基于弹性微球增强的SnBi低温热压键合方法及结构
By employing a low-temperature hot-press bonding method for SnBi reinforced with elastic microspheres, the problems of brittle fracture and overflow of SnBi solder joints are solved by utilizing the pre-stress interlocking mechanism of metallized elastic microspheres and a precise hot-press cooling sequence, thus achieving a low-temperature interconnect structure with high reliability and high yield.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- 江苏中科智芯集成科技有限公司
- Filing Date
- 2026-04-23
- Publication Date
- 2026-07-17
AI Technical Summary
Existing SnBi interconnect technology suffers from brittle fracture and overflow issues in thermocompression bonding applications, making it difficult to achieve both high mechanical reliability and high yield.
A SnBi low-temperature hot-press bonding method based on elastic microsphere reinforcement was adopted. By preparing a composite solder paste containing metallized elastic microspheres, the prestress interlocking mechanism of the metallized elastic microspheres was utilized. Combined with a precise hot-pressing and cooling sequence, the internal rebound compressive stress of the solder joint was used to offset the external impact, and the deformation of the metallized elastic microspheres was used to prevent the liquid solder from overflowing.
It effectively overcomes the brittle fracture problem of SnBi solder joints, avoids short circuits in solder pads, achieves a low-temperature interconnect structure with high reliability and high yield, and improves drop resistance.
Smart Images
Figure CN122121074B_ABST