Display panel and display device

Abstract

The application discloses a display panel and a display device. The display panel comprises a substrate, an isolation structure arranged on one side of the substrate, the isolation structure being provided with an isolation opening, the isolation structure comprising a first isolation part and a second isolation part located on the side, away from the substrate, of the first isolation part, the second isolation part being arranged protruding from the first isolation part towards the isolation opening, the first isolation part comprising a first sub-part and a second sub-part in contact with each other, the second sub-part having a different thermal expansion coefficient from that of the first sub-part, light emitting devices, at least part of the light emitting devices being arranged in the isolation opening, and a first encapsulation layer arranged on the side, away from the substrate, of the light emitting devices, the sidewall of the first sub-part and / or the sidewall of the second sub-part being in contact with the first encapsulation layer. The display panel provided by the application has good structural reliability.

Description

Technical Field

[0001] This application belongs to the field of display technology, and in particular relates to a display panel and display device. Background Technology

[0002] Organic light-emitting diodes (OLEDs) and flat panel displays based on light-emitting diodes (LEDs) are widely used in various consumer electronics products such as mobile phones, televisions, laptops, and desktop computers due to their advantages such as high image quality, energy saving, thin body, and wide range of applications, becoming the mainstream of display devices.

[0003] However, the current manufacturing process of OLED display products needs improvement. Summary of the Invention

[0004] This application provides a display panel and a display device, which aim to improve the structural reliability of the display panel.

[0005] An embodiment of the first aspect of this application provides a display panel, comprising: a substrate; an isolation structure disposed on one side of the substrate, the isolation structure having an isolation opening, the isolation structure including a first isolation portion and a second isolation portion located on the side of the first isolation portion away from the substrate, the second isolation portion protruding from the first isolation portion toward the isolation opening, the first isolation portion including a first portion and a second portion in contact with each other, the coefficient of thermal expansion of the second portion being different from that of the first portion; a light-emitting device, at least a portion of the light-emitting device being disposed within the isolation opening; and a first encapsulation layer disposed on the side of the light-emitting device away from the substrate, the sidewall of the first portion and / or the sidewall of the second portion being in contact with the first encapsulation layer.

[0006] According to an embodiment of the first aspect of this application, the second portion is disposed on at least one side of the first portion in the thickness direction of the display panel.

[0007] According to any of the foregoing embodiments of the first aspect of this application, the material of the first portion includes a conductive material, and / or the material of the second portion includes a conductive material.

[0008] According to any of the foregoing embodiments of the first aspect of this application, the material of the second isolation portion includes titanium, and / or the material of the first portion includes aluminum, and / or the material of the second portion includes at least one of aluminum nitride, molybdenum nitride and titanium nitride.

[0009] According to any of the foregoing embodiments of the first aspect of this application, the first isolation portion further includes a transition portion disposed between the first portion and the second portion, wherein the coefficient of thermal expansion of the transition portion is between the coefficient of thermal expansion of the first portion and the coefficient of thermal expansion of the second portion.

[0010] According to any of the foregoing embodiments of the first aspect of this application, the coefficient of thermal expansion of the second portion is less than that of the first portion, the coefficient of thermal expansion of the transition portion is less than that of the first portion, and the coefficient of thermal expansion of the transition portion is greater than that of the second portion.

[0011] According to any of the foregoing embodiments of the first aspect of this application, the material of the transition portion includes a conductive material.

[0012] According to any of the foregoing embodiments of the first aspect of this application, the material of the transition portion includes at least one of aluminum nitride, molybdenum nitride, and titanium nitride.

[0013] According to any of the foregoing embodiments of the first aspect of this application, the first portion is provided with a receiving groove, and the second portion is disposed within the receiving groove.

[0014] According to any of the foregoing embodiments of the first aspect of this application, the receiving groove is formed on the side of the first portion away from the substrate.

[0015] According to any of the foregoing embodiments of the first aspect of this application, the material of the second isolation portion includes titanium, and / or the material of the first portion includes aluminum, and / or the material of the second portion includes at least one of aluminum nitride, molybdenum nitride and titanium nitride.

[0016] According to any of the foregoing embodiments of the first aspect of this application, the number of receiving slots is multiple, and the multiple receiving slots are spaced apart around the periphery of the isolation opening, or the receiving slots are annular, and the receiving slots are arranged around at least one isolation opening.

[0017] According to any of the foregoing embodiments of the first aspect of this application, the dimension of the receiving groove in the thickness direction of the display panel is less than or equal to the dimension of the first portion in the thickness direction of the display panel.

[0018] According to any of the foregoing embodiments of the first aspect of this application, the coefficient of thermal expansion of the second portion is less than the coefficient of thermal expansion of the first portion, and there is a first difference between the coefficient of thermal expansion of the first encapsulation layer and the coefficient of thermal expansion of the first portion, the first difference being less than or equal to 50% of the coefficient of thermal expansion of the first portion, and / or, there is a second difference between the coefficient of thermal expansion of the first encapsulation layer and the coefficient of thermal expansion of the second portion, the second difference being less than or equal to 50% of the coefficient of thermal expansion of the first portion.

[0019] According to any of the foregoing embodiments of the first aspect of this application, the second difference is less than or equal to 50% of the coefficient of thermal expansion of the second portion.

[0020] According to any of the foregoing embodiments of the first aspect of this application, the coefficient of thermal expansion of the first encapsulation layer is less than the coefficient of thermal expansion of the first portion, and / or, the coefficient of thermal expansion of the first encapsulation layer is less than the coefficient of thermal expansion of the second portion.

[0021] According to any of the foregoing embodiments of the first aspect of this application, the material of the first encapsulation layer includes an inorganic material, and / or the material of the first portion includes a conductive material, and / or the material of the second portion includes a conductive material.

[0022] According to any of the foregoing embodiments of the first aspect of this application, the material of the first encapsulation layer includes silicon nitride.

[0023] According to any of the foregoing embodiments of the first aspect of this application, in the direction away from the substrate, the light-emitting device includes a first electrode, a light-emitting unit and a second electrode stacked sequentially, the material of the isolation structure includes a conductive material, and the second electrode is connected to the isolation structure.

[0024] According to any of the foregoing embodiments of the first aspect of this application, the second electrode is connected to the first isolation portion.

[0025] According to any of the foregoing embodiments of the first aspect of this application, the isolation structure further includes a third isolation portion disposed on the side of the first isolation portion facing the substrate, the third isolation portion protruding from the first isolation portion toward the isolation opening, and the second electrode being connected to the third isolation portion.

[0026] According to any of the foregoing embodiments of the first aspect of this application, the material of the third isolation section includes molybdenum.

[0027] According to any of the foregoing embodiments of the first aspect of this application, there is a third difference between the thermal expansion coefficient of the second electrode and the thermal expansion coefficient of the first portion, the third difference being less than or equal to 50% of the thermal expansion coefficient of the first portion, and / or, there is a fourth difference between the thermal expansion coefficient of the second electrode and the thermal expansion coefficient of the second portion, the fourth difference being less than or equal to 50% of the thermal expansion coefficient of the first portion.

[0028] According to any of the foregoing embodiments of the first aspect of this application, the fourth difference is less than or equal to 50% of the coefficient of thermal expansion of the second portion.

[0029] An embodiment of the first aspect of this application also provides a display panel, comprising: a substrate; an isolation structure disposed on one side of the substrate, the isolation structure having an isolation opening, the isolation structure including a first isolation portion and a second isolation portion located on the side of the first isolation portion away from the substrate, the second isolation portion protruding from the first isolation portion toward the isolation opening; a light-emitting device, at least a portion of the light-emitting device being disposed within the isolation opening; and a first encapsulation layer disposed on the side of the light-emitting device away from the substrate and in contact with the isolation structure, wherein the coefficient of thermal expansion of the first encapsulation layer has a first preset difference with the coefficient of thermal expansion of at least a portion of the structure in the first isolation portion, the first preset difference being less than or equal to 50% of the maximum coefficient of thermal expansion in the first isolation portion.

[0030] According to an embodiment of the first aspect of this application, the first isolation portion includes a first part and a second part that are in contact with each other, wherein the coefficient of thermal expansion of the second part is less than the coefficient of thermal expansion of the first part.

[0031] According to an embodiment of the first aspect of this application, the sidewall of the first portion and / or the sidewall of the second portion are in contact with the first encapsulation layer.

[0032] According to any of the foregoing embodiments of the first aspect of this application, the coefficient of thermal expansion of the first encapsulation layer is less than the coefficient of thermal expansion of the first portion, and / or, the coefficient of thermal expansion of the first encapsulation layer is less than the coefficient of thermal expansion of the second portion.

[0033] According to any of the foregoing embodiments of the first aspect of this application, the material of the first encapsulation layer includes an inorganic material, and / or the material of the first portion includes a conductive material, and / or the material of the second portion includes a conductive material.

[0034] According to any of the foregoing embodiments of the first aspect of this application, the material of the first encapsulation layer includes silicon nitride.

[0035] According to any of the foregoing embodiments of the first aspect of this application, there is a first difference between the thermal expansion coefficient of the first encapsulation layer and the thermal expansion coefficient of the first portion, the first difference being less than or equal to 50% of the thermal expansion coefficient of the first portion, and / or, there is a second difference between the thermal expansion coefficient of the first encapsulation layer and the thermal expansion coefficient of the second portion, the second difference being less than or equal to 50% of the thermal expansion coefficient of the first portion.

[0036] According to any of the foregoing embodiments of the first aspect of this application, the second difference is less than or equal to 50% of the coefficient of thermal expansion of the second portion.

[0037] According to any of the foregoing embodiments of the first aspect of this application, in the direction away from the substrate, the light-emitting device includes a first electrode, a light-emitting unit and a second electrode stacked sequentially, the material of the isolation structure includes a conductive material, and the second electrode is connected to the isolation structure.

[0038] According to any of the foregoing embodiments of the first aspect of this application, the second electrode is connected to the first isolation portion.

[0039] According to any of the foregoing embodiments of the first aspect of this application, there is a third difference between the thermal expansion coefficient of the second electrode and the thermal expansion coefficient of the first portion, the third difference being less than or equal to 50% of the thermal expansion coefficient of the first portion, and / or, there is a fourth difference between the thermal expansion coefficient of the second electrode and the thermal expansion coefficient of the second portion, the fourth difference being less than or equal to 50% of the thermal expansion coefficient of the first portion.

[0040] According to any of the foregoing embodiments of the first aspect of this application, the fourth difference is less than or equal to 50% of the coefficient of thermal expansion of the second portion.

[0041] According to any of the foregoing embodiments of the first aspect of this application, the isolation structure further includes a third isolation portion disposed on the side of the first isolation portion facing the substrate, the third isolation portion protruding from the first isolation portion toward the isolation opening, and the second electrode being connected to the third isolation portion.

[0042] According to any of the foregoing embodiments of the first aspect of this application, the material of the third isolation section includes molybdenum.

[0043] An embodiment of the first aspect of this application also provides a display panel, comprising: a substrate; an isolation structure disposed on one side of the substrate, the isolation structure having an isolation opening, the isolation structure including a first isolation portion and a second isolation portion located on the side of the first isolation portion away from the substrate, the second isolation portion protruding from the first isolation portion toward the isolation opening, the first isolation portion including a first portion and a second portion in contact with each other, the coefficient of thermal expansion of the second portion being different from the coefficient of thermal expansion of the first portion; a light-emitting device, at least a portion of the light-emitting device being disposed within the isolation opening; and a first encapsulation layer disposed on the side of the light-emitting device away from the substrate, the first encapsulation layer and the sidewall of the first isolation portion being in continuous contact from the side closer to the substrate to the side farther from the substrate.

[0044] An embodiment of the second aspect of this application provides a display device, which includes a display panel of any of the above embodiments.

[0045] In a display panel provided in this application embodiment, the display panel includes a substrate, an isolation structure, a light-emitting device, and a first encapsulation layer. The isolation structure is disposed on one side of the substrate, and the isolation structure has an isolation opening. At least a portion of the structure of the light-emitting device is disposed within the isolation opening. The isolation structure can be used to participate in dividing the sub-pixels of the display panel.

[0046] The isolation structure includes a first isolation portion and a second isolation portion located on the side of the first isolation portion away from the substrate. The second isolation portion protrudes from the first isolation portion toward the isolation opening, so that the isolation structure can be used to block at least a portion of the material of the light-emitting device, which facilitates the fabrication of the light-emitting device.

[0047] The first encapsulation layer is disposed on the side of the light-emitting device facing away from the substrate, and the first encapsulation layer can be used to encapsulate the light-emitting device. The first isolation portion includes a first portion and a second portion that are in contact with each other. By providing the sidewalls of the first portion and / or the sidewalls of the second portion to contact the first encapsulation layer, the encapsulation path of the first encapsulation layer can be extended better, and the first encapsulation layer can be better attached to the first isolation portion to limit external impurities from invading the light-emitting device through the sidewalls of the first isolation portion.

[0048] By setting the coefficient of thermal expansion of the second part to be different from that of the first part, the first isolation part as a whole can have more suitable thermal expansion characteristics. This makes it less likely that the first isolation part will undergo excessive volume changes during the manufacturing process of the display panel, allowing the first isolation part and the first encapsulation layer to fit more tightly. This can better improve the interface anomalies between the first isolation part and the first encapsulation layer, thereby improving the structural reliability of the display panel and the encapsulation effect of the first encapsulation layer. Attached Figure Description

[0049] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments of this application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0050] Figure 1 This is a schematic diagram of an isolation structure provided in an embodiment of this application;

[0051] Figure 2 This is a partial cross-sectional view of a display panel provided in an embodiment of this application;

[0052] Figure 3 This is a partial cross-sectional view of a display panel provided in another embodiment of this application;

[0053] Figure 4 This is a partial cross-sectional view of a display panel provided in another embodiment of this application;

[0054] Figure 5 This is a partial cross-sectional view of a display panel provided in another embodiment of this application;

[0055] Figure 6 This is a schematic diagram of the structure of a first part provided in an embodiment of this application;

[0056] Figure 7 This is a schematic diagram of the structure of a first part provided in another embodiment of this application;

[0057] Figure 8 This is a partial cross-sectional view of a display panel provided in another embodiment of this application;

[0058] Figure 9 This is a partial cross-sectional view of a display panel provided in another embodiment of this application.

[0059] Explanation of reference numerals in the attached figures:

[0060] 10. Display panel;

[0061] 100, Substrate; 110, Substrate; 120, First insulating layer; 130, Second insulating layer; 140, Third insulating layer; 150, Driving circuit; 151, Transistor; 151a, Gate; 151b, Source / drain; 152, Storage capacitor; 152a, First electrode; 152b, Second electrode;

[0062] 200, Pixel definition layer; 210, Pixel limiting section; 220, Pixel opening;

[0063] 300, Isolation structure; 300a, Isolation opening; 300aa, First opening; 300ab, Second opening; 300ac, Third opening; 310, First isolation section; 311, First subsection; 311a, Receiving groove; 312, Second subsection; 313, Transition subsection; 320, Second isolation section; 330, Third isolation section;

[0064] 400. Light-emitting device; 401. Type I device; 402. Type II device; 403. Type III device; 410. First electrode; 420. Light-emitting unit; 430. Second electrode;

[0065] S1, First encapsulation layer; S11, First encapsulation unit; S12, Second encapsulation unit; S13, Third encapsulation unit; S2, Second encapsulation layer; S3, Third encapsulation layer;

[0066] X, thickness direction. Detailed Implementation

[0067] The features and exemplary embodiments of various aspects of this application will now be described in detail. To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain this application and are not configured to limit this application. For those skilled in the art, this application can be implemented without some of these specific details. The following description of the embodiments is merely to provide a better understanding of this application by illustrating examples of this application.

[0068] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes the element.

[0069] It should be understood that when describing the structure of a component, when referring to a layer or region as being "above" or "on top of" another layer or region, it can mean that it is directly above the other layer or region, or that it contains other layers or regions between it and the other layer or region. Furthermore, if the component is flipped over, that layer or region will be located "below" or "under" the other layer or region.

[0070] This application provides a display panel and a display device. The following description, in conjunction with the accompanying drawings, will illustrate various embodiments of the display panel and the display device.

[0071] Figure 1 This is a schematic diagram of an isolation structure 300 provided in an embodiment of this application. Figure 2 This is a partial cross-sectional view of a display panel 10 provided in an embodiment of this application. The X direction in the figure can be the thickness direction X of the display panel 10.

[0072] like Figure 1 and Figure 2 As shown, an embodiment of the first aspect of this application provides a display panel 10, including: a substrate 100; an isolation structure 300 disposed on one side of the substrate 100, the isolation structure 300 having an isolation opening 300a, the isolation structure 300 including a first isolation portion 310 and a second isolation portion 320 located on the side of the first isolation portion 310 away from the substrate 100, the second isolation portion 320 protruding from the first isolation portion 310 toward the isolation opening 300a, the first isolation portion 310 including a first portion 311 and a second portion 312 in contact with each other, the coefficient of thermal expansion of the second portion 312 being different from the coefficient of thermal expansion of the first portion 311; a light-emitting device 400, at least a portion of the light-emitting device 400 being disposed within the isolation opening 300a; and a first encapsulation layer S1 disposed on the side of the light-emitting device 400 away from the substrate 100, the sidewall of the first portion 311 and / or the sidewall of the second portion 312 being in contact with the first encapsulation layer S1.

[0073] In a display panel 10 provided in this application embodiment, the display panel 10 includes a substrate 100, an isolation structure 300, a light-emitting device 400 and a first encapsulation layer S1.

[0074] An isolation structure 300 is disposed on one side of the substrate 100. The isolation structure 300 has an isolation opening 300a. At least a portion of the structure of the light-emitting device 400 is disposed within the isolation opening 300a. The isolation structure 300 can be used to participate in dividing the sub-pixels of the display panel 10.

[0075] Regarding solutions for the isolation structure 300 (also known as a partition structure, etc.), see patents (applications) CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, PCT / CN2024 / 099072, and CN117979. The structure, materials and preparation methods are described in CN117998900A, CN117062489A, CN117580403A, CN116583155A, CN116669477A, ​​CN117396039A, CN116669480A, CN116600606A, CN117500332A, etc., and the contents of these documents are incorporated herein by reference.

[0076] Optionally, the isolation structure 300 may be mesh-like, and the hollow areas in the mesh-like isolation structure 300 may form isolation openings 300a.

[0077] The isolation structure 300 includes a first isolation portion 310 and a second isolation portion 320 located on the side of the first isolation portion 310 away from the substrate 100. The second isolation portion 320 protrudes from the first isolation portion 310 toward the isolation opening 300a, so that the isolation structure 300 can be used to block at least a portion of the material of the light-emitting device 400, which facilitates the fabrication of the light-emitting device 400.

[0078] The first encapsulation layer S1 is disposed on the side of the light-emitting device 400 away from the substrate 100, and the first encapsulation layer S1 can be used to encapsulate the light-emitting device 400.

[0079] The first isolation portion 310 includes a first portion 311 and a second portion 312 that are in contact with each other. By setting the sidewall of the first portion 311 and / or the sidewall of the second portion 312 to contact the first encapsulation layer S1, the encapsulation path of the first encapsulation layer S1 can be extended in a better way, and the first encapsulation layer S1 can be better attached to the first isolation portion 310 to limit external impurities from invading into the light-emitting device 400 through the sidewall of the first isolation portion 310.

[0080] Optionally, the sidewall of the first portion 311 may refer to the sidewall of the first portion 311 facing the isolation opening 300a. Optionally, the sidewall of the second portion 312 may refer to the sidewall of the second portion 312 facing the isolation opening 300a.

[0081] Optionally, the first encapsulation layer S1 can contact the second isolation part 320, which can further extend the encapsulation path of the first encapsulation layer S1 and improve the encapsulation effect of the first encapsulation layer S1.

[0082] Optionally, the material of the first encapsulation layer S1 may include inorganic materials, so that the first encapsulation layer S1 can better reduce the impact of moisture on the operation of the light-emitting device 400, and thus the first encapsulation layer S1 can have better encapsulation capabilities. For example, the material of the first encapsulation layer S1 may include silicon nitride. Exemplarily, the first encapsulation layer S1 can be prepared by chemical vapor deposition (CVD).

[0083] By setting the coefficient of thermal expansion of the second part 312 to be different from that of the first part 311, the first isolation part 310 as a whole can have more suitable thermal expansion characteristics. This makes it less likely that the first isolation part 310 will undergo excessive volume changes during the manufacturing process of the display panel 10, allowing the first isolation part 310 and the first encapsulation layer S1 to fit more tightly. This can better improve the interface abnormalities between the first isolation part 310 and the first encapsulation layer S1, thereby improving the structural reliability of the display panel 10 and the encapsulation effect of the first encapsulation layer S1.

[0084] For example, the thermal expansion characteristics of the first isolation portion 310 can be adjusted by reasonably adjusting the thermal expansion coefficient of the first portion 311, the thermal expansion coefficient of the second portion 312, the size of the first portion 311, the size of the second portion 312, and the relative positional relationship between the first portion 311 and the second portion 312. This makes it less likely that the first isolation portion 310 will undergo excessive volume changes during the manufacturing process of the display panel 10, thereby improving the structural reliability of the display panel 10 and the encapsulation effect of the first encapsulation layer S1.

[0085] Optionally, the coefficient of thermal expansion of the second portion 312 may differ from that of the first portion 311. Specifically, the coefficient of thermal expansion of the second portion 312 may be less than that of the first portion 311, or the coefficient of thermal expansion of the second portion 312 may be greater than that of the first portion 311. For ease of description, the following embodiments will be illustrated using the example that the coefficient of thermal expansion of the second portion 312 is less than that of the first portion 311.

[0086] In some embodiments of this application, the substrate 100 can be configured in various ways. For example, the substrate 100 may include a substrate 110 and a driving circuit 150 disposed on the substrate 110. Optionally, the substrate 100 includes a first insulating layer 120, a second insulating layer 130, and a third insulating layer 140 stacked together. Exemplarily, the driving circuit 150 may include a transistor 151, a storage capacitor 152, and driving signal lines for connecting various devices. The transistor 151 includes a semiconductor, a gate 151a, and source / drain electrodes 151b. The storage capacitor 152 includes a first electrode 152a and a second electrode 152b.

[0087] As an example, the gate 151a and the first electrode 152a may be located on the side of the first insulating layer 120 facing the substrate 110, the second electrode 152b may be located between the first insulating layer 120 and the second insulating layer 130, and the source and drain electrodes 151b may be located between the second insulating layer 130 and the third insulating layer 140.

[0088] In some optional embodiments, the display panel 10 may further include a pixel definition layer 200 disposed on one side of the substrate 100. The pixel definition layer 200 may include a pixel limiting portion 210, and the pixel limiting portion 210 may have a pixel opening 220 communicating with the isolation opening 300a. The pixel definition layer 200 may also be used to participate in dividing the sub-pixels of the display panel 10.

[0089] Optionally, the isolation structure 300 may be disposed on the side of the pixel limiting portion 210 away from the substrate 100.

[0090] Optionally, a portion of the structure of the light-emitting device 400 may be located within the pixel opening 220, and another portion of the light-emitting device 400 may be located within the isolation opening 300a.

[0091] Optionally, there can be multiple isolation openings 300a and pixel openings 220, and a single isolation opening 300a can be connected to a single pixel opening 220.

[0092] Optionally, the pixel definition layer 200 may also be mesh-like, and the cutout areas in the mesh-like pixel definition layer 200 may form pixel openings 220.

[0093] In some alternative embodiments, in the direction away from the substrate 100, the light-emitting device 400 may include a first electrode 410, a light-emitting unit 420 and a second electrode 430 stacked in sequence.

[0094] Optionally, the light-emitting unit 420 may include a hole injection layer (HIL), a hole transport layer (HTL), a light-emitting structure, an electron injection layer (EIL), and an electron transport layer (ETL).

[0095] In these optional embodiments, the first electrode 410 and the second electrode 430 can serve as pixel electrodes of the display panel 10. One of the first electrode 410 and the second electrode 430 can serve as an anode, and the other can serve as a cathode to drive the light-emitting unit 420 to emit light. This application embodiment illustrates this by using the first electrode 410 as the anode of the display panel 10 and the second electrode 430 as the cathode of the display panel 10.

[0096] For example, by providing the second isolation portion 320 protruding from the first isolation portion 310 toward the isolation opening 300a, the second isolation portion 320 can block at least part of the material used to prepare the light-emitting unit 420 and the second electrode 430 when the light-emitting unit 420 and the second electrode 430 of the display panel 10 are vapor-deposited, thereby isolating the light-emitting unit 420 and the second electrode 430 between adjacent sub-pixels, and facilitating the formation of multiple spaced light-emitting units 420 and the second electrode 430. This eliminates the need to provide a high-precision mask when vapor-depositing the light-emitting unit 420 and the second electrode 430 of the display panel 10, for example, eliminating the need to provide a high-precision fine metal mask (FMM) when vapor-depositing the light-emitting unit 420 and the second electrode 430, thereby significantly reducing the manufacturing cost of the display panel 10.

[0097] In some alternative embodiments, the material of the isolation structure 300 may include a conductive material, and the second electrode 430 may be connected to the isolation structure 300 so that the second electrodes 430 of adjacent light-emitting devices 400 can be electrically connected through the isolation structure 300 to facilitate control of the second electrode 430.

[0098] Optionally, the isolation structure 300 may further include a third isolation portion 330 disposed on the side of the first isolation portion 310 facing the substrate 100. The third isolation portion 330 protrudes from the first isolation portion 310 toward the isolation opening 300a, and the second electrode 430 may be connected to the third isolation portion 330.

[0099] By providing the third isolation portion 330 to protrude from the first isolation portion 310 toward the isolation opening 300a, it is easier to connect the second electrode 430 and the third isolation portion 330, thereby increasing the connection area between the second electrode 430 and the third isolation portion 330 and reducing the resistance of the display panel 10.

[0100] Optionally, the second electrode 430 can be connected to the first isolation part 310, so that the second electrodes 430 of adjacent light-emitting devices 400 can be electrically connected through the first isolation part 310, so as to facilitate the control of the second electrode 430.

[0101] Optionally, the material of the first portion 311 includes a conductive material, and / or the material of the second portion 312 includes a conductive material.

[0102] The second electrode 430 may be connected only to the first portion 311 in the first isolation portion 310, or the second electrode 430 may be connected only to the second portion 312 in the first isolation portion 310, or the second electrode 430 may be connected to both the first portion 311 and the second portion 312 in the first isolation portion 310. This application does not make any specific limitations on these.

[0103] In some embodiments of this application, when the first isolation portion 310 is adjusted to have a suitable thermal expansion characteristic, the first isolation portion 310 is less likely to undergo excessive volume change during the manufacturing process of the display panel 10. This allows the first isolation portion 310 and the second electrode 430 to fit more tightly, which can better improve the interface abnormalities between the first isolation portion 310 and the second electrode 430, improve the structural reliability of the display panel 10, and improve the electrical connection effect between the first isolation portion 310 and the second electrode 430.

[0104] In some alternative embodiments, the material of the second isolation portion 320 may include titanium, and / or the material of the first portion 311 may include aluminum, and / or the material of the second portion 312 may include at least one of aluminum nitride, molybdenum nitride and titanium nitride.

[0105] Optionally, the material of the third isolation section 330 may include molybdenum.

[0106] In this optional embodiment, the material of the second isolation portion 320 includes titanium, the material of the third isolation portion 330 may include molybdenum, the material of the first portion 311 includes aluminum, and the material of the second portion 312 includes at least one of aluminum nitride, molybdenum nitride, and titanium nitride. This allows the second portion 312 to have a lower coefficient of thermal expansion, thereby adjusting the overall thermal expansion characteristics of the first isolation portion 310 to be more suitable, while also facilitating the fabrication of the isolation structure 300. For example, it facilitates the formation of a morphology in which the second isolation portion 320 protrudes from the first isolation portion 310 toward the isolation opening 300a, and it also facilitates the formation of a morphology in which the third isolation portion 330 protrudes from the first isolation portion 310 toward the isolation opening 300a.

[0107] Optionally, the first encapsulation layer S1 may not be in contact with the third isolation portion 330 due to the second electrode 430 being in contact with the third isolation portion 330.

[0108] In some optional embodiments, there is a first difference between the coefficient of thermal expansion of the first encapsulation layer S1 and the coefficient of thermal expansion of the first portion 311, the first difference being less than or equal to 50% of the coefficient of thermal expansion of the first portion 311, and / or, there is a second difference between the coefficient of thermal expansion of the first encapsulation layer S1 and the coefficient of thermal expansion of the second portion 312, the second difference being less than or equal to 50% of the coefficient of thermal expansion of the first portion 311.

[0109] For example, the first difference may be less than or equal to 50%, 45%, 40%, 35%, 30%, 25%, or 20% of the coefficient of thermal expansion of the first portion 311. The second difference may be less than or equal to 50%, 45%, 40%, 35%, 30%, 25%, 20%, or 15% of the coefficient of thermal expansion of the first portion 311.

[0110] Optionally, the coefficient of thermal expansion of the first encapsulation layer S1 may be less than the coefficient of thermal expansion of the first portion 311, and / or the coefficient of thermal expansion of the first encapsulation layer S1 may be less than the coefficient of thermal expansion of the second portion 312.

[0111] Optionally, the material of the first portion 311 may include aluminum and aluminum nitride, such that the material of the first portion 311 may have a smaller coefficient of thermal expansion to better reduce the first difference. For example, the material of the first portion 311 may include dopants of aluminum and aluminum nitride.

[0112] For example, the first portion 311 can be prepared by physical vapor deposition (PVD) process, and a certain amount of nitrogen gas is added to the aluminum material during the preparation process to form the first portion 311, which includes aluminum and aluminum nitride.

[0113] Optionally, the material of the second portion 312 may include at least one of aluminum nitride, molybdenum nitride, and titanium nitride, such that the material of the second portion 312 may have a smaller coefficient of thermal expansion to better reduce the second difference.

[0114] Optionally, during the fabrication of the first encapsulation layer S1, the coefficient of thermal expansion of the first encapsulation layer S1 can be adjusted by regulating the fabrication parameters of the first encapsulation layer S1. For example, the coefficient of thermal expansion of the first encapsulation layer S1 can be adjusted by regulating its density.

[0115] Optionally, the second difference may be less than or equal to 50% of the coefficient of thermal expansion of the second portion 312. For example, the second difference may be less than or equal to 50%, 45%, 40%, 35%, 30%, 25%, or 20% of the coefficient of thermal expansion of the second portion 312.

[0116] In these optional embodiments, by reasonably setting the difference between the thermal expansion coefficient of the first encapsulation layer S1 and the thermal expansion coefficient of the first portion 311, and by reasonably setting the difference between the thermal expansion coefficient of the first encapsulation layer S1 and the thermal expansion coefficient of the second portion 312, the thermal expansion characteristics of the first isolation portion 310 and the thermal expansion characteristics of the first encapsulation layer S1 will not have too large a difference. This allows the first isolation portion 310 and the first encapsulation layer S1 to fit more tightly during the manufacturing process of the display panel 10, which can better improve the interface anomalies between the first isolation portion 310 and the first encapsulation layer S1, better improve the structural reliability of the display panel 10, and better improve the encapsulation effect of the first encapsulation layer S1.

[0117] In some alternative embodiments, there is a third difference between the coefficient of thermal expansion of the second electrode 430 and the coefficient of thermal expansion of the first portion 311, the third difference being less than or equal to 50% of the coefficient of thermal expansion of the first portion 311, and / or, there is a fourth difference between the coefficient of thermal expansion of the second electrode 430 and the coefficient of thermal expansion of the second portion 312, the fourth difference being less than or equal to 50% of the coefficient of thermal expansion of the first portion 311.

[0118] For example, the third difference may be less than or equal to 50%, 45%, 40%, 35%, 30%, 25%, or 20% of the coefficient of thermal expansion of the first part 311. The fourth difference may be less than or equal to 50%, 45%, 40%, 35%, 30%, 25%, 20%, or 15% of the coefficient of thermal expansion of the first part 311.

[0119] Optionally, the material of the first portion 311 may include aluminum and aluminum nitride, such that the material of the first portion 311 may have a smaller coefficient of thermal expansion to better reduce the third difference. For example, the material of the first portion 311 may include dopants of aluminum and aluminum nitride.

[0120] For example, the first portion 311 can be prepared by physical vapor deposition process, and a certain amount of nitrogen gas is added to the aluminum material during the preparation process to form the first portion 311, which includes aluminum and aluminum nitride.

[0121] Optionally, the material of the second portion 312 may include at least one of aluminum nitride, molybdenum nitride, and titanium nitride, such that the material of the second portion 312 may have a smaller coefficient of thermal expansion to better reduce the fourth difference.

[0122] Optionally, the fourth difference is less than or equal to 50% of the coefficient of thermal expansion of the second portion 312. For example, the fourth difference may be less than or equal to 50%, 45%, 40%, 35%, 30%, 25%, or 20% of the coefficient of thermal expansion of the second portion 312.

[0123] In these optional embodiments, by reasonably setting the difference between the thermal expansion coefficient of the second electrode 430 and the thermal expansion coefficient of the first portion 311, and by reasonably setting the difference between the thermal expansion coefficient of the second electrode 430 and the thermal expansion coefficient of the second portion 312, the thermal expansion characteristics of the first isolation portion 310 and the thermal expansion characteristics of the second electrode 430 are not too different. This allows the first isolation portion 310 and the second electrode 430 to fit more tightly during the fabrication of the display panel 10, which can better improve the interface anomalies between the first isolation portion 310 and the second electrode 430, better improve the structural reliability of the display panel 10, and better improve the electrical connection effect between the first isolation portion 310 and the second electrode 430.

[0124] In some embodiments of this application, there are various ways to set the relative positional relationship between the first part 311 and the second part 312.

[0125] like Figure 2 As shown, in some alternative embodiments, the second portion 312 may be disposed on at least one side of the first portion 311 in the thickness direction X of the display panel 10.

[0126] In this optional embodiment, by disposing the second portion 312 on at least one side of the first portion 311 in the thickness direction X of the display panel 10, that is, by stacking the second portion 312 and the first portion 311, it is possible to facilitate the preparation of the first portion 311 and the second portion 312, and make the second portion 312 adjustable for the bonding effect between the first isolation portion 310 and other adjacent film layer structures of the first isolation portion 310 in the thickness direction X of the display panel 10.

[0127] For example, such as Figure 2As shown, at least a portion of the second portion 312 may be disposed on the side of the first portion 311 facing the substrate 100. For example, at least a portion of the second portion 312 may be disposed between the first portion 311 and the third isolation portion 330.

[0128] By placing the second portion 312 on the side of the first portion 311 facing the substrate 100, the second electrode 430 can be connected to the second portion 312, which has a lower coefficient of thermal expansion. This allows for a tighter fit between the second portion 312 and the second electrode 430 during the fabrication of the display panel 10, effectively improving the electrical connection between the first isolation portion 310 and the second electrode 430. Furthermore, it also ensures a tighter fit between the third isolation portion 330 and the second portion 312, reducing the likelihood of interface abnormalities. For example, when the material of the third isolation portion 330 includes molybdenum and the material of the first portion 311 includes aluminum, the coefficient of thermal expansion of molybdenum is 4.9 × 10⁻⁶. -6 At ℃, the coefficient of thermal expansion of aluminum is 24×10⁻⁶. -6 / ℃. Therefore, if the first portion 311 directly contacts the third isolation portion 330, interface abnormalities may easily occur between the first portion 311 and the third isolation portion 330 due to the excessive difference in their coefficients of thermal expansion. Therefore, by providing a second portion 312 with a lower coefficient of thermal expansion between the third isolation portion 330 and the first portion 311, the relationship between the coefficients of thermal expansion of the first isolation portion 310 and the third isolation portion 330 can be effectively adjusted, thereby enabling a tighter fit between the first isolation portion 310 and the third isolation portion 330 during the manufacturing process of the display panel 10, which can significantly improve the structural reliability of the display panel 10.

[0129] Figure 3 This is a partial cross-sectional view of a display panel 10 provided in another embodiment of this application.

[0130] For example, such as Figure 3 As shown, at least a portion of the second portion 312 may be disposed on the side of the first portion 311 facing away from the substrate 100. For example, at least a portion of the second portion 312 may be disposed between the first portion 311 and the second isolation portion 320.

[0131] By placing the second portion 312 on the side of the first portion 311 facing away from the substrate 100, the second isolation portion 320 and the second portion 312, which has a lower coefficient of thermal expansion, can fit more tightly together, making it less likely for interface abnormalities to occur between the second isolation portion 320 and the second portion 312. For example, when the material of the second isolation portion 320 includes titanium and the material of the first portion 311 includes aluminum, since the coefficient of thermal expansion of molybdenum is 10 × 10⁻⁶... -6 At ℃, the coefficient of thermal expansion of aluminum is 24×10⁻⁶.-6 / ℃. Therefore, if the first portion 311 directly contacts the second isolation portion 320, interface abnormalities may easily occur between the first portion 311 and the second isolation portion 320 due to the excessive difference in their coefficients of thermal expansion. Therefore, by providing a second portion 312 with a lower coefficient of thermal expansion between the second isolation portion 320 and the first portion 311, the relationship between the coefficients of thermal expansion of the first isolation portion 310 and the second isolation portion 320 can be effectively adjusted, thereby enabling a tighter fit between the first isolation portion 310 and the second isolation portion 320 during the manufacturing process of the display panel 10, which can significantly improve the structural reliability of the display panel 10.

[0132] For example, such as Figure 3 As shown, the second portion 312 can be disposed on both sides of the first portion 311 in the thickness direction X of the display panel 10, that is, a portion of the second portion 312 can be disposed on the side of the first portion 311 away from the substrate 100, and another portion of the second portion 312 can be disposed on the side of the first portion 311 facing the substrate 100.

[0133] When the second portion 312 is disposed on both sides of the first portion 311 in the thickness direction X of the display panel 10, the coefficients of thermal expansion of the second portions 312 located on different sides of the first portion 311 in the thickness direction X of the display panel 10 may be different or the same, and this application does not specifically limit them. For example, the coefficients of thermal expansion of the second portions 312 located on different sides of the first portion 311 in the thickness direction X of the display panel 10 may be the same, so as to facilitate the fabrication of the isolation structure 300. Or, for example, the coefficient of thermal expansion of the second portion 312 located on the side of the first portion 311 facing the substrate 100 may be greater than the coefficient of thermal expansion of the second portion 312 located on the side of the first portion 311 away from the substrate 100, so as to facilitate the bonding of the second portion 312 located on the side of the first portion 311 facing the substrate 100 with the third isolation portion 330 and the first portion 311, and to facilitate the bonding of the second portion 312 located on the side of the first portion 311 away from the substrate 100 with the second isolation portion 320 and the first portion 311.

[0134] Figure 4 This is a partial cross-sectional view of a display panel 10 provided in another embodiment of this application.

[0135] like Figure 4 As shown, in some optional embodiments, the first isolation portion 310 may further include a transition portion 313 disposed between the first portion 311 and the second portion 312, wherein the coefficient of thermal expansion of the transition portion 313 is between the coefficient of thermal expansion of the first portion 311 and the coefficient of thermal expansion of the second portion 312.

[0136] For example, the coefficient of thermal expansion of the transition portion 313 may be less than that of the first portion 311, and the coefficient of thermal expansion of the transition portion 313 may be greater than that of the second portion 312.

[0137] Optionally, the transition portion 313 may be made of a conductive material, so that the transition portion 313 may also be used to transmit signals in the second electrode 430.

[0138] Optionally, the material of the transition portion 313 includes at least one of aluminum nitride, molybdenum nitride, and titanium nitride.

[0139] In these optional embodiments, the transition portion 313, which is disposed between the first portion 311 and the second portion 312 and has a moderate coefficient of thermal expansion, can also be used to adjust the overall thermal expansion characteristics of the first isolation portion 310. Furthermore, when the difference in the coefficient of thermal expansion between the first portion 311 and the second portion 312 is too large, since the coefficient of thermal expansion of the transition portion 313 is relatively moderate, the volume change difference between the transition portion 313 and the first portion 311 will not have a large gap during the manufacturing process of the display panel 10, and the volume change difference between the transition portion 313 and the second portion 312 will not have a large gap. This allows the transition portion 313, which has a relatively moderate coefficient of thermal expansion, to fit well with both the first portion 311 and the second portion 312 on both sides, thereby further improving the structural reliability of the display panel 10.

[0140] Figure 5 This is a partial cross-sectional view of a display panel 10 provided in another embodiment of this application.

[0141] like Figure 5 As shown, in some optional embodiments, the first portion 311 may have a receiving groove 311a, and the second portion 312 is disposed in the receiving groove 311a.

[0142] Optionally, the receiving groove 311a may be formed on the side of the first portion 311 away from the substrate 100, so that when the second portion 312 is prepared after the first portion 311 is prepared, the material of the second portion 312 can more easily enter the receiving groove 311a.

[0143] In these optional embodiments, by opening a receiving groove 311a in the first portion 311 and placing the second portion 312 in the receiving groove 311a, the first portion 311 and the second portion 312 can be fitted together. This allows the second portion 312 to play a better role in compensating for thermal expansion during the manufacturing process of the display panel 10, so that the volume change of the first isolation portion 310 can be more uniform, which is beneficial to adjusting the overall thermal expansion characteristics of the first isolation portion 310.

[0144] In some alternative embodiments, the dimension of the receiving groove 311a in the thickness direction X of the display panel 10 may be less than or equal to the dimension of the first portion 311 in the thickness direction X of the display panel 10. For example, the receiving groove 311a may not extend through the first portion 311.

[0145] In this optional embodiment, when the size of the receiving groove 311a in the thickness direction X of the display panel 10 is smaller than the size of the first portion 311 in the thickness direction X of the display panel 10, such that when the conductivity of the first portion 311 is greater than that of the second portion 312, for example, when the material of the first portion 311 includes aluminum and the material of the second portion 312 includes at least one of aluminum nitride, molybdenum nitride and titanium nitride, providing a receiving groove 311a that does not penetrate the first portion 311 can help improve the conductivity of the first isolation portion 310, and facilitate the transmission of signals in the second electrode 430 by the isolation structure 300.

[0146] In some embodiments of this application, the shape of the receiving groove 311a can be configured in various ways.

[0147] Figure 6 This is a schematic diagram of the structure of a first part 311 provided in an embodiment of this application.

[0148] like Figure 6 As shown, in some optional embodiments, there are multiple receiving slots 311a, which are spaced apart around the isolation opening 300a to improve the uniformity of volume change of the first isolation portion 310 during the manufacturing process of the display panel 10.

[0149] like Figure 7 As shown, in some alternative embodiments, the receiving groove 311a is annular and is disposed around at least one isolation opening 300a to improve the uniformity of volume change of the first isolation portion 310 during the fabrication of the display panel 10.

[0150] Figure 8 This is a partial cross-sectional view of a display panel 10 provided in another embodiment of this application.

[0151] like Figure 8 As shown, in some optional embodiments, the display panel 10 may further include a second encapsulation layer S2 located on the side of the first encapsulation layer S1 away from the substrate 100, so as to further improve the encapsulation effect of the display panel 10.

[0152] Optionally, the material of the second encapsulation layer S2 may include an organic material, which allows the second encapsulation layer S2 to have good flowability during the fabrication of the display panel 10, and allows the surface of the second encapsulation layer S2 facing away from the substrate 100 to have good flatness, facilitating the formation of subsequent film layers. For example, the second encapsulation layer S2 can be fabricated using inkjet printing (IJP) technology.

[0153] Optionally, the display panel 10 may further include a third encapsulation layer S3 located on the side of the second encapsulation layer S2 facing away from the substrate 100, to further improve the encapsulation effect of the display panel 10. Optionally, the material of the third encapsulation layer S3 may include inorganic materials, so that the third encapsulation layer S3 can better reduce the impact of moisture on the operation of the light-emitting device 400. For example, the third encapsulation layer S3 can be prepared by a chemical vapor deposition process.

[0154] In some optional embodiments, the isolation opening 300a may include a first opening 300aa, a second opening 300ab, and a third opening 300ac. The light-emitting device 400 may include a first type device 401 corresponding to the first opening 300aa, a second type device 402 corresponding to the second opening 300ab, and a third type device 403 corresponding to the third opening 300ac. The first encapsulation layer S1 may include a first encapsulation unit S11 disposed on the side of the first type device 401 away from the substrate 100, a second encapsulation unit S12 disposed on the side of the second type device 402 away from the substrate 100, and a third encapsulation unit S13 disposed on the side of the third type device 403 away from the substrate 100.

[0155] The emission colors of the first type of device 401, the second type of device 402, and the third type of device 403 can be different in pairs, that is, the emission colors of the first type of device 401, the second type of device 402, and the third type of device 403 can all be different, so as to realize the color display of the display panel 10. The first packaging unit S11, the second packaging unit S12, and the third packaging unit S13 can respectively encapsulate the first type of device 401, the second type of device 402, and the third type of device 403 in a relatively independent manner.

[0156] Optionally, the first type of device 401 corresponding to the first opening 300aa can refer to at least a portion of the structure of the first type of device 401 being located within the first opening 300aa. Optionally, the second type of device 402 corresponding to the second opening 300ab can refer to at least a portion of the structure of the second type of device 402 being located within the second opening 300ab. Optionally, the third type of device 403 corresponding to the third opening 300ac can refer to at least a portion of the structure of the third type of device 403 being located within the third opening 300ac.

[0157] In some embodiments of this application, during some manufacturing processes of the display panel 10, temperature changes in the manufacturing environment occur. These temperature changes can easily cause volume changes in the first isolation portion 310 as described in the preceding embodiments. Therefore, by adjusting the overall thermal expansion characteristics of the first isolation portion 310 in the preceding embodiments, excessive volume changes in the first isolation portion 310 are less likely to occur during the manufacturing process of the display panel 10, thereby effectively improving the structural reliability of the display panel 10.

[0158] Optionally, before the process steps of evaporating the light-emitting unit 420 and the second electrode 430 of each light-emitting device 400, the structure of the already formed display panel 10 is often baked. The environment during the baking process is relatively stable, which can easily cause the volume of the first isolation part 310 to change.

[0159] For example, during the fabrication of the display panel 10, the isolation structure 300 can be used to shield and isolate the light-emitting devices 400 to achieve the individual fabrication of light-emitting devices 400 of different colors. For instance, the isolation structure 300 can be used to sequentially fabricate the first packaging unit S11, the first type of device 401, the second packaging unit S12, the second type of device 402, the third packaging unit S13, and the third type of device 403.

[0160] Specifically, the first electrode 410 of each light-emitting device 400 can be prepared first. Then, the material of the light-emitting unit 420 and the second electrode 430 in the first type of device 401 can be vapor-deposited over the entire surface. The isolation structure 300 can separate part of the material of the light-emitting unit 420 and the second electrode 430 in the first type of device 401. Then, the material of the first encapsulation layer S1 can be vapor-deposited over the entire surface. Then, the material of the first encapsulation layer S1 outside the first opening 300aa is removed to form the first encapsulation unit S11. Then, the material of the second electrode 430 of the first type of device 401 and the material of the light-emitting unit 420 of the first type of device 401 outside the first opening 300aa are removed in sequence to form the first type of device 401 corresponding to the first opening 300aa.

[0161] Then, the materials of the light-emitting unit 420 and the second electrode 430 in the second type of device 402 are vapor-deposited over their entire surface. The isolation structure 300 can isolate part of the materials of the light-emitting unit 420 and the second electrode 430 in the second type of device 402. Then, the materials of the first encapsulation layer S1 are vapor-deposited over their entire surface. Then, the materials of the first encapsulation layer S1 outside the second opening 300ab are removed to form the second encapsulation unit S12. Then, the materials of the second electrode 430 and the light-emitting unit 420 of the second type of device 402 outside the second opening 300ab are removed in sequence to form the second type of device 402 corresponding to the second opening 300ab.

[0162] Then, the materials of the light-emitting unit 420 and the second electrode 430 in the third type device 403 can be vapor-deposited across the entire surface. The isolation structure 300 can isolate part of the materials of the light-emitting unit 420 and the second electrode 430 in the third type device 403. Then, the materials of the first encapsulation layer S1 are vapor-deposited across the entire surface. Then, the materials of the first encapsulation layer S1 outside the third opening 300ac are removed to form the third encapsulation unit S13. Then, the materials of the second electrode 430 and the light-emitting unit 420 of the third type device 403 outside the third opening 300ac are removed in sequence to form the third type device 403 corresponding to the third opening 300ac.

[0163] In some embodiments of this application, before the full-surface evaporation of the materials of the light-emitting unit 420 and the second electrode 430 in the first type of device 401, before the full-surface evaporation of the materials of the light-emitting unit 420 and the second electrode 430 in the second type of device 402, and before the full-surface evaporation of the materials of the light-emitting unit 420 and the second electrode 430 in the third type of device 403, the structure of the already formed display panel 10 can be baked. The environment during this baking process is highly stable, which can easily cause changes in the volume of the prepared first isolation portion 310. Therefore, by adjusting the overall thermal expansion characteristics of the first isolation portion 310 in the aforementioned embodiments, the first isolation portion 310 is less likely to undergo excessive volume changes during the fabrication of the display panel 10, thereby effectively improving the structural reliability of the display panel 10.

[0164] Figure 9 This is a partial cross-sectional view of a display panel 10 provided in another embodiment of this application.

[0165] Please see Figures 1 to 9 An embodiment of the first aspect of this application also provides a display panel 10, comprising: a substrate 100; an isolation structure 300 disposed on one side of the substrate 100, the isolation structure 300 having an isolation opening 300a, the isolation structure 300 including a first isolation portion 310 and a second isolation portion 320 located on the side of the first isolation portion 310 away from the substrate 100, the second isolation portion 320 protruding from the first isolation portion 310 toward the isolation opening 300a; a light-emitting device 400, at least a portion of the structure of the light-emitting device 400 disposed within the isolation opening 300a; a first encapsulation layer S1 disposed on the side of the light-emitting device 400 away from the substrate 100 and in contact with the isolation structure 300, the coefficient of thermal expansion of the first encapsulation layer S1 having a first preset difference with the coefficient of thermal expansion of at least a portion of the structure in the first isolation portion 310, the first preset difference being less than or equal to 50% of the maximum coefficient of thermal expansion in the first isolation portion 310.

[0166] In a display panel 10 provided in this application embodiment, the display panel 10 includes a substrate 100, an isolation structure 300, a light-emitting device 400, and a first encapsulation layer S1. The isolation structure 300 is disposed on one side of the substrate 100, and the isolation structure 300 has an isolation opening 300a. At least a portion of the structure of the light-emitting device 400 is disposed within the isolation opening 300a. The isolation structure 300 can be used to participate in dividing the sub-pixels of the display panel 10.

[0167] The isolation structure 300 includes a first isolation portion 310 and a second isolation portion 320 located on the side of the first isolation portion 310 away from the substrate 100. The second isolation portion 320 protrudes from the first isolation portion 310 toward the isolation opening 300a, so that the isolation structure 300 can be used to block at least a portion of the material of the light-emitting device 400, which facilitates the fabrication of the light-emitting device 400.

[0168] The first encapsulation layer S1 disposed on the side of the light-emitting device 400 away from the substrate 100 can be used to encapsulate the light-emitting device 400. By setting the first encapsulation layer S1 to contact the isolation structure 300, moisture is less likely to invade the light-emitting device 400 along the sidewall of the isolation structure 300 toward the isolation opening 300a.

[0169] By setting a first preset difference between the thermal expansion coefficient of the first encapsulation layer S1 and the thermal expansion coefficient of at least a portion of the structure in the first isolation portion 310, wherein the first preset difference is less than or equal to 50% of the maximum thermal expansion coefficient in the first isolation portion 310, the thermal expansion characteristics of the first isolation portion 310 and the thermal expansion characteristics of the first encapsulation layer S1 will not have too large a difference. This allows the first isolation portion 310 and the first encapsulation layer S1 to fit more tightly during the manufacturing process of the display panel 10, which can better improve the interface anomalies between the first isolation portion 310 and the first encapsulation layer S1, better improve the structural reliability of the display panel 10, and better improve the encapsulation effect of the first encapsulation layer S1.

[0170] Optionally, the maximum coefficient of thermal expansion in the first isolation section 310 may refer to the coefficient of thermal expansion of the structure in the first isolation section 310 that has the maximum coefficient of thermal expansion.

[0171] Optionally, the display panel 10 provided in the first aspect of this application may be the display panel 10 in any of the foregoing embodiments. Therefore, the display panel 10 provided in the embodiments of this application may have the structure and beneficial effects of the display panel 10 in any of the foregoing embodiments, and this application will not elaborate on it further.

[0172] For example, the fabrication process of the display panel 10 is set according to any of the foregoing embodiments. For example, the substrate 100 may be the substrate 100 in any of the foregoing embodiments. For example, the light-emitting device 400 may be the light-emitting device 400 in any of the foregoing embodiments, and the light-emitting device 400 may include the first electrode 410, the light-emitting unit 420, and the second electrode 430 in any of the foregoing embodiments. For example, the light-emitting device 400 may include the first type of device 401, the second type of device 402, and the third type of device 403 in any of the foregoing embodiments. For example, the first encapsulation layer S1 may be the first encapsulation layer S1 in any of the foregoing embodiments, and the first encapsulation layer S1 may include the first encapsulation unit S11, the second encapsulation unit S12, and the third encapsulation unit S13 in any of the foregoing embodiments.

[0173] For example, the isolation structure 300 may be the isolation structure 300 in any of the foregoing embodiments, the isolation structure 300 may enclose and form the isolation opening 300a in any of the foregoing embodiments, and the isolation structure 300 may include the first isolation portion 310, the second isolation portion 320 and the third isolation portion 330 in any of the foregoing embodiments.

[0174] In one embodiment of the first aspect of this application, a display panel 10 is also provided, such as... Figures 1 to 8 As shown, the first isolation portion 310 of the isolation structure 300 can be configured with reference to the first isolation portion 310 in any of the foregoing embodiments. That is, the first isolation portion 310 of the isolation structure 300 may include the first portion 311, the second portion 312 and the transition portion 313 in any of the foregoing embodiments. The first preset difference may be the first difference or the second difference in any of the foregoing embodiments. The first preset difference may be less than or equal to 50% of the thermal expansion coefficient of the first portion 311.

[0175] Or, such as Figure 9 As shown, unlike the first isolation portion 310 in the previous embodiments, in a display panel 10 provided in the first aspect of this application, the first isolation portion 310 of the isolation structure 300 can be an integral structure rather than a split structure as in any of the previous embodiments. That is, there is a first preset difference between the thermal expansion coefficient of the first encapsulation layer S1 and the thermal expansion coefficient of the first isolation portion 310, and the first preset difference is less than or equal to 50% of the thermal expansion coefficient of the first isolation portion 310.

[0176] An embodiment of the first aspect of this application also provides a display panel, including: a substrate 100; an isolation structure 300 disposed on one side of the substrate 100, the isolation structure 300 having an isolation opening 300a, the isolation structure 300 including a first isolation portion 310 and a second isolation portion 320 located on the side of the first isolation portion 310 away from the substrate 100, the second isolation portion 320 protruding from the first isolation portion 310 toward the isolation opening 300a, the first isolation portion 310 including a first portion 311 and a second portion 312 in contact with each other, the coefficient of thermal expansion of the second portion 312 being different from the coefficient of thermal expansion of the first portion 311; at least a portion of light-emitting devices 400 disposed within the isolation opening 300a; a first encapsulation layer S1 disposed on the side of the light-emitting devices 400 away from the substrate 100, the first encapsulation layer S1 and the sidewall of the first isolation portion 310 being in continuous contact from the side near the substrate 100 to the side away from the substrate 100.

[0177] In a display panel 10 provided in this application embodiment, the display panel 10 includes a substrate 100, an isolation structure 300, a light-emitting device 400 and a first encapsulation layer S1.

[0178] An isolation structure 300 is disposed on one side of the substrate 100. The isolation structure 300 has an isolation opening 300a. At least a portion of the structure of the light-emitting device 400 is disposed within the isolation opening 300a. The isolation structure 300 can be used to participate in dividing the sub-pixels of the display panel 10.

[0179] The isolation structure 300 includes a first isolation portion 310 and a second isolation portion 320 located on the side of the first isolation portion 310 away from the substrate 100. The second isolation portion 320 protrudes from the first isolation portion 310 toward the isolation opening 300a, so that the isolation structure 300 can be used to block at least a portion of the material of the light-emitting device 400, which facilitates the fabrication of the light-emitting device 400.

[0180] The first encapsulation layer S1 is disposed on the side of the light-emitting device 400 away from the substrate 100, and the first encapsulation layer S1 can be used to encapsulate the light-emitting device 400. By setting the first encapsulation layer S1 and the sidewall of the first isolation portion 310 to be in continuous contact from the side close to the substrate 100 to the side away from the substrate 100, the encapsulation path of the first encapsulation layer S1 can be extended better, and the first encapsulation layer S1 can be continuously attached to the first isolation portion 310 to limit external impurities from invading the light-emitting device 400 through the sidewall of the first isolation portion 310.

[0181] Optionally, the sidewalls of the first encapsulation layer S1 and the first isolation portion 310 are in continuous contact from the side closest to the substrate 100 to the side furthest from the substrate 100. This can mean that the contact surface between the first encapsulation layer S1 and the sidewalls of the first isolation portion 310 can be continuous, that is, there may be no gap in the contact surface between the first encapsulation layer S1 and the sidewalls of the first isolation portion 310.

[0182] Optionally, the first encapsulation layer S1 may not completely contact and cover the sidewall of the first isolation portion 310. For example, the first encapsulation layer S1 may contact and cover the sidewall of the first isolation portion 310 together with the second electrode 430 in any of the aforementioned embodiments. The continuous contact between the first encapsulation layer S1 and the sidewall of the first isolation portion 310 from the side closer to the substrate 100 to the side farther from the substrate 100 can mean that the contact surface of the contact coverage portion between the first encapsulation layer S1 and the sidewall of the first isolation portion 310 can be continuous.

[0183] The first isolation portion 310 includes a first portion 311 and a second portion 312 that are in contact with each other. By setting the coefficient of thermal expansion of the second portion 312 to be different from that of the first portion 311, the first isolation portion 310 as a whole can have more suitable thermal expansion characteristics. This makes it less likely that the first isolation portion 310 will undergo excessive volume changes during the manufacturing process of the display panel 10, allowing the first isolation portion 310 and the first encapsulation layer S1 to fit more tightly. This can better improve the interface abnormalities between the first isolation portion 310 and the first encapsulation layer S1, thereby improving the structural reliability of the display panel 10 and the encapsulation effect of the first encapsulation layer S1.

[0184] Optionally, the display panel 10 provided in the first aspect of this application may be the display panel 10 in any of the foregoing embodiments. Therefore, the display panel 10 provided in the embodiments of this application may have the structure and beneficial effects of the display panel 10 in any of the foregoing embodiments, and this application will not elaborate on it further.

[0185] For example, the fabrication process of the display panel 10 is set according to any of the foregoing embodiments. For example, the substrate 100 may be the substrate 100 in any of the foregoing embodiments. For example, the light-emitting device 400 may be the light-emitting device 400 in any of the foregoing embodiments, and the light-emitting device 400 may include the first electrode 410, the light-emitting unit 420, and the second electrode 430 in any of the foregoing embodiments. For example, the light-emitting device 400 may include the first type of device 401, the second type of device 402, and the third type of device 403 in any of the foregoing embodiments. For example, the first encapsulation layer S1 may be the first encapsulation layer S1 in any of the foregoing embodiments, and the first encapsulation layer S1 may include the first encapsulation unit S11, the second encapsulation unit S12, and the third encapsulation unit S13 in any of the foregoing embodiments.

[0186] For example, the isolation structure 300 may be the isolation structure 300 in any of the foregoing embodiments. The isolation structure 300 may enclose and form the isolation opening 300a in any of the foregoing embodiments. The isolation structure 300 may include the first isolation portion 310, the second isolation portion 320, and the third isolation portion 330 in any of the foregoing embodiments. The first isolation portion 310 of the isolation structure 300 may be configured with reference to the first isolation portion 310 in any of the foregoing embodiments, that is, the first isolation portion 310 of the isolation structure 300 may include the first portion 311, the second portion 312, and the transition portion 313 in any of the foregoing embodiments.

[0187] An embodiment of the second aspect of this application provides a display device, which includes the display panel 10 of any of the above embodiments. Since the display device provided by the second aspect of this application includes the display panel 10 of any of the first aspects, it has the beneficial effects of the display panel 10 of any of the first aspects, which will not be repeated here.

[0188] The display devices in this application include, but are not limited to, mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, control consoles, and other devices with display functions.

[0189] The embodiments described above are not exhaustive and do not limit the invention to specific examples. Clearly, many modifications and variations can be made based on the above description. These embodiments are selected and specifically described in this specification to better explain the principles and practical applications of this application, thereby enabling those skilled in the art to effectively utilize this application and its modifications. This application is limited only by the claims and their full scope and equivalents.

Claims

1. A display panel, characterized in that, include: substrate; An isolation structure is disposed on one side of the substrate. The isolation structure has an isolation opening. The isolation structure includes a first isolation portion and a second isolation portion located on the side of the first isolation portion away from the substrate. The second isolation portion protrudes from the first isolation portion toward the isolation opening. The first isolation portion includes a first portion and a second portion that are in contact with each other. The coefficient of thermal expansion of the second portion is different from that of the first portion. A light-emitting device, at least a portion of which is disposed within the isolation opening; A first encapsulation layer is disposed on the side of the light-emitting device away from the substrate, and the sidewall of the first portion and / or the sidewall of the second portion are in contact with the first encapsulation layer.

2. The display panel according to claim 1, characterized in that, The second portion is disposed on at least one side of the first portion in the thickness direction of the display panel; Preferably, the material of the first portion includes a conductive material, and / or the material of the second portion includes a conductive material; Preferably, the material of the second insulating portion includes titanium, and / or the material of the first portion includes aluminum, and / or the material of the second portion includes at least one of aluminum nitride, molybdenum nitride and titanium nitride.

3. The display panel according to claim 2, characterized in that, The first isolation portion further includes a transition portion disposed between the first portion and the second portion, wherein the coefficient of thermal expansion of the transition portion is between the coefficient of thermal expansion of the first portion and the coefficient of thermal expansion of the second portion; Preferably, the coefficient of thermal expansion of the second portion is less than that of the first portion, the coefficient of thermal expansion of the transition portion is less than that of the first portion, and the coefficient of thermal expansion of the transition portion is greater than that of the second portion. Preferably, the material of the transition section includes a conductive material; Preferably, the material of the transition portion includes at least one of aluminum nitride, molybdenum nitride, and titanium nitride.

4. The display panel according to claim 1, characterized in that, The first portion is provided with a receiving groove, and the second portion is disposed within the receiving groove; Preferably, the receiving groove is formed on the side of the first portion away from the substrate; Preferably, the material of the second insulating portion includes titanium, and / or the material of the first portion includes aluminum, and / or the material of the second portion includes at least one of aluminum nitride, molybdenum nitride and titanium nitride.

5. The display panel according to claim 4, characterized in that, The number of receiving slots is multiple, and the multiple receiving slots are spaced apart around the periphery of the isolation opening, or the receiving slots are annular, and the receiving slots are arranged around at least one of the isolation openings.

6. The display panel according to claim 4, characterized in that, The dimension of the receiving groove in the thickness direction of the display panel is less than or equal to the dimension of the first portion in the thickness direction of the display panel.

7. The display panel according to any one of claims 1 to 6, characterized in that, The coefficient of thermal expansion of the second portion is less than that of the first portion, and there is a first difference between the coefficient of thermal expansion of the first encapsulation layer and the coefficient of thermal expansion of the first portion, wherein the first difference is less than or equal to 50% of the coefficient of thermal expansion of the first portion. And / or, there is a second difference between the coefficient of thermal expansion of the first encapsulation layer and the coefficient of thermal expansion of the second portion, the second difference being less than or equal to 50% of the coefficient of thermal expansion of the first portion; Preferably, the second difference is less than or equal to 50% of the coefficient of thermal expansion of the second portion; Preferably, the coefficient of thermal expansion of the first encapsulation layer is less than the coefficient of thermal expansion of the first portion, and / or, the coefficient of thermal expansion of the first encapsulation layer is less than the coefficient of thermal expansion of the second portion; Preferably, the material of the first encapsulation layer includes an inorganic material, and / or the material of the first portion includes a conductive material, and / or the material of the second portion includes a conductive material; Preferably, the material of the first encapsulation layer includes silicon nitride.

8. The display panel according to any one of claims 1 to 6, characterized in that, In a direction away from the substrate, the light-emitting device includes a first electrode, a light-emitting unit, and a second electrode stacked sequentially, the material of the isolation structure includes a conductive material, and the second electrode is connected to the isolation structure; Preferably, the second electrode is connected to the first isolation portion; Preferably, the isolation structure further includes a third isolation portion disposed on the side of the first isolation portion facing the substrate, the third isolation portion protruding from the first isolation portion toward the isolation opening, and the second electrode being connected to the third isolation portion; Preferably, the material of the third isolation portion includes molybdenum.

9. The display panel according to claim 8, characterized in that, The coefficient of thermal expansion of the second electrode has a third difference with that of the first portion, and this third difference is less than or equal to 50% of the coefficient of thermal expansion of the first portion. And / or, there is a fourth difference between the coefficient of thermal expansion of the second electrode and the coefficient of thermal expansion of the second portion, the fourth difference being less than or equal to 50% of the coefficient of thermal expansion of the first portion; Preferably, the fourth difference is less than or equal to 50% of the coefficient of thermal expansion of the second portion.

10. A display panel, characterized in that, include: substrate; An isolation structure is disposed on one side of the substrate. The isolation structure has an isolation opening. The isolation structure includes a first isolation portion and a second isolation portion located on the side of the first isolation portion away from the substrate. The second isolation portion protrudes from the first isolation portion toward the isolation opening. A light-emitting device, wherein at least a portion of the structure of the light-emitting device is disposed within the isolation opening; A first encapsulation layer is disposed on the side of the light-emitting device away from the substrate and in contact with the isolation structure. The coefficient of thermal expansion of the first encapsulation layer has a first preset difference with the coefficient of thermal expansion of at least a portion of the structure in the first isolation portion. The first preset difference is less than or equal to 50% of the maximum coefficient of thermal expansion in the first isolation portion.

11. The display panel according to claim 10, characterized in that, The first isolation portion includes a first part and a second part that are in contact with each other, wherein the coefficient of thermal expansion of the second part is smaller than the coefficient of thermal expansion of the first part; Preferably, the sidewall of the first portion and / or the sidewall of the second portion are in contact with the first encapsulation layer; Preferably, the coefficient of thermal expansion of the first encapsulation layer is less than the coefficient of thermal expansion of the first portion, and / or, the coefficient of thermal expansion of the first encapsulation layer is less than the coefficient of thermal expansion of the second portion; Preferably, the material of the first encapsulation layer includes an inorganic material, and / or the material of the first portion includes a conductive material, and / or the material of the second portion includes a conductive material; Preferably, the material of the first encapsulation layer includes silicon nitride.

12. The display panel according to claim 11, characterized in that, There is a first difference between the coefficient of thermal expansion of the first encapsulation layer and the coefficient of thermal expansion of the first portion, and the first difference is less than or equal to 50% of the coefficient of thermal expansion of the first portion. And / or, there is a second difference between the coefficient of thermal expansion of the first encapsulation layer and the coefficient of thermal expansion of the second portion, the second difference being less than or equal to 50% of the coefficient of thermal expansion of the first portion; Preferably, the second difference is less than or equal to 50% of the coefficient of thermal expansion of the second portion.

13. The display panel according to claim 11, characterized in that, In a direction away from the substrate, the light-emitting device includes a first electrode, a light-emitting unit, and a second electrode stacked sequentially, the material of the isolation structure includes a conductive material, and the second electrode is connected to the isolation structure; Preferably, the second electrode is connected to the first isolation portion; Preferably, there is a third difference between the coefficient of thermal expansion of the second electrode and the coefficient of thermal expansion of the first portion, wherein the third difference is less than or equal to 50% of the coefficient of thermal expansion of the first portion. And / or, there is a fourth difference between the coefficient of thermal expansion of the second electrode and the coefficient of thermal expansion of the second portion, the fourth difference being less than or equal to 50% of the coefficient of thermal expansion of the first portion; Preferably, the fourth difference is less than or equal to 50% of the coefficient of thermal expansion of the second portion; Preferably, the isolation structure further includes a third isolation portion disposed on the side of the first isolation portion facing the substrate, the third isolation portion protruding from the first isolation portion toward the isolation opening, and the second electrode being connected to the third isolation portion; Preferably, the material of the third isolation portion includes molybdenum.

14. A display panel, characterized in that, include: substrate; An isolation structure is disposed on one side of the substrate. The isolation structure has an isolation opening. The isolation structure includes a first isolation portion and a second isolation portion located on the side of the first isolation portion away from the substrate. The second isolation portion protrudes from the first isolation portion toward the isolation opening. The first isolation portion includes a first portion and a second portion that are in contact with each other. The coefficient of thermal expansion of the second portion is different from that of the first portion. A light-emitting device, at least a portion of which is disposed within the isolation opening; A first encapsulation layer is disposed on the side of the light-emitting device away from the substrate, and the first encapsulation layer and the sidewall of the first isolation portion are in continuous contact from the side closer to the substrate to the side farther away from the substrate.

15. A display device, characterized in that, Includes the display panel as described in any one of claims 1 to 14.

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