Two-dimensional material automatic transfer system and transfer method

By using a multi-source sensing and collaborative control system to detect the contact pressure and relative posture during the two-dimensional material transfer process in real time, the problems of transfer instability and consistency in existing technologies are solved, and highly reliable and automated two-dimensional material transfer is achieved.

CN122138677APending Publication Date: 2026-06-02NANJING UNIV

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
NANJING UNIV
Filing Date
2026-01-30
Publication Date
2026-06-02

AI Technical Summary

Technical Problem

Existing two-dimensional material transfer equipment relies on manual operation or semi-automation and lacks real-time monitoring and collaborative control. This leads to uneven local stress, interface wrinkling, bubble residue, or material damage during the transfer process. Furthermore, the temperature control process is decoupled from the interface state, affecting the stability and consistency of the transfer.

Method used

A multi-source sensing and collaborative control system is adopted, which combines vision module, sensing module and temperature control module to detect the contact pressure and relative attitude between two-dimensional material and target substrate in real time. The control unit performs closed-loop adjustment to achieve adaptive control of the pressing force, attitude compensation and temperature control stages.

Benefits of technology

It improves the stability and consistency of the two-dimensional material transfer process, solves the wrinkling and bubble problems caused by imperceptible interface conditions, enhances the reliability and process controllability of the transfer, and supports batch operation.

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Abstract

The application discloses a two-dimensional material automatic transfer system and a transfer method, and relates to the technical field of material transfer, and can be used for improving the quality, consistency and process reliability of a transfer interface.
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