Method, apparatus and device for heat dissipation evaluation for data center
CN122113715APending Publication Date: 2026-05-29GDS SERVICES LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- GDS SERVICES LTD
- Filing Date
- 2025-12-31
- Publication Date
- 2026-05-29
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Figure CN122113715A_ABST
Abstract
The present disclosure provides a heat dissipation evaluation method, device and equipment for a data center. Wherein, the data center comprises a modular device, and the heat dissipation evaluation method comprises: performing a computational fluid dynamics (CFD) simulation based on a first preset working condition and a first preset inlet air temperature of the modular device to obtain a first steady-state inlet air temperature of the modular device under a steady state; determining a second preset inlet air temperature of the modular device based on the first steady-state inlet air temperature; performing a CFD simulation based on a second preset working condition and the second preset inlet air temperature of the modular device to obtain a second steady-state inlet air temperature of the modular device under a steady state; and determining a heat dissipation parameter of the modular device based on the second steady-state inlet air temperature and the second preset inlet air temperature.
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