键合前的晶圆对准方法及相关设备
By identifying the angle information of the reference line at the wafer positioning slot, calculating the angle and position offset, and adjusting the wafer alignment, the problem of wafer alignment accuracy being affected by edge defects of the positioning slot is solved, and higher alignment accuracy is achieved.
CN122121613BActive Publication Date: 2026-07-17JIANGSU JIANGLING SEMICON CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- JIANGSU JIANGLING SEMICON CO LTD
- Filing Date
- 2026-04-28
- Publication Date
- 2026-07-17
AI Technical Summary
Technical Problem
In semiconductor manufacturing, before wafer bonding, defects such as dust particles can easily appear on the edge of the positioning groove, resulting in low wafer alignment accuracy and affecting the accuracy of angular offset recognition.
Method used
By acquiring images of the first and second wafers placed opposite each other, the angle information of the slot reference line of the positioning slot is identified. The angle module and offset module are used to calculate the angle and position offset, and the second wafer is adjusted to achieve alignment.
Benefits of technology
This improved wafer alignment accuracy before bonding, reduced the impact of positioning groove edge defects on identification accuracy, and enhanced wafer alignment accuracy.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN122121613B_ABST
Abstract
本申请实施例公开了一种键合前的晶圆对准方法及相关设备，可以获取在相对放置的第一晶圆与第二晶圆之间采集的第一图像和至少一个第二图像，第一图像包括第一晶圆边缘的第一定位槽的图像和第二晶圆边缘的第二定位槽的图像；在第一图像中确定第一分界线，第一分界线位于第一定位槽和第二定位槽之间，并识别第一定位槽的槽口参考线的第一角度信息和第二定位槽的槽口参考线的第二角度信息，槽口参考线包括定位槽与晶圆的外轮廓相接的两个端点之间的连线；基于第一角度信息、第二角度信息和第二图像，确定第一晶圆相对于第二晶圆的偏移量；根据偏移量触发调节单元带动第二晶圆移动，使得第二晶圆与第一晶圆对准，有效提升对准精度。
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