一种适用于MicroLED的混合器件封装体结构的封装方法
By employing wide-bandgap semiconductor driver chips, dielectric layer deposition, and metal interconnects to construct electrical interconnect structures in MicroLED display panels, the problems of thermal failure and high-frequency signal delay under high-temperature environments are solved, thereby improving array mounting yield and signal integrity of the display system.
CN122121371BActive Publication Date: 2026-07-17SUZHOU XINJU SEMICON LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SUZHOU XINJU SEMICON LTD
- Filing Date
- 2026-04-29
- Publication Date
- 2026-07-17
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Figure CN122121371B_ABST
Abstract
本发明涉及微电子封装与新型显示技术领域，公开了一种适用于MicroLED的混合器件封装体结构的封装方法，包括制备宽禁带半导体驱动芯片、逻辑控制芯片与发光像素芯片，将宽禁带半导体驱动芯片、逻辑控制芯片与发光像素芯片共面转移固定于载板表面；在载板表面沉积介质层暴露电极接点，制作金属连线构建内部电气互连结构并引出外围接口；在载板表面涂布封装材料对内部电气互连结构进行绝缘包覆，固化切割分离出独立的像素封装体；将像素封装体组装至显示面板基板及外围接口接入全局供电网络。本发明抑制了高温工况下热载流子效应，解决热失效问题，降低高频驱动互连寄生电容，并在宏观贴装前剔除潜在失效品，提升显示面板阵列组装良率。
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