Display panel, display panel manufacturing method and electronic device

Abstract

This application provides a display panel, a method for manufacturing the display panel, and an electronic device, relating to the field of display technology. The display panel includes a substrate, an isolation structure, a first encapsulation layer, and a barrier layer. The isolation structure encloses an isolation opening; at least some light-emitting units are located within the isolation opening. The first encapsulation layer is located on the side of the light-emitting units away from the substrate, and includes a plurality of encapsulation units spaced apart. Each encapsulation unit includes an edge portion located on the side of the isolation structure away from the substrate, with a gap between the side of the edge portion near the substrate and the side of the isolation structure away from the substrate. The barrier layer includes a plurality of first barrier portions spaced apart, at least some of which extend from the side of the isolation structure away from the substrate through the opening in the gap to the side of the edge portion away from the substrate. This application can effectively prevent external moisture from reaching the light-emitting units through the gap, thereby improving the display effect of the display panel.

Description

Technical Field

[0001] This application relates to the field of display technology, and more specifically, to a display panel, a method for manufacturing the display panel, and an electronic device. Background Technology

[0002] Organic light-emitting diodes (OLEDs) and flat panel displays based on light-emitting diodes (LEDs) are widely used in various consumer electronics products such as mobile phones, televisions, laptops, and desktop computers due to their advantages such as high image quality, energy saving, thin body, and wide range of applications, becoming the mainstream of display panels.

[0003] However, there are still some problems with the display panel that need to be addressed. Summary of the Invention

[0004] To overcome the technical problems mentioned in the background, this application provides a display panel, which includes:

[0005] substrate;

[0006] An isolation structure is located on one side of the substrate, and the isolation structure encloses and forms an isolation opening;

[0007] The light-emitting unit is at least partially located within the isolation opening;

[0008] A first encapsulation layer is located on the side of the light-emitting unit away from the substrate. The first encapsulation layer includes a plurality of encapsulation units spaced apart. Each encapsulation unit includes a cladding portion located on the side of the isolation structure away from the substrate. There is a gap between the side of the cladding portion close to the substrate and the side of the isolation structure away from the substrate.

[0009] The barrier layer includes a plurality of first barrier portions spaced apart, at least a portion of which extends from the side of the isolation structure away from the substrate through an opening in the gap to the side of the edge portion away from the substrate.

[0010] In some possible implementations, the display panel includes a display area and a non-display area surrounding at least a portion of the display area, and the barrier layer further includes a second barrier portion located in the non-display area;

[0011] Preferably, the second barrier extends from the side of the isolation structure toward the non-display area to the side of the isolation structure away from the substrate and is connected to the side of the first barrier near the non-display area;

[0012] Preferably, the display panel further includes a pixel defining layer located between the substrate and the isolation structure, the pixel defining layer including a pixel opening communicating with the isolation opening, and the second barrier portion located on the side of the pixel defining layer away from the substrate;

[0013] Preferably, the first barrier portion blocks the opening of the gap.

[0014] In some possible implementations, the display panel further includes an adhesive unit located between the second barrier portion and the isolation structure, the adhesive unit extending from the side of the isolation structure toward the non-display area to the side of the isolation structure away from the substrate, the adhesive unit contacting the side of the isolation structure toward the non-display area;

[0015] Preferably, the bonding unit and the encapsulation unit are spaced apart;

[0016] Preferably, the bonding unit and the encapsulation unit are in the same layer and made of the same material;

[0017] Preferably, the light-emitting unit includes a first light-emitting unit, a second light-emitting unit, and a third light-emitting unit with different light-emitting colors, and the encapsulation unit includes a first encapsulation unit, a second encapsulation unit, and a third encapsulation unit. The first encapsulation unit is located on the side of the first light-emitting unit away from the substrate, the second encapsulation unit is located on the side of the second light-emitting unit away from the substrate, and the third encapsulation unit is located on the side of the third light-emitting unit away from the substrate. The bonding unit is in the same layer and made of the same material as the third encapsulation unit.

[0018] Preferably, the thickness of the bonding unit located on the side of the isolation structure facing the non-display area is less than the thickness of the second barrier portion located on the side of the isolation structure facing the non-display area;

[0019] Preferably, the thickness of the bonding unit located on the side of the isolation structure facing the non-display area is greater than or equal to 0.1 μm and less than or equal to 0.5 μm;

[0020] Preferably, the thickness of the second barrier portion located on the side of the isolation structure facing the non-display area is greater than or equal to 0.3 μm and less than or equal to 1.5 μm.

[0021] In some possible implementations, the isolation structure includes a first isolation portion and a second isolation portion stacked sequentially along a direction away from the substrate, wherein the orthographic projection of the side of the first isolation portion away from the substrate on the substrate is located within the orthographic projection of the second isolation portion on the substrate;

[0022] Preferably, the distance between the edge of the orthographic projection of the side of the first isolation portion facing the non-display area away from the substrate and the edge of the orthographic projection of the second isolation portion on the substrate in the isolation structure closest to the non-display area is less than or equal to 0.3 μm;

[0023] Preferably, the distance between the edge of the orthographic projection of the side of the first isolation portion facing the non-display area away from the substrate and the edge of the orthographic projection of the second isolation portion on the substrate in the isolation structure closest to the non-display area is equal to 0.

[0024] Preferably, the thickness of the second barrier portion located on the side of the isolation structure facing the non-display area is greater than the thickness of the encapsulation unit located on the side of the isolation structure facing the isolation opening;

[0025] Preferably, the thickness of the encapsulation unit located on the side of the isolation structure facing the isolation opening is greater than or equal to 0.1 μm and less than or equal to 0.5 μm;

[0026] Preferably, the thickness of the second barrier portion located on the side of the isolation structure facing the non-display area is greater than or equal to 0.3 μm and less than or equal to 1.5 μm.

[0027] In some possible implementations, the display panel further includes conductive traces located in the non-display area. The conductive traces include a first conductive portion and a second conductive portion stacked sequentially in a direction away from the substrate. The orthographic projection of the side of the first conductive portion away from the substrate on the substrate is located within the orthographic projection of the second conductive portion on the substrate.

[0028] Preferably, the distance between the edge of the orthographic projection of the side of the first conductive portion away from the substrate and the edge of the orthographic projection of the second conductive portion on the substrate is less than or equal to 0.3 μm;

[0029] Preferably, the distance between the edge of the orthographic projection of the side of the first conductive portion away from the substrate and the edge of the orthographic projection of the second conductive portion on the substrate is equal to 0.

[0030] Preferably, the second barrier portion covers the conductive trace;

[0031] Preferably, the conductive traces are in the same layer and made of the same material as the isolation structure;

[0032] Preferably, the conductive trace includes a power supply trace or an in-panel gate driving unit;

[0033] Preferably, the power supply line is electrically connected to the isolation structure.

[0034] In some possible implementations, the display panel further includes a filling layer comprising a plurality of spaced-apart filling portions that fill the gaps, and at least a portion of the first barrier portion extends from the side of the isolation structure away from the substrate through the filling portion away from the isolation opening to the side of the edging portion away from the substrate.

[0035] Preferably, along the thickness direction of the substrate, the thickness of the barrier layer is greater than or equal to 0.3 μm and less than or equal to 1.5 μm.

[0036] In some possible implementations, the display panel further includes a second encapsulation layer located on the side of the first encapsulation layer away from the substrate and a third encapsulation layer located on the side of the second encapsulation layer away from the substrate;

[0037] Preferably, the third encapsulation layer extends from the display area to the non-display area, and the portion of the third encapsulation layer located in the non-display area is located on the side of the second barrier portion away from the substrate;

[0038] Preferably, the side of the third encapsulation layer located in the non-display area closer to the substrate contacts the side of the second barrier portion away from the substrate;

[0039] Preferably, the material of the second encapsulation layer includes organic materials;

[0040] Preferably, the material of the third encapsulation layer includes inorganic materials.

[0041] In some possible implementations, the barrier layer further includes a third barrier portion located on the side of the isolation structure away from the substrate;

[0042] Preferably, the orthographic projection of the third barrier portion on the substrate is located between the orthographic projections of two adjacent first barrier portions on the substrate;

[0043] Preferably, the third barrier is connected to the side of each of the two adjacent first barrier portions away from the isolation opening.

[0044] In some possible implementations, the encapsulation unit further includes an encapsulation portion connected to the edge portion, wherein the orthographic projection of the encapsulation portion on the substrate covers the orthographic projection of the light-emitting unit on the substrate;

[0045] Preferably, the barrier layer further includes a fourth barrier portion located on the side of the encapsulation portion away from the substrate.

[0046] In some possible implementations, the orthographic projection of the fourth barrier portion on the substrate is located between the orthographic projections of two adjacent first barrier portions on the substrate.

[0047] Preferably, the fourth barrier is connected to the side of each of the two adjacent first barrier portions near the isolation opening.

[0048] In some possible implementations, the barrier layer is made of the same material as the first encapsulation layer;

[0049] Preferably, the material of the barrier layer includes inorganic materials;

[0050] Preferably, the material of the barrier layer includes at least one of silicon nitride, silicon oxide, or silicon oxynitride.

[0051] In some possible implementations, the second electrode of the light-emitting unit is electrically connected to the first isolation portion; and / or, the isolation structure further includes a third isolation portion located on the side of the first isolation portion facing the substrate, and the second electrode of the light-emitting unit is electrically connected to the third isolation portion;

[0052] Preferably, the material of the third isolation portion includes molybdenum; and / or, the material of the first isolation portion includes aluminum; and / or, the material of the second isolation portion includes titanium.

[0053] In some possible implementations, this application also provides a method for manufacturing a display panel, the method comprising:

[0054] Provide substrate;

[0055] An isolation structure is formed on one side of the substrate, and the isolation structure encloses an isolation opening;

[0056] At least a portion of the light-emitting unit and a first encapsulation layer located on the side of the light-emitting unit away from the substrate are formed within the isolation opening. The first encapsulation layer includes a plurality of encapsulation units spaced apart. Each encapsulation unit includes a cladding portion located on the side of the isolation structure away from the substrate. There is a gap between the side of the cladding portion close to the substrate and the side of the isolation structure away from the substrate.

[0057] A barrier layer is formed on the side of the first encapsulation layer away from the substrate. The barrier layer includes a plurality of first barrier portions spaced apart. At least a portion of the first barrier portions extend from the side of the isolation structure away from the substrate through an opening in the gap to the side of the edge portion away from the substrate.

[0058] In some possible implementations, the display panel includes a display area and a non-display area surrounding at least a portion of the display area, and the barrier layer includes a second barrier portion located in the non-display area;

[0059] After the step of forming a barrier layer on the side of the first encapsulation layer away from the substrate, the method further includes:

[0060] A second encapsulation layer is formed on the side of the first encapsulation layer away from the substrate;

[0061] A third encapsulation layer is formed on the side of the second encapsulation layer away from the substrate. The third encapsulation layer extends from the display area to the non-display area. The third encapsulation layer located in the non-display area is located on the side of the second barrier portion away from the substrate.

[0062] In some possible implementations, this application also provides an electronic device, which includes the display panel described in this application, or a display panel prepared by the method for preparing the display panel described in this application.

[0063] Compared with the prior art, this application has the following beneficial effects:

[0064] This application provides a display panel, a method for manufacturing the display panel, and an electronic device. By configuring at least a portion of the first barrier portion to extend from the side of the isolation structure away from the substrate through the opening of the gap to the side of the edge portion away from the substrate, external moisture can be effectively blocked from reaching the light-emitting unit through the gap, thereby improving the display effect of the display panel. Attached Figure Description

[0065] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0066] Figure 1 This is a top view of the isolation structure, encapsulation unit, and barrier layer in the display panel provided in an embodiment of this application.

[0067] Figure 2 Provided for the embodiments of this application Figure 1 Schematic diagram of the cross section at point AA;

[0068] Figure 3 A top view of the display panel provided in an embodiment of this application;

[0069] Figure 4 Provided for the embodiments of this application Figure 3 One of the cross-sectional schematic diagrams at point BB in the middle;

[0070] Figure 5 Provided for the embodiments of this application Figure 3 Schematic diagram of the cross section at point BB (part 2);

[0071] Figure 6 Provided for the embodiments of this application Figure 3 Schematic diagram of the cross section at point BB (part 3);

[0072] Figure 7 Provided for the embodiments of this application Figure 3 Fourth cross-sectional view at point BB;

[0073] Figure 8 Provided for the embodiments of this application Figure 3 Fifth cross-sectional view at point BB;

[0074] Figure 9 Provided for the embodiments of this application Figure 3 Sixth cross-sectional view at point BB;

[0075] Figure 10a Provided for the embodiments of this application Figure 3 Schematic diagram of the cross section at point BB (part 7);

[0076] Figure 10b Provided for the embodiments of this application Figure 3 Schematic diagram of the cross section at point BB (part 8);

[0077] Figure 11 Provided for the embodiments of this application Figure 3 Schematic diagram of the cross section at point BB (part 9);

[0078] Figure 12 Provided for the embodiments of this application Figure 3 Schematic diagram of the cross section at point BB (part 10);

[0079] Figure 13 Provided for the embodiments of this application Figure 3 Schematic diagram of the cross section at point BB (part 11);

[0080] Figure 14 Provided for the embodiments of this application Figure 3 Schematic diagram of the cross section at point BB (section 12);

[0081] Figure 15 A schematic flowchart illustrating a method for manufacturing a display panel according to an embodiment of this application;

[0082] Figure 16 A cross-sectional schematic diagram showing a first electrode layer formed on one side of a substrate, provided for an embodiment of this application;

[0083] Figure 17 A cross-sectional schematic diagram showing that a pixel defining material layer and an isolation material layer are sequentially formed on the side of the first electrode layer away from the substrate, as provided in an embodiment of this application;

[0084] Figure 18 A cross-sectional schematic diagram of the isolation structure material layer and the pixel defining material layer sequentially etched according to an embodiment of this application;

[0085] Figure 19 A cross-sectional view of at least a portion of the light-emitting unit and a first encapsulation layer located on the side of the light-emitting unit away from the substrate, provided for an embodiment of this application;

[0086] Figure 20 A schematic cross-section showing the formation of a barrier layer on the side of the first encapsulation layer away from the substrate, as provided in an embodiment of this application.

[0087] Figure 21 This is a schematic cross-section of a second encapsulation layer formed on the side of the first encapsulation layer away from the substrate, as provided in an embodiment of this application.

[0088] Reference numerals: 1. Substrate; 2. Pixel defining layer; 21. Pixel opening; 3. Isolation structure; 31. First isolation portion; 32. Second isolation portion; 33. Third isolation portion; 4. First electrode; 5. Light-emitting portion; 6. Second electrode; 7. Light-emitting unit; 8. Encapsulation unit; 801. First encapsulation unit; 802. Second encapsulation unit; 81. Edge-wrapping portion; 82. Encapsulation portion; 9. Barrier layer; 91. First barrier portion; 92. Second barrier portion; 93. Third barrier portion; 94. Fourth barrier portion; 10. Isolation opening; 11. Gap; 12. Second encapsulation layer; 13. Third encapsulation layer; 14. Pixel defining material layer; 15. Isolation material layer; 16. Adhesive unit; 17. Conductive trace; 171. First conductive portion; 172. Second conductive portion; 18. Filling layer; 181. Filling portion. Detailed Implementation

[0089] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0090] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0091] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0092] In the description of this application, it should be noted that the terms "center," "upper," "lower," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of the invention is in use. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. In addition, the terms "first," "second," and "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0093] It should be noted that, where there is no conflict, different features in the embodiments of this application can be combined with each other.

[0094] Increasing the density of light-emitting units (i.e., pixel density) in a display panel is a crucial way to improve display quality. However, current display panels manufactured using Fine Metal Mask (FMM) technology are limited by technological constraints that prevent further increases in light-emitting unit density. Through long-term research, the inventors discovered that to address this technical challenge, some display panels incorporate isolation structures. During the full-layer deposition of the light-emitting functional layer and the second electrode, the light-emitting functional layer and the second electrode can be disconnected at the isolation structure. Through multiple deposition and etching processes (i.e., light-emitting unit patterning), light-emitting units of different colors can be formed within different isolation openings.

[0095] Among them, patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, PCT / CN2024 / 099072, CN117979755A, and CN1179 CN117062489A, CN117580403A, CN116583155A, CN116669477A, ​​CN117396039A, CN116669480A, CN116600606A, and CN117500332A describe relevant technical solutions for isolation structures, the contents of which are incorporated herein by reference.

[0096] The display panel in the related technology includes a substrate, an isolation structure located on one side of the substrate, a light-emitting unit located within an isolation opening formed by the isolation structure, and an encapsulation layer located on the side of the light-emitting unit away from the substrate. The encapsulation layer encapsulates the light-emitting unit. However, in the related technology, external moisture can easily penetrate the light-emitting unit through the damaged encapsulation unit, causing the corresponding light-emitting unit to form dark spots, ultimately affecting the display effect of the display panel.

[0097] To address the aforementioned technical problems, the inventors have innovatively designed the following technical solutions, which will be described in detail below with reference to the accompanying drawings. It should be noted that the deficiencies in the existing solutions are the result of the inventors' practical experience and careful research. Therefore, the discovery process of the aforementioned technical problems and the solutions proposed in this embodiment below are contributions made by the inventors to this application during the invention process, and should not be construed as technical content known to those skilled in the art.

[0098] Please see Figure 1 and Figure 2 This embodiment provides a display panel, which includes a substrate 1, an isolation structure 3, a first encapsulation layer and a barrier layer 9.

[0099] The substrate 1 may include a substrate and a plurality of driving units located on one side of the substrate, each driving unit may include one or more semiconductor switching devices. The semiconductor switching devices may be formed by the interaction of multiple film layers in the substrate 1; for example, the semiconductor switching devices may be thin-film transistors formed by the interaction of multiple film layers.

[0100] The isolation structure 3 is located on one side of the substrate 1, and the isolation structure 3 encloses and forms an isolation opening 10; at least a portion of the light-emitting units 7 are located within the isolation opening 10.

[0101] The first encapsulation layer is located on the side of the light-emitting unit 7 away from the substrate 1. The first encapsulation layer includes a plurality of encapsulation units 8 spaced apart. Each encapsulation unit 8 includes a cladding portion 81 located on the side of the isolation structure 3 away from the substrate 1. There is a gap 11 between the side of the cladding portion 81 close to the substrate 1 and the side of the isolation structure 3 away from the substrate 1.

[0102] The barrier layer 9 includes a plurality of first barrier portions 91 spaced apart, at least a portion of the first barrier portions 91 extending from the side of the isolation structure 3 away from the substrate 1 through the opening of the gap 11 to the side of the edge portion 81 away from the substrate 1.

[0103] The encapsulation unit 8 extends from the side of the isolation structure 3 toward the isolation opening 10 to the side of the isolation structure 3 away from the substrate 1. The encapsulation unit 8 located on the side of the isolation structure 3 away from the substrate 1 is the edge portion 81. There is a gap 11 between the edge portion 81 and the side of the isolation structure 3 away from the substrate 1. In related technologies, external moisture can easily penetrate the light-emitting unit 7 through the gap 11 along the space between the encapsulation unit 8 and the isolation structure 3.

[0104] In this embodiment, a first barrier portion 91 is provided on the side of the isolation structure 3 away from the substrate 1, extending through the gap to the side of the edge portion 81 away from the substrate 1. The first barrier portion 91 can seal at least part of the opening of the gap 11, forming a sealing structure, thereby preventing external moisture from entering the gap 11 between the edge portion 81 and the isolation structure 3, thus effectively preventing moisture from intruding into the light-emitting unit 7, making it less likely for the light-emitting unit 7 to produce dark spots, and ultimately improving the light-emitting effect of the display panel.

[0105] Based on the above design, this embodiment can effectively block external moisture from reaching the light-emitting unit 7 through the gap 11 by setting at least a portion of the first barrier portion 91 to extend from the side of the isolation structure 3 away from the substrate 1 through the opening of the gap 11 to the side of the edge portion 81 away from the substrate 1, thereby improving the display effect of the display panel.

[0106] For some possible implementations, please refer to Figure 3 and Figure 4 The display panel includes a display area AA and a non-display area AB surrounding at least a portion of the display area AA, and the barrier layer 9 also includes a second barrier portion 92 located in the non-display area AB.

[0107] In related technologies, external moisture can easily penetrate the gap 11 between the edge portion 81 and the isolation structure 3 in the display area AA through the non-display area AB, and then penetrate the light-emitting unit 7 through the gap 11.

[0108] In this embodiment, by setting a second barrier 92 in the non-display area AB, external moisture can be blocked from the source, making it less likely for external moisture to invade the light-emitting unit 7 from the non-display area AB, and thus making the light-emitting unit 7 in the display area AA less likely to fail.

[0109] Preferably, please see again. Figure 4 The second barrier portion 92 extends from the side of the isolation structure 3 toward the non-display area AB to the side of the isolation structure 3 away from the substrate 1 and is connected to the side of the first barrier portion 91 near the non-display area AB.

[0110] Preferably, please refer to Figure 5 The second barrier 92 extends away from the display area AA.

[0111] The second barrier portion 92 is integrally formed with the first barrier portion 91, so that a complete barrier layer 9 is formed from the non-display area AB to the display area AA, which makes it more difficult for external moisture to penetrate the light-emitting unit 7 of the display area AA.

[0112] Preferably, the first blocking part 91 blocks the opening of the gap 11.

[0113] The first barrier 91 completely seals the openings of the gap 11 in different directions. Even if external moisture enters the gap 11 from the non-display area AB, the first barrier 91 will effectively block the moisture from entering the gap 11, thereby more effectively preventing moisture from entering the light-emitting unit 7.

[0114] Preferably, the display panel further includes a pixel defining layer 2 located between the substrate 1 and the isolation structure 3. The pixel defining layer 2 includes a pixel opening 21, which communicates with the isolation opening 10. The second barrier portion 92 is located on the side of the pixel defining layer 2 away from the substrate 1. The light-emitting unit 7 includes a first electrode 4, a light-emitting portion 5, and a second electrode 6 stacked in a direction away from the substrate 1.

[0115] The pixel defining layer 2 extends from the display area AA to the non-display area AB. The pixel defining layer 2 located in the display area AA is provided with a pixel opening 21. The second blocking part 92 is located on the side of the pixel defining layer 2 in the non-display area AB away from the substrate 1.

[0116] The isolation structure 3 allows the display panel to form film layers of different colors of light-emitting units 7 in different isolation openings 10 without the need for a fine metal mask. When forming the light-emitting functional layer, the isolation structure 3 separates the light-emitting functional layer into multiple spaced light-emitting portions 5. When forming the second electrode material layer, the isolation structure 3 separates the second electrode material layer into multiple spaced second electrodes 6. The isolation structure 3 includes a conductive material, and the second electrodes 6 are electrically connected to the isolation structure 3. One first electrode 4, one light-emitting portion 5, and one second electrode 6 form one light-emitting unit 7. The first electrode 4 can be an anode, and the second electrode 6 can be a cathode.

[0117] In this way, different light-emitting units 7 can be made independent of each other, thereby reducing crosstalk between adjacent light-emitting units 7 and improving the display effect of the display panel. At the same time, due to the presence of the isolation structure 3, the light-emitting functional layer and the second electrode material layer in each color light-emitting unit 7 of the display panel can be fabricated and patterned on the entire surface first, thereby eliminating the need for a fine metal mask and saving on the manufacturing cost of the display panel.

[0118] For some possible implementations, please refer to Figure 6 The display panel also includes a second encapsulation layer 12 located on the side of the first encapsulation layer away from the substrate 1 and a third encapsulation layer 13 located on the side of the second encapsulation layer 12 away from the substrate 1.

[0119] Optionally, the material of the second encapsulation layer 12 includes organic materials, and the material of the third encapsulation layer 13 includes inorganic materials.

[0120] For example, the first and third encapsulation layers 13 can be formed by chemical vapor deposition (CVD), and the second encapsulation layer 12 can be formed by inkjet printing (IJP). The second and third encapsulation layers 12 and 13 can achieve a better encapsulation effect on the light-emitting unit 7, thereby further improving the encapsulation quality of the display panel.

[0121] In some possible implementations, please refer again. Figure 6 The third encapsulation layer 13 extends from the display area AA to the non-display area AB, and the portion of the third encapsulation layer 13 located in the non-display area AB is located on the side of the second barrier portion 92 away from the substrate 1.

[0122] Optionally, the side of the third encapsulation layer 13 located in the non-display area AB that is close to the substrate 1 contacts the side of the second barrier portion 92 that is away from the substrate 1.

[0123] In related technologies, only the edge portion of the non-display area AB is encapsulated by the third encapsulation layer 13. When the third encapsulation layer 13 located at the edge portion of the non-display area AB is damaged, moisture can easily penetrate the second encapsulation layer 12 through the damaged third encapsulation layer 13. Since the material of the second encapsulation layer 12 includes organic materials, moisture can easily be transferred through the second encapsulation layer 12 to the gap 11 between the edge portion 81 of the display area AA and the isolation structure 3.

[0124] In this embodiment, a second barrier 92 is provided between the third encapsulation layer 13 and the pixel defining layer 2, which can greatly improve the encapsulation effect of the non-display area AB, and make it more difficult for external moisture to penetrate the light-emitting unit 7 of the display area AA through the non-display area AB.

[0125] For some possible implementations, please refer to Figure 7 The display panel also includes an adhesive unit 16 located between the second barrier portion 92 and the isolation structure 3. The adhesive unit 16 extends from the side of the isolation structure 3 toward the non-display area AB to the side of the isolation structure 3 away from the substrate 1, and the adhesive unit 16 contacts the side of the isolation structure 3 toward the non-display area AB.

[0126] The bonding unit 16 is disposed on the side wall closest to the non-display isolation structure 3. The second barrier 92 is provided on the basis of the bonding unit 16, which can make the second barrier 92 extend more evenly on the side of the isolation structure 3 facing the non-display area AB. The thickness of the second barrier 92 is also thicker, which can improve the stability and encapsulation effect of the second barrier 92, and ultimately further improve the encapsulation effect of the display panel.

[0127] Preferably, the bonding unit 16 and the encapsulation unit 8 are spaced apart, and the bonding unit 16 and the encapsulation unit 8 are made of the same layer and material. In this way, the bonding unit 16 can be formed at the same time as the encapsulation unit 8, so that there is no need to set up a special bonding process, thereby reducing the cost of forming the bonding unit 16.

[0128] Preferably, the light-emitting unit 7 includes a first light-emitting unit, a second light-emitting unit, and a third light-emitting unit with different light-emitting colors. The encapsulation unit 8 includes a first encapsulation unit 801, a second encapsulation unit 802, and a third encapsulation unit (not shown). The first encapsulation unit 801 is located on the side of the first light-emitting unit away from the substrate 1. The second encapsulation unit 802 is located on the side of the second light-emitting unit away from the substrate 1. The third encapsulation unit is located on the side of the third light-emitting unit away from the substrate 1. The bonding unit 16 is in the same layer and made of the same material as the third encapsulation unit.

[0129] When forming the third encapsulation unit (not shown), the bonding unit 16 is formed, that is, the bonding unit is formed at the same time as the encapsulation unit 8 of the last light-emitting unit 7 of the display panel, which facilitates the formation of the bonding unit 16.

[0130] Preferably, the thickness L2 of the bonding unit 16 located on the side of the isolation structure 3 facing the non-display area AB is less than the thickness L1 of the second barrier portion 92 located on the side of the isolation structure 3 facing the non-display area AB.

[0131] Optionally, the thickness L2 of the bonding unit 16 located on the side of the isolation structure 3 facing the non-display area AB is greater than or equal to 0.1 μm and less than or equal to 0.5 μm. For example, the thickness L2 can be 0.1 μm, 0.2 μm, 0.3 μm, 0.4 μm or 0.5 μm, etc.

[0132] Optionally, the thickness L1 of the second barrier portion 92 located on the side of the isolation structure 3 facing the non-display area AB is greater than or equal to 0.3 μm and less than or equal to 1.5 μm. For example, the thickness L1 can be 0.3 μm, 0.5 μm, 0.7 μm, 1 μm, 1.3 μm or 1.5 μm, etc.

[0133] In this way, the thickness L1 of the second barrier portion 92 can be increased, thereby further improving the encapsulation effect of the light-emitting unit 7.

[0134] For some possible implementations, please refer to Figure 8 The isolation structure 3 includes a first isolation portion 31 and a second isolation portion 32 stacked sequentially along the direction away from the substrate 1. The orthographic projection of the side of the first isolation portion 31 away from the substrate 1 on the substrate 1 is located within the orthographic projection of the second isolation portion 32 on the substrate 1.

[0135] The isolation structure 3 includes a first isolation portion 31 and a second isolation portion 32 stacked sequentially along the direction away from the substrate 1. The orthographic projection of the side of the first isolation portion 31 away from the substrate 1 on the substrate 1 is located within the orthographic projection of the second isolation portion 32 on the substrate 1.

[0136] Since the second isolation portion 32 is located on the side of the first isolation portion 31 away from the substrate 1, and the lateral width of the second isolation portion 32 is greater than the lateral width of the first isolation portion 31, the second isolation portion 32 will disconnect the light-emitting functional layer and the second electrode layer at the isolation structure 3. In this way, the isolation structure 3 formed by the first isolation portion 31 and the second isolation portion 32 can more easily make each light-emitting unit 7 independently packaged.

[0137] Preferably, the distance W between the edge of the orthographic projection of the first isolation portion 31 on the substrate 1 away from the non-display area AB and the edge of the orthographic projection of the second isolation portion 32 on the substrate 1 in the isolation structure 3 closest to the non-display area AB is less than or equal to 0.3 μm.

[0138] For example, the distance W can be 0.3μm, 0.25μm, 0.2μm, 0.1μm, 0.05μm, or 0. By reducing the distance W, the second barrier portion 92 can extend more uniformly on the side of the isolation structure 3 facing the non-display area AB, making the second barrier portion 92 thicker. This improves the stability and encapsulation effect of the second barrier portion 92, ultimately further enhancing the encapsulation effect of the display panel.

[0139] Preferably, please refer to Figure 9 In the isolation structure 3 closest to the non-display area AB, the distance between the edge of the orthographic projection of the first isolation portion 31 on the substrate 1 away from the substrate 1 and the orthographic projection of the second isolation portion 32 on the substrate 1 is equal to 0. In this way, the thickness of the second barrier portion 92 can be made thicker.

[0140] Preferably, the thickness D2 of the second barrier portion 92 located on the side of the isolation structure 3 facing the non-display area AB is greater than the thickness D1 of the encapsulation unit 8 located on the side of the isolation structure 3 facing the isolation opening 10.

[0141] Optionally, the thickness D1 of the packaging unit 8 located on the side of the isolation structure 3 facing the isolation opening 10 is greater than or equal to 0.1 μm and less than or equal to 0.5 μm. For example, the thickness D1 can be 0.1 μm, 0.2 μm, 0.3 μm, 0.4 μm or 0.5 μm, etc.

[0142] Optionally, the thickness D2 of the second barrier portion 92 located on the side of the isolation structure 3 facing the non-display area AB is greater than or equal to 0.3 μm and less than or equal to 1.5 μm. For example, the thickness D2 can be 0.3 μm, 0.5 μm, 0.7 μm, 1 μm, 1.3 μm or 1.5 μm, etc.

[0143] In this way, the thickness L2 of the second barrier portion 92 can be increased, thereby further improving the encapsulation effect of the light-emitting unit 7.

[0144] For some possible implementations, please refer to Figure 10a The display panel also includes conductive traces 17 located in the non-display area AB. The conductive traces 17 include a first conductive portion 171 and a second conductive portion 172 that are sequentially stacked along the direction away from the substrate 1. The orthographic projection of the side of the first conductive portion 171 away from the substrate 1 on the substrate 1 is located within the orthographic projection of the second conductive portion 172 on the substrate 1.

[0145] Optionally, the distance W1 between the edge of the orthographic projection of the side of the first conductive portion 171 away from the substrate 1 on the substrate 1 and the edge of the orthographic projection of the second conductive portion 172 on the substrate 1 is less than or equal to 0.3 μm.

[0146] For example, the distance W1 can be 0.3μm, 0.25μm, 0.2μm, 0.1μm, 0.05μm, or 0. By reducing the distance W1, the second barrier portion 92 can extend more uniformly on the side of the conductive trace 17 facing the non-display area AB, making the second barrier portion 92 thicker. This improves the stability and encapsulation effect of the second barrier portion 92, ultimately further enhancing the encapsulation effect of the display panel.

[0147] Further, please see Figure 10b The distance between the edge of the orthographic projection of the side of the first conductive part 171 away from the substrate 1 on the substrate 1 and the edge of the orthographic projection of the second conductive part 172 on the substrate 1 is equal to 0.

[0148] Optionally, the second barrier 92 covers the conductive trace 17.

[0149] The first conductive part 171 and the first isolation part 31 are in the same layer and made of the same material, and the second conductive part 172 and the second isolation part 32 are in the same layer and made of the same material.

[0150] In this way, the second barrier portion 92 can be extended more evenly at the conductive trace 17, and the thickness of the second barrier portion 92 can be increased, thereby improving the stability and encapsulation effect of the second barrier portion 92, and ultimately further improving the encapsulation effect of the display panel.

[0151] Preferably, the conductive trace 17 and the isolation structure 3 are in the same layer and made of the same material. In this way, the conductive trace 17 can be formed at the same time as the isolation structure 3, so that there is no need to set up a special process for forming the conductive trace 17, thereby reducing the cost of forming the conductive trace 17.

[0152] Optionally, the conductive trace 17 includes a power trace or an in-panel gate drive unit. When the conductive trace 17 is a power trace, the power trace is electrically connected to the isolation structure 3.

[0153] For some possible implementations, please refer to Figure 11 The display panel also includes a filling layer 18, which includes a plurality of filling portions 181 spaced apart. The filling portions 181 fill the gaps 11. At least a portion of the first barrier portion 91 extends from the side of the isolation structure 3 away from the substrate 1 through the filling portion 181 away from the isolation opening 10 to the side of the edge portion 81 away from the substrate 1.

[0154] After forming the encapsulation unit 8, an optical adhesive layer can be formed. The optical adhesive layer is fluid and can flow to the gap 11 and fill the gap 11. Then the optical adhesive layer is patterned, and finally the optical adhesive layer that fills the gap 11 is retained, that is, the filling part 181 is formed.

[0155] The gap 11 can be completely filled by the filling part 181, which can increase the stability of the encapsulation unit 8 on the one hand, and make the first barrier part 91 extend more evenly in the gap 11 on the other hand, making the thickness of the first barrier part 91 thicker, thereby improving the stability and encapsulation effect of the first barrier part 91, and ultimately further improving the encapsulation effect of the display panel.

[0156] For some possible implementations, please refer to Figure 12 The barrier layer 9 also includes a third barrier portion 93, which is located on the side of the isolation structure 3 away from the substrate 1.

[0157] By providing a third barrier 93 on the side of the isolation structure 3 away from the substrate 1, the path for water vapor to reach the gap 11 can be increased, thereby further improving the effect of blocking external water vapor.

[0158] In some possible implementations, please refer again. Figure 12 The orthographic projection of the third barrier portion 93 on the substrate 1 is located between the orthographic projections of the two adjacent first barrier portions 91 on the substrate 1.

[0159] Optionally, the third barrier 93 is connected to the side of each of the two adjacent first barrier parts 91 away from the isolation opening 10.

[0160] The third barrier 93 is integrally formed with the first barrier 91, which can further enhance the barrier layer 9's ability to block external moisture, making it less likely for external moisture to penetrate the light-emitting unit 7.

[0161] For some possible implementations, please refer to Figure 13 The encapsulation unit 8 also includes an encapsulation part 82 connected to the edge-wrapping part 81, and the orthographic projection of the encapsulation part 82 on the substrate 1 covers the orthographic projection of the light-emitting unit 7 on the substrate 1.

[0162] Optionally, the barrier layer 9 further includes a fourth barrier portion 94, which is located on the side of the encapsulation portion 82 away from the substrate 1.

[0163] The encapsulation part 82 and the edge-wrapping part 81 are integrally formed. The encapsulation part 82 can encapsulate the light-emitting unit 7, and the fourth barrier part 94 can prevent moisture from entering the light-emitting unit 7. At the same time, it can also further encapsulate the light-emitting unit 7.

[0164] In some possible implementations, please refer again. Figure 13 The orthographic projection of the fourth barrier portion 94 on the substrate 1 is located between the orthographic projections of the two adjacent first barrier portions 91 on the substrate 1.

[0165] Optionally, the fourth barrier 94 is connected to the side of each of the two adjacent first barrier parts 91 near the isolation opening 10.

[0166] Thus, the first barrier portion 91, the second barrier portion 92, the third barrier portion 93 and the fourth barrier portion 94 are integrally formed in sequence, and the barrier layer 9 is disposed on the side of the light-emitting unit 7 and the isolation structure 3 away from the substrate 1, which can greatly improve the packaging reliability of the light-emitting unit 7.

[0167] In some possible implementations, the material of the barrier layer 9 is the same as the material of the first encapsulation layer.

[0168] Optionally, the material of the barrier layer 9 may include inorganic materials.

[0169] Optionally, the material of the barrier layer 9 includes at least one of silicon nitride, silicon oxide, or silicon oxynitride.

[0170] Inorganic materials form a film layer that is more effective at blocking water vapor. Therefore, by forming a barrier layer 9 with inorganic materials such as silicon nitride, silicon oxide, or silicon oxynitride, it is more difficult for external water vapor to penetrate the light-emitting unit 7.

[0171] In some possible implementations, please refer again. Figure 13 Along the thickness direction of the substrate 1, the thickness D of the barrier layer 9 is greater than or equal to 0.3 μm and less than or equal to 1.5 μm. For example, the thickness D can be 0.3 μm, 0.5 μm, 0.7 μm, 1 μm, 1.3 μm, or 1.5 μm, etc. If the thickness D is set too large, the thickness of the display panel will increase. If the thickness D is set too small, the barrier layer 9 will reduce its barrier effect against external moisture. Therefore, by reasonably setting the thickness D, the barrier layer 9 can improve its barrier effect against external moisture without excessively increasing the thickness of the display panel.

[0172] In some possible implementations, please refer again. Figure 13 The second electrode 6 of the light-emitting unit 7 is electrically connected to the first isolation portion 31. The first isolation portion 31 includes a conductive material, and the second electrode 6 corresponding to the light-emitting unit 7 extends to contact the sidewall of the first isolation portion 31, so as to realize the electrical connection between the second electrode 6 corresponding to the light-emitting unit 7 and the first isolation portion 31.

[0173] Please see Figure 14 The isolation structure 3 also includes a third isolation section 33 located on the side of the first isolation section 31 facing the substrate 1, and the second electrode 6 of the light-emitting unit 7 is electrically connected to the third isolation section 33.

[0174] The third isolation section 33 includes a conductive material, and the second electrode 6 corresponding to the light-emitting unit 7 extends to contact the side wall of the third isolation section 33 so as to realize the electrical connection between the second electrode 6 corresponding to the light-emitting unit 7 and the third isolation section 33.

[0175] Specifically, the material of the third isolation portion 33 includes molybdenum metal; and / or, the material of the first isolation portion 31 includes aluminum metal; and / or, the material of the second isolation portion 32 includes titanium metal. Thus, when the isolation structure 3 isolates the second electrode layer into the second electrode 6, the second electrode 6 is more easily electrically connected to the first isolation portion 31 and / or the third isolation portion 33.

[0176] For some possible implementations, please refer to Figure 15 This application also provides a method for manufacturing a display panel, the method comprising:

[0177] S10: Provide substrate 1.

[0178] S11: An isolation structure 3 is formed on one side of the substrate 1, and the isolation structure 3 encloses and forms an isolation opening 10.

[0179] Please see Figure 16 A first electrode layer is formed on one side of the substrate 1, and the first electrode layer includes a plurality of first electrodes 4 spaced apart.

[0180] Please see Figure 17 A pixel defining material layer 14 and an isolation material layer 15 are sequentially formed on the side of the first electrode layer away from the substrate 1.

[0181] Please see Figure 18 The isolation material layer 15 and the pixel defining material layer 14 are etched sequentially to form the isolation structure 3 and the pixel defining layer 2, respectively. The pixel defining layer 2 includes a pixel opening 21 that exposes a portion of the first electrode 4. The orthographic projection of the pixel opening 21 on the substrate 1 is located within the orthographic projection of the isolation opening 10 on the substrate 1.

[0182] S12: At least a portion of the light-emitting unit 7 and a first encapsulation layer located on the side of the light-emitting unit 7 away from the substrate 1 are formed in the isolation opening 10. The first encapsulation layer includes a plurality of encapsulation units 8 spaced apart. Each encapsulation unit 8 includes a cladding portion 81 located on the side of the isolation structure 3 away from the substrate 1. A gap 11 is formed between the side of the cladding portion 81 close to the substrate 1 and the side of the isolation structure 3 away from the substrate 1.

[0183] Please see Figure 19 At least a portion of the light-emitting unit 7 and a first encapsulation layer located on the side of the light-emitting unit 7 away from the substrate 1 are formed within the isolation opening 10.

[0184] S13: A barrier layer 9 is formed on the side of the first encapsulation layer away from the substrate 1. The barrier layer 9 includes a plurality of first barrier portions 91 spaced apart. At least a portion of the first barrier portions 91 extend from the side of the isolation structure 3 away from the substrate 1 through the opening of the gap 11 to the side of the edge portion 81 away from the substrate 1.

[0185] Please see Figure 20A barrier layer 9 is formed on the side of the first encapsulation layer away from the substrate 1.

[0186] In the display panel formed by the above method, a first barrier portion 91 is provided on the side of the isolation structure 3 away from the substrate 1, extending through the opening of the gap 11 to the side of the edge portion 81 away from the substrate 1. The first barrier portion 91 can seal at least part of the opening of the gap 11 to form a sealing structure, thereby preventing external moisture from entering the gap 11 between the edge portion 81 and the isolation structure 3. This can effectively prevent moisture from intruding into the light-emitting unit 7, making it less likely for the light-emitting unit 7 to produce dark spots, and ultimately improving the light-emitting effect of the display panel.

[0187] In some possible implementations, the display panel includes a display area AA and a non-display area AB surrounding at least a portion of the display area AA, with a second barrier portion 92 located in the non-display area AB. After the step of forming the barrier layer 9 on the side of the first encapsulation layer away from the substrate 1, the panel further includes:

[0188] Please see Figure 21 A second encapsulation layer 12 is formed on the side of the first encapsulation layer away from the substrate 1.

[0189] Please see again Figure 14 A third encapsulation layer 13 is formed on the side of the second encapsulation layer 12 away from the substrate 1. The third encapsulation layer 13 extends from the display area AA to the non-display area AB. The third encapsulation layer 13 located in the non-display area AB is located on the side of the second barrier portion 92 away from the substrate 1.

[0190] The barrier layer 9 includes a first barrier portion 91, a second barrier portion 92, a third barrier portion 93 and a fourth barrier portion 94 integrally formed in sequence. That is, the entire surface of the barrier layer 9 is disposed on the side of the light-emitting unit 7 and the isolation structure 3 away from the substrate 1, which can greatly improve the packaging reliability of the light-emitting unit 7. The third encapsulation layer 13 extends to the side of the second barrier portion 92 away from the substrate 1.

[0191] In related technologies, only the edge portion of the non-display area AB is encapsulated by the third encapsulation layer 13. When the third encapsulation layer 13 located at the edge portion of the non-display area AB is damaged, moisture can easily penetrate the second encapsulation layer 12 through the damaged third encapsulation layer 13. Since the material of the second encapsulation layer 12 includes organic materials, moisture can easily be transferred through the second encapsulation layer 12 to the gap 11 between the edge portion 81 of the display area AA and the isolation structure 3.

[0192] In this embodiment, a second barrier 92 is provided between the third encapsulation layer 13 and the pixel defining layer 2 in the display panel formed by the above method, which can greatly improve the encapsulation effect of the non-display area AB, and make it more difficult for external moisture to penetrate the light-emitting unit 7 of the display area AA through the non-display area AB.

[0193] In some possible embodiments, this application also provides an electronic device that includes the display panel described in this application, or includes a display panel prepared by the method described in this application. This electronic device may include a device with image processing capabilities, such as a server, personal computer, laptop computer, etc. Because this electronic device includes the display panel described in this application, it has better display quality.

[0194] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0195] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A display panel, characterized in that, The display panel includes: substrate; An isolation structure is located on one side of the substrate, and the isolation structure encloses and forms an isolation opening; The light-emitting unit is at least partially located within the isolation opening; A first encapsulation layer is located on the side of the light-emitting unit away from the substrate. The first encapsulation layer includes a plurality of encapsulation units spaced apart. Each encapsulation unit includes a cladding portion located on the side of the isolation structure away from the substrate. There is a gap between the side of the cladding portion close to the substrate and the side of the isolation structure away from the substrate. The barrier layer includes a plurality of first barrier portions spaced apart, at least a portion of which extends from the side of the isolation structure away from the substrate through an opening in the gap to the side of the edge portion away from the substrate.

2. The display panel according to claim 1, characterized in that, The display panel includes a display area and a non-display area surrounding at least a portion of the display area, and the barrier layer further includes a second barrier portion located in the non-display area; Preferably, the second barrier extends from the side of the isolation structure toward the non-display area to the side of the isolation structure away from the substrate and is connected to the side of the first barrier near the non-display area; Preferably, the display panel further includes a pixel defining layer located between the substrate and the isolation structure, the pixel defining layer including a pixel opening communicating with the isolation opening, and the second barrier portion located on the side of the pixel defining layer away from the substrate; Preferably, the first barrier portion blocks the opening of the gap.

3. The display panel according to claim 2, characterized in that, The display panel further includes an adhesive unit located between the second barrier portion and the isolation structure. The adhesive unit extends from the side of the isolation structure toward the non-display area to the side of the isolation structure away from the substrate, and the adhesive unit contacts the side of the isolation structure toward the non-display area. Preferably, the bonding unit and the encapsulation unit are spaced apart; Preferably, the bonding unit and the encapsulation unit are in the same layer and made of the same material; Preferably, the light-emitting unit includes a first light-emitting unit, a second light-emitting unit, and a third light-emitting unit with different light-emitting colors, and the encapsulation unit includes a first encapsulation unit, a second encapsulation unit, and a third encapsulation unit. The first encapsulation unit is located on the side of the first light-emitting unit away from the substrate, the second encapsulation unit is located on the side of the second light-emitting unit away from the substrate, and the third encapsulation unit is located on the side of the third light-emitting unit away from the substrate. The bonding unit is in the same layer and made of the same material as the third encapsulation unit. Preferably, the thickness of the bonding unit located on the side of the isolation structure facing the non-display area is less than the thickness of the second barrier portion located on the side of the isolation structure facing the non-display area; Preferably, the thickness of the bonding unit located on the side of the isolation structure facing the non-display area is greater than or equal to 0.1 μm and less than or equal to 0.5 μm; Preferably, the thickness of the second barrier portion located on the side of the isolation structure facing the non-display area is greater than or equal to 0.3 μm and less than or equal to 1.5 μm.

4. The display panel according to claim 2, characterized in that, The isolation structure includes a first isolation portion and a second isolation portion stacked sequentially along a direction away from the substrate, wherein the orthogonal projection of the side of the first isolation portion away from the substrate on the substrate is located within the orthogonal projection of the second isolation portion on the substrate. Preferably, the distance between the edge of the orthographic projection of the side of the first isolation portion facing the non-display area away from the substrate and the edge of the orthographic projection of the second isolation portion on the substrate in the isolation structure closest to the non-display area is less than or equal to 0.3 μm; Preferably, the distance between the edge of the orthographic projection of the side of the first isolation portion facing the non-display area away from the substrate and the edge of the orthographic projection of the second isolation portion on the substrate in the isolation structure closest to the non-display area is equal to 0. Preferably, the thickness of the second barrier portion located on the side of the isolation structure facing the non-display area is greater than the thickness of the encapsulation unit located on the side of the isolation structure facing the isolation opening; Preferably, the thickness of the encapsulation unit located on the side of the isolation structure facing the isolation opening is greater than or equal to 0.1 μm and less than or equal to 0.5 μm; Preferably, the thickness of the second barrier portion located on the side of the isolation structure facing the non-display area is greater than or equal to 0.3 μm and less than or equal to 1.5 μm.

5. The display panel according to claim 2, characterized in that, The display panel also includes conductive traces located in the non-display area. The conductive traces include a first conductive portion and a second conductive portion that are sequentially stacked along a direction away from the substrate. The orthogonal projection of the side of the first conductive portion away from the substrate onto the substrate is located within the orthogonal projection of the second conductive portion onto the substrate. Preferably, the distance between the edge of the orthographic projection of the side of the first conductive portion away from the substrate and the edge of the orthographic projection of the second conductive portion on the substrate is less than or equal to 0.3 μm; Preferably, the distance between the edge of the orthographic projection of the side of the first conductive portion away from the substrate and the edge of the orthographic projection of the second conductive portion on the substrate is equal to 0. Preferably, the second barrier portion covers the conductive trace; Preferably, the conductive traces are in the same layer and made of the same material as the isolation structure; Preferably, the conductive trace includes a power supply trace or an in-panel gate driving unit; Preferably, the power supply line is electrically connected to the isolation structure.

6. The display panel according to any one of claims 1-5, characterized in that, The display panel further includes a filling layer, which includes a plurality of filling portions spaced apart, the filling portions filling the gaps, and at least a portion of the first barrier portion extending from the side of the isolation structure away from the substrate through the filling portion away from the isolation opening to the side of the edge portion away from the substrate. Preferably, along the thickness direction of the substrate, the thickness of the barrier layer is greater than or equal to 0.3 μm and less than or equal to 1.5 μm.

7. The display panel according to any one of claims 2-5, characterized in that, The display panel further includes a second encapsulation layer located on the side of the first encapsulation layer away from the substrate and a third encapsulation layer located on the side of the second encapsulation layer away from the substrate; Preferably, the third encapsulation layer extends from the display area to the non-display area, and the portion of the third encapsulation layer located in the non-display area is located on the side of the second barrier portion away from the substrate; Preferably, the side of the third encapsulation layer located in the non-display area closer to the substrate contacts the side of the second barrier portion away from the substrate; Preferably, the material of the second encapsulation layer includes organic materials; Preferably, the material of the third encapsulation layer includes inorganic materials.

8. The display panel according to any one of claims 1-5, characterized in that, The barrier layer further includes a third barrier portion, which is located on the side of the isolation structure away from the substrate; Preferably, the orthographic projection of the third barrier portion on the substrate is located between the orthographic projections of two adjacent first barrier portions on the substrate; Preferably, the third barrier is connected to the side of each of the two adjacent first barrier portions away from the isolation opening.

9. The display panel according to any one of claims 1-5, characterized in that, The encapsulation unit further includes an encapsulation part connected to the edge-wrapping portion, wherein the orthogonal projection of the encapsulation part on the substrate covers the orthogonal projection of the light-emitting unit on the substrate; Preferably, the barrier layer further includes a fourth barrier portion located on the side of the encapsulation portion away from the substrate.

10. The display panel according to claim 9, characterized in that, The orthogonal projection of the fourth barrier portion on the substrate is located between the orthogonal projections of two adjacent first barrier portions on the substrate. Preferably, the fourth barrier is connected to the side of each of the two adjacent first barrier portions near the isolation opening.

11. The display panel according to any one of claims 1-5, characterized in that, The material of the barrier layer is the same as the material of the first encapsulation layer; Preferably, the material of the barrier layer includes inorganic materials; Preferably, the material of the barrier layer includes at least one of silicon nitride, silicon oxide, or silicon oxynitride.

12. The display panel according to claim 4, characterized in that, The second electrode of the light-emitting unit is electrically connected to the first isolation portion; and / or, the isolation structure further includes a third isolation portion located on the side of the first isolation portion facing the substrate, and the second electrode of the light-emitting unit is electrically connected to the third isolation portion; Preferably, the material of the third isolation portion includes molybdenum; and / or, the material of the first isolation portion includes aluminum; and / or, the material of the second isolation portion includes titanium.

13. A method for manufacturing a display panel, characterized in that, The method includes: Provide substrate; An isolation structure is formed on one side of the substrate, and the isolation structure encloses an isolation opening; At least a portion of the light-emitting unit and a first encapsulation layer located on the side of the light-emitting unit away from the substrate are formed within the isolation opening. The first encapsulation layer includes a plurality of encapsulation units spaced apart. Each encapsulation unit includes a cladding portion located on the side of the isolation structure away from the substrate. There is a gap between the side of the cladding portion close to the substrate and the side of the isolation structure away from the substrate. A barrier layer is formed on the side of the first encapsulation layer away from the substrate. The barrier layer includes a plurality of first barrier portions spaced apart. At least a portion of the first barrier portions extend from the side of the isolation structure away from the substrate through an opening in the gap to the side of the edge portion away from the substrate.

14. The method for manufacturing a display panel according to claim 13, characterized in that, The display panel includes a display area and a non-display area surrounding at least a portion of the display area, and the barrier layer includes a second barrier portion located in the non-display area; After the step of forming a barrier layer on the side of the first encapsulation layer away from the substrate, the method further includes: A second encapsulation layer is formed on the side of the first encapsulation layer away from the substrate; A third encapsulation layer is formed on the side of the second encapsulation layer away from the substrate. The third encapsulation layer extends from the display area to the non-display area. The third encapsulation layer located in the non-display area is located on the side of the second barrier portion away from the substrate.

15. An electronic device, characterized in that, The electronic device includes a display panel as described in any one of claims 1-12, or a display panel prepared by the method for preparing a display panel as described in claim 13 or 14.

Images