一种液冷计算机机箱的智能温控散热方法及系统

By collecting chip temperature and power consumption in real time, and using a dual-hypothesis prediction model and thermal resistance parameter calibration, the problems of control inaccuracy caused by thermal inertia misjudgment and aging in liquid cooling systems were solved, achieving precise heat dissipation and stability in high-performance computers.

CN122111194BActive Publication Date: 2026-07-17CHANGSHA RUITENG INFORMATION TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
CHANGSHA RUITENG INFORMATION TECH CO LTD
Filing Date
2026-04-29
Publication Date
2026-07-17

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Abstract

一种液冷计算机机箱的智能温控散热方法及系统，机箱内至少设有芯片和用于冷却芯片的液冷系统，液冷系统中至少包括水泵和冷排风扇，包括：实时采集机箱内的第一特征集，第一特征集包括芯片的核心温度、芯片的功耗以及液冷系统中冷却液的液温；基于第一特征集校准预设模型中的热阻参数，热阻参数包括计算获取的快速热阻值或预设的慢速热阻值；利用快速热阻值和热容对芯片的热负荷来源进行分析判断并获取判断结果；根据液温和预设的标准冷却液温度计算获取液冷系统的剩余蓄热能力；根据判断结果和剩余蓄热能力，生成水泵和冷排风扇的占空比集；根据占空比集向水泵和冷排风扇分别输入对应的PWM控制信号，以控制水泵和冷排风扇对芯片执行散热。
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