An alignment device, bonding apparatus and method

Abstract

This invention relates to an alignment device, bonding apparatus, and method, comprising: a base disk; three alignment mechanisms distributed circumferentially along the base disk, with at least three alignment mechanisms operating sequentially; each alignment mechanism including a receiving component movable horizontally relative to the base disk and a clamping component rotatable vertically relative to the base disk; a target component including at least a first semiconductor wafer and a second semiconductor wafer; each clamping component is further configured to rotate vertically when the second semiconductor wafer is dropped to align with the first semiconductor wafer, after one of the receiving components has been removed and the second semiconductor wafer is in contact with the first semiconductor wafer, thereby clamping the second semiconductor wafer and the first semiconductor wafer to achieve positioning and alignment of the target component. Through this method, the alignment accuracy of the first and second semiconductor wafers can be improved, thereby ensuring the bonding efficiency of the first and second semiconductor wafers.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor manufacturing technology, and specifically relates to an alignment device, bonding equipment and method. Background Technology

[0002] With the rapid development of microelectromechanical systems (MEMS) and 3D integrated packaging, multifunctional high-performance devices, small-size low-power devices, and highly integrated devices have become the research focus in the packaging field. Wafer bonding equipment, as the core equipment for mass production of these high-performance integrated packaged devices, directly determines the precision and reliability of device packaging. In the wafer bonding process, accurately aligning and reliably bonding two or more semiconductor wafers is a crucial preliminary step to ensure the final device's electrical and mechanical performance.

[0003] Currently, the semiconductor industry is placing increasingly higher demands on alignment mechanisms in wafer bonding equipment, with future development trending towards higher precision, higher alignment speed, higher adhesion, and higher reliability. However, existing alignment devices still have many shortcomings in practical applications.

[0004] On the one hand, as the size of wafers and carriers continues to increase, air is easily trapped between the two wafers during the falling and bonding process. Even if the process chamber is made into a vacuum, due to the inevitable warpage of the wafers, air bubbles may form between the wafer and carrier under the action of van der Waals forces after bonding. Once these air bubbles are locked in the bonding surface, they cannot escape even if vacuum is continued later, eventually forming voids that seriously affect the electrical and mechanical properties of the bonded device.

[0005] On the other hand, in bonding scenarios involving homogeneous or heterogeneous wafers of the same size, a slight edge misalignment is commonly observed after the two wafers are bonded, whether supported by external force or dropped by gravity. This causes the centers and edges of the two wafers, which were aligned before bonding, to become misaligned after bonding, negatively impacting subsequent wafer bonding processes.

[0006] Furthermore, existing technologies typically employ structures such as pins or chucks to hold and transport wafers. These structures struggle to precisely control the wafer's orientation and position during descent, easily leading to relative displacement or deflection between the wafer and the substrate. Moreover, existing alignment mechanisms often use a single-stage alignment method, which is insufficient for scenarios requiring sequential bonding of multiple wafers. While existing technologies have proposed edge detection, visual alignment, and optical alignment for wafer alignment and positioning, these methods often require complex optical systems or image processing algorithms, increasing equipment costs and limiting their application within vacuum bonding cavities.

[0007] Therefore, there is an urgent need to provide an alignment device and bonding equipment that is compact in structure, reliable in operation, and capable of high-precision positioning and alignment, in order to solve the technical problems in the existing technology such as uncontrollable wafer falling posture and easy generation of bubbles and misalignment during bonding. Summary of the Invention

[0008] Therefore, the technical problem to be solved by the present invention is to solve the problems of uncontrollable posture, misalignment and air bubbles in the bonding process of semiconductor wafers in the prior art, and to achieve high-precision positioning and reliable bonding of semiconductor wafers.

[0009] To solve the above-mentioned technical problems, the present invention provides an alignment device, comprising: The base plate is configured to hold the target component. The alignment mechanism is provided in at least three parts, the at least three alignment mechanisms are distributed along the circumference of the base plate, and the at least three alignment mechanisms operate sequentially. Each of the alignment mechanisms includes a receiving component movable in a horizontal direction relative to the base plate and a clamping component rotatable in a vertical direction relative to the base plate. The receiving component is configured to receive the target component and move in the horizontal direction to drop the target component into a target area of ​​the base plate. The clamping component is configured to clamp the target component received by the receiving component to prevent the target component from moving. The target component includes at least a first semiconductor wafer and a second semiconductor wafer. Each of the clamping components is also configured to rotate along the height direction when the second semiconductor wafer is dropped to align with the first semiconductor wafer, after one of the receiving components is removed and the second semiconductor wafer is in contact with the first semiconductor wafer, to clamp the second semiconductor wafer and the first semiconductor wafer, thereby achieving the positioning and alignment of the target component.

[0010] In one embodiment, each of the receiving components includes a receiving member disposed in a horizontal direction, a first fixing member connected to the receiving member, and a first pushing member abutting against the first fixing member and moving in a vertical direction, the first pushing member having a first inclined surface abutting against the first fixing member; When the first pushing member moves along the height direction, the first inclined surface pushes the first fixing member and the receiving member to move along the horizontal direction.

[0011] In one embodiment, each of the clamping components includes a pressure roller, a gear connected to the pressure roller, a rack connected to the gear and horizontally connected, a second fixing member connected to the rack, and a second pushing member abutting against the second fixing member and moving in the height direction, the second pushing member having a second inclined surface abutting against the second fixing member; When the second pushing member moves along the height direction, the second inclined surface pushes the second fixing member and the rack to move in the horizontal direction, thereby driving the gear and the pressure roller to rotate.

[0012] In one embodiment, the alignment device further includes a first drive mechanism connected to the alignment mechanism, the first drive mechanism including at least two sets of drive components, one set of drive components being connected to the receiving component and the other set of drive components being connected to the pressing component.

[0013] In one embodiment, each set of drive components includes a drive rod arranged in the height direction, a cam docked with the drive rod, and a first drive member connected to the cam to drive the cam to rotate, the first drive member driving the cam to rotate to drive the drive rod to move in the height direction.

[0014] In one embodiment, the alignment mechanism further includes an alignment housing, in which the receiving component, the clamping component, and the drive rod are mounted; The drive assembly further includes a first protrusion connected to the drive rod, a second protrusion connected to the alignment housing, and a telescopic member connecting the first protrusion and the second protrusion, the telescopic member enabling the drive rod to return to its original position.

[0015] In one embodiment, the alignment device further includes a second drive mechanism connected to the alignment mechanism, the second drive mechanism driving the alignment mechanism to move along the height direction to adjust the first gap between the base plate and the receiving component.

[0016] The present invention also provides a bonding apparatus, comprising: Bonded cavity; An alignment device is installed inside the bonding cavity; The alignment device is the alignment device described above.

[0017] The present invention also provides a bonding method using the bonding apparatus described above, the bonding method comprising the following steps: The first semiconductor wafer is placed inside the bonding cavity; There is a first gap between the base plate and the receiving component of the alignment mechanism; the receiving component extends to receive the first semiconductor wafer, and the pressing component rotates to press the first semiconductor wafer located on the receiving component to achieve initial positioning; One of the clamping components rotates to disengage from the first semiconductor sheet, and the corresponding receiving component retracts to tilt the first semiconductor sheet. The remaining two clamping components and the receiving component repeat the above actions in sequence, causing the first semiconductor wafer to fall into the target area of ​​the base plate; The receiving component extends to receive the second semiconductor wafer, and the pressing component rotates to press the second semiconductor wafer located on the receiving component, so that the second semiconductor wafer and the first semiconductor wafer are aligned and repositioned. One of the clamping components rotates to disengage from the second semiconductor sheet, and the corresponding receiving component retracts to tilt the second semiconductor sheet. The clamping component then rotates again to clamp the corresponding second semiconductor sheet and the first semiconductor sheet together. The remaining two clamping components and the receiving component repeat the above actions in sequence, so that the second semiconductor wafer falls into the target area of ​​the base plate and overlaps with the first semiconductor wafer.

[0018] In one embodiment, the first gap is less than or equal to 1 mm.

[0019] The technical solution provided by this invention has the following advantages: By setting an alignment mechanism including a receiving component that can move horizontally relative to the base plate and a pressing component that can rotate vertically relative to the base plate, wherein the receiving component is configured to receive the target component and move horizontally to allow the target component to fall onto the target area of ​​the base plate, and the pressing component is configured to press the target component received by the receiving component to prevent the target component from moving; the target component includes at least a first semiconductor wafer and a second semiconductor wafer, and each pressing component is further configured to rotate vertically when the second semiconductor wafer falls to align with the first semiconductor wafer, after one of the receiving components is removed and the second semiconductor wafer is in contact with the first semiconductor wafer, thereby pressing the second semiconductor wafer and the first semiconductor wafer together, thereby achieving the positioning and alignment of the target component, ensuring that the first semiconductor wafer and the second semiconductor wafer maintain a good alignment posture during the falling process, preventing relative displacement and misalignment caused by gravity or external force, and significantly improving the accuracy of bonding alignment. Attached Figure Description

[0020] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the bonding device provided in Embodiment 1 of the present invention; Figure 2 for Figure 1 Partial structural diagram; Figure 3 for Figure 1 Another part of the structural diagram; Figure 4 for Figure 3 A partial structural diagram.

[0022] Explanation of reference numerals in the attached figures: 100-Bonding device; 101-Bonding cavity; 102-Alignment mechanism; 103-Base plate; 1031-Slot; 104-Second drive mechanism; 105-Mounting platform; 200 - Target Component; 1-Alignment housing; 11-Slot; 12-Second protrusion; 2-First drive mechanism; 21-First drive member; 22-Cam; 23-Drive rod; 231-First protrusion; 24-Telescopic member; 3-Receiving assembly; 31-Receiving member; 32-First fixing member; 33-First pushing member; 331-First inclined surface; 4-Pressure assembly; 41-Pressure roller; 42-Gear; 43-Rack; 44-Second fixing member; 45-Second pushing member; 451-Second inclined surface. Detailed Implementation

[0023] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. The present invention will be described in detail below with reference to the accompanying drawings and embodiments. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of the present invention can be combined with each other.

[0024] It should be noted that the terms "first," "second," etc., in the specification, claims, and drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0025] In this invention, unless otherwise stated, directional terms such as "upper," "lower," "top," and "bottom" are generally used in relation to the direction shown in the accompanying drawings, or in relation to the vertical, perpendicular, or gravitational direction of the component itself; similarly, for ease of understanding and description, "inner" and "outer" refer to the inner and outer contours of each component itself, but the above directional terms are not intended to limit this invention. Example

[0026] Please see Figures 1 to 4 In a preferred embodiment of this invention, a bonding apparatus 100 is used in the manufacturing of a target component 200. The target component 200 includes at least a first semiconductor wafer and a second semiconductor wafer. The bonding apparatus 100 is capable of bonding the first semiconductor wafer and the second semiconductor wafer together by physical or chemical methods. The first and second semiconductor wafers can be wafers, sapphire, chips, etc., and are not specifically limited here, depending on the actual situation. The materials of the first and second semiconductor wafers can be the same or different. Furthermore, in this embodiment, the dimensions of the first and second semiconductor wafers are not specifically limited. In the following description, a specific embodiment is given using the first semiconductor wafer as a carrier and the second semiconductor wafer as a wafer.

[0027] The bonding apparatus 100 includes a bonding cavity 101, a base plate 103 installed within the bonding cavity 101, and an alignment device. The base plate 103 is configured to hold the target component 200, and its upper surface is flat. The alignment device is installed on the outside of the base plate 103 and abuts against the base plate 103, and is able to position the target component 200 so that the target component 200 eventually falls into the target area of ​​the base plate 103.

[0028] The bonding cavity 101 is typically a stainless steel vacuum cavity. It is equipped with a vacuum pump and a heating mechanism. The vacuum pump creates a vacuum within the cavity, while the heating mechanism is connected to the base plate 103. The base plate 103 is responsible for flattening and adsorbing the first semiconductor wafer, preventing displacement. The heating mechanism, through heat conduction, transfers heat to the materials of the first and second semiconductor wafers on the base plate 103, causing thermal softening and reducing their hardness and elastic modulus. Therefore, during the bonding process of the first and second semiconductor wafers, the surfaces of the first and second semiconductor wafers can make more thorough contact, reducing voids and defects at the interface and creating a favorable physical basis for subsequent bonding reactions.

[0029] Furthermore, when both the first and second semiconductor wafers are made of silicon, the energy provided by the heating mechanism allows the atoms at the interface between the first and second semiconductor wafers to gain sufficient kinetic energy to overcome the obstacles of the surface oxide layer or adsorption layer, undergo atomic-level diffusion, form covalent bonds, significantly improve the bonding strength, and thus ensure bonding efficiency.

[0030] In the bonding process described above, the first semiconductor wafer needs to be placed on the base plate 103 first, and then the second semiconductor wafer is placed on top of it. Therefore, the accuracy of the alignment of the first and second semiconductor wafers on the base plate 103 is also an important reference indicator for bonding quality.

[0031] In existing technologies, a vacuum suction robot is typically used to transport the first and second semiconductor wafers to above the base disk 103, and after calibration, place them on the surface of the base disk 103. This calibration is generally performed using a vision system or sensor detection, which is inefficient and prone to accuracy issues. For example, after the first semiconductor wafer is placed above the base disk 103, the vacuum suction robot releases it, allowing the wafer to fall vertically. During this fall, the first semiconductor wafer may shift, but the vacuum suction robot may not be able to detect this shift in its final position on the base disk 103. Consequently, the second semiconductor wafer may remain in its original position without adjustment, and during its final fall, it may shift in the opposite direction. This results in a misalignment between the centers of the first and second semiconductor wafers, leading to low overlap and ultimately affecting the final bonding quality.

[0032] To prevent the aforementioned problems, the alignment device in this embodiment includes the base disk 103 and at least three alignment mechanisms 102, which are evenly distributed along the circumference of the base disk 103. This embodiment uses three alignment mechanisms 102 as an example, arranged at 120° intervals around the outer periphery of the base disk 103. The three alignment mechanisms 102 operate sequentially, performing receiving, pressing, and withdrawing actions according to a preset timing sequence to achieve the successive tilting and falling of the first and second semiconductor wafers. This successive tilting and falling method allows air between the first and second semiconductor wafers and the base disk 103 to be gradually expelled from the tilted edge, effectively preventing the formation of bubbles and voids.

[0033] The base disk 103 has a slot 1031 arranged circumferentially thereon, and each alignment mechanism 102 engages with the slot 1031 so that the alignment mechanism 102 can engage with the base disk 103. The alignment mechanism 102 also includes an alignment housing 1, which is engaged in the slot 1031 of the base disk 103, and can fall into the target area of ​​the base disk 103 along the direction of the alignment housing 1 when the first semiconductor wafer and the second semiconductor wafer fall.

[0034] Each alignment mechanism 102 includes a receiving component 3 movable in the horizontal direction relative to the base plate 103 and a pressing component 4 rotatable in the vertical direction relative to the base plate 103. The receiving component 3 is configured to receive the target component 200 and move horizontally to drop the target component 200 into the target area of ​​the base plate 103. The pressing component 4 is configured to press the target component 200 received by the receiving component 3 to prevent the target component 200 from moving.

[0035] Specifically, the receiving component 3 has an extended state and a retracted state. In the extended state, the receiving component 3 extends into the area above the base plate 103 to receive the target component 200; in the retracted state, the receiving component 3 is withdrawn from the area above the base plate 103, causing the target component 200 to lose support and fall. Correspondingly, the clamping component 4 has a clamping state and a releasing state. In the clamping state, the clamping component 4 rotates to contact the upper surface of the target component 200, applying a downward clamping force; in the releasing state, the clamping component 4 rotates to a position away from the target component 200.

[0036] When the second semiconductor wafer needs to be aligned and positioned, each clamping component 4 is also configured to rotate after one of the receiving components 3 is removed and when the second semiconductor wafer is in contact with the first semiconductor wafer during the process of the second semiconductor wafer falling to align with the first semiconductor wafer. The rotation along the height direction is used to clamp the second semiconductor wafer and the first semiconductor wafer, thereby achieving precise positioning and alignment of the target component 200. This ensures that during the process of the second semiconductor wafer falling at different angles, the semiconductor wafers that have been in contact can be clamped and fixed in time to prevent misalignment due to warping or shaking.

[0037] Each receiving assembly 3 includes a receiving member 31 arranged horizontally, a first fixing member 32 connected to the receiving member 31, and a first pushing member 33 that abuts against the first fixing member 32 and moves along the height direction. The receiving member 31 is an elongated rod-shaped or plate-shaped structure, one end of which is used to extend into the area above the base plate 103 to receive the target assembly 200. The first fixing member 32 is fixedly installed on the receiving member 31 and is spherical. The first pushing member 33 has a first inclined surface 331 that abuts against the first fixing member 32. When the first pushing member 33 moves along the height direction, the first inclined surface 331 pushes the first fixing member 32 and the receiving member 31 to move horizontally. Correspondingly, the alignment housing 1 is also provided with a slot 11 arranged horizontally. When the receiving assembly 3 is in the extended state, at least part of the receiving member 31 is located outside the alignment housing 1, the first fixing member 32 is located on the side of the slot 11 near the base plate 103, and the end of the first pushing member 33 is engaged with the first fixing member 32. When the first pusher 33 moves up the height direction, the first pusher 33 pushes the first fixing member 32 to slide from the end of the slot 11 near the base plate 103 to the end away from the base plate 103, thereby driving the receiving member 31 to move in the horizontal direction and switch from the extended state to the retracted state.

[0038] The horizontal movement is achieved by using an inclined plane push mechanism, which has advantages such as simple structure, smooth transmission, and easy stroke control. By controlling the height movement of the first pusher 33, the horizontal extension and retraction distances of the receiving part 31 can be precisely controlled.

[0039] Each clamping assembly 4 includes a pressure roller 41, a gear 42 connected to the pressure roller 41, a rack 43 meshing with the gear 42 and arranged horizontally, a second fixing member 44 connected to the rack 43, and a second pushing member 45 abutting against the second fixing member 44 and moving in the height direction. The pressure roller 41 is used to directly contact and clamp the target assembly 200, and its surface may be provided with a buffer layer to avoid damage to the target assembly 200. The gear 42 is coaxially fixedly connected to the pressure roller 41. The rack 43 meshes with the gear 42, and when the rack 43 moves in the horizontal direction, it drives the gear 42 and the pressure roller 41 to rotate. The second pushing member 45 has a second inclined surface 451 that abuts against the second fixing member 44. When the second pushing member 45 moves in the height direction, the second inclined surface 451 pushes the second fixing member 44 and the rack 43 to move horizontally, thereby driving the gear 42 and the pressure roller 41 to rotate. Similarly, the housing 1 is also provided with a slot 11 arranged in the horizontal direction. When the clamping assembly 4 is in the clamping state, the pressure roller 41 contacts and abuts against the target assembly 200. The second fixing member 44 is located on the side of the slot 11 near the base plate 103, and the end of the second pushing member 45 is engaged with the second fixing member 44. When the second pushing member 45 moves up the height direction, the second pushing member 45 pushes the second fixing member 44 to slide from the end of the slot 11 near the base plate 103 to the end away from the base plate 103, thereby driving the rack 43 to move in the horizontal direction and drive the pressure roller 41 to rotate, thereby switching from the clamping state to the releasing state.

[0040] The height movement of the second pusher 45 is converted into the rotational movement of the pressure roller 41 through the gear 42 and rack 43 transmission, so as to realize the pressing and releasing of the pressing component 4 on the target component 200. The transmission efficiency is high and the action is precise and reliable.

[0041] The alignment device also includes a first drive mechanism 2 connected to the alignment mechanism 102. The first drive mechanism 2 includes at least two sets of drive components, one set of drive components connected to the receiving component 3 for driving the action of the receiving component 3; and the other set of drive components connected to the pressing component 4 for driving the action of the pressing component 4. The two sets of drive components can be controlled independently to achieve precise timing control of the receiving component 3 and the pressing component 4.

[0042] Each drive assembly includes a drive rod 23 arranged along the height direction, a cam 22 that engages with the drive rod 23, and a first drive member 21 connected to the cam 22 to drive the cam 22 to rotate. When the first drive member 21 drives the cam 22 to rotate, the curved surface of the cam 22 pushes the drive rod 23 to move along the height direction. The upper end of the drive rod 23 engages with the lower end of the first push member 33 or the second push member 45, thereby transmitting the driving force in the height direction to the receiving assembly 3 or the clamping assembly 4.

[0043] The receiving assembly 3, the clamping assembly 4, and the drive rod 23 are installed inside the alignment housing 1. The drive assembly also includes a first protrusion 231 connected to the drive rod 23, a second protrusion 12 connected to the alignment housing 1, and a telescopic member 24 connecting the first protrusion 231 and the second protrusion 12. The telescopic member 24 can be a spring or other elastic return member. When the cam 22 rotates to the non-lifting state, the telescopic member 24 can use its elastic restoring force to reset the drive rod 23, thereby driving the receiving assembly 3 or the clamping assembly 4 to return to the initial state.

[0044] The alignment device also includes a second drive mechanism 104 connected to the alignment mechanism 102. The second drive mechanism 104 drives the alignment mechanism 102 to move along the height direction to adjust the first gap between the base plate 103 and the receiving component 3, so as to ensure that the target component 200 does not shift during the fall, thereby ensuring the accuracy of bonding.

[0045] The second drive mechanism 104 includes a mounting platform 105 for mounting at least three alignment mechanisms 102, and a second drive member connected to the mounting platform 105. The second drive member drives the mounting platform 105 to move in the height direction to drive the alignment mechanism 102 to move in the height direction, thereby adjusting the first gap between the base plate 103 and the receiving component 3.

[0046] The first driving component 21 and the second driving component mentioned above can be a drive motor, a servo motor, etc., and can be set according to the actual situation. No specific limitation is made here.

[0047] The present invention also provides a bonding method using the bonding apparatus 100 described above, the bonding method comprising the following steps: The first semiconductor wafer is placed in the bonding cavity 101 and initially positioned in the alignment area above the base disk 103.

[0048] A first gap exists between the base plate 103 and the receiving component 3 of the alignment mechanism 102. This first gap is preferably less than or equal to 1 mm to ensure that the first semiconductor wafer experiences a minimal drop when falling, thus preventing impact or displacement due to excessive drop. The receiving component 3 extends to receive the first semiconductor wafer, and the pressing component 4 rotates to press the first semiconductor wafer located on the receiving component 3, achieving initial positioning. In this embodiment, the receiving components 3 of the three alignment mechanisms 102 extend simultaneously into the area above the base plate 103 to jointly receive the first semiconductor wafer. At the same time, the three pressing components 4 rotate to the pressing state, pressing and fixing the first semiconductor wafer located on the receiving component 3, completing the initial positioning.

[0049] One of the clamping components 4 rotates and disengages from the first semiconductor sheet, and its corresponding receiving component 3 retracts to tilt the first semiconductor sheet. At this time, the first semiconductor sheet loses support in that direction and exhibits a partially tilted state. Since the receiving components 3 of the other two alignment mechanisms 102 remain supported, the first semiconductor sheet will not fall directly as a whole, but will slowly approach the base plate 103 in a tilted posture.

[0050] The remaining two clamping components 4 and receiving components 3 repeat the above actions sequentially, causing the first semiconductor wafer to fall into the target area of ​​the base plate 103. That is, the clamping components 4 of the second and third alignment mechanisms 102 disengage sequentially, and the corresponding receiving components 3 retract sequentially. As the support points disappear one by one, the first semiconductor wafer falls gradually in an inclined posture, eventually falling completely into the target area of ​​the base plate 103 and tightly adhering to the upper surface of the base plate 103. This sequential inclined falling method allows the air between the first semiconductor wafer and the base plate 103 to be gradually expelled from the inclined edge, ensuring the consistency of the final falling position of the first and second semiconductor wafers.

[0051] The receiving component 3 extends to receive the second semiconductor wafer, and the pressing component 4 rotates to press the second semiconductor wafer located on the receiving component 3. At this time, the second semiconductor wafer is located directly above the first semiconductor wafer, and through the precise positioning of the receiving component 3, the second semiconductor wafer and the first semiconductor wafer are initially aligned, and the repositioning is completed.

[0052] One of the clamping components 4 rotates to disengage from the second semiconductor sheet, and its corresponding receiving component 3 retracts to tilt the second semiconductor sheet. The clamping component 4 then rotates again to press the corresponding second and first semiconductor sheets together. That is, the clamping component 4 of the first alignment mechanism 102 rotates to disengage from the second semiconductor sheet, and its corresponding receiving component 3 retracts. The second semiconductor sheet loses support in this direction and becomes partially tilted, with its lower surface beginning to contact the upper surface of the first semiconductor sheet. At this time, the clamping component 4 rotates again to the clamping state, pressing the corresponding second and first semiconductor sheets together, ensuring that the second semiconductor sheet can fall smoothly and immediately fixing it after contact to prevent relative displacement.

[0053] The remaining two clamping components 4 and receiving components 3 repeat the above actions in sequence. That is, the clamping components 4 of the second and third alignment mechanisms 102 disengage sequentially, and the corresponding receiving components 3 retract sequentially. The second semiconductor wafer falls gradually in an inclined posture and contacts the first semiconductor wafer. The corresponding clamping components 4 immediately clamp again after contact. Finally, the second semiconductor wafer falls into the target area of ​​the base plate 103 and overlaps with the first semiconductor wafer.

[0054] After alignment is completed, all clamping components 4 remain clamped, and the bonding equipment 100 can further perform subsequent bonding processes such as pressurization and heating to achieve permanent bonding between the first semiconductor wafer and the second semiconductor wafer.

[0055] The above bonding method achieves precise alignment and controllable bonding of semiconductor wafers during the bonding process through steps such as initial positioning, tilting and falling, repositioning, and successive pressing and bonding. This effectively avoids misalignment, bubbles, and voids, and significantly improves bonding quality and yield.

[0056] In summary: By providing an alignment mechanism 102 including a receiving component 3 movable horizontally relative to the base plate 103 and a pressing component 4 rotatable vertically relative to the base plate 103, wherein the receiving component 3 is configured to receive the target component 200 and move horizontally to allow the target component 200 to fall into the target area of ​​the base plate 103, and the pressing component 4 is configured to press the target component 200 received by the receiving component 3 to prevent the target component 200 from moving; the target component 200 includes at least a first semiconductor wafer and a second semiconductor wafer, and each pressing component 4 is further configured to rotate vertically when the second semiconductor wafer falls to align with the first semiconductor wafer, after one of the receiving components 3 is removed and the second semiconductor wafer is in contact with the first semiconductor wafer, thereby pressing the second semiconductor wafer and the first semiconductor wafer together, the positioning and alignment of the target component 200 is achieved, ensuring that the first semiconductor wafer and the second semiconductor wafer maintain a good alignment posture during the falling process, preventing relative displacement and misalignment caused by gravity or external forces, and significantly improving the accuracy of bonding alignment.

[0057] Obviously, the embodiments described above are merely some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, those skilled in the art can make inventive decisions without creative effort. Any other variations or modifications that may be made should fall within the scope of protection of this invention.

Claims

1. An alignment device, characterized in that, include: The base plate is configured to hold the target component. The alignment mechanism is provided in at least three parts, the at least three alignment mechanisms are distributed along the circumference of the base plate, and the at least three alignment mechanisms operate sequentially. Each of the alignment mechanisms includes a receiving component movable in a horizontal direction relative to the base plate and a clamping component rotatable in a vertical direction relative to the base plate. The receiving component is configured to receive the target component and move in the horizontal direction to drop the target component into a target area of ​​the base plate. The clamping component is configured to clamp the target component received by the receiving component to prevent the target component from moving. The target component includes at least a first semiconductor wafer and a second semiconductor wafer. Each of the clamping components is also configured to rotate along the height direction when the second semiconductor wafer is dropped to align with the first semiconductor wafer, after one of the receiving components is removed and the second semiconductor wafer is in contact with the first semiconductor wafer, to clamp the second semiconductor wafer and the first semiconductor wafer, thereby achieving the positioning and alignment of the target component.

2. The alignment device as claimed in claim 1, characterized in that, Each of the receiving components includes a receiving member arranged in a horizontal direction, a first fixing member connected to the receiving member, and a first pushing member abutting against the first fixing member and moving in a vertical direction, the first pushing member having a first inclined surface abutting against the first fixing member; When the first pushing member moves along the height direction, the first inclined surface pushes the first fixing member and the receiving member to move along the horizontal direction.

3. The alignment device as claimed in claim 1, characterized in that, Each of the clamping assemblies includes a pressure roller, a gear connected to the pressure roller, a rack connected to the gear and horizontally connected, a second fixing member connected to the rack, and a second pushing member abutting against the second fixing member and moving in the height direction, the second pushing member having a second inclined surface abutting against the second fixing member; When the second pushing member moves along the height direction, the second inclined surface pushes the second fixing member and the rack to move in the horizontal direction, thereby driving the gear and the pressure roller to rotate.

4. The alignment device as claimed in claim 1, characterized in that, The alignment device further includes a first drive mechanism connected to the alignment mechanism. The first drive mechanism includes at least two sets of drive components, one set of which is connected to the receiving component and the other set of which is connected to the pressing component.

5. The alignment device as claimed in claim 4, characterized in that, Each set of drive components includes a drive rod arranged along the height direction, a cam that engages with the drive rod, and a first drive member connected to the cam to drive the cam to rotate. The first drive member drives the cam to rotate, thereby driving the drive rod to move along the height direction.

6. The alignment device as claimed in claim 5, characterized in that, The alignment mechanism further includes an alignment housing, and the receiving component, the clamping component and the drive rod are installed inside the alignment housing; The drive assembly further includes a first protrusion connected to the drive rod, a second protrusion connected to the alignment housing, and a telescopic member connecting the first protrusion and the second protrusion, the telescopic member enabling the drive rod to return to its original position.

7. The alignment device as claimed in claim 1, characterized in that, The alignment device further includes a second drive mechanism connected to the alignment mechanism, the second drive mechanism driving the alignment mechanism to move along the height direction to adjust the first gap between the base plate and the receiving component.

8. A bonding apparatus, characterized in that, include: Bonded cavity; An alignment device is installed inside the bonding cavity; The alignment device is the alignment device as described in any one of claims 1 to 7.

9. A bonding method, characterized in that, Using the bonding apparatus as described in claim 8, the bonding method includes the following steps: The first semiconductor wafer is placed inside the bonding cavity; There is a first gap between the base plate and the receiving component of the alignment mechanism; the receiving component extends to receive the first semiconductor wafer, and the pressing component rotates to press the first semiconductor wafer located on the receiving component to achieve initial positioning; One of the clamping components rotates to disengage from the first semiconductor sheet, and the corresponding receiving component retracts to tilt the first semiconductor sheet. The remaining two clamping components and the receiving component repeat the above actions in sequence, causing the first semiconductor wafer to fall into the target area of ​​the base plate; The receiving component extends to receive the second semiconductor wafer, and the pressing component rotates to press the second semiconductor wafer located on the receiving component, so that the second semiconductor wafer and the first semiconductor wafer are aligned and repositioned. One of the clamping components rotates to disengage from the second semiconductor sheet, and the corresponding receiving component retracts to tilt the second semiconductor sheet. The clamping component then rotates again to clamp the corresponding second semiconductor sheet and the first semiconductor sheet together. The remaining two clamping components and the receiving component repeat the above actions in sequence, so that the second semiconductor wafer falls into the target area of ​​the base plate and overlaps with the first semiconductor wafer.

10. The bonding method as described in claim 9, characterized in that, The first gap is less than or equal to 1 mm.

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