A filter-integrated antenna based on three-dimensional packaging

Abstract

This invention proposes a three-dimensional packaged filter integrated antenna, which includes a first dielectric substrate, a first bonding plate, a second dielectric substrate, a second bonding plate, and a third dielectric substrate in a bottom-up order. The first dielectric substrate, the second dielectric substrate, the third dielectric substrate, the first bonding plate, and the second bonding plate are vertically integrated in a three-dimensional scale and stacked in a multi-layered manner to form an antenna structure. A first ground plane is disposed below the first dielectric substrate; a first U-shaped cavity and a first rectangular cavity are disposed on the first dielectric substrate. The first U-shaped cavity is formed by a U-shaped arrangement of grounded metal pillars, and the first rectangular cavity is formed by a rectangular arrangement of grounded metal pillars. One side of each rectangular cavity has a notch. The first U-shaped cavity and the first rectangular cavity are perpendicular to each other and the notches face each other without contact; a first metal disk is disposed inside the first rectangular cavity, and the first metal disk is located on the axis of symmetry of the first dielectric substrate.

Description

Technical Field

[0001] This invention belongs to the field of wireless mobile communication technology, and in particular relates to a filter integrated antenna based on three-dimensional packaging. Background Technology

[0002] With the rapid development of wireless communication technology, radio frequency (RF) front-end systems are evolving towards higher performance, greater integration, and miniaturization. As core components of the RF front-end, antennas and filters are typically cascaded to achieve signal radiation and spectrum selection. However, traditional discrete design methods treat antennas and filters as independent modules, connecting them via transmission lines or matching networks. This not only occupies a large circuit area but also introduces additional insertion loss and impedance mismatch, reducing overall system efficiency. Therefore, integrating filtering and antenna radiation functions into a single integrated antenna with a filtering response has become a research hotspot in the field of wireless communication.

[0003] Based on the structural and performance characteristics of filtered antennas, their design methods can be categorized into three types. The first method is the cascade method, which directly cascades the filter output to the antenna input into a single entity, then performs overall impedance matching. This method is simple in structure, reducing impedance mismatch and interconnection losses, but its integration is limited, and filtering and radiation performance can easily deteriorate due to mutual interference. The second method is the integrated design method, which integrates filtering and radiation functions by embedding the filter circuit in the feed network or antenna structure. This method can reduce size to some extent and utilize cross-coupling to generate multiple transmission zeros, improving out-of-band rejection. However, most existing designs are limited to two-dimensional planar structures, with the filter circuit and antenna radiator located in the same dielectric layer, leading to strong electromagnetic coupling interference between them, high design complexity, and difficulty in simultaneously optimizing filter selectivity and radiation performance. Furthermore, planar filtered antennas typically require large lateral dimensions, hindering the miniaturization of terminal devices. The third method is the fusion design method, which loads short-circuit probes, slots, or parasitic elements onto the antenna radiator to excite multiple adjacent resonant modes, thereby generating radiation zeros at the edge of the radiation passband and achieving a filtering response. Designs based on this method can achieve low loss and compact size, but the limited number of radiation zeros makes it difficult to achieve good filtering response, such as high selectivity and high out-of-band suppression. More radiation zeros mean more introduced structures, which offsets the size advantage and easily degrades radiation performance.

[0004] On the other hand, with the maturity of 3D packaging technologies such as multilayer printed circuit boards (PCBs), low-temperature co-fired ceramic (LTCC) and wafer-level packaging (WLP), RF front-end systems are gradually developing towards vertical integration. 3D packaging technology allows passive circuits, transmission lines, resonators, and antenna radiators to be distributed across different dielectric layers, interconnected through metallized vias, and shielded cavities constructed using grounded metal pillars, effectively suppressing crosstalk between different functional modules. However, research on filter antennas based on 3D packaging is still in its early stages. Most designs simply stack filters and antennas, failing to fully utilize the three-dimensional spatial freedom to compress size and improve filtering performance. Furthermore, how to embed multimode resonators into the antenna radiating structure to achieve broadband, high selectivity, and wide stopband characteristics without increasing additional area remains a pressing technical problem to be solved. Summary of the Invention

[0005] The purpose of this invention is to propose a three-dimensional packaged integrated filter antenna. Utilizing the antenna's inherent structural characteristics, a filter circuit is embedded without increasing the antenna's size. The bandwidth is broadened by creating a U-shaped slot, and open-circuit stubs are added at the two corners of the antenna's radiating portion to reduce cross-polarization. This invention also proposes a filter circuit design method based on a folded multimode resonator, achieving vertical integration in a three-dimensional scale. The technical solution of this invention balances compactness, frequency selectivity, and out-of-band rejection. Furthermore, the packaged structure ensures low loss and is highly suitable for high-density integration applications, making it well-suited for radar and satellite communication systems.

[0006] Technical Solution: To achieve the above objectives, this invention proposes a filter integrated antenna based on three-dimensional packaging. The antenna includes a first dielectric substrate, a first bonding plate, a second dielectric substrate, a second bonding plate, and a third dielectric substrate in a bottom-to-top order. The first dielectric substrate, the first bonding plate, the second dielectric substrate, the second bonding plate, and the third dielectric substrate are vertically integrated in a three-dimensional scale and stacked in multiple layers to form an antenna structure.

[0007] A first ground plane is disposed below the first dielectric substrate; a first U-shaped cavity and a first rectangular cavity are disposed on the first dielectric substrate, the first U-shaped cavity is formed by a U-shaped arrangement of grounding metal pillars, the first rectangular cavity is formed by a rectangular arrangement of grounding metal pillars, one side of the rectangle is provided with a notch, the first U-shaped cavity and the first rectangular cavity are perpendicular to each other and the notches face each other but do not contact each other; a first metal disk is disposed inside the first rectangular cavity, and the first metal disk is located on the axis of symmetry of the first dielectric substrate and is directly opposite the opening of the first U-shaped cavity.

[0008] Furthermore, a first feed stripline is disposed above the first dielectric substrate and located inside the first U-shaped cavity; a first coupling stripline, a first quarter-wavelength stripline resonator, and a first open-circuit stripline stub are located above the first dielectric substrate and inside the first rectangular cavity; a first signal transmission metal pillar penetrates the first dielectric substrate, is located directly below the first metal disk, and its two ends are respectively connected to a coaxial feed terminal and the first metal disk; the coaxial feed terminal is located directly below the first signal transmission metal pillar;

[0009] One end of the first feed strip is connected to the fourth signal transmission metal pillar, and the other end is connected to the fifth signal transmission metal pillar. Both ends of the first feed strip are circularized. The fourth signal transmission metal pillar passes through the first bonding plate, the second dielectric substrate, and the second bonding plate. The fifth signal transmission metal pillar passes through the first bonding plate, the second dielectric substrate, the second bonding plate, and the third dielectric substrate.

[0010] The first coupling stripline is arranged in an η-shape, with its short side end connected to the first metal disk; the first quarter-wavelength stripline resonator is composed of a first stripline and a second stripline, the length of the first stripline is greater than the length of the second stripline, and the width of the first stripline is less than the width of the second stripline; the long side of the first stripline is parallel to the long side of the first coupling stripline; the first coupling stripline and the first quarter-wavelength stripline resonator transmit signals through coupling; the first open-circuit stripline stub is L-shaped, with one end connected to the second stripline through the second metal disk.

[0011] Furthermore, the first bonding plate is provided with a second U-shaped cavity and a second rectangular cavity, the second U-shaped cavity and the second rectangular cavity having the same shape as the first U-shaped cavity and the first rectangular cavity respectively and being directly opposite each other; the second coupling stripline and the second quarter-wavelength stripline resonator are located above the first bonding plate and inside the second rectangular cavity; the second grounding plate is located above the first bonding plate, is rectangular, and covers the second U-shaped cavity;

[0012] The second coupling stripline has the same shape and size as the first coupling stripline and is directly opposite it, with the short end of the second coupling stripline connected to the fourth metal disk; the second quarter-wavelength stripline resonator has the same shape and size as the first quarter-wavelength stripline resonator and is directly opposite it; the second stripline of the second quarter-wavelength stripline resonator is connected to the third metal disk; the first stripline of the second quarter-wavelength stripline resonator is parallel to the long side of the second coupling stripline; the second coupling stripline and the second quarter-wavelength stripline resonator transmit signals through coupling; the third metal disk is connected to one end of the second signal transmission metal pillar; the second signal transmission metal pillar penetrates the first bonding plate, and its other end is connected to the second metal disk, realizing interlayer signal transmission; the second ground plane is connected to the first ground plane through a grounding metal pillar.

[0013] Furthermore, a third rectangular cavity is provided on the second dielectric substrate, the third rectangular cavity having the same shape as the first rectangular cavity and being directly opposite and penetrating it; a second feed strip is located above the second dielectric substrate, placed perpendicular to the opening of the third rectangular cavity; one end of the second feed strip is connected to a fifth metal disk, and the other end is connected to a sixth metal disk; the fifth metal disk is connected to one end of a third signal transmission metal pillar; the third signal transmission metal pillar penetrates the second dielectric substrate, and its other end is connected to a fourth metal disk, realizing interlayer signal transmission; the sixth metal disk is connected to the fourth signal transmission metal pillar, and is connected to the first feed strip through the fourth signal transmission metal pillar, realizing interlayer signal transmission.

[0014] Furthermore, a fourth rectangular cavity is provided on the second bonding plate, the fourth rectangular cavity having the same shape as the first rectangular cavity and being directly opposite and penetrating it; a fifth rectangular cavity is provided on the third dielectric substrate, the fifth rectangular cavity having the same shape as the first rectangular cavity and being directly opposite and penetrating it; a microstrip slotted patch is located above the third dielectric substrate; the microstrip slotted patch is connected to a fifth signal transmission metal pillar, and is connected to a first feed stripline through the fifth signal transmission metal pillar, and is excited by the first feed stripline; the microstrip slotted patch is rectangular, placed at the center of the third dielectric substrate, and has a U-shaped slot on its side near the fifth signal transmission metal pillar, and its two sides are connected to a first open-circuit stub and a second open-circuit stub respectively; the first open-circuit stub and the second open-circuit stub are L-shaped and the same size, and are placed symmetrically.

[0015] Furthermore, the thickness of the first dielectric substrate and the second dielectric substrate is 0.254 mm, the thickness of the third dielectric substrate is 1.118 mm, and the dielectric constant of all the above dielectric substrates is 3.0.

[0016] Furthermore, the thickness of the first adhesive plate is 0.306 mm, the thickness of the second adhesive plate is 0.102 mm, and the dielectric constant of both the first adhesive plate and the second adhesive plate is 3.0.

[0017] Beneficial effects: Compared with the prior art, the technical solution of the present invention has the following beneficial technical effects:

[0018] (1) This invention provides a filter integrated antenna based on three-dimensional packaging, which realizes multifunctionality and miniaturization. It has both the good radiation performance of a linearly polarized antenna and the filtering performance of the filter device itself. It replaces the cascading of multiple devices with a single device, avoiding the problem of large insertion loss and realizing the integration of multiple functions; at the same time, it has the advantage of compact size.

[0019] (2) The present invention provides a novel filter circuit design method based on a folded multimode resonator. By introducing additional cross-coupling between the source load and the resonant unit, the filter can obtain multiple zeros and high roll-off characteristics in both the upper and lower stopbands, resulting in good out-of-band rejection. Therefore, the filter antenna achieves good frequency selectivity and out-of-band rejection capability.

[0020] (3) The present invention introduces additional resonance by loading a U-shaped slot, which broadens the bandwidth of the antenna and makes the antenna have broadband characteristics; open stubs are loaded at the two corners of the antenna radiation part to reduce the cross polarization level of the antenna.

[0021] (4) The present invention embeds a metal shielding cavity inside the antenna, which not only ensures low loss, but also makes the antenna very suitable for high-density integrated self-encapsulated application scenarios. Attached Figure Description

[0022] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments, so as to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art. The advantages and implementation methods of the present invention will become more apparent. The content of the accompanying drawings is only used to illustrate and explain the present invention, but does not constitute any limitation on the present invention. In the accompanying drawings:

[0023] Figure 1 This is a three-dimensional structural schematic diagram of a filter integrated antenna based on three-dimensional packaging according to the present invention.

[0024] Figure 2 This is a partial structural diagram of the first and second layers of the structure of the present invention.

[0025] Figure 3 This is a schematic diagram of the planar dimensions of the three-dimensional structure of the present invention, including the microstrip slotted patch and the third dielectric substrate.

[0026] Figure 4This is a schematic diagram of the planar dimensions of the three-dimensional structure of the present invention, including the second feed strip and the second dielectric substrate.

[0027] Figure 5 This is a schematic diagram of the planar dimensions of the three-dimensional structure of the present invention, including the first feed strip and the first dielectric substrate.

[0028] Figure 6 This is a schematic diagram of the planar dimensions of the three-dimensional structure of the present invention, including the second grounding plate and the first bonding plate.

[0029] Figure 7 This is a schematic diagram of the planar dimensions of the three-dimensional structure of the present invention, including the first dielectric substrate and its upper circuit.

[0030] Figure 8 This is a diagram showing the S-parameters and gain curves of a three-dimensional packaged filter integrated antenna according to the present invention.

[0031] Figure 9 This is the radiation pattern at 13 GHz of a three-dimensional packaged filter integrated antenna according to the present invention. Detailed Implementation

[0032] The embodiments of the present invention will now be described with reference to the accompanying drawings. The embodiments shown in the drawings are merely exemplary and intended to explain the principles of the present invention, and are not intended to limit the scope of the present invention.

[0033] like Figure 1 and Figure 2 As shown, the present invention proposes a filter integrated antenna based on three-dimensional packaging. The antenna includes a first dielectric substrate 100, a first bonding plate 200, a second dielectric substrate 300, a second bonding plate 400, and a third dielectric substrate 500 in a bottom-to-top order. The first dielectric substrate 100, the first bonding plate 200, the second dielectric substrate 300, the second bonding plate 400, and the third dielectric substrate 500 are vertically integrated in a three-dimensional scale and stacked in a multi-layer center to form an antenna structure.

[0034] A first ground plane 120 is disposed below the first dielectric substrate 100; a first U-shaped cavity and a first rectangular cavity are disposed on the first dielectric substrate 100, the first U-shaped cavity is formed by a U-shaped arrangement of grounding metal pillars 211, and the first rectangular cavity is formed by a rectangular arrangement of grounding metal pillars 211, one side of the rectangle is provided with a notch, the first U-shaped cavity and the first rectangular cavity are perpendicular to each other and the notches face each other but do not contact each other; a first metal disk 104 is disposed inside the first rectangular cavity, and the first metal disk 104 is located on the axis of symmetry of the first dielectric substrate 100 and is directly opposite the opening of the first U-shaped cavity.

[0035] Furthermore, a first feed stripline 106 is disposed above the first dielectric substrate 100 and located inside the first U-shaped cavity; a first coupling stripline 101, a first quarter-wavelength stripline resonator 102, and a first open-circuit stripline stub 103 are located above the first dielectric substrate 100 and inside the first rectangular cavity; a first signal transmission metal pillar 107 penetrates the first dielectric substrate 100, is located directly below the first metal disk 104, and its two ends are respectively connected to the coaxial feed terminal 121 and the first metal disk 104; the coaxial feed terminal 121 is located directly below the first signal transmission metal pillar 107;

[0036] One end of the first feed strip 106 is connected to the fourth signal transmission metal pillar 305, and the other end is connected to the fifth signal transmission metal pillar 501. Both ends of the first feed strip 106 are circularized. The fourth signal transmission metal pillar 305 passes through the first bonding plate 200, the second dielectric substrate 300, and the second bonding plate 400. The fifth signal transmission metal pillar 501 passes through the first bonding plate 200, the second dielectric substrate 300, the second bonding plate 400, and the third dielectric substrate 500.

[0037] The first coupling stripline 101 is arranged in an η-shape, with its short side end connected to the first metal disk 104; the first quarter-wavelength stripline resonator 102 is composed of a first stripline and a second stripline, the length of the first stripline is greater than the length of the second stripline, and the width of the first stripline is less than the width of the second stripline; the first stripline is parallel to the long side of the first coupling stripline 101; the first coupling stripline 101 and the first quarter-wavelength stripline resonator 102 transmit signals through coupling; the first open-circuit stripline stub 103 is L-shaped, with one end connected to the second stripline through the second metal disk 105.

[0038] Furthermore, the first bonding plate 200 is provided with a second U-shaped cavity and a second rectangular cavity, the second U-shaped cavity and the second rectangular cavity having the same shape as the first U-shaped cavity and the first rectangular cavity respectively and being directly opposite and penetrating each other; the second coupling stripline 201 and the second quarter-wavelength stripline resonator 202 are located above the first bonding plate 200 and inside the second rectangular cavity; the second grounding plate 210 is located above the first bonding plate 200, is rectangular, and covers the second U-shaped cavity;

[0039] The second coupling stripline 201 has the same shape and size as the first coupling stripline 101 and is directly opposite to it, and the short end of the second coupling stripline 201 is connected to the fourth metal disk 204; the second quarter-wavelength stripline resonator 202 has the same shape and size as the first quarter-wavelength stripline resonator 102 and is directly opposite to it; the second stripline of the second quarter-wavelength stripline resonator 202 is connected to the third metal disk 205; the first stripline of the second quarter-wavelength stripline resonator 202 is parallel to the long side of the second coupling stripline 201; the second coupling stripline 201 and the second quarter-wavelength stripline resonator 202 transmit signals through coupling; the third metal disk 205 is connected to one end of the second signal transmission metal post 203; the second signal transmission metal post 203 passes through the first bonding plate 200, and its other end is connected to the second metal disk 105 to realize interlayer signal transmission; the second ground plane 210 is connected to the first ground plane 120 through the grounding metal post 211.

[0040] Furthermore, a third rectangular cavity is provided on the second dielectric substrate 300, the third rectangular cavity having the same shape as the first rectangular cavity and being directly opposite and penetrating it; a second feed strip 303 is located above the second dielectric substrate 300, placed perpendicular to the opening of the third rectangular cavity; one end of the second feed strip 303 is connected to the fifth metal disk 301, and the other end is connected to the sixth metal disk 302; the fifth metal disk 301 is connected to one end of the third signal transmission metal pillar 304; the third signal transmission metal pillar 304 penetrates the second dielectric substrate 300, and its other end is connected to the fourth metal disk 204, realizing interlayer signal transmission; the sixth metal disk 302 is connected to the fourth signal transmission metal pillar 305, and is connected to the first feed strip 106 through the fourth signal transmission metal pillar 305, realizing interlayer signal transmission.

[0041] Furthermore, the second bonding plate 400 is provided with a fourth rectangular cavity, which has the same shape as the first rectangular cavity and is directly opposite to it; the third dielectric substrate 500 is provided with a fifth rectangular cavity, which has the same shape as the first rectangular cavity and is directly opposite to it; the microstrip slotted patch 600 is located above the third dielectric substrate 500; the microstrip slotted patch 600 is connected to the fifth signal transmission metal pillar 501, and is connected to the first feed strip 106 through the fifth signal transmission metal pillar 501, and is excited by the first feed strip 106; the microstrip slotted patch 600 is rectangular and placed at the center of the third dielectric substrate 500, and has a U-shaped slot 601 on its side near the fifth signal transmission metal pillar 501, and its two sides are connected to the first open-circuit stub 602 and the second open-circuit stub 603 respectively; the first open-circuit stub 602 and the second open-circuit stub 603 are L-shaped and the same size, and are placed symmetrically.

[0042] Furthermore, the thickness of the first dielectric substrate 100 and the second dielectric substrate 300 is 0.254 mm, the thickness of the third dielectric substrate 500 is 1.118 mm, and the dielectric constant of all the above dielectric substrates is 3.0.

[0043] Furthermore, the thickness of the first adhesive plate 200 is 0.306 mm, the thickness of the second adhesive plate 400 is 0.102 mm, and the dielectric constant of both the first adhesive plate 200 and the second adhesive plate 400 is 3.0.

[0044] This design example achieves both multifunctionality and miniaturization, with a final size of 0.65λg * 0.65λg * 0.088λg, as shown below. Figures 3-7As shown, the specific dimensions are shown in Table 1 (unit: mm); where L and W represent the length and width of the microstrip slotted patch 600, respectively; L1 and W1 represent the length and width of the second grounding plate 210, respectively; l1, l2, and w1 represent the length and width of the two perpendicular segments of the first open-circuit stub 602, respectively; l3, l4, and w2 represent the length and width of the three segments of the U-shaped slot 601, respectively; l5 and w3 represent the length and width of the second feed stripline 303, respectively; l6, l7, and w4 represent the length, distance from the end near the grounding metal post 211 to the center of the latter, and width of the first feed stripline 106, respectively; x1, x2, x3-x7, z1, and z2 represent the length and width of the three segments of the first coupling stripline 101, respectively; x3, z3, x4, and z4 represent the length and width of the first stripline of the first quarter-wavelength stripline resonator 102, respectively. The length and width of the first stripline and the second stripline; x7 represents the horizontal spacing between the first stripline of the first quarter-wavelength stripline resonator 102 and the long side of the first coupling stripline 101; x5, z5 and x6, z6 represent the length and width of the two perpendicular segments of the first open-circuit stripline stub 103, respectively; g represents the coupling spacing between the first coupling stripline 101 and the first quarter-wavelength stripline resonator 102; r1, r2, r3, r4 and r5 represent the radii of the fifth metal disk 301 and the sixth metal disk 302, the radius of the grounding metal post 211, the radius of the two through holes opened on the second grounding plate 210, the radius of the second metal disk 105 and the radius of the first metal disk 104, respectively; d1 and d2 represent the distance between the grounding metal posts 211 in the U-shaped cavity and the rectangular cavity, respectively.

[0045] The simulation results of this invention show a 10-dB impedance bandwidth in the range of 12.27 GHz to 13.67 GHz (relative bandwidth of 10.8%), and a peak actual gain of 5.17 dBi. Figure 8 The response of the integrated filter antenna is demonstrated. The designed integrated filter antenna achieves a suppression level of 26.8 dB in the lower near-stopband and 34.9 dB in the upper near-stopband, indicating the high selectivity of this invention. Furthermore, six radiation nulls are clearly observed on the left and right sides of the passband, and the 10-dB stopband suppression is as high as 1.54f0, demonstrating excellent out-of-band suppression performance. Figure 9 Figures (a) and (b) show the radiation patterns of the filter integrated antenna in the E and H planes at a center frequency of 13 GHz, respectively. They demonstrate omnidirectional radiation characteristics and the cross-polarization level remains below -11 dB, indicating good radiation performance.

[0046] Table 1

[0047]

[0048] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, chip, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, chip, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, chip, article, or apparatus that includes said element.

[0049] The above description is merely a preferred embodiment of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention are included within the scope of protection of the present invention.

Claims

1. A three-dimensional package based filtered integrated antenna, characterized by, The antenna includes, in order from bottom to top, a first dielectric substrate, a first bonding plate, a second dielectric substrate, a second bonding plate, and a third dielectric substrate; The first dielectric substrate, the first bonding plate, the second dielectric substrate, the second bonding plate, and the third dielectric substrate are vertically integrated in three dimensions and stacked in a multi-layered manner to form an antenna structure. A first ground plane is provided below the first dielectric substrate; The first dielectric substrate has a first U-shaped cavity and a first rectangular cavity. The first U-shaped cavity is formed by a U-shaped arrangement of grounded metal pillars, and the first rectangular cavity is formed by a rectangular arrangement of grounded metal pillars. One side of the rectangle has a notch. The first U-shaped cavity and the first rectangular cavity are perpendicular to each other and the notches face each other but do not contact each other. A first metal disk is disposed inside the first rectangular cavity. The first metal disk is located on the axis of symmetry of the first dielectric substrate and is directly opposite the opening of the first U-shaped cavity. A first feed stripline is disposed above a first dielectric substrate and located inside a first U-shaped cavity; a first coupling stripline, a first quarter-wavelength stripline resonator, and a first open-circuit stripline stub are located above the first dielectric substrate and inside a first rectangular cavity; a first signal transmission metal pillar penetrates the first dielectric substrate, is located directly below a first metal disk, and its two ends are respectively connected to a coaxial feed terminal and a first metal disk; the coaxial feed terminal is located directly below the first signal transmission metal pillar; One end of the first feed strip is connected to the fourth signal transmission metal pillar, and the other end is connected to the fifth signal transmission metal pillar. Both ends of the first feed strip are circularized. The fourth signal transmission metal pillar passes through the first bonding plate, the second dielectric substrate, and the second bonding plate. The fifth signal transmission metal pillar passes through the first bonding plate, the second dielectric substrate, the second bonding plate, and the third dielectric substrate. The first coupling stripline is arranged in an η-shape, with its short side end connected to the first metal disk; the first quarter-wavelength stripline resonator is composed of a first stripline and a second stripline, the length of the first stripline is greater than the length of the second stripline, and the width of the first stripline is less than the width of the second stripline; the first stripline is parallel to the long side of the first coupling stripline; the first coupling stripline and the first quarter-wavelength stripline resonator transmit signals through coupling; the first open-circuit stripline stub is L-shaped, with one end connected to the second stripline through the second metal disk; The first bonding plate is provided with a second U-shaped cavity and a second rectangular cavity. The second U-shaped cavity and the second rectangular cavity have the same shape as the first U-shaped cavity and the first rectangular cavity, respectively, and are directly opposite each other and penetrate through each other. The second coupling stripline and the second quarter-wavelength stripline resonator are located above the first bonding plate and inside the second rectangular cavity. The second grounding plate is located above the first bonding plate, is rectangular in shape, and covers the second U-shaped cavity; The second coupling stripline has the same shape and size as the first coupling stripline and is directly opposite it, and the short end of the second coupling stripline is connected to the fourth metal disk; the second quarter-wavelength stripline resonator has the same shape and size as the first quarter-wavelength stripline resonator and is directly opposite it. The second stripline of the second quarter-wavelength stripline resonator is connected to the third metal disk; the first stripline of the second quarter-wavelength stripline resonator is parallel to the long side of the second coupled stripline; the second coupled stripline and the second quarter-wavelength stripline resonator transmit signals through coupling; the third metal disk is connected to one end of the second signal transmission metal pillar; the second signal transmission metal pillar passes through the first bonding plate, and its other end is connected to the second metal disk to realize interlayer signal transmission; the second ground plane is connected to the first ground plane through a grounding metal pillar. A third rectangular cavity is provided on the second dielectric substrate. The third rectangular cavity has the same shape as the first rectangular cavity and is directly opposite to it. A second feed strip is located above the second dielectric substrate and is placed perpendicular to the opening of the third rectangular cavity. One end of the second feed strip is connected to a fifth metal disk, and the other end is connected to a sixth metal disk. The fifth metal disk is connected to one end of a third signal transmission metal pillar. The third signal transmission metal pillar penetrates the second dielectric substrate, and its other end is connected to a fourth metal disk to realize interlayer signal transmission. The sixth metal disk is connected to the fourth signal transmission metal pillar and is connected to the first feed strip through the fourth signal transmission metal pillar to realize interlayer signal transmission. The second bonding plate has a fourth rectangular cavity, which has the same shape as the first rectangular cavity and is directly opposite to it. The third dielectric substrate has a fifth rectangular cavity, which has the same shape as the first rectangular cavity and is directly opposite to it. The microstrip slotted patch is located above the third dielectric substrate. The microstrip slotted patch is connected to a fifth signal transmission metal pillar and is connected to a first feed stripline through the fifth signal transmission metal pillar. The microstrip slotted patch is excited through the first feed stripline. The microstrip slotted patch is rectangular and placed at the center of the third dielectric substrate. A U-shaped slot is provided on the side of the patch closest to the fifth signal transmission metal pillar, and its two sides are connected to a first open-circuit stub and a second open-circuit stub, respectively. The first open-circuit stub and the second open-circuit stub are L-shaped and the same size, and are placed symmetrically.

2. The filter integrated antenna based on three-dimensional packaging according to claim 1, characterized in that, The thickness of the first dielectric substrate and the second dielectric substrate is 0.254 mm, the thickness of the third dielectric substrate is 1.118 mm, and the dielectric constant of all the above dielectric substrates is 3.

0.

3. The filter integrated antenna based on three-dimensional packaging according to claim 1, characterized in that, The thickness of the first bonding plate is 0.306 mm, the thickness of the second bonding plate is 0.102 mm, and the dielectric constant of both the first and second bonding plates is 3.0.

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