一种芯片表面缺陷检测方法及装置、系统、存储介质
By combining detection methods using bright-field and dark-field images and employing confidence scores for evaluation, the problem of balancing high resolution and high throughput in biochip surface defect detection has been solved, achieving higher precision defect detection.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- ANHUI SHUZIXING INTELLIGENT TECH CO LTD
- Filing Date
- 2026-04-30
- Publication Date
- 2026-07-17
AI Technical Summary
In existing technologies, it is difficult to achieve both high resolution and high throughput for the detection of surface defects on biochips, resulting in insufficient detection accuracy.
A method combining bright-field and dark-field images is adopted. An initial image group is obtained through image registration, the classification and prediction distribution of defect primitives are determined, and a confidence score is constructed using the first feature information and the second feature information to determine whether the defect primitives need to be resampled to improve the detection accuracy.
By combining bright and dark field images and using confidence scores for evaluation, the accuracy and detail representation of surface defects in biochips are improved, ensuring the accuracy of the detection results.
Smart Images
Figure CN122115461B_ABST