the high-voltage power supply is used for further fault detection to check for insulation degradation or leakage.

[0004] However, these detection methods have a fundamental flaw: they cannot pinpoint the location of the fault. Whether it's the paper feeder or the power supply's built-in monitoring, they can only inform operators that the system has insulation degradation or leakage, but they cannot determine where the fault is occurring. This brings enormous difficulties to troubleshooting and repair, not only easily leading to prolonged downtime but also increasing the risk of equipment damage, seriously affecting the normal operation of the equipment and production efficiency. Summary of the Invention

[0005] This application provides a fault location method, monitoring equipment, and program product, which can accurately locate faults in high-voltage circuits, thereby effectively improving the overall fault diagnosis and maintenance efficiency.

[0006] In a first aspect, embodiments of this application provide a fault location method, wherein a first monitoring device and a second monitoring device are provided in the high-voltage circuit from the high-voltage power supply to the load, the first monitoring device being located at the output terminal of the high-voltage power supply and the second monitoring device being located at the input terminal of the load; the fault location method includes: In the event of a fault in the high-voltage circuit, the first moment when the first monitoring device detects the fault signal and the second moment when the second monitoring device detects the fault signal are acquired. Based on the difference between the first time point and the second time point, the detection time difference between the first monitoring device and the second monitoring device detecting the fault signal is determined respectively; Based on the detection time difference and the test signal transmission parameters corresponding to at least some local cables in the high-voltage circuit, the location information of the fault point that generates the fault signal is determined from the high-voltage circuit. The test signal transmission parameters include at least two of the following: the transmission time of the test signal on the corresponding local cable, the transmission speed, and the length of the corresponding local cable.

[0007] In some possible implementations, the test signal transmission parameters include transmission time and transmission speed. Based on the detection time difference and the test signal transmission parameters corresponding to at least a portion of the local cables in the high-voltage circuit, the location information of the fault point generating the fault signal is determined from the high-voltage circuit, including: Based on the detection time difference and the transmission time of the test signal on at least some local cables, the target local cable where the fault point is located is determined from at least some local cables; Based on the detection time difference and the transmission speed and time of the test signal on the target local cable, the location information of the fault point on the target local cable is determined.

[0008] In some possible implementations, the high-voltage circuit includes N devices and N-1 local cables. Among the N devices, the first device is the first monitoring device, the Nth device is the second monitoring device, and N is a positive integer greater than 2. Among the N-1 local cables, the i-th local cable is located between the second end of the i-th device and the first end of the (i+1)-th device, where 1≤i≤N-1 and i is a positive integer. Based on the detection time difference and the transmission speed and time of the test signal on the target local cable, the location information of the fault point on the target local cable is determined, including: Given that the target local cable is the j-th local cable, the local transmission time of the fault point on the j-th local cable is calculated based on the difference between the transmission time and the detection time of each local cable in N-1 local cables, where 1≤j≤N-1 and j is a positive integer. The local transmission time is the transmission time from the fault point to the second end of the j-th device, or the transmission time from the fault point to the first end of the (j+1)-th device. Based on the transmission speed and local transmission time corresponding to the j-th local cable, the location information of the fault point on the j-th local cable is determined.

[0009] In some possible implementations, determining the target local cable where the fault point is located from at least a portion of the local cables, based on the detection time difference and the transmission time of the test signal on at least a portion of the local cables, includes: If the detection time difference is within the preset detection time difference range corresponding to the j-th local cable, the target local cable is determined to be the j-th local cable; The lower limit of the preset detection time difference range is: the test time difference between the detection of the test signal by the first monitoring device and the second monitoring device when the test signal originates from the first end of the (j+1)th device. The upper limit of the preset detection time difference range is the test time difference when the test signal originates from the second end of the j-th device and is detected by the first monitoring device and the second monitoring device, respectively.

[0010] In some possible implementations, before determining the location information of the fault point that generated the fault signal from the high-voltage circuit based on the detection time difference and the test signal transmission parameters corresponding to at least a portion of the local cables in the high-voltage circuit, the fault location method further includes: Obtain the length information of each local cable in multiple local cables on the high-voltage circuit; The transmission time of the test signal on each local cable is determined by testing. Based on the transmission time and length information of each local cable, the transmission speed of the test signal on each local cable is determined.

[0011] In some possible implementations, the high-voltage circuit includes N devices and N-1 local cables. Of the N devices, the first device is a first monitoring device, the Nth device is a second monitoring device, and N is a positive integer greater than 2. Of the N-1 local cables, the i-th local cable is located between the second end of the i-th device and the first end of the (i+1)-th device, where 1 ≤ i ≤ N-1, and i is a positive integer. The transmission time of the test signal on each local cable is determined through testing, including: When the test signal originates from the first monitoring device, the total transmission time between the first monitoring device and the second monitoring device is obtained. Given that the test signal originates from the first and second ends of each of the devices from the second device to the (N-1)th device, the test time differences detected by the first and second monitoring devices are obtained respectively. Based on multiple test time differences and the total transmission time, determine the transmission time corresponding to each local cable in N-1 local cables.

[0012] In some possible implementations, the fault location method further includes: During the withstand voltage test phase of the high-voltage circuit, the first voltage value collected by the first monitoring device and / or the second voltage value collected by the second monitoring device are obtained. If either the first or second voltage value exceeds the preset alarm voltage, an alarm message is output, indicating that the withstand voltage test of the high-voltage circuit has failed.

[0013] In some possible implementations, the fault location method further includes: Acquire voltage data from the first and second monitoring devices at different time periods; Based on voltage acquisition data and preset threshold warning voltage points, record the target voltage acquisition data that exceeds the threshold warning voltage point in at least a portion of the time periods from the voltage acquisition data in different time periods. Based on the target voltage data, the leakage current over-limit time of the high-voltage circuit is predicted, and early warning information is output based on the leakage current over-limit time.

[0014] In some possible implementations, in the event of a fault in the high-voltage circuit, acquiring the first moment when the first monitoring device detects the fault signal and the second moment when the second monitoring device detects the fault signal include: In the event of a fault in the high-voltage circuit, the first pulse waveform of the fault signal received by the first monitoring device and the second pulse waveform of the fault signal received by the second monitoring device are acquired. Based on the first pulse waveform and the second pulse waveform, the first time point and the second time point are determined by a cross-correlation algorithm.

[0015] Based on the same inventive concept, in a second aspect, embodiments of this application provide a monitoring device, which is a first monitoring device and / or a second monitoring device in the fault location method of any embodiment of the first aspect of this application, and the monitoring device is used to perform the fault location method as described in any of the first aspects of this application.

[0016] In some possible implementations, the monitoring device includes a filtering module, a sampling module, and a processing module; The filtering module is electrically connected to the target location point in the high-voltage circuit. It is used to filter the electrical signal collected from the target location point and output the filtered electrical signal. The target location point is the output terminal of the high-voltage power supply or the input terminal of the load in the high-voltage circuit. The input terminal of the sampling module is electrically connected to the output terminal of the filtering module. It is used to amplify and convert the filtered electrical signal to obtain the sampled electrical signal and output the sampled electrical signal. The input terminal of the processing module is electrically connected to the output terminal of the sampling module, and is used to perform analog-to-digital conversion and data analysis on the sampled electrical signal to execute the fault location method as described in any of the first aspects of this application.

[0017] In some possible implementations, the sampling module includes multiple sampling units, and the processing module includes multiple analog-to-digital conversion units and control units; The input terminals of multiple sampling units are electrically connected to the output terminals of the filtering module, the output terminals of multiple sampling units are electrically connected to the corresponding input terminals of multiple analog-to-digital conversion units, and the input terminal of the control unit is electrically connected to the output terminals of multiple analog-to-digital conversion units. The sampling unit is used to acquire the filtered electrical signal according to the preset sampling frequency, amplify and convert the filtered electrical signal to obtain the corresponding sampled electrical signal, and output the sampled electrical signal. The analog-to-digital conversion unit is used to receive the sampled electrical signal output by the corresponding sampling unit, and to perform analog-to-digital conversion on the sampled electrical signal to obtain the corresponding sampled digital signal; The control unit is used to receive sampled digital signals output from multiple analog-to-digital conversion units and perform summary data analysis based on the multiple sampled digital signals; Among them, the sampling frequencies of multiple sampling units are consistent, and the starting sampling time points of multiple sampling units are arranged at intervals, and there is a fixed phase difference between the sampling clocks of multiple analog-to-digital conversion units.

[0018] In some possible implementations, the filter module is disposed within a metal shielding structure, the inner cavity of which is filled with potting adhesive.

[0019] In some possible implementations, among the multiple grounding terminals and grounding paths provided in the monitoring equipment, the grounding terminal at the metal shielding structure has the shortest connection length.

[0020] Based on the same inventive concept, in a third aspect, embodiments of this application provide a fault location device, wherein a first monitoring device and a second monitoring device are provided in the high-voltage circuit from the high-voltage power supply to the load, the first monitoring device being located at the output terminal of the high-voltage power supply, and the second monitoring device being located at the input terminal of the load; the fault location device includes: The first acquisition module is used to acquire, in the event of a fault in the high-voltage circuit, the first moment when the first monitoring device detects the fault signal and the second moment when the second monitoring device detects the fault signal. The first determining module is used to determine the detection time difference between the first monitoring device and the second monitoring device when they respectively detect the fault signal based on the difference between the first time and the second time. The second determining module is used to determine the location information of the fault point that generates the fault signal from the high-voltage circuit based on the detection time difference and the test signal transmission parameters corresponding to at least some local cables in the high-voltage circuit. The test signal transmission parameters include at least two of the following: the transmission time of the test signal on the corresponding local cable, the transmission speed, and the length of the corresponding local cable.

[0021] Based on the same inventive concept, in a fourth aspect, embodiments of this application provide a fault location device, which includes: Processor and memory storing computer program instructions; When the processor executes the computer program instructions, it implements the fault location method provided in any of the embodiments of this application described above.

[0022] Based on the same inventive concept, in a fifth aspect, embodiments of this application provide a computer storage medium storing computer program instructions, which, when executed by a processor, implement the fault location method provided in any of the above embodiments of this application.

[0023] Based on the same inventive concept, in a sixth aspect, embodiments of this application provide a computer program product, wherein instructions in the computer program product, when executed by a processor of an electronic device, cause the electronic device to perform a fault location method as provided in any of the embodiments of this application described above.

[0024] As described above, the fault location method, monitoring device, and program product provided in this application embodiment include a first monitoring device and a second monitoring device installed in a high-voltage circuit from a high-voltage power supply to a load. The first monitoring device is located at the output end of the high-voltage power supply, and the second monitoring device is located at the input end of the load. In the event of a fault in the high-voltage circuit, by acquiring the first moment when the first monitoring device detects the fault signal and the second moment when the second monitoring device detects the fault signal, the detection time difference between the first and second monitoring devices is determined based on the difference between the first and second moments. Based on this, and combining the detection time difference with the test signal transmission parameters corresponding to at least a portion of the local cables in the high-voltage circuit, the location information of the fault point generating the fault signal is determined from the high-voltage circuit. The test signal transmission parameters include at least two of the following: the transmission time and speed of the test signal on the corresponding local cable, and the length of the corresponding local cable.

[0025] Compared to the shortcomings of related technologies that cannot accurately locate fault points in high-voltage power supply systems, the fault location method, monitoring equipment, and program product of this application embodiment adopt a location mechanism based on the arrival time difference of fault signals using dual monitoring devices. Furthermore, considering the characteristics of different sections of local cables in the high-voltage circuit (such as cables outside and inside a vacuum) leading to potentially different transmission speeds, this application embodiment, when determining the fault location, not only relies on the detection time difference but also incorporates the test signal transmission parameters corresponding to at least some local cables in the high-voltage circuit. These test signal transmission parameters accurately reflect the signal transmission characteristics of different cable sections. Therefore, this application embodiment can accurately calculate the location information of the fault point, thereby achieving rapid and precise fault location, effectively improving overall fault diagnosis and maintenance efficiency, effectively reducing equipment downtime, and ultimately ensuring stable equipment operation and increased production efficiency. Attached Figure Description

[0026] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments of this application will be briefly introduced below. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a schematic flowchart of a fault location method provided in an embodiment of this application; Figure 2 This is a schematic diagram of the architecture of a high-voltage circuit provided in an embodiment of this application; Figure 3 This is a schematic diagram of the structure of a monitoring device provided in one embodiment of this application; Figure 4 This is a schematic diagram of the structure of a monitoring device provided in another embodiment of this application; Figure 5 This is a schematic diagram of the structure of a filtering module provided in one embodiment of this application; Figure 6 This is a schematic diagram of the structure of a fault location device provided in an embodiment of this application; Figure 7 This is a schematic diagram of the structure of a fault location device provided in an embodiment of this application. Detailed Implementation

[0028] The features and exemplary embodiments of various aspects of this application will be described in detail below. To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain this application and not to limit it. For those skilled in the art, this application can be implemented without some of these specific details. The following description of the embodiments is merely to provide a better understanding of this application by illustrating examples.

[0029] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes said element.

[0030] It should be noted that in the embodiments of this application, certain software, components, models and other existing solutions in the industry may be mentioned. These should be regarded as exemplary and are only intended to illustrate the feasibility of implementing the technical solution of this application. However, it does not mean that the applicant has used or necessarily used the solution.

[0031] As described in the background section, both the paper feeder and the power supply with built-in monitoring currently used in related technologies have some technical shortcomings. Specifically, in the withstand voltage measurement stage of the stand-alone power supply equipment, a paper feeder is usually used for fault detection. By recording the voltage and current change curves, the paper feeder can preliminarily determine whether there is insulation degradation or leakage in the system. However, the measurement speed of the paper feeder is slow, usually on the order of 100ms or more, making it difficult to capture instantaneous discharge phenomena. In addition, the paper feeder requires manual parameter configuration, observation and recording, and manual paper replacement, which is cumbersome and inefficient. More importantly, although the paper feeder can collect signals at the mV level, its output is a motor drive signal, which has conversion errors, thus limiting the accuracy of the acquired signal.

[0032] After the entire unit is assembled, the withstand voltage measurement is usually performed using the current monitoring function built into the high-voltage power supply. Although this monitoring function can monitor current changes in real time, its sampling rate is also on the order of 100ms or higher, making it unable to detect instantaneous discharge phenomena. In addition, the voltage ripple measurement capability of the high-voltage power supply's built-in monitoring function is poor, with an accuracy of only 100mV or higher, making it unsuitable for long-term power quality testing and unable to detect leakage current during instantaneous discharges.

[0033] Most critically, all of the aforementioned technologies suffer from a fundamental flaw: they cannot accurately pinpoint the fault location. Whether it's the paper feeder or the power supply's built-in monitoring, they can only inform operators that the system has insulation degradation or leakage, but they cannot determine whether the fault originates inside the high-voltage power supply, in the transmission cables, or at the load end (such as the electron gun). This lack of fault location capability creates enormous difficulties for troubleshooting and repair. Maintenance personnel need to inspect the high-voltage power supply, transmission cables, and load end one by one, consuming a significant amount of time and effort. This not only prolongs downtime but also increases the risk of equipment damage, severely impacting the normal operation and production efficiency of SEM equipment.

[0034] Furthermore, in the field of SEM (Search Engine Imaging), due to the compact structure of the equipment and the close proximity of the components, higher positioning accuracy is required. Current measurement equipment cannot meet the needs of fault location, let alone the high-precision fault location requirements of the SEM field.

[0035] Overall, the main problems with the above technologies are: (1) Fundamental defects: The fault point cannot be located. The above technologies can only inform the operator that the system has insulation deterioration or leakage, but cannot determine the specific location of the fault, which brings great difficulties to fault diagnosis and maintenance. In addition, there are some technical problems with the above technologies: (2) Slow measurement speed. The sampling speed of the paper feeder and the high voltage power supply with built-in monitoring is on the order of 100ms or more, which cannot capture instantaneous discharge phenomena; (3) Low measurement accuracy. The paper feeder has conversion error, and the voltage ripple measurement capability of the high voltage power supply with built-in monitoring is poor, with an accuracy of only 100mV or more, which cannot detect power quality for a long time; (4) Cumbersome manual operation. The paper feeder requires manual configuration of parameters, observation and recording, and paper replacement. The high voltage power supply with built-in monitoring requires manual data analysis, which is cumbersome and inefficient. In actual application scenarios, these problems lead to prolonged equipment downtime, increased production shutdown risk, and seriously affect the normal operation and production efficiency of SEM equipment.

[0036] In view of the above, in order to solve the problems of the prior art, the embodiments of this application provide a fault location method, monitoring equipment and program product, which aim to improve the problems existing in the above-mentioned related technologies and improve the high voltage power supply monitoring capability and fault diagnosis efficiency of SEM equipment.

[0037] The fault location method provided in the embodiments of this application will be described below. It should be noted that the embodiments provided in this application are not intended to limit the scope of this application.

[0038] Figure 1 A schematic flowchart of a fault location method provided in an embodiment of this application is shown. A first monitoring device and a second monitoring device are provided in the high-voltage circuit from the high-voltage power supply to the load. The first monitoring device is located at the output terminal of the high-voltage power supply, and the second monitoring device is located at the input terminal of the load.

[0039] It should be understood that this fault location method can be executed by the first monitoring device, the second monitoring device, or an external host computer that can communicate with the first / second monitoring device; no strict limitation is made here. Figure 1 As shown, the fault location method includes the following steps: S110, in the event of a fault in the high-voltage circuit, acquire the first moment when the first monitoring device detects the fault signal, and acquire the second moment when the second monitoring device detects the fault signal; S120, Based on the difference between the first time and the second time, determine the detection time difference between the first monitoring device and the second monitoring device respectively detecting the fault signal; S130, based on the detection time difference and the test signal transmission parameters corresponding to at least some local cables in the high-voltage circuit, determine the location information of the fault point that generates the fault signal from the high-voltage circuit; wherein, the test signal transmission parameters include at least two of the following: the transmission time of the test signal on the corresponding local cable, the transmission speed, and the length of the corresponding local cable.

[0040] This application provides a fault location method. A first monitoring device and a second monitoring device are installed in a high-voltage circuit from a high-voltage power supply to a load. The first monitoring device is located at the output end of the high-voltage power supply, and the second monitoring device is located at the input end of the load. In the event of a fault in the high-voltage circuit, the method acquires the first moment when the first monitoring device detects the fault signal and the second moment when the second monitoring device detects the fault signal. Based on the difference between the first and second moments, the detection time difference between the first and second monitoring devices is determined. Then, by combining this detection time difference with the test signal transmission parameters corresponding to at least a portion of the local cables in the high-voltage circuit, the location information of the fault point generating the fault signal is determined from the high-voltage circuit. These test signal transmission parameters include at least two of the following: the transmission time and speed of the test signal on the corresponding local cable, and the length of the corresponding local cable.

[0041] Compared to the shortcomings of related technologies that cannot accurately locate fault points in high-voltage power supply systems, a fault location method in this application adopts a location mechanism based on the time difference of arrival of fault signals using dual monitoring devices. Furthermore, considering the characteristics of different sections of local cables in the high-voltage circuit (such as cables outside and inside a vacuum) leading to different transmission speeds, this application, when determining the fault location, not only relies on the detection time difference but also incorporates the test signal transmission parameters corresponding to at least some local cables in the high-voltage circuit. These test signal transmission parameters accurately reflect the signal transmission characteristics of different cable sections. Therefore, this application can accurately calculate the location information of the fault point, thereby achieving rapid and precise fault location, effectively improving overall fault diagnosis and maintenance efficiency, effectively reducing equipment downtime, and ultimately ensuring stable equipment operation and increased production efficiency.

[0042] The specific implementation methods of steps 110 to 130 above are described in detail below.

[0043] In S110, for ease of understanding, please refer to the following... Figure 2 As shown, Figure 2This is a schematic diagram of a high-voltage circuit architecture provided in one embodiment of this application. In some embodiments, the high-voltage circuit includes a high-voltage power supply 100, a load 200, a first monitoring device 310, device 1 (320), device 2 (330), device 3 (340), and a second monitoring device (350). Optionally, the first monitoring device 310 and the second monitoring device 350 are connected. The first monitoring device 310 is used to receive data collected by the second monitoring device 350 and perform fault location calculations based on its own collected data. Optionally, the first monitoring device 310 communicates with a host computer 400 to report the fault location calculation results to the host computer 400. It should be understood that, for the sake of brevity, the following text will use the term "fault location calculation". Figure 2 The labels in the text are omitted.

[0044] Specifically, a first monitoring device and a second monitoring device are installed in the high-voltage circuit from the high-voltage power supply to the load. The first monitoring device is located at the output end of the high-voltage power supply, and the second monitoring device is located at the input end of the load. Both the first and second monitoring devices can be equipped with a high-precision timestamp function, capable of recording the current time the moment a fault signal is detected.

[0045] Depending on the application scenario of scanning electron microscopy, this high-voltage circuit can also include other devices, such as Device 1, Device 2, and Device 3. These devices include high-voltage relays, vacuum chambers, and cavities, etc., without strict limitations. The aforementioned loads include, for example, an electron gun, and the high-voltage power supply provides the high voltage required to accelerate the electron beam. Different devices are connected using appropriate local cables.

[0046] During normal operation, high-voltage pulse signals propagate along the cable. When a fault occurs at a point in the high-voltage circuit (such as a short circuit or leakage), the resulting fault signal propagates to both ends and is subsequently captured by the first and second monitoring devices. This fault signal can be an abnormal pulse exceeding a threshold, enabling effective determination of whether a fault has occurred.

[0047] In specific implementation, when a fault occurs in the high-voltage circuit, the fault location process provided in this application embodiment is entered. First, the first moment when the first monitoring device detects the fault signal and the second moment when the second monitoring device detects the fault signal are acquired to measure the fault propagation time, which facilitates subsequent fault location.

[0048] As an example, after detecting a fault signal, the second monitoring device will immediately transmit the second moment to the first monitoring device via fiber optic communication. In this way, the first monitoring device can obtain the first moment when it detected the fault signal, and through communication with the second monitoring device, obtain the second moment when the second monitoring device detected the fault signal.

[0049] As another example, after detecting a fault signal, the first monitoring device immediately transmits the first moment of detection to the second monitoring device via fiber optic communication. In this way, the second monitoring device can obtain the second moment of its own fault signal detection, and through communication with the first monitoring device, obtain the first moment of the first monitoring device's fault signal detection.

[0050] As another example, after detecting a fault signal, the first monitoring device immediately transmits the first moment of detection to the host computer via fiber optic communication; after detecting a fault signal, the second monitoring device immediately transmits the second moment of detection to the host computer via fiber optic communication. In this way, the host computer obtains the first moment of detection of the fault signal by the first monitoring device and the second moment of detection of the fault signal by the second monitoring device through communication with both devices.

[0051] In S120, specifically, based on the first moment when the first monitoring device detects the fault signal and the second moment when the second monitoring device detects the fault signal, the detection time difference between the first and second monitoring devices is determined. This detection time difference is the difference between the second moment and the first moment. By calculating this difference, the time difference in which the fault signal propagates from the fault point to the two monitoring devices can be clearly defined, thus providing an important basis for related analyses such as fault location.

[0052] Continue to combine Figure 2 As shown, in some examples, if the fault point occurs in the local cable segment AB between the high-voltage power supply and the first monitoring device, the detection time difference between the second moment and the first moment is the total propagation time of the fault signal from the first monitoring device to the second monitoring device in the high-voltage circuit.

[0053] If the fault point occurs in the IJ segment of the local cable between the second monitoring device and the load, the detection time difference between the second moment and the first moment is the negative value of the total propagation time of the fault signal from the second monitoring device to the first monitoring device in the high-voltage circuit.

[0054] If the fault point is located between the first monitoring device and the second monitoring device, for example... Figure 2 If the fault signal is transmitted through the BC section, DE section, FG section, or HI section of the local cable, then the detection time difference is greater than or equal to the negative of the total propagation time of the fault signal from the second monitoring device to the first monitoring device in the high-voltage circuit, and less than or equal to the total propagation time of the fault signal from the first monitoring device to the second monitoring device in the high-voltage circuit.

[0055] It should be added that the fault location method in this application mainly focuses on calculating the fault location between the first monitoring device and the second monitoring device. Based on this, the lengths of the AB section of the local cable between the high-voltage power supply and the first monitoring device, and the IJ section of the local cable between the second monitoring device and the load, can be set as small as possible.

[0056] In S130, the high-voltage circuit includes multiple local cables. For example, combined with Figure 2 As shown, the high-voltage circuit includes a BC section local cable between the first monitoring device and device 1, a DE section local cable between device 1 and device 2, an FG section local cable between device 2 and device 3, and a HI section local cable between device 3 and the second monitoring device. In practical applications, the specific number of local cables in this high-voltage circuit can be related to the number of devices in the circuit and the circuit structure design, and is not strictly limited here.

[0057] In scanning electron microscopy applications, the local cables in different sections of a high-voltage circuit are not consistent. A high-voltage circuit contains multiple different sections of local cables, such as local cables outside the vacuum and local cables inside the vacuum, and these cables have different characteristics. The capacitance values ​​of different sections of local cables may differ, therefore the signal transmission speed may also differ across these sections.

[0058] Based on this, considering that the transmission speed may vary due to the characteristics of different sections of the cable, the transmission parameters of the test signals corresponding to different sections of the cable can be obtained in advance. These transmission parameters can be obtained by providing test signals at different locations in the high-voltage circuit and obtaining the test time difference of the test signals at different locations by the first monitoring device and the second monitoring device, and then determining the transmission parameters of the test signals corresponding to different sections of the cable.

[0059] As an example, the lengths of multiple local cables can be pre-measured using a dimensional measuring tool. Then, the aforementioned test signals are applied, for example, using an electrostatic gun... Figure 2 The letter above represents the location where static electricity is applied. The test time difference between the first and second monitoring devices is measured by the first and second monitoring devices respectively. Based on this, combined with the length information of the local cables, the transmission time and transmission speed in the test signal transmission parameters corresponding to multiple local cables are calculated.

[0060] It should be understood that, considering that signals typically propagate at a uniform speed on a single local cable, if any two of the following parameters—the transmission time, transmission speed, and length of the test signal on the corresponding local cable—are known, the remaining parameter can be calculated based on those two. Therefore, in actual data processing, the test signal transmission parameters only need to include at least two of the following parameters to achieve accurate fault location: the transmission time, transmission speed, and length of the test signal on the corresponding local cable.

[0061] In practice, after calculating the time difference between the arrival of the fault signal at the first and second monitoring devices, the location information of the fault point that generated the fault signal is determined from the high-voltage circuit based on the detection time difference and the test signal transmission parameters corresponding to at least some local cables in the high-voltage circuit.

[0062] By individually acquiring the test signal transmission parameters corresponding to at least some local cables, and calculating the location of the fault point based on the test signal transmission parameters corresponding to at least some local cables, the characteristics of different local cables in the high-voltage circuit can be fully considered, thereby achieving accurate location calculation of the fault point.

[0063] Therefore, in this step, considering the differences between different cable segments, the test signal transmission parameters (such as transmission time and transmission speed) of different cable segments are acquired separately. Based on these local cable test signal transmission parameters, the fault point can be accurately located by combining the aforementioned detection time difference, thereby effectively improving the overall fault diagnosis and repair efficiency.

[0064] Optionally, and more specifically, to achieve precise fault location and accurate time difference calculation, fiber optic communication is used between the first and second monitoring devices. Specifically, a 1.6T or higher CPO (Co-Packaged Optics) optical transmission scheme is employed, using 8B / 10B or more efficient alternative coding as the clock recovery method. This scheme theoretically achieves synchronization accuracy at the 10ps (picosecond) level, providing a reliable foundation for high-precision time difference measurement and also helping to improve fault location efficiency.

[0065] Optionally, according to some embodiments of this application, the test signal transmission parameters include transmission time and transmission speed. Based on the detection time difference and the test signal transmission parameters corresponding to at least a portion of the local cables in the high-voltage circuit, the location information of the fault point that generates the fault signal is determined from the high-voltage circuit, including: Based on the detection time difference and the transmission time of the test signal on at least some local cables, the target local cable where the fault point is located is determined from at least some local cables; Based on the detection time difference and the transmission speed and time of the test signal on the target local cable, the target local cable where the fault point is located is determined from at least some local cables.

[0066] In this embodiment, to achieve accurate fault location in the high-voltage circuit, a dual-monitoring device location mechanism based on signal arrival time difference is adopted, combined with the test signal transmission parameters of different cable segments in the high-voltage circuit. These transmission parameters include the transmission time and transmission speed of the test signal corresponding to each cable segment.

[0067] In practice, the transmission speed and transmission time of the test signal corresponding to each cable segment can be predetermined, and the target local cable where the fault point is located can be determined from at least some local cables based on the detection time difference and the transmission time of the test signal on at least some local cables.

[0068] For example, the time difference between the fault signals generated in different local cables and their transmission to the first and second monitoring devices can be within a certain range. This range can be calculated in advance using the transmission time on each local cable. Thus, in practical applications, the cable segment where the fault point is located can be determined by observing the different ranges within which the aforementioned detection time differences fall. Then, based on the detection time differences and the known transmission speed and time of the test signal on the target local cable, the precise location of the fault point on the target local cable can be determined.

[0069] Therefore, this embodiment can accurately locate fault points in high-voltage circuits, improve fault diagnosis and maintenance efficiency, reduce equipment downtime, and ensure stable equipment operation and production efficiency.

[0070] Optionally, according to some embodiments of this application, the high-voltage circuit includes N devices and N-1 local cables. Among the N devices, the first device is a first monitoring device, the Nth device is a second monitoring device, and N is a positive integer greater than 2. Among the N-1 local cables, the i-th local cable is located between the second end of the i-th device and the first end of the (i+1)-th device, 1≤i≤N-1, and i is a positive integer. Based on the detection time difference and the transmission speed and time of the test signal on the target local cable, the location information of the fault point on the target local cable is determined, including: Given that the target local cable is the j-th local cable, the local transmission time of the fault point on the j-th local cable is calculated based on the difference between the transmission time and the detection time of each local cable in N-1 local cables, where 1≤j≤N-1 and j is a positive integer. The local transmission time is the transmission time from the fault point to the second end of the j-th device, or the transmission time from the fault point to the first end of the (j+1)-th device. Based on the transmission speed and local transmission time corresponding to the j-th local cable, the location information of the fault point on the j-th local cable is determined.

[0071] In practical implementation, given that the target local cable is determined to be the j-th local cable, the local transmission time of the fault point on the j-th local cable can be calculated based on the difference between the transmission time and detection time of each of the N-1 local cables. Then, by calculating the product of the transmission speed and the local transmission time corresponding to the j-th local cable, the location information of the fault point on the j-th local cable is determined. In this way, the precise location of the fault point in the high-voltage circuit is fully realized.

[0072] To facilitate understanding of the fault location method provided in the above embodiments, a specific scenario embodiment will be used to illustrate the embodiments below. Figure 2 As shown, taking N=5 as an example, the N devices include: the first monitoring device, device 1, device 2, device 3, and slave monitoring devices. The N-1 local cables include: BC segment local cable, DE segment local cable, FG segment local cable, and HI segment local cable. TBC represents the transmission time corresponding to the BC segment local cable, TDE represents the transmission time corresponding to the DE segment local cable, TFG represents the transmission time corresponding to the FG segment local cable, and THI represents the transmission time corresponding to the HI segment local cable.

[0073] As an example, assuming j=1, a fault occurs in a section of the BC cable. Taking Δt as the time required for the fault point in the BC cable to travel to point B, the first moment when the first monitoring device detects the fault signal is equal to the time when the fault occurs plus Δt; the second moment when the second monitoring device detects the fault signal is equal to the time when the fault occurs plus (TBC-Δt+TDE+TFG+THI).

[0074] Therefore, the detection time difference = second moment - first moment = (TBC - Δt + TDE + TFG + THI) - (Δt) = TDE + TFG + THI + TBC - 2Δt. Since the detection time difference, TBC, TDE, TFG, and THI are all known, Δt can be calculated. After calculating the time Δt required for the fault point in the BC segment of the cable to travel to point B, the distance from the fault point to point B can be calculated by multiplying Δt by the known transmission speed of the BC segment of the cable. This determines the location of the fault point on the BC segment of the cable. Furthermore, the distance from the fault point to the first monitoring device can be calculated.

[0075] As another example, assuming j=2, a fault occurs in a section of cable DE. Taking Δt as the time required for the fault point in the section of cable DE to be transmitted to point D, the first moment when the first monitoring device detects the fault signal is = the time when the fault occurs + TBC + Δt; the second moment when the second monitoring device detects the fault signal is = the time when the fault occurs + (TDE - Δt + TFG + THI).

[0076] Therefore, the detection time difference = second moment - first moment = (TDE - Δt + TFG + THI) - (TBC + Δt) = TDE + TFG + THI - TBC - 2Δt. Since the detection time difference, TBC, TDE, TFG, and THI are all known, Δt can be calculated. After calculating the time Δt required for the fault point in the DE segment of the cable to travel to point D, the distance from the fault point to point D can be calculated by multiplying Δt by the known transmission speed of the DE segment cable. This determines the location of the fault point on the DE segment cable. Furthermore, the distance from the fault point to the first monitoring device can be calculated.

[0077] As another example, assuming j=4, a fault occurs in a section of the cable in segment HI. Taking Δt as the time required for the fault point in the section HI cable to be transmitted to point H, the first moment when the first monitoring device detects the fault signal is = the time when the fault occurs + TBC + TDE + TFG + Δt; the second moment when the second monitoring device detects the fault signal is = the time when the fault occurs + (THI - Δt).

[0078] Therefore, the detection time difference = second moment - first moment = THI - Δt - (TBC + TDE + TFG + Δt) = TDE + TFG + THI - TBC - 2Δt. Since the detection time difference, TBC, TDE, TFG, and THI are all known, Δt can be calculated. After calculating the time Δt required for the fault point in the HI segment of the local cable to travel to point H, the distance from the fault point in the HI segment to point H can be calculated by multiplying Δt by the known transmission speed of the HI segment's local cable. This determines the location of the fault point on the HI segment's local cable. Furthermore, the distance from the fault point to the first monitoring device can be calculated.

[0079] As can be seen from the above examples, the specific location method for fault points on local cables provided in this embodiment fully considers the signal transmission characteristics of different sections of local cables in the high-voltage circuit, and fully combines the transmission time required for the signals corresponding to different local cables and the transmission speed of the local cable where the fault point is located, thereby enabling rapid and accurate location of fault points and effectively improving the overall fault diagnosis and maintenance efficiency.

[0080] Optionally, according to some embodiments of this application, determining the target local cable where the fault point is located from at least a portion of the local cables based on the detection time difference and the transmission time of the test signal on at least a portion of the local cables includes: If the detection time difference is within the preset detection time difference range corresponding to the j-th local cable, the target local cable is determined to be the j-th local cable; The lower limit of the preset detection time difference range is: the test time difference between the detection of the test signal by the first monitoring device and the second monitoring device when the test signal originates from the first end of the (j+1)th device. The upper limit of the preset detection time difference range is the test time difference when the test signal originates from the second end of the j-th device and is detected by the first monitoring device and the second monitoring device, respectively.

[0081] In this embodiment, the time difference between the fault signals generated in different local cables and their transmission to the first and second monitoring devices exists within a corresponding preset detection time difference range. Taking the preset detection time difference range corresponding to the j-th local cable as an example, the lower limit of the preset detection time difference range is used to characterize the test time difference between the first and second monitoring devices when the test signal originates from the first end of the (j+1)-th device. The upper limit of this preset detection time difference range is the test time difference between the first and second monitoring devices when the test signal originates from the second end of the j-th device. In practical applications, this preset detection time difference range can be calculated in advance using the transmission time on each local cable.

[0082] Thus, in practical applications, by determining the preset detection time difference range corresponding to the local cable segment where the aforementioned detection time difference falls, the cable segment where the fault point is located can be accurately determined. Subsequently, based on the detection time difference and the known transmission speed and time of the test signal on the target local cable, the precise location information of the fault point on the target local cable can be further realized.

[0083] Optionally, according to some embodiments of this application, before determining the target local cable where the fault point is located from at least a portion of the local cables based on the detection time difference and the transmission time of the test signal on at least a portion of the local cables, the method further includes: Based on the transmission time of each local cable, a preset test time difference range is determined for each local cable.

[0084] To facilitate understanding of the method for determining the preset test time difference range in the above embodiments, the following describes the method using a specific scenario embodiment.

[0085] For example, continue to combine Figure 2 As shown, the transmission time of the first local cable BC is 3 microseconds. The transmission time of the second local cable DE is 4 microseconds. The transmission time of the third local cable FG is 5 microseconds. The transmission time of the fourth local cable HI is 6 microseconds.

[0086] With j=1, assume the first sum is the transmission time from point C to the second monitoring device, and the second sum is the transmission time from point C to the main monitoring device. The sum of the transmission times of the second local cable DE, the third local cable FG, and the fourth local cable HI is the first sum (4+5+6=15 microseconds), and the transmission time of the first local cable (3 microseconds) is the second sum. In this case, the lower limit of the preset detection time range corresponding to the first local cable is the difference between the first and second sums, i.e., 15-3=12 microseconds.

[0087] Assume the third sum is the transmission time from point B to the second monitoring device, and the fourth sum is the transmission time from point B to the first monitoring device. The sum of the transmission times of the first local cable BC, the second local cable DE, the third local cable FG, and the fourth local cable HI is the third sum (3+4+5+6=18 microseconds), and the fourth sum is zero. In this case, the upper limit of the preset detection time range corresponding to the first local cable is the difference between the third and fourth sums, i.e., 18-0=18 microseconds.

[0088] Based on the above examples, and by analogy, the upper and lower limits of the preset test time difference range for each local cable can be calculated efficiently and accurately, thereby helping to accurately locate the fault point on which local cable.

[0089] Optionally, according to some embodiments of this application, in the event of a fault in the high-voltage circuit, taking the detection time difference obtained by subtracting the first time corresponding to the first monitoring device from the second time corresponding to the second monitoring device as an example, if the value of the detection time difference is equal to the sum of the transmission times of the first local cable BC, the second local cable DE, the third local cable FG, and the fourth local cable HI, then the fault point can be determined to be in segment AB. The cables in segment AB can be set to be relatively short, which facilitates rapid fault repair after fault determination.

[0090] Taking the detection time difference obtained by subtracting the first time from the second time point as an example, if the value of the detection time difference is equal to the negative value of the sum of the transmission times of the first local cable BC, the second local cable DE, the third local cable FG, and the fourth local cable HI, then the fault point can be determined to be in segment IJ. The cables in segment IJ can be set to be shorter, which helps to facilitate rapid fault repair after fault diagnosis.

[0091] Optionally, according to some embodiments of this application, before determining the location information of the fault point that generates the fault signal from the high-voltage circuit based on the detection time difference and the test signal transmission parameters corresponding to at least some local cables in the high-voltage circuit, the fault location method further includes: Obtain the length information of each local cable in multiple local cables on the high-voltage circuit; The transmission time of the test signal on each local cable is determined by testing. Based on the transmission time and length information of each local cable, the transmission speed of the test signal on each local cable is determined.

[0092] In practice, for fixed cables, the length information of each local cable in the high-voltage circuit is obtained. This length information is pre-measured and recorded, providing basic data for subsequent fault location. Secondly, the transmission time of the test signal on each local cable is determined through testing. This testing process can be accomplished by injecting test signals at different locations in the high-voltage circuit and recording the signal arrival time using monitoring equipment. Finally, based on the transmission time and length information of each local cable, the transmission speed of the test signal on each local cable is determined according to V=S / T.

[0093] Therefore, this embodiment takes into account the different signal transmission speeds caused by different cable characteristics, and obtains the signal transmission time and transmission speed on different cable segments separately through the above method. This facilitates accurate and efficient location of fault points and provides accurate data support for fault point location.

[0094] Optionally, according to some embodiments of this application, the high-voltage circuit includes N devices and N-1 local cables. Among the N devices, the first device is a first monitoring device, the Nth device is a second monitoring device, and N is a positive integer greater than 2. Among the N-1 local cables, the i-th local cable is located between the second end of the i-th device and the first end of the (i+1)-th device, where 1 ≤ i ≤ N-1, and i is a positive integer. The transmission time of the test signal on each local cable is determined through testing, including: When the test signal originates from the first monitoring device, the total transmission time between the first monitoring device and the second monitoring device is obtained. Given that the test signal originates from the first and second ends of each of the devices from the second device to the (N-1)th device, the test time differences detected by the first and second monitoring devices are obtained respectively. Based on multiple test time differences and the total transmission time, determine the transmission time corresponding to each local cable in N-1 local cables.

[0095] Specifically, a test signal is injected at a corresponding location in the high-voltage circuit. This injection can be achieved using a specialized signal generator, ensuring signal stability and repeatability. The test signal can be, for example, a pulse signal.

[0096] In this way, the total transmission time between the first and second monitoring devices is obtained when the test signal originates from the first monitoring device. This total transmission time covers the complete time required for the test signal to propagate from the first monitoring device to the second monitoring device through multiple local cables, providing a basic reference for subsequent calculations of local cable transmission times.

[0097] Next, with the test signal originating from the first and second ends of each of the devices from the second device to the (N-1)th device, multiple test time differences are obtained for the test signal detected by the first and second monitoring devices respectively. Based on the obtained multiple test time differences and the total transmission time, the result can be determined by establishing a mathematical model or using an algorithm for calculation and analysis. The transmission time of each local cable in a single local cable.

[0098] Therefore, this embodiment can accurately obtain the transmission time of each local cable in the high-voltage circuit in the early stage of testing, providing a data basis for the accurate location of the fault point, thereby helping to improve the accuracy of fault location.

[0099] To facilitate understanding, let's continue with... Figure 2 As shown, as an example, using an electrostatic gun in Figure 2 The letter B represents the location where static electricity is applied. By measuring the time difference using dual monitoring devices, the total transmission time T1 from point B to point I (i.e., from the first monitoring device to the second monitoring device) can be obtained.

[0100] Next, use an electrostatic gun on Figure 2 The letter C represents the location where electrostatic discharge (ESD) is applied. By measuring the time difference using dual monitoring devices, we can obtain the test time difference T2 between the transmission time X required from point C to point I and the transmission time T2 required from point C to point B. Thus, X + Y = T1, XY = T2. Knowing T1 and T2, we can establish and solve a system of two linear equations to obtain the transmission time Y (TBC) for the local cable segment BC. By continuing this process of testing and calculation, we can accurately calculate the transmission times TBC, TDE, TFG, and THI for each cable segment.

[0101] Optionally, according to some embodiments of this application, the fault location method further includes: During the withstand voltage test phase of the high-voltage circuit, the first voltage value collected by the first monitoring device and / or the second voltage value collected by the second monitoring device are obtained. If either the first or second voltage value exceeds the preset alarm voltage, an alarm message is output, indicating that the withstand voltage test of the high-voltage circuit has failed.

[0102] In practice, to ensure the reliability and safety of the high-voltage circuit, it is necessary to monitor and evaluate the withstand voltage performance of the circuit in real time during the withstand voltage test phase.

[0103] In the withstand voltage test phase of the high-voltage circuit, the withstand voltage test is achieved by actively applying voltage to the high-voltage power supply. Specifically, during the withstand voltage test, a first voltage value is acquired through a first monitoring device, and / or a second voltage value is acquired through a second monitoring device. These two voltage values ​​reflect the real-time voltage status of the high-voltage circuit at different monitoring points. Next, by setting a preset alarm voltage and calculating whether the acquired voltage value exceeds this preset alarm voltage, it is possible to accurately determine whether the high-voltage circuit has passed the withstand voltage test. If either the first or second voltage value exceeds the preset alarm voltage, an alarm message is output. This alarm message clearly indicates that the withstand voltage test of the high-voltage circuit has failed, thus promptly reminding operators to take appropriate measures to avoid equipment damage or safety accidents caused by insufficient withstand voltage.

[0104] Through the above-described withstand voltage test steps, the embodiments of this application can monitor the withstand voltage performance of the high-voltage circuit in real time and accurately, promptly detect potential withstand voltage problems, and remind operators through alarm information. This improves the efficiency and accuracy of withstand voltage testing, enhances the safety and reliability of the high-voltage circuit, and provides a strong guarantee for the stable operation of the high-voltage circuit.

[0105] Optionally, according to some embodiments of this application, the fault location method further includes: Acquire voltage data from the first and second monitoring devices at different time periods; Based on voltage acquisition data and preset threshold warning voltage points, record the target voltage acquisition data that exceeds the threshold warning voltage point in at least a portion of the time periods from the voltage acquisition data in different time periods. Based on the target voltage data, the leakage current over-limit time of the high-voltage circuit is predicted, and early warning information is output based on the leakage current over-limit time.

[0106] In this embodiment, in order to achieve long-term monitoring and early warning of high-voltage circuits, an early warning mechanism based on voltage acquisition data is provided, which can realize real-time monitoring and early warning of leakage in high-voltage circuits.

[0107] In practice, the voltage data collected by the first and second monitoring devices over different time periods is first acquired. A time period is, for example, one hour. This voltage data reflects the voltage changes in the high-voltage circuit over these periods, providing fundamental data support for subsequent leakage current monitoring and early warning.

[0108] Next, by comparing the voltage acquisition data with the preset threshold warning voltage point, when the voltage value acquired by the monitoring device exceeds the threshold, the target voltage acquisition data exceeding the threshold warning voltage point for at least a portion of the time periods is recorded from the voltage acquisition data in different time periods for further analysis.

[0109] Then, based on the target voltage acquisition data, the time distribution and trend of the target voltage acquisition data are analyzed. The time point when leakage current exceeds the limit may occur in the high voltage circuit is predicted by mathematical model or algorithm, and early warning information is output based on the leakage current exceeding the limit time.

[0110] Therefore, this embodiment, through real-time monitoring and data analysis, can promptly detect potential leakage risks and issue early warnings to remind operators to take appropriate measures to avoid equipment damage or safety accidents caused by leakage, thereby effectively improving equipment operating efficiency and maintenance management level.

[0111] It should be added that, in practical implementation, the measured data can be plotted, line drawn, and compressed by configuring a time period, such as 1 hour, for easy archiving. This not only effectively records and stores a large amount of voltage acquisition data, but also visually displays voltage change trends in a graphical way, facilitating subsequent analysis and evaluation.

[0112] Optionally, according to some embodiments of this application, in the event of a fault in the high-voltage circuit, acquiring the first moment when the first monitoring device detects the fault signal and the second moment when the second monitoring device detects the fault signal includes: In the event of a fault in the high-voltage circuit, the first pulse waveform of the fault signal received by the first monitoring device and the second pulse waveform of the fault signal received by the second monitoring device are acquired. Based on the first pulse waveform and the second pulse waveform, the first time point and the second time point are determined by a cross-correlation algorithm.

[0113] In this embodiment, to accurately determine the detection time of a fault signal on a high-voltage circuit, a fault detection time acquisition method based on pulse waveforms and a cross-correlation algorithm is proposed. Specifically, when a fault occurs on the high-voltage circuit, the first pulse waveform of the fault signal received by the first monitoring device and the second pulse waveform of the fault signal received by the second monitoring device are first acquired. These two pulse waveforms reflect the characteristics of the fault signal at the two monitoring devices, providing basic data for subsequent time difference calculation. Then, based on the first and second pulse waveforms, the first and second time points are determined using a cross-correlation algorithm. The cross-correlation algorithm is an effective waveform processing algorithm; its core lies in calculating the cross-correlation coefficient between two pulse waveforms.

[0114] For example, when determining the first and second time points using a cross-correlation algorithm, the first and second pulse waveforms are first preprocessed, including filtering and denoising. Then, the cross-correlation coefficient between the two pulse waveforms is calculated. This cross-correlation coefficient reflects the similarity between the two pulse waveforms, and its peak position corresponds to the time delay between the two waveforms. Finally, by analyzing the peak position of the cross-correlation coefficient, the time difference between the two pulse waveforms is determined; this time difference is the difference between the first and second time points.

[0115] In this embodiment, the cross-correlation algorithm described above can accurately obtain the time difference between the fault signals detected by the first and second monitoring devices. The high precision of the cross-correlation algorithm further enhances the reliability and stability of fault detection, helping to improve the accuracy of fault location. Furthermore, the cross-correlation algorithm can effectively overcome noise interference and achieve sub-nanosecond time difference resolution. This means that even in the presence of noise, the time difference between two pulse waveforms can be accurately determined, thereby improving the accuracy of fault signal detection time.

[0116] Optionally, according to some embodiments of this application, in the actual fault detection process, an analog-to-digital converter (ADC) is used to sample the signals at each monitoring point. If leakage faults occur simultaneously in different cable segments, then according to the ADC sampling results, the signal characteristics generated at the same fault point by different monitoring devices are similar. Therefore, points with similar amplitudes and the same time interval can be identified as signals from the same fault point. This allows for the simultaneous location of leakage faults in different cable segments, effectively improving the efficiency and accuracy of fault detection. Even when multiple fault points occur simultaneously, each fault point can be accurately identified and located.

[0117] In more specific examples, during the withstand voltage test of a high-voltage circuit, the pressurization operation may trigger multiple fault points. These fault points exhibit varying degrees of damage, resulting in different signal characteristics for each. Specifically, points with more severe faults typically have higher root mean square (Vrms) voltage values. Therefore, by analyzing the magnitude of the Vrms value, the severity of the fault can be preliminarily determined. Similar Vrms indicate the same fault point, allowing for simultaneous location of multiple faults. Furthermore, comparing the magnitudes of the Vrms values ​​provides crucial reference information for maintenance personnel, improving the efficiency of critical component maintenance and equipment recovery speed, and ultimately enhancing the safety and reliability of the high-voltage circuit.

[0118] Optionally, according to some embodiments of this application, taking the second monitoring device sending monitoring information to the first monitoring device for processing, and the first monitoring device performing location calculation on the fault point as an example, after the first monitoring device calculates the location information of the fault point, it can output the result to the host computer through the communication link for reporting and display.

[0119] The host computer's operating interface can be configured to display the high-voltage circuit diagram graphically, marking the approximate location of the fault point. This graphical display intuitively shows the structure of the high-voltage circuit and the location of the fault point, allowing operators to quickly understand the fault situation. Simultaneously, the host computer's operating interface records relevant information about the location results, including the time of location, fault intensity, and detailed information. This information can be stored in a database for subsequent querying and analysis.

[0120] Therefore, by outputting the fault location results to the host computer for graphical display and detailed recording, the efficiency of fault location and the convenience of operation are improved, which helps to reliably realize the maintenance and management of high-voltage circuits.

[0121] Overall, the fault location method provided in this application embodiment achieves online and accurate location of high-voltage insulation faults in a vacuum environment. It can precisely pinpoint the fault point, fundamentally solving the problem of existing technologies that only provide alarms but do not locate faults, and significantly reducing fault investigation time and equipment downtime losses. Furthermore, the fault location method provided in this application embodiment also supports long-term monitoring of high-voltage circuits without manual judgment, features fast sampling speed and high accuracy, supports multi-fault point location, and can provide withstand voltage test early warning. In addition, compared to related technologies where the paper feeder cannot be installed on the machine, the monitoring equipment used in this application can be installed on the machine, saving space, reducing wiring requirements, and improving overall integration and reliability.

[0122] Based on the fault location method provided in the above embodiments, and with the same inventive concept, this application also provides a monitoring device corresponding to the above fault location method. The following describes... Figure 3 A detailed introduction to the monitoring equipment is provided.

[0123] Figure 3 This is a schematic diagram of the structure of a monitoring device provided in one embodiment of this application, as shown below. Figure 3 As shown, this application provides a monitoring device, which is the first monitoring device 310 and / or the second monitoring device 350 in the fault location method described in any of the foregoing embodiments of this application. The monitoring device can be used to execute the fault location method provided in any of the foregoing embodiments of this application.

[0124] It should be understood that the monitoring device provided in this application has the same or similar effects as the fault location method provided in any of the foregoing embodiments of this application. For the sake of brevity, this application will not elaborate further here. Furthermore, it should be noted that, compared to the paper feeder in related technologies which cannot be installed on the machine, the monitoring device used in this application can be installed on the machine, which not only saves space but also reduces wiring requirements and improves overall integration and reliability.

[0125] Optionally, according to some embodiments of this application, the monitoring device includes a filtering module 10, a sampling module 20, and a processing module 30; The filtering module 10 is electrically connected to the target location point in the high-voltage circuit. It is used to filter the electrical signal collected from the target location point and output the filtered electrical signal. The target location point is the output terminal of the high-voltage power supply or the input terminal of the load in the high-voltage circuit. The input terminal of the sampling module 20 is electrically connected to the output terminal of the filtering module 10, and is used to amplify and convert the filtered electrical signal to obtain the sampled electrical signal, and output the sampled electrical signal. The input terminal of the processing module 30 is electrically connected to the output terminal of the sampling module 20, and is used to perform analog-to-digital conversion and data analysis on the sampled electrical signal in order to execute the fault location method as described in any of the foregoing embodiments of this application.

[0126] In practice, the monitoring equipment is connected in parallel with the high-voltage circuit for detection, without affecting the effective output of the main channel in the high-voltage circuit. This parallel design ensures that the monitoring equipment will not interfere with the normal operation of the high-voltage circuit during operation, while being able to collect and process fault signals in real time and accurately.

[0127] The aforementioned filtering module 10 is electrically connected to the target location point in the high-voltage circuit and is used to filter the electrical signal collected at the target location point, for example, removing the DC part and retaining the AC part, thereby extracting the signal features related to the fault.

[0128] The aforementioned sampling module 20 can amplify and convert the filtered electrical signal to obtain a sampled electrical signal. After amplification and conversion, this signal can more accurately reflect the fault characteristics in the high-voltage circuit, ensuring the signal strength and stability, so that the subsequent processing unit can effectively analyze and process the sampled electrical signal.

[0129] The input terminal of the processing module 30 is electrically connected to the output terminal of the sampling module 20. The processing module 30 converts the sampled electrical signal into a digital signal through analog-to-digital conversion, and then performs data analysis to execute the fault location method as described in the foregoing embodiments of this application. The processing module 30 performs information storage, processing and analysis, and outputs corresponding operations under different conditions. For example, the processing module 30 can analyze the sampled electrical signal in real time, calculate key parameters such as the time difference and location information of the fault signal, and perform fault location based on these parameters.

[0130] Furthermore, the processing module 30 can also output data such as the location information, time, and fault intensity of the fault point to the host computer through the communication interface, and display them graphically on the operation interface, while recording relevant information of the current location result.

[0131] Optionally, according to some embodiments of this application, the monitoring device may also use a CPO scheme with a rate of 1.6T or higher to design a communication interface for communication, ensuring sufficient data transmission rate.

[0132] Alternatively, according to some embodiments of this application, Figure 4 This is a schematic diagram of the structure of a monitoring device provided in another embodiment of this application; as shown Figure 4 As shown, the sampling module 20 includes multiple sampling units 21, and the processing module 30 includes multiple analog-to-digital conversion units 31 and a control unit 32; The input terminals of multiple sampling units 21 are electrically connected to the output terminals of the filtering module 10, the output terminals of multiple sampling units 21 are electrically connected to the corresponding input terminals of multiple analog-to-digital conversion units 31, and the input terminal of the control unit 32 is electrically connected to the output terminals of multiple analog-to-digital conversion units 31. The sampling unit 21 is used to acquire the filtered electrical signal according to the preset sampling frequency, amplify and convert the filtered electrical signal to obtain the corresponding sampled electrical signal, and output the sampled electrical signal. The analog-to-digital conversion unit 31 is used to receive the sampling electrical signal output by the corresponding sampling unit 21, and to perform analog-to-digital conversion processing on the sampling electrical signal to obtain the corresponding sampling digital signal; The control unit 32 is used to receive sampled digital signals output by multiple analog-to-digital conversion units 31, and perform summary data analysis based on the multiple sampled digital signals; Among them, the sampling frequencies of multiple sampling units 21 are consistent, and the starting sampling time points of multiple sampling units 21 are arranged at intervals, and there is a fixed phase difference between the sampling clocks of multiple analog-to-digital conversion units 31.

[0133] In practical applications, the sampling unit 21 uses, for example, an ADA4930 chip, which can convert the input single-ended signal into a differential signal and adjust its magnitude according to the bias of the input signal, making the output signal easier to calculate.

[0134] The sampling frequency of the multiple sampling units 21 is the same, but the starting sampling time points are arranged at intervals. For example, assuming that the sampling module 20 includes 4 sampling units 21, when the sampling frequency is 1 microsecond, sampling is started at 0, 0.25, 0.5, and 0.75 microseconds respectively, with the starting sampling time points spaced 0.25 microseconds apart. This helps to improve the overall sampling rate.

[0135] The aforementioned processing module 30 includes multiple analog-to-digital conversion units 31 and a control unit 32. In practice, the analog-to-digital conversion units 31 can, for example, employ a Xilinx Zynq UltraScale+ FPGA ZU49 chip, using multiple external high-speed ADC chips with matching performance operating in parallel. Each ADC's sampling clock has a fixed phase difference (e.g., 90° for four chips), thus interleaving the sampling of the same analog input signal in time.

[0136] The aforementioned control unit 32 receives sampled digital signals output from multiple analog-to-digital conversion units 31 and performs aggregated data analysis based on these sampled digital signals. The control unit 32 ultimately outputs the analysis results to a host computer via a communication interface for fault location calculation and display. The control unit 32 may employ functional modules with logic control capabilities, such as FPGAs (Field-Programmable Gate Arrays) or MCUs (Microcontroller Units), and is not limited here.

[0137] Therefore, through the collaborative design of the sampling module 20 and the processing module 30 in this embodiment, the overall sampling speed and accuracy can be effectively improved, thereby helping to achieve high-precision acquisition and rapid processing of fault signals in high-voltage circuits.

[0138] Alternatively, according to some embodiments of this application, please continue to refer to... Figure 3 or Figure 4 As shown, the filter module 10 is disposed in the metal shielding structure 11, and the inner cavity of the metal shielding structure 11 is filled with potting adhesive.

[0139] Thus, the filter module 10 is housed within the metal shielding structure 11, which helps reduce electromagnetic interference and ensures detection accuracy. The metal shielding structure 11 effectively isolates external electromagnetic interference, ensuring the stable operation of the filter module 10 under high-voltage conditions.

[0140] Furthermore, the inner cavity of the metal shielding structure 11 is filled with potting adhesive. The potting adhesive not only provides mechanical support but also increases high-voltage isolation capability, preventing high-voltage arcing and electrical breakdown, thereby effectively improving the insulation performance and reliability of the filter module 10 and enhancing the reliability of the circuit and equipment.

[0141] Alternatively, according to some embodiments of this application, please continue to refer to... Figure 3 or Figure 4 As shown, among the multiple grounding terminals GND and earth connections in the monitoring equipment, the grounding terminal GND at the metal shielding structure 11 has the shortest connection length.

[0142] Thus, the metal shielding structure 11 is preferentially grounded throughout the entire test circuit, ensuring the shortest return path and minimal interference. By designing a reasonable grounding path, voltage drop and electromagnetic interference on the grounding path can be effectively reduced, improving the anti-interference capability of the filter module 10 and enhancing the accuracy and reliability of the sampling data.

[0143] Alternatively, according to some embodiments of this application, Figure 5 This is a schematic diagram of the structure of a filter module 10 provided in one embodiment of this application. The filter module 10 includes a capacitor C1, a resistor R1, and clamping diodes D1 and D2. The capacitor C1 is disposed between the voltage source V1 and the first end of the resistor R1, the second end of the resistor R1 is grounded, the cathode of the clamping diode D1 is electrically connected to the voltage source V2 (voltage, for example, 2.5V), the anode of the clamping diode D1 is electrically connected to the cathode of the clamping diode D2, and the anode of the clamping diode D2 is electrically connected to the voltage source V3 (voltage, for example, -2.5V).

[0144] Specifically, for example, voltage source V1 is a high-voltage power supply, such as 20KV; capacitor C1 is a 10pF 30KV high-voltage capacitor; resistor R1 is a 50V 1K resistor; and D1 and D2 are clamping diodes, which can be used to prevent excessive high-voltage fluctuations from damaging the sampling circuit. Voltage sources V2 and V3 can be used to protect subsequent stages. The output terminal of filter module 10 can be an intermediate node connecting clamping diodes D1 and D2.

[0145] Optionally, according to some embodiments of this application, the input terminal of the filter module 10 can be connected to the high-voltage circuit via a high-voltage connector, which can effectively prevent leakage and electrical breakdown. This high-voltage connector has good insulation performance and mechanical strength, and can provide a stable electrical connection under high-voltage conditions, ensuring a safe connection between the filter module 10 and the high-voltage circuit.

[0146] In summary, this application utilizes the monitoring equipment provided in the above embodiments for fault location detection. This fault location mechanism supports high sampling rates, enabling rapid capture of instantaneous discharge phenomena, and possesses high measurement accuracy, accurately measuring voltage ripple and leakage current, supporting long-term power quality monitoring. Furthermore, this application has fault point location capabilities, accurately pinpointing fault locations, reducing troubleshooting and repair time, and supports automated operation, reducing manual intervention and improving operational efficiency and reliability. Moreover, in SEM application scenarios, the monitoring equipment designed using this fault location method is suitable for the size of SEMs, with a small device size for easy installation and use.

[0147] Based on the fault location method provided in the above embodiments, and with the same inventive concept, this application also provides a fault location device corresponding to the above fault location method. The following describes... Figure 6 A detailed introduction to the fault location device is provided.

[0148] Figure 6 The diagram shows a structural schematic of a fault location device provided in an embodiment of this application. A first monitoring device and a second monitoring device are provided in the high-voltage circuit from the high-voltage power supply to the load. The first monitoring device is located at the output end of the high-voltage power supply, and the second monitoring device is located at the input end of the load. Figure 6 The fault location device 600 shown includes: The first acquisition module 610 is used to acquire, in the event of a fault in the high-voltage circuit, the first moment when the first monitoring device detects the fault signal and the second moment when the second monitoring device detects the fault signal. The first determining module 620 is used to determine the detection time difference between the first monitoring device and the second monitoring device when they respectively detect the fault signal based on the difference between the first time and the second time. The second determining module 630 is used to determine the location information of the fault point that generates the fault signal from the high-voltage circuit based on the detection time difference and the test signal transmission parameters corresponding to at least some local cables in the high-voltage circuit. The test signal transmission parameters include at least two of the following: the transmission time of the test signal on the corresponding local cable, the transmission speed, and the length of the corresponding local cable.

[0149] This application provides a fault location device. A first monitoring device and a second monitoring device are installed in a high-voltage circuit from a high-voltage power supply to a load. The first monitoring device is located at the output end of the high-voltage power supply, and the second monitoring device is located at the input end of the load. By configuring corresponding functional modules, in the event of a fault in the high-voltage circuit, the device acquires the first moment when the first monitoring device detects the fault signal and the second moment when the second monitoring device detects the fault signal. Based on the difference between the first and second moments, the detection time difference between the first and second monitoring devices is determined. Based on this, and combining the detection time difference with the test signal transmission parameters corresponding to at least a portion of the local cables in the high-voltage circuit, the location information of the fault point generating the fault signal is determined from the high-voltage circuit. The test signal transmission parameters include at least two of the following: the transmission time and speed of the test signal on the corresponding local cable, and the length of the corresponding local cable.

[0150] Compared to the shortcomings of related technologies that cannot accurately locate fault points in high-voltage power supply systems, a fault location device according to an embodiment of this application employs a location mechanism based on the time difference of arrival of fault signals using dual monitoring devices. Furthermore, considering the characteristics of different sections of local cables in the high-voltage circuit (such as cables outside and inside a vacuum) leading to potentially different transmission speeds, this embodiment of the application, when determining the location of the fault point, not only relies on the detection time difference but also incorporates the test signal transmission parameters corresponding to at least some local cables in the high-voltage circuit. These test signal transmission parameters accurately reflect the signal transmission characteristics of different cable sections. Therefore, this embodiment of the application can accurately calculate the location information of the fault point, thereby achieving rapid and precise fault location, effectively improving overall fault diagnosis and maintenance efficiency, effectively reducing equipment downtime, and ultimately ensuring stable equipment operation and increased production efficiency.

[0151] Based on the fault location method provided in the above embodiments, and with the same inventive concept, this application also provides a fault location device corresponding to the above fault location method. The following describes... Figure 7 A detailed introduction to fault location equipment is provided.

[0152] Please see below. Figure 7 , Figure 7 This is a schematic diagram of the structure of a fault location device provided in an embodiment of this application.

[0153] The fault location device may include a processor 701 and a memory 702 storing computer program instructions.

[0154] Specifically, the processor 701 may include a central processing unit (CPU), an application-specific integrated circuit (ASIC), or one or more integrated circuits that can be configured to implement the embodiments of this application.

[0155] Memory 702 may include mass storage for data or instructions. For example, and not limitingly, memory 702 may include a hard disk drive (HDD), floppy disk drive, flash memory, optical disk, magneto-optical disk, magnetic tape, or Universal Serial Bus (USB) drive, or a combination of two or more of these. Where appropriate, memory 702 may include removable or non-removable (or fixed) media. Where appropriate, memory 702 may be internal or external to the integrated gateway disaster recovery device. In a particular embodiment, memory 702 is non-volatile solid-state memory.

[0156] Memory may include read-only memory (ROM), random access memory (RAM), disk storage media devices, optical storage media devices, flash memory devices, and electrical, optical, or other physical / tangible memory storage devices. Therefore, typically, memory includes one or more tangible (non-transitory) computer-readable storage media (e.g., memory devices) encoded with software including computer-executable instructions, and when the software is executed (e.g., by one or more processors), it is operable to perform the operations described with reference to the methods according to one aspect of this disclosure.

[0157] The processor 701 reads and executes computer program instructions stored in the memory 702 to implement any of the fault location methods in the above embodiments.

[0158] In one example, the data fault location device may further include a communication interface 703 and a bus 710. Wherein, as... Figure 7 As shown, the processor 701, memory 702, and communication interface 703 are connected through bus 710 and complete communication with each other.

[0159] The communication interface 703 is mainly used to realize communication between various modules, devices, units and / or equipment in the embodiments of this application.

[0160] Bus 710 includes hardware, software, or both, that couples components of a fault location device together. For example, and not limitingly, the bus may include an Accelerated Graphics Port (AGP) or other graphics bus, an Enhanced Industry Standard Architecture (EISA) bus, a Front Side Bus (FSB), HyperTransport (HT) interconnect, an Industry Standard Architecture (ISA) bus, an Infinite Bandwidth Interconnect, a Low Pin Count (LPC) bus, a memory bus, a Microchannel Architecture (MCA) bus, a Peripheral Component Interconnect (PCI) bus, a PCI-Express (PCI-X) bus, a Serial Advanced Technology Attachment (SATA) bus, a Video Electronics Standards Association Local (VLB) bus, or other suitable buses, or combinations of two or more of these. Where appropriate, bus 710 may include one or more buses. Although specific buses are described and illustrated in embodiments of this application, any suitable bus or interconnect is contemplated herein.

[0161] The fault location device executes the fault location method in the embodiments of this application, thereby realizing the fault location method described in the embodiments of this application.

[0162] Furthermore, in conjunction with the fault location methods in the above embodiments, this application embodiment can provide a computer storage medium for implementation. The computer storage medium stores computer program instructions; when these computer program instructions are executed by a processor, they implement any of the fault location methods in the above embodiments.

[0163] Based on the fault location method in the above embodiments, this application provides a computer program product. When the instructions in the computer program product are executed by the processor of an electronic device, the electronic device performs the fault location method provided in any of the above embodiments of this application.

[0164] It should be clarified that this application is not limited to the specific configurations and processes described above and shown in the figures. For the sake of brevity, detailed descriptions of known methods are omitted here. In the above embodiments, several specific steps are described and shown as examples. However, the method process of this application is not limited to the specific steps described and shown. Those skilled in the art can make various changes, modifications, and additions, or change the order of steps, after understanding the spirit of this application.

[0165] The functional blocks shown in the above-described structural diagram can be implemented as hardware, software, firmware, or a combination thereof. When implemented in hardware, they can be, for example, electronic circuits, application-specific integrated circuits (ASICs), appropriate firmware, plug-ins, function cards, etc. When implemented in software, the elements of this application are programs or code segments used to perform the required tasks. Programs or code segments can be stored on a machine-readable medium or transmitted over a transmission medium or communication link via data signals carried on a carrier wave. "Machine-readable medium" can include any medium capable of storing or transmitting information. Examples of machine-readable media include electronic circuits, semiconductor memory devices, ROM, flash memory, erasable ROM (EROM), floppy disks, CD-ROMs, optical disks, hard disks, fiber optic media, radio frequency (RF) links, etc. Code segments can be downloaded via computer networks such as the Internet, intranets, etc.

[0166] It should also be noted that the exemplary embodiments mentioned in this application describe methods or systems based on a series of steps or apparatus. However, this application is not limited to the order of the above steps; that is, the steps can be performed in the order mentioned in the embodiments, or in a different order, or several steps can be performed simultaneously.

[0167] The aspects of this disclosure have been described above with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of this disclosure. It should be understood that each block in the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing apparatus to produce a machine such that these instructions, executable via the processor of the computer or other programmable data processing apparatus, enable the implementation of the functions / actions specified in one or more blocks of the flowchart illustrations and / or block diagrams. Such a processor can be, but is not limited to, a general-purpose processor, a special-purpose processor, a special application processor, or a field-programmable logic circuit. It is also understood that each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, can also be implemented by special-purpose hardware performing the specified functions or actions, or can be implemented by a combination of special-purpose hardware and computer instructions.

[0168] The above description is merely a specific implementation of this application. Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the systems, modules, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here. It should be understood that the protection scope of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the protection scope of this application.

Claims

1. A fault location method, characterized in that, A first monitoring device and a second monitoring device are installed in the high-voltage circuit from the high-voltage power supply to the load. The first monitoring device is located at the output terminal of the high-voltage power supply, and the second monitoring device is located at the input terminal of the load. The method includes: In the event of a fault in the high-voltage circuit, the system acquires a first moment when the first monitoring device detects the fault signal and a second moment when the second monitoring device detects the fault signal. Based on the difference between the first time point and the second time point, the detection time difference between the first monitoring device and the second monitoring device detecting the fault signal is determined respectively; Based on the detection time difference and the test signal transmission parameters corresponding to at least some local cables in the high-voltage circuit, the location information of the fault point that generated the fault signal is determined from the high-voltage circuit. The test signal transmission parameters include at least two of the following: the transmission time of the test signal on the corresponding local cable, the transmission speed, and the length of the corresponding local cable.

2. The method according to claim 1, characterized in that, The test signal transmission parameters include the transmission time and the transmission speed. The determination of the location information of the fault point generating the fault signal from the high-voltage circuit based on the detection time difference and the test signal transmission parameters corresponding to at least a portion of the local cables in the high-voltage circuit includes: Based on the detection time difference and the transmission time of the test signal on at least a portion of the local cables, the target local cable where the fault point is located is determined from the at least a portion of the local cables; Based on the detection time difference and the transmission speed and transmission time of the test signal on the target local cable, the location information of the fault point on the target local cable is determined.

3. The method according to claim 2, characterized in that, The high-voltage circuit includes N devices and N-1 local cables. Among the N devices, the first device is the first monitoring device, the Nth device is the second monitoring device, and N is a positive integer greater than 2. Among the N-1 local cables, the i-th local cable is located between the second end of the i-th device and the first end of the (i+1)-th device, where 1≤i≤N-1 and i is a positive integer. The step of determining the location information of the fault point on the target local cable based on the detection time difference and the transmission speed and transmission time of the test signal on the target local cable includes: If the target local cable is determined to be the j-th local cable, the local transmission time of the fault point on the j-th local cable is calculated based on the transmission time of each local cable in the N-1 local cables and the detection time difference, where 1≤j≤N-1 and j is a positive integer. The local transmission time is the transmission time of the fault point to the second end of the j-th device, or the transmission time of the fault point to the first end of the (j+1)-th device. Based on the transmission speed and local transmission time corresponding to the j-th local cable, the location information of the fault point on the j-th local cable is determined.

4. The method according to claim 3, characterized in that, The step of determining the target local cable where the fault point is located from at least a portion of the local cables based on the detection time difference and the transmission time of the test signal on at least a portion of the local cables includes: If the detection time difference is within the preset detection time difference range corresponding to the j-th local cable, the target local cable is determined to be the j-th local cable; The lower limit of the preset detection time difference range is: when the test signal originates from the first end of the (j+1)th device, the test time difference at which the first monitoring device and the second monitoring device respectively detect the test signal; The upper limit of the preset detection time difference range is: when the test signal originates from the second end of the j-th device, the test time difference at which the first monitoring device and the second monitoring device respectively detect the test signal.

5. The method according to claim 1, characterized in that, Before determining the location information of the fault point that generated the fault signal from the high-voltage circuit based on the detection time difference and the test signal transmission parameters corresponding to at least a portion of the local cables in the high-voltage circuit, the method further includes: Obtain the length information of each of the multiple local cables in the high-voltage circuit; The transmission time of the test signal on each of the local cables is determined by testing. Based on the transmission time and length information of each of the local cables, the transmission speed of the test signal on each of the local cables is determined.

6. The method according to claim 5, characterized in that, The high-voltage circuit includes N devices and N-1 local cables. Among the N devices, the first device is the first monitoring device, the Nth device is the second monitoring device, and N is a positive integer greater than 2. Among the N-1 local cables, the i-th local cable is located between the second end of the i-th device and the first end of the (i+1)-th device, where 1≤i≤N-1 and i is a positive integer. The step of determining the transmission time of the test signal on each of the local cables through testing includes: When the test signal originates from the first monitoring device, the total transmission time between the first monitoring device and the second monitoring device is obtained; When the test signal originates from the first end and the second end of each of the devices from the second device to the (N-1)th device, multiple test time differences are obtained where the first monitoring device and the second monitoring device respectively detect the test signal. Based on the multiple test time differences and the total transmission time, the transmission time corresponding to each local cable in the N-1 local cables is determined.

7. The method according to claim 1, characterized in that, The method further includes: During the withstand voltage test phase of the high-voltage circuit, the first voltage value collected by the first monitoring device and / or the second voltage value collected by the second monitoring device are obtained. If either the first voltage value or the second voltage value is greater than the preset alarm voltage, an alarm message is output, which indicates that the withstand voltage test of the high voltage circuit has failed.

8. The method according to claim 1, characterized in that, The method further includes: Acquire voltage data collected by the first monitoring device and the second monitoring device at different time periods; Based on the voltage acquisition data and the preset threshold warning voltage point, at least a portion of the target voltage acquisition data exceeding the threshold warning voltage point within the voltage acquisition data of different time periods are recorded. Based on the target voltage acquisition data, the leakage current over-limit time of the high voltage circuit is predicted, and an early warning information is output based on the leakage current over-limit time.

9. The method according to claim 1, characterized in that, In the event of a fault in the high-voltage circuit, acquiring the first moment when the first monitoring device detects the fault signal and the second moment when the second monitoring device detects the fault signal includes: In the event of a fault in the high-voltage circuit, the first pulse waveform of the fault signal received by the first monitoring device and the second pulse waveform of the fault signal received by the second monitoring device are acquired. Based on the first pulse waveform and the second pulse waveform, the first time point and the second time point are determined by a cross-correlation algorithm.

10. A monitoring device, characterized in that, The monitoring device is the first monitoring device and / or the second monitoring device in the fault location method according to any one of claims 1-9, and the monitoring device is used to perform the fault location method according to any one of claims 1-9.

11. The monitoring device according to claim 10, characterized in that, The monitoring equipment includes a filtering module, a sampling module, and a processing module; The filtering module is electrically connected to the target location point in the high-voltage circuit. It is used to filter the electrical signal collected at the target location point and output the filtered electrical signal. The target location point is the output terminal of the high-voltage power supply or the input terminal of the load in the high-voltage circuit. The input terminal of the sampling module is electrically connected to the output terminal of the filtering module, and is used to amplify and convert the filtered electrical signal to obtain a sampled electrical signal, and output the sampled electrical signal. The input terminal of the processing module is electrically connected to the output terminal of the sampling module, and is used to perform analog-to-digital conversion and data analysis on the sampled electrical signal to execute the fault location method as described in any one of claims 1-9.

12. The monitoring device according to claim 11, characterized in that, The sampling module includes multiple sampling units, and the processing module includes multiple analog-to-digital conversion units and control units; The input terminals of the plurality of sampling units are electrically connected to the output terminals of the filtering module, the output terminals of the plurality of sampling units are electrically connected to the corresponding input terminals of the plurality of analog-to-digital conversion units, and the input terminal of the control unit is electrically connected to the output terminals of the plurality of analog-to-digital conversion units. The sampling unit is used to acquire the filtered electrical signal according to a preset sampling frequency, amplify and convert the filtered electrical signal to obtain the corresponding sampled electrical signal, and output the sampled electrical signal. The analog-to-digital conversion unit is used to receive the sampled electrical signal output by the corresponding sampling unit, and to perform analog-to-digital conversion on the sampled electrical signal to obtain the corresponding sampled digital signal; The control unit is used to receive the sampled digital signals output by the plurality of analog-to-digital conversion units, and to perform summary data analysis based on the plurality of sampled digital signals; The sampling frequencies of the multiple sampling units are consistent, and the starting sampling time points of the multiple sampling units are arranged at intervals. There is a fixed phase difference between the sampling clocks of the multiple analog-to-digital conversion units.

13. The monitoring device according to claim 12, characterized in that, The filtering module is housed within a metal shielding structure, the inner cavity of which is filled with potting adhesive.

14. The monitoring device according to claim 13, characterized in that, Among the multiple grounding terminals and ground connections in the monitoring equipment, the grounding terminal at the metal shielding structure has the shortest connection length to the ground.

15. A computer program product, characterized in that, When the instructions in the computer program product are executed by the processor of the electronic device, the electronic device performs the fault location method as described in any one of claims 1-9.

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