Evaporation Coating Method and Apparatus

Abstract

This invention provides an evaporation coating method and apparatus, relating to the field of semiconductor technology. The method includes: providing a coating pot and an evaporator; multiple substrates are laid on the inner wall of the coating pot, the perpendicular bisector K of the plane to be coated passes through the center of a sphere; the perpendicular bisector G of the outlet of the evaporator passes through the center, and the evaporator can swing around a pivot axis passing through the center; selecting a target substrate, obtaining the number b of substrates in the radial group where the target substrate is located according to the position of the target substrate, and obtaining the single rotation angle d of the coating pot according to the number b; adjusting the orientation of the outlet of the evaporator according to the position of the target substrate, so that the perpendicular bisector of the outlet coincides with the perpendicular bisector K of the plane to be coated on the target substrate; controlling the evaporator to start evaporation and starting timing, after time e, rotating the coating pot by angle d around the center line N of the coating pot, so that the perpendicular bisector of the outlet coincides with the perpendicular bisector K of the plane to be coated on the next target substrate.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and in particular to an evaporation coating method and apparatus. Background Technology

[0002] Existing evaporation coating apparatus includes a coating pot and an evaporator. The substrate is fixed inside the coating pot, and the coating material is placed inside the evaporator. The coating pot is bowl-shaped, and there are multiple substrates inside the coating pot. The substrates are laid on the inner side wall of the coating pot, and the orientation of the substrates to be coated is different.

[0003] The coating material inside the heated evaporator causes its atoms or molecules to vaporize and escape from the surface, forming a vapor stream that is incident on the substrate surface and condenses to form a solid thin film. Vacuum evaporation coating produces films with high purity, fast coating rates, and simple, easy-to-operate equipment. However, the coating material is continuously consumed during the evaporation process, requiring the addition of new material before each evaporation cycle to ensure the desired film thickness is achieved.

[0004] like Figure 8 As shown, at the same location on substrate 2, raw material vapors are deposited from different angles, and the coating is isotropic. The photoresist (stripping process) or the lateral sidewalls of the existing protrusion structure 21 are wrapped by the metal film layer 22, affecting the next process. Summary of the Invention

[0005] The purpose of this invention is to provide an evaporation coating method and apparatus to alleviate the technical problem of the transverse sidewalls of the protruding structure on the substrate being wrapped by a metal film layer in the existing evaporation coating process.

[0006] In a first aspect, the present invention provides an evaporation coating method, comprising: Step S10. Provide a plating pan with a spherical inner wall and an evaporator; along the radial direction of the plating pan, from the inside to the outside, multiple substrates are laid on the inner wall of the plating pan, and multiple substrates at the same radial position are arranged in a tight ring around the center line N of the plating pan to form a radial group; the side of the substrate facing the evaporator is the plane to be plated, and the perpendicular bisector K of the plane to be plated passes through the center of the sphere; the plane to be plated is provided with a protruding structure; The vertical line G of the evaporator's outlet passes through the center of the circle, and the evaporator can swing around the axis passing through the center of the circle to adjust the orientation of the evaporator's outlet. Step S20. Select the target substrate, obtain the number b of substrates in the radial group where the target substrate is located according to the position of the target substrate, and obtain the single rotation angle d of the plating pot according to the number b; Step S30. Adjust the orientation of the evaporator outlet according to the position of the target substrate, so that the perpendicular bisector of the outlet coincides with the perpendicular bisector K of the plane to be evaporated on the target substrate; Step S40. Control the evaporator to start evaporation and start timing. After time e, rotate the evaporation pot by an angle d around the center line N of the evaporation pot so that the perpendicular bisector of the outlet coincides with the perpendicular bisector K of the plane to be evaporated on the next target substrate. Continue in this manner until the film thickness on all substrates in the radial group reaches the preset thickness c, and then stop, so that all substrates in the radial group form coated substrates.

[0007] Furthermore, step S10 also includes the step of: providing a single-piece injection mechanism, wherein the edge of the plating pot and the center of the plating pot form a vapor deposition range, and the single-piece injection mechanism is located outside the vapor deposition range; The evaporation coating method also includes steps performed between steps S20 and S30: Step S21. Calculate the total evaporation time based on the preset film thickness c and quantity b of the target substrate; S22. Swing the evaporator to the filling state so that its opening is outside the evaporation range, and inject a ball of material into the outlet of the evaporator through the single-ball filling mechanism; Step S40 also includes: stopping the timing after the material balls in the evaporator 3 are completely consumed, and then proceeding to step S22; until the cumulative timing reaches the total evaporation time.

[0008] Furthermore, the evaporation coating method also includes the steps performed before step S22: setting the evaporation temperature of the evaporator and preheating the evaporator to the evaporation temperature.

[0009] Furthermore, the evaporation coating method also includes the following steps performed before step S22: setting the evaporation temperature of the evaporator; preheating the evaporator to a first temperature, the first temperature being lower than the evaporation temperature, and the difference between the evaporation temperature and the first temperature being in the range of 20℃-50℃; In step S40, the specific steps of controlling the evaporator to start vapor deposition and start timing are as follows: control the evaporator to heat to the evaporation temperature, start vapor deposition and start timing.

[0010] Furthermore, the evaporator includes an evaporation tank for holding and depositing material balls, and the opening of the evaporation tank forms a discharge port; Along the depth direction of the evaporation tank and from the outside to the inside, the evaporation tank includes a first region, a second region, and a third region connected in sequence. The inner wall of the first region is cylindrical; the inner wall of the second region is conical and its inner diameter gradually decreases; the inner wall of the third region is cylindrical; and the inner diameter of the first region is larger than the inner diameter of the third region. When the evaporator is in the charging state, the angle M between the inner wall of the first zone and the center line of the plating pot is less than 80°.

[0011] Furthermore, step S30 specifically includes: Step S31. Adjust the orientation of the evaporator outlet so that the vertical line G of the evaporator outlet is perpendicular to the plane of the target substrate to be coated; Step S32. Rotate the plating pan so that the vertical line G of the evaporator outlet passes through the center of the plane to be plated on the target substrate.

[0012] Furthermore, step S31 specifically includes the following steps: The laser perpendicularity detection mechanism installed on the evaporator determines whether the vertical line G of the evaporator outlet is perpendicular to the target substrate's deposition plane. The laser transmission and reception path of the laser perpendicularity detection mechanism is parallel to the vertical line G of the outlet. Step S32 specifically includes the following steps: Rotate the plating pot; acquire an image of the target substrate's platen to be plated using an image acquisition device mounted on the evaporator, compare the acquired image with a standard image of the target substrate's platen to be plated, and stop rotating the plating pot when the acquired image matches the shape of the standard image of the target substrate's platen to be plated; the perpendicular bisector G of the evaporator's outlet passes through the center of the target substrate's platen to be plated, wherein the center line of the image acquisition device's lens is coaxial with the perpendicular bisector G of the outlet.

[0013] Furthermore, the image acquisition device is movably connected to the evaporator via a rocker arm, so that when the image acquisition device is in working condition, it is in front of the discharge port, and when the image acquisition device is not in working condition or the evaporator is in the feeding condition, it is outside the evaporation range. The evaporation range is formed by connecting the edge of the evaporation pot with the center of the evaporation pot.

[0014] Furthermore, in the coated substrate, the top surface of the raised structure and the area on the top surface of the substrate not covered by the raised structure are both deposited with a metal film layer. The transverse sidewalls of the protruding structure are not covered by a metal film layer.

[0015] Secondly, the present invention provides an evaporation coating apparatus for performing the above-described method; The evaporation coating apparatus includes a coating pot, a drive mechanism, an evaporator, a single-piece feeding mechanism, and a controller. The controller is connected to the coating pot, the drive mechanism, the evaporator, and the single-piece feeding mechanism, respectively. The inner wall of the plating pot is spherical, and the inner wall of the plating pot is used to lay multiple substrates; The evaporator is connected to the drive mechanism, and the drive mechanism's rotating shaft passes through the center of the circle, causing the evaporator to swing around the center of the circle. The single-ball injection mechanism is used to inject ball material into the evaporator; The controller includes a timing module for accumulating the evaporation time.

[0016] This invention has at least the following advantages or beneficial effects: The evaporation coating method provided by this invention includes: Step S10. Providing a coating pot with a spherical inner wall and an evaporator; along the radial direction of the coating pot, from the inside to the outside, multiple substrates are laid on the inner wall of the coating pot, and multiple substrates at the same radial position are arranged in a tight ring around the center line N of the coating pot as a radial group; the side of the substrate facing the evaporator is the plane to be coated, and the perpendicular bisector K of the plane to be coated passes through the center of the sphere; the plane to be coated is provided with a protruding structure; the perpendicular bisector G of the outlet of the evaporator passes through the center, and the evaporator can swing around the axis passing through the center to adjust the orientation of the outlet of the evaporator; Step S20. Selecting a target substrate, and obtaining the target substrate according to its position. The number of substrates b in the radial group is determined, and the single rotation angle d of the plating pot is obtained based on the number b; Step S30. According to the position of the target substrate, the orientation of the evaporator outlet is adjusted so that the perpendicular bisector of the outlet coincides with the perpendicular bisector K of the plane to be plated on the target substrate; Step S40. The evaporator is controlled to start the evaporation and the timing is started. After time e, the plating pot is rotated by an angle d around the center line N of the plating pot so that the perpendicular bisector of the outlet coincides with the perpendicular bisector K of the plane to be plated on the next target substrate. This process is repeated until the film thickness on all substrates in the radial group reaches the preset thickness c, so that all substrates in the radial group form coated substrates.

[0017] In this vapor deposition method, multiple substrates are evenly distributed on the spherical surface of the deposition pan, and are arranged radially in a manner from the inside out to form multiple radial groups, which facilitates uniform coating of substrates within the same radial group. After selecting the target substrate, the number b of substrates in the radial group where the target substrate is located is obtained according to the position of the target substrate, and the single rotation angle d of the plating pot is obtained according to the number b. Then, according to the position of the target substrate, the orientation of the evaporator outlet is adjusted so that the perpendicular bisector G of the outlet coincides with the perpendicular bisector K of the plane to be plated on the target substrate. The outlet of the evaporator is made to face the raised structure as much as possible. The particles ejected from the outlet of the evaporator are vertically deposited on the top surface of the raised structure, achieving anisotropic deposition and reducing the probability of coating on the sidewall of the raised structure. Furthermore, when the raised structure is the required existing structure and the sidewall of the existing structure is not covered by a thin film, it can be applied to scenarios where it is forbidden to coat the sidewall of the structure with a thin film. When the raised structure is photoresist, the sidewall of the photoresist is not covered by a thin film, and the metal film covering the top surface of the photoresist can be easily peeled off without the problem of edge metal stringing. The evaporator is controlled to start evaporation and timing begins. Initially, evaporation is performed on one target substrate. After time e, the evaporation pot is rotated by an angle d around the center line N of the evaporation pot so that the perpendicular bisector of the outlet coincides with the perpendicular bisector K of the plane to be evaporated on the next target substrate. Then, evaporation is performed for another time e, and so on, until the film thickness on all substrates in the radial group reaches the preset thickness c, and then the process stops. This ensures that all substrates in the radial group form coated substrates, thereby achieving simultaneous coating of multiple substrates. Attached Figure Description

[0018] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0019] Figure 1 A schematic diagram of step S10 of the evaporation coating method provided in an embodiment of the present invention; Figure 2 A bottom view of the plating pot for step S10 of the evaporation coating method provided in an embodiment of the present invention; Figure 3 A schematic diagram of step S22 of the evaporation coating method provided in an embodiment of the present invention; Figure 4 A schematic diagram of step S30 of the evaporation coating method provided in an embodiment of the present invention; Figure 5 A schematic diagram of steps S31 and S32 of the evaporation coating method provided in the embodiments of the present invention; Figure 6 This is a schematic diagram showing the image acquisition device in a non-working state during the evaporation coating method provided in this embodiment of the invention; Figure 7 A schematic diagram of the coating substrate prepared by the evaporation coating method provided in the embodiments of the present invention; Figure 8 This is a schematic diagram of a coating substrate in the prior art.

[0020] Icons: 1-Pouring pot; 2-Substrate; 21-Raised structure; 22-Metal film layer; 3-Evaporator; 31-First region; 32-Second region; 33-Third region; 4-Single-piece injection mechanism; 5-Laser verticality detection mechanism; 6-Image acquisition device; 7-Target substrate; 9-Rotating shaft; 10-Shaker arm; 11-Center; 12-Evaporation range. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0022] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0023] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0024] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this invention is in use. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention. In addition, the terms "first," "second," "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0025] Furthermore, terms such as "horizontal" and "vertical" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0026] In the description of this invention, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0027] like Figure 1 and Figure 2 As shown, the evaporation coating method provided by the present invention includes: Step S10. Provide a plating pot 1 with a spherical inner wall and an evaporator 3.

[0028] The plating pan 1 is located above the evaporator 3. The inner wall of the plating pan 1 is spherical. The top of the plating pan 1 is connected to a rotary drive mechanism to drive the plating pan 1 to rotate around its center line N. The center line N of the plating pan 1 mentioned above refers to the straight line passing through the surface center H of the sphere and the center 11 of the sphere. Figure 1 and Figure 2 As shown.

[0029] like Figure 2 As shown, along the radial direction of the plating pot 1, from the inside to the outside, multiple substrates 2 are laid on the inner wall of the plating pot 1. Multiple substrates 2 at the same radial position are arranged in a tight ring around the center line of the plating pot 1 to form a radial group. In two adjacent radial groups, the number of substrates 2 in the radial group that is closer to the center line of the plating pot 1 is less than the number of substrates 2 in the radial group that is farther away from the center line of the plating pot 1.

[0030] like Figure 2 As shown, in this embodiment, a substrate 2 may or may not be installed at the center of the inner surface of the plating pot 1. A ring of substrates 2 surrounds the central substrate 2 radially outwards, with these rings approximately located in the same radial position, thus forming a radial group. Similarly, a second ring of substrates 2 is arranged radially outwards to form a second radial group. In this embodiment, besides the central substrate 2, a total of two radial groups are arranged on the plating pot 1: the inner radial group contains 6 substrates 2, and the outer radial group contains 12 substrates 2.

[0031] like Figure 4 As shown, the side of the substrate 2 facing the evaporator 3 is the surface to be coated, and the perpendicular bisector K of the surface to be coated passes through the center 11 of the sphere. A protruding structure 21 is provided in the approximate central area of ​​the surface to be coated. The protruding structure 21 can be columnar, with a circular or rectangular cross-section, etc. The protruding structure 21 should be arranged as centrally as possible in the surface to be coated so that the outlet of the evaporator 3 can be aligned with the protruding structure 21 as much as possible during the subsequent adjustment of the outlet.

[0032] like Figure 4 and Figure 5 As shown, the perpendicular bisector G of the outlet of the evaporator 3 passes through the center 11. The perpendicular bisector G of the outlet of the evaporator 3 refers to a straight line passing through the center of the opening of the evaporator 3 and perpendicular to the surface of that opening. The evaporator 3 can swing about a pivot 9 passing through the center 11 to adjust the orientation of the outlet of the evaporator 3. Since the pivot 9 of the evaporator 3 passes through the center 11, regardless of how the evaporator 3 swings, the perpendicular bisector G of the outlet of the evaporator 3 can be perpendicular to the surfaces of the radially arranged substrates 2 to be coated.

[0033] Step S20. Select the target substrate 7, obtain the number b of substrates 2 in the radial group where the target substrate 7 is located according to the position of the target substrate 7, and obtain the single rotation angle d of the plating pot 1 according to the number b.

[0034] The materials and thicknesses of the films deposited on the substrates 2 in the inner and outer radial groups can be different. The substrate 2 in the inner radial group can be selected as the target substrate 7. There are six substrates 2 in this radial group. Therefore, the single rotation angle d is 60°. By rotating the plating pan 1, the evaporator 3 is aligned with the substrate 2 one by one.

[0035] Step S21. Calculate the total evaporation time based on the preset film thickness c and quantity b of the target substrate 7.

[0036] In this embodiment, the film thickness can be controlled by the total evaporation time. The total evaporation time of the substrates 2 in the radial group is directly proportional to the preset film thickness c and the number b; the thicker the film, the longer the time; the more substrates, the longer the time. Before coating, the overall coating time of the radial group can be roughly calculated. Once the film thickness is known, the coating time of a single substrate 2 can be obtained in advance based on experience. Combined with the rotation speed of the coating pan 1, the total evaporation time can be calculated.

[0037] Step S30. Adjust the orientation of the outlet of the evaporator 3 according to the position of the target substrate 7, so that the vertical line G of the outlet coincides with the vertical line K of the plane to be evaporated on the target substrate 7.

[0038] like Figure 4 and Figure 5 As shown, once the target substrate 7 is selected, the angle of the outlet of the evaporator 3 is determined. The evaporator 3 is driven by a drive mechanism to swing around the rotating shaft 9, causing the perpendicular bisector G of the outlet to coincide with the perpendicular bisector K of the surface to be coated on the target substrate 7. Particles ejected from the outlet of the evaporator 3 are vertically deposited on the top surface of the raised structure 21, achieving anisotropic deposition. During the process of aligning the perpendicular bisector G of the outlet with the perpendicular bisector K of the surface to be coated on the target substrate 7, the perpendicular bisector G of the outlet can be first adjusted to be perpendicular to the surface to be coated on the target substrate 7. Then, the coating pan 1 is rotated, and image recognition technology is used to ensure that the perpendicular bisector G of the outlet coincides with the perpendicular bisector K of the surface to be coated on the target substrate 7.

[0039] Step S40. Control the evaporator 3 to start evaporation and start timing. After time e, rotate the evaporation pot 1 by an angle d around the center line N of the evaporation pot 1 so that the perpendicular line G of the outlet coincides with the perpendicular line K of the plane to be evaporated on the next target substrate 7. Stop when the film thickness on all substrates 2 in the radial group reaches the preset thickness c, so that all substrates 2 in the radial group form a coated substrate.

[0040] After the evaporator 3 starts working, it begins to coat the first substrate 2. After time e, which can be set as the total coating time for a single substrate 2, the first substrate 2 completes the deposition of a film of the preset thickness. Then, the coating pan 1 is rotated by an angle d so that the perpendicular bisector G of the outlet of the evaporator 3 coincides with the perpendicular bisector K of the plane to be coated on the next substrate 2. Deposition is then carried out again for time e, and so on, to complete the deposition of all substrates 2 one by one. The film thickness on all substrates 2 is the same.

[0041] Alternatively, the time e can be set to be less than the total coating time of a single substrate 2. By repeating the evaporation process, the coating of all substrates 2 in the radial group can be completed. For example, the first substrate 2 is coated for time e (e.g., 2s), and then the coating pan 1 is rotated by d (e.g., 60°) to coat the second substrate 2 for time e. Then the coating pan 1 is rotated by d, and so on. The coating pan 1 rotates at least twice to coat all substrates 2 with a film of the same thickness.

[0042] like Figure 7 As shown, when the protrusion structure 21 is a required existing structure (e.g., a structure in a product that does not need to be peeled off in subsequent processes), the sidewalls of the existing structure are not covered by a thin film, which can be applied to scenarios where it is forbidden to deposit a thin film on the sidewalls of the structure; while when the protrusion structure 21 is photoresist, the sidewalls of the photoresist are not covered by a thin film, and the metal film covering the top surface of the photoresist can be easily peeled off without the problem of edge metal stringing.

[0043] Step S10 also includes the step of: providing a single-piece injection mechanism 4, the edge of the plating pot 1 and the center 11 of the plating pot 1 forming a vapor deposition range 12, and the single-piece injection mechanism 4 being located outside the vapor deposition range 12.

[0044] like Figure 3 As shown, in this embodiment, a single-ball feeding method is used to add material balls into the evaporator 3. Furthermore, the single-ball feeding mechanism 4 is positioned outside the evaporation range 12 to avoid affecting the evaporation process during feeding. The single-ball feeding mechanism 4 includes a hopper and a feeding port. A cross-shaped flap is positioned between the hopper and the feeding port. Rotation of the cross-shaped flap pushes a single material ball from the hopper out of the feeding port.

[0045] The pellets can be binary alloys, multi-element alloys, etc. (each pellet is a gold and tin alloy, or other ternary alloys). The weight of a single pellet is 0.5 g - 10 g, and the diameter is 1 mm - 5 mm.

[0046] The evaporation coating method also includes steps performed between steps S20 and S30: S22. Swing the evaporator 3 to the feeding state so that its opening is outside the evaporation range 12, and inject a ball into the outlet of the evaporator 3 through the single ball feeding mechanism 4.

[0047] Before each vapor deposition process, the evaporator 3 needs to be fed to ensure that there is a material ball inside. Furthermore, since the single-ball injection mechanism 4 is located outside the vapor deposition range 12, the evaporator 3 is configured to rotate so that its outlet is outside the vapor deposition range 12 during feeding, so that the single-ball injection mechanism 4 can inject a material ball into the outlet of the evaporator 3.

[0048] Step S40 also includes: stopping the timing after the material balls in the evaporator 3 are completely consumed, and then proceeding to step S22; until the cumulative timing reaches the total evaporation time.

[0049] Because it involves single-piece feeding, continuous feeding is required during the vapor deposition process of a radial group. Therefore, the feeding time in step S40 is not included in the total vapor deposition time. The timer stops during feeding and resumes counting when the evaporator 3 has finished feeding and returned to its evaporation angle.

[0050] In evaporator 3, individual feed pellets evaporate, forming a very thin film on the surface of substrate 2. The proportions of each element in the film are exactly the same as those in the feed pellets, and the thickness of the film is not limited by the size of evaporator 3. Theoretically, feed can be added indefinitely to increase the film thickness. This avoids the situation where, when a large amount of raw material evaporates together, elements with high vapor pressure evaporate first and deposit on the surface of substrate 2, while elements with low vapor pressure evaporate later and deposit on the film surface, resulting in an inconsistent elemental ratio in the thickness direction of the film compared to the raw material composition. For example, when a large amount of raw material evaporates together, a 2-micrometer-thick film is formed: 1 micrometer of tin and 1 micrometer of gold. However, using a single-particle feeding method, 100 gold and tin alloy particles are deposited one by one, forming an overlapping layer of 10nm tin and 10nm gold, up to 2 micrometers.

[0051] In other feasible solutions, the film thickness can be obtained through direct data acquisition. After a single feed ball is added to evaporator 3, evaporation and coating begin. A quartz crystal film thickness gauge monitors the change in film thickness on substrate 2 and converts it into an evaporation rate, which is then displayed on the equipment. When the feed ball has evaporated completely, the evaporation rate is zero. Evaporator 3 is then rotated, and the program controls the flapper of the single feed ball injection mechanism 4 to rotate 90 degrees, adding the next feed ball to evaporator 3. The process then returns to evaporator 3, and evaporation and coating continue, repeating this cycle.

[0052] In one possible implementation, the evaporation coating method further includes the steps performed before step S22: setting the evaporation temperature of the evaporator 3 and preheating the evaporator 3 to the evaporation temperature.

[0053] Before adding the material, the evaporator 3 is preheated to the evaporation temperature. The evaporator 3 has been heated and reached thermal equilibrium, and the adsorbed water vapor is discharged.

[0054] In another possible implementation, the evaporation coating method further includes the following steps performed before step S22: setting the evaporation temperature of the evaporator 3; preheating the evaporator 3 to a first temperature, which is lower than the evaporation temperature, and the difference between the evaporation temperature and the first temperature is in the range of 20℃-50℃; in step S40, the step of controlling the evaporator 3 to start evaporation coating and start timing specifically involves: controlling the evaporator 3 to heat to the evaporation temperature, starting evaporation coating and starting timing.

[0055] Before feeding, the evaporator 3 can be preheated, but the preheating temperature does not reach the evaporation temperature (500℃-2500℃), but is slightly lower than the evaporation temperature by 20℃-50℃. This can still remove the adsorbed water vapor. However, this design can prevent the material balls from evaporating in advance, and all the material balls are deposited on the substrate 2, resulting in better consistency of the film composition and affecting the accuracy of the subsequent film thickness.

[0056] Evaporator 3 includes an evaporation tank for holding and evaporating material balls, and the opening of the evaporation tank forms a discharge port. Along the depth direction of the evaporation tank and from the outside to the inside, the evaporation tank includes a first region 31, a second region 32 and a third region 33 connected in sequence. The inner wall of the first region 31 is cylindrical. The inner wall of the second region 32 is conical and its inner diameter gradually decreases. The inner wall of the third region 33 is cylindrical. The inner diameter of the first region 31 is larger than the inner diameter of the third region 33. When the evaporator 3 is in the material filling state, the angle M between the inner wall of the first region 31 and the center line of the plating pot 1 is less than 80°.

[0057] In this embodiment, the evaporator 3 has a three-section design for its evaporation tank. The first region 31 has a larger opening for easy material feeding. The second region 32 is conical, and its sidewall forms a "V" angle with the sidewall of the first region 31. When feeding, the material ball falls into the first region 31 and then rolls from the first region 31 to the connection between the first region 31 and the second region 32 (the "V" angle position). Then, as the evaporator 3 gradually returns to the evaporation range, the material ball is guided by the inner wall of the second region 32 and rolls towards the third region 33. Compared to the first region 31, the third region 33 is a long and thin cylindrical shape, which guides the material ball to the vertical line of the evaporation tank.

[0058] like Figure 3 As shown in this embodiment, when the evaporator 3 is in the feeding state, the angle M between the inner wall of the first region 31 and the center line of the plating pot 1 is less than 80°. If the angle is too large, it may cause the feeding of the material balls to fail.

[0059] The specific steps of adjusting the orientation of the outlet of evaporator 3 so that the perpendicular bisector G of the outlet coincides with the perpendicular bisector K of the plane to be deposited on the target substrate 7 include: Step S31. Adjust the orientation of the outlet of the evaporator 3 so that the vertical line G of the outlet of the evaporator 3 is perpendicular to the plane of the target substrate 7 to be evaporated.

[0060] like Figure 5 and Figure 6 As shown, a laser perpendicularity detection mechanism 5 installed on the evaporator 3 determines whether the perpendicular bisector G of the outlet of the evaporator 3 is perpendicular to the surface to be deposited on the target substrate 7. The laser transmission and reception path of the laser perpendicularity detection mechanism 5 is parallel to the perpendicular bisector G of the outlet. The light emitted by the laser perpendicularity detection mechanism 5 is directed towards the surface to be deposited. If the outlet is directly facing the surface, the laser beam will return along its original path and be received by the laser perpendicularity detection mechanism 5.

[0061] Step S32. Rotate the plating pan 1 so that the vertical line G of the outlet of the evaporator 3 passes through the center of the plane to be plated on the target substrate 7.

[0062] Slowly rotate the plating pot 1; use the image acquisition device 6 mounted on the evaporator 3 to acquire multiple images of the target substrate 7 to be plated at high frequency, compare the acquired images with the standard image of the target substrate 7 to be plated, and stop rotating the plating pot 1 when the acquired image matches the shape of the standard image of the target substrate 7 to be plated; at this time, the perpendicular bisector G of the outlet of the evaporator 3 passes through the center of the target substrate 7 to be plated, wherein the center line of the lens of the image acquisition device 6 is coaxial with the perpendicular bisector G of the outlet.

[0063] The image acquisition device 6 is movably connected to the evaporator 3 via a rocker arm 10. When the image acquisition device 6 is in working condition, it swings to the front of the discharge port. When the image acquisition device 6 is not in working condition and the evaporator 3 is in the feeding condition, the image acquisition device 6 swings to outside the vapor deposition range 12 to avoid affecting the vapor deposition.

[0064] like Figure 7 As shown, due to the vertical incident evaporation at the outlet, anisotropic deposition is achieved. In the substrate, the top surface of the protrusion structure 21 and the area on the top surface of the substrate 2 not covered by the protrusion structure 21 are both coated with a metal film layer 22; the transverse sidewalls of the protrusion structure 21 are not covered by the metal film layer 22.

[0065] The evaporation coating apparatus provided by this invention is used to perform the method described above; The evaporation coating apparatus includes a coating pot 1, a drive mechanism, an evaporator 3, a single-piece injection mechanism 4, and a controller. The controller is connected to the coating pot 1, the drive mechanism, the evaporator 3, and the single-piece injection mechanism 4, respectively, and sends control commands to these components. The inner wall of the coating pot 1 is spherical, and multiple substrates 2 are laid on the inner wall. The installation position of the curved surface is fixed, and the state of the substrates 2 fixed on it is also relatively fixed. The evaporator 3 is connected to the drive mechanism, which includes a motor. The motor's shaft 9 passes through a center 11, and the drive mechanism drives the evaporator 3 to swing around the center 11 to change the orientation of the outlet. The single-piece injection mechanism 4 is used to inject material balls into the evaporator 3. The controller includes a timing module for accumulating the evaporation time.

[0066] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. An evaporation coating method, characterized in that, include: Step S10. Provide a plating pan (1) with a spherical inner wall and an evaporator (3); along the radial direction of the plating pan (1), from the inside to the outside, a plurality of substrates (2) are laid on the inner wall of the plating pan (1), and the plurality of substrates (2) at the same radial position are arranged in a tight ring around the center line N of the plating pan (1) as a radial group; the side of the substrate (2) facing the evaporator (3) is the plate to be plated, and the perpendicular bisector K of the plate to be plated passes through the center (11) of the sphere; the plate to be plated is provided with a protruding structure (21). The perpendicular line G of the outlet of the evaporator (3) passes through the center (11), and the evaporator (3) can swing around the pivot (9) passing through the center (11) to adjust the orientation of the outlet of the evaporator (3). Step S20. Select the target substrate (7), and according to the position of the target substrate (7), obtain the number b of the substrates (2) in the radial group where the target substrate (7) is located, and obtain the single rotation angle d of the plating pot (1) according to the number b; Step S30. Adjust the orientation of the outlet of the evaporator (3) according to the position of the target substrate (7) so that the perpendicular bisector of the outlet coincides with the perpendicular bisector K of the plane to be vaporized on the target substrate (7); Step S40. Control the evaporator (3) to start evaporation and start timing. After time e, rotate the evaporation pot (1) by an angle d around the center line N of the evaporation pot (1) so that the perpendicular line of the outlet coincides with the perpendicular line K of the plane to be evaporated on the next target substrate (7). Continue in this manner until the film thickness on all substrates (2) in the radial group reaches the preset thickness c and then stop, so that all substrates (2) in the radial group form a coated substrate.

2. The evaporation coating method according to claim 1, characterized in that, Step S10 further includes the step of: providing a single-piece injection mechanism (4), wherein the edge of the plating pot (1) and the center (11) of the plating pot (1) form a vapor deposition range (12), and the single-piece injection mechanism (4) is located outside the vapor deposition range (12). The evaporation coating method further includes a step performed between step S20 and step S30: Step S21. Calculate the total evaporation time based on the preset film thickness c and the quantity b of the target substrate (7); S22. Swing the evaporator (3) to the filling state so that its opening is outside the vapor deposition range (12), and inject a ball into the outlet of the evaporator (3) through the single ball filling mechanism (4); Step S40 further includes: stopping the timing after the material balls in the evaporator (3) are completely consumed, and then proceeding to step S22; until the cumulative timing reaches the total evaporation time.

3. The evaporation coating method according to claim 2, characterized in that, The evaporation coating method further includes a step performed before step S22: setting the evaporation temperature of the evaporator (3) and preheating the evaporator (3) to the evaporation temperature.

4. The evaporation coating method according to claim 2, characterized in that, The evaporation coating method further includes the following steps performed before step S22: setting the evaporation temperature of the evaporator (3); preheating the evaporator (3) to a first temperature, the first temperature being lower than the evaporation temperature, and the difference between the evaporation temperature and the first temperature being in the range of 20℃-50℃; In step S40, the step of controlling the evaporator (3) to start vapor deposition and start timing specifically involves controlling the evaporator (3) to heat to the evaporation temperature, starting vapor deposition and starting timing.

5. The evaporation coating method according to claim 2, characterized in that, The evaporator (3) includes an evaporation tank for holding and evaporating material balls, and the opening of the evaporation tank forms the discharge port; Along the depth direction of the evaporation tank and from the outside to the inside, the evaporation tank includes a first region (31), a second region (32), and a third region (33) connected in sequence. The inner wall of the first region (31) is cylindrical; the inner wall of the second region (32) is conical and its inner diameter gradually decreases; the inner wall of the third region (33) is cylindrical; the inner diameter of the first region (31) is larger than the inner diameter of the third region (33). When the evaporator (3) is in the feeding state, the angle M between the inner wall of the first region (31) and the center line of the plating pot (1) is less than 80°.

6. The evaporation coating method according to claim 1, characterized in that, Step S30 specifically includes: Step S31. Adjust the orientation of the outlet of the evaporator (3) so that the vertical line G of the outlet of the evaporator (3) is perpendicular to the plane to be vaporized on the target substrate (7); Step S32. Rotate the plating pan (1) so that the vertical line G of the outlet of the evaporator (3) passes through the center of the plane to be plated on the target substrate (7).

7. The evaporation coating method according to claim 6, characterized in that, Step S31 specifically includes the following steps: By using the laser verticality detection mechanism (5) set on the evaporator (3), it is determined whether the vertical line G of the outlet of the evaporator (3) is perpendicular to the platen to be deposited on the target substrate (7). The laser transmission and reception path of the laser verticality detection mechanism (5) is parallel to the vertical line G of the outlet. Step S32 specifically includes the following steps: Rotate the plating pot (1); acquire an image of the plate to be plated on the target substrate (7) using an image acquisition device (6) mounted on the evaporator (3), compare the acquired image with a standard plate to be plated image of the target substrate (7), and stop rotating the plating pot (1) when the acquired image is consistent with the standard plate to be plated image of the target substrate (7); the perpendicular bisector G of the outlet of the evaporator (3) passes through the center of the plate to be plated on the target substrate (7), wherein the center line of the lens of the image acquisition device (6) is coaxial with the perpendicular bisector G of the outlet.

8. The evaporation coating method according to claim 7, characterized in that, The image acquisition device (6) is movably connected to the evaporator (3) via a rocker arm (10) so that when the image acquisition device (6) is in working condition, it is in front of the discharge port, and when the image acquisition device (6) is in non-working condition and the evaporator (3) is in feeding condition, it is outside the evaporation range (12). The evaporation range (12) is formed by connecting the edge of the plating pot (1) with the center (11) of the plating pot (1).

9. The evaporation coating method according to claim 1, characterized in that, In the coating substrate, the top surface of the protrusion structure (21) and the area on the top surface of the substrate (2) not covered by the protrusion structure (21) are both coated with a metal film layer (22). The transverse sidewalls of the protruding structure (21) are not covered by the metal film layer (22).

10. An evaporation coating apparatus, characterized in that, Used to perform the method according to any one of claims 2-9; The evaporation coating apparatus includes a coating pot (1), a driving mechanism, an evaporator (3), a single-piece injection mechanism (4), and a controller, wherein the controller is connected to the coating pot (1), the driving mechanism, the evaporator (3), and the single-piece injection mechanism (4), respectively. The inner wall of the plating pot (1) is spherical, and the inner wall of the plating pot (1) is used to lay multiple substrates (2). The evaporator (3) is connected to the drive mechanism, and the rotating shaft (9) of the drive mechanism passes through the center (11). The drive mechanism drives the evaporator (3) to swing around the center (11). The single-ball injection mechanism (4) is used to inject ball into the evaporator (3); The controller includes a timing module for accumulating the evaporation time.

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