一种并联解耦柔性纳米对位平台
By employing three sets of motion branches and a decoupled flexible hinge structure in the parallel decoupled flexible nano-alignment platform, the motion coupling problem was solved, high-precision chip packaging alignment was achieved, and positioning accuracy and motion stroke were improved.
CN122121611BActive Publication Date: 2026-07-17GUANGDONG UNIV OF TECH
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- GUANGDONG UNIV OF TECH
- Filing Date
- 2026-04-27
- Publication Date
- 2026-07-17
AI Technical Summary
Technical Problem
Existing parallel planar three-degree-of-freedom flexible mechanisms suffer from motion coupling problems, which affect the alignment accuracy of high-precision chip packaging.
Method used
Three sets of identical motion chains are used, including first and second decoupled flexible hinges, a balance module, a lever, and a piezoelectric ceramic. The planar three degrees of freedom of the ring-shaped moving platform is decoupled and the stroke is increased through the series decoupled flexible hinges.
Benefits of technology
The positioning accuracy of the alignment platform was improved, the motion stroke of the circular moving platform was increased, and higher alignment accuracy and decoupling capability were achieved.
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Figure CN122121611B_ABST
Abstract
本发明公开一种并联解耦柔性纳米对位平台，涉及芯片先进封装纳米对位技术领域。平台包括同心的固定平台和环形动平台、缺口连接块、压电陶瓷及三组环形阵列运动支链，运动支链上设有第一解耦柔性铰链、第二解耦柔性铰链、对称平衡模块、杠杆等结构。第一解耦柔性铰链集成拉压变形组件与柔性转动铰链，柔性转动铰链实现柔性转动，拉压变形组件跟随柔性转动铰链转动，在转动轨迹径向方向上通过拉压变形组件拉伸压缩柔性变形实现X、Y轴解耦，环形动平台实现了平面三自由度的解耦，解耦后的环形动平台具有更高的对位精度。第二解耦柔性铰链与第一解耦柔性铰链串联成双解耦模块，联合实现环形动平台平面三自由度解耦，大幅提升平台行程与解耦能力。
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