Modular metrology apparatus for interchangeable process modules

Abstract

A modular metrology apparatus includes a vacuum chamber housing with an opening having a mechanical interface for sealing and attaching a modular adapter. A sample platform located within the vacuum chamber positions a sample to be processed. One or more charged particle scanning systems scan particle beams across the sample. The mechanical interface is capable of integrating detachable, interchangeable modular adapters containing different process module configurations. The process modules are sealed within the adapters and extend from the outside into the vacuum chamber housing toward the sample platform. The modular adapters are interchangeable to reconfigure installed process modules. Configurations may include scanning electron beams, focused ion beams, interferometers, detectors, and other process modules. This modular architecture provides a configurable mechanical framework that optimizes the metrology apparatus by interchangeable adapters with customized process modules.

Description

[0001] priority

[0002] This application claims priority to German patent application 10 2023 130 647.2, the disclosure of which is incorporated herein by reference. Technical Field

[0003] The various examples are generally about metering systems. In particular, some examples relate to a modular metering device that integrates multiple process modules configured for different operating modes. Background Technology

[0004] In modern metrology applications, various techniques are employed for material property analysis, defect inspection, and sample measurement. Instruments such as scanning electron microscopes (SEM), focused ion beam (FIB), laser-induced fluorescence (LIF), and gas injection systems (GIS) can perform specialized tasks, but their operation is often limited. For example, the current construction of SEM systems typically provides a working distance (WD) that is insufficient to meet the demands of higher resolution. Furthermore, the cutting efficiency of FIB systems is often affected by design limitations. For instance, a dual-beam FIB-SEM system combines two functions, but the positions of the electron and ion columns relative to each other, as well as the working distance to the sample, are mechanically constrained and cannot be altered after system integration. Metrological systems can be identified from DE 102021 128 117 A1 and DE 10 2021 110 948 A1.

[0005] Adapting conventional metrology equipment to constantly changing requirements is impractical and necessitates drilling, realignment, and recalibration. Therefore, it is usually necessary to purchase additional systems to meet different testing requirements. Summary of the Invention

[0006] Therefore, there is a need for advanced metrology systems that mitigate or reduce at least some of the aforementioned drawbacks. In particular, there is a need for metrology equipment employing at least one charged particle scanning system that can be easily adapted to changing requirements.

[0007] This requirement is met by the features of the independent claims. The features of the dependent claims define the embodiments.

[0008] It should be understood that the foregoing features and similar features explained below can be used not only in the corresponding combinations shown, but also in other combinations or individually, without departing from the scope of the invention.

[0009] A modular metrology device is provided, configured to process samples in a vacuum chamber. The vacuum chamber is formed by a vacuum chamber housing having an opening with a mechanical interface configured for attaching a modular adapter. The modular metrology device further includes a sample platform located inside the vacuum chamber housing. The modular metrology device further includes at least one charged particle scanning system, each of which is configured to scan a corresponding beam of charged particles on the sample platform.

[0010] The opening may be located, for example, on one side of the vacuum chamber housing relative to the sample platform. The opening may be circular (i.e., circular in shape) or may include at least partially straight and / or angled edges. The mechanical interface may be configured for sealing attachment of one of a variety of modular adapters. In various instances, the claimed modular metrology device may or may not include a modular adapter. The modular adapter may be formed such that it can be inserted into the opening from a top-side detachable portion of the vacuum chamber housing, but cannot completely pass through the opening due to its larger dimensions in the xy-plane compared to the external opening. When attached, the modular adapter may extend along the z-axis portion through the opening into the sealed internal space of the metrology device. The modular adapter may extend from the opening of the vacuum chamber housing along the z-axis in both the positive and negative directions. It may extend beyond the thickness of the vacuum chamber housing or twice its thickness on the top outer surface of the vacuum chamber housing. It may extend from above the inner surface of the vacuum chamber housing into the interior of the vacuum chamber beyond 20%, 30%, or 50% of the distance from the vacuum chamber housing to the sample platform along the z-axis.

[0011] Modular adapters can accommodate one or more process modules in a specific spatial configuration, such as two or more, three or more, or four or more process modules, to implement a desired operating mode. At least one charged particle scanning system may include at least one process module. In other words, the at least one process module may include a process module comprising at least a portion of the charged particle scanning system, and selectively one or more additional process modules providing alternative processing operating modes. The vacuum chamber housing may include an opening, wherein the mechanical interface is formed along the edge of the opening, particularly around the edge of the opening. The modular metrology device may be configured to hermetically attach to the modular adapter. The modular metrology device may be configured to hermetically attach to at least one or various, such as at least two or three different modular adapters. The modular adapter may include a corresponding mechanical interface, i.e., a mechanical interface corresponding to the vacuum chamber opening. It should be understood that the vacuum chamber opening and the mechanical interface of the modular adapter provide a hermetically attached connection between the vacuum chamber housing and the modular adapter. The mechanical interface may include corresponding mechanical attachments and / or sealing structures that correspond to each other, enabling them to implement a hermetically attached connection. The mechanical interface may extend along and / or around the opening, particularly around the entire perimeter of the opening.

[0012] In other words, the modular metrology device comprises a vacuum chamber housing, which, together with a modular adapter, forms a closed structure with an internal space. The vacuum chamber housing includes an opening on one side allowing access to the internal space. A mechanical interface is provided around this opening, enabling the detachable attachment of interchangeable modular adapters. When the modular adapter is installed, this mechanical interface provides a sealed connection to maintain the vacuum condition. Within the vacuum chamber housing is a sample platform on which a specimen or sample can be mounted for analysis or processing. The sample platform allows the sample to be adjustably positioned within the internal space of the vacuum chamber housing. By moving the sample platform, the position of the sample can be controlled in three dimensions. In other instances, the sample platform can also move only in a plane (i.e., in the xy direction).

[0013] In various instances, this modular metrology apparatus employs a charged particle scanning system. In some instances, this may represent a modular metrology apparatus comprising a custom-designed process module, particularly an electron microscopy process module, which includes an electron microscope source column capable of scanning a focused beam across the sample. Therefore, at least one process module may include at least a portion of a charged particle scanning system. At least one such charged electron scanning system may be included, but multiple charged particle scanning systems may also be included. The charged particle beam may contain, for example, electrons or ions. Each scanning system can independently scan its respective particle beam on the sample platform surface.

[0014] Generally, a modular adapter refers to a mechanical component configured to receive, guide, or hold various process modules. A modular adapter is an interchangeable component that connects to the vacuum chamber housing of a metrology device. The primary purpose of this modular adapter is to integrate and provide mounting points for one or more process modules. The modular adapter can be configured within an opening in the vacuum chamber housing. Therefore, at least one process module can be configured within or extend through an opening in the vacuum chamber housing. The modular adapter includes ports, connectors, alignment features, and other components for receiving process modules, and is interchangeable with the vacuum chamber housing. When attached to the edge of an opening in the vacuum chamber housing, the modular adapter allows the process module to extend into the internal vacuum space and interact with samples on the platform. The modular adapter is interchangeable to allow for different combinations of process modules. By interchangeable modular components tailored to specific analytical needs, metrology devices can be flexibly optimized. The adapter acts as the primary medium between the vacuum chamber housing and customized process modules. The modular architecture with interchangeable adapters allows the entire system to be adapted and reconfigured for different detection and metrology applications. Modular adapters provide an interface that integrates this constructibility and modularity.

[0015] In various instances, the charged particle scanning system may include or be integrated into a process module that is sealed and secured to and extends through a modular adapter and openings into the vacuum chamber housing. In some instances, at least one process module may be part of the charged particle scanning system. For example, this charged particle scanning system process module may include an electron column or ion column assembly. This process module may extend through a socket or port in the modular adapter from the outside of the vacuum chamber housing into the internal vacuum space. The portion of the scanning system within the vacuum may include, for example, beam generation components such as sources, lenses, detectors, etc. The external portion outside the vacuum may include electronics, pumps, controllers, and peripheral components that are not required to be in a vacuum.

[0016] The modular adapter can be configured to hold at least one process module in different spatial configurations, for example, at different angles or positions relative to the modular adapter and / or relative to other process modules, as will be described in more detail below. The modular design allows different scanning systems to be interchanged at the opening of the vacuum chamber. Various modules can be attached to the vacuum chamber housing to reconfigure the metrology equipment for desired analytical capabilities. All modules are securely connected to mechanical interfaces to maintain vacuum integrity during operation. Process modules can be fixedly attached to the vacuum chamber housing or detachably attached.

[0017] In other words, the mechanical interface can be configured to receive and attach to various modular adapters. This is achieved by providing a mechanical interface configured to attach and seal to a corresponding mechanical interface of the modular adapter. For example, the mechanical interface can extend around the periphery of an opening in the vacuum chamber housing. By extending around the periphery of the opening, the mechanical interface provides a continuous mounting surface on which the modular adapter can be secured and sealed. The modular adapter can be hermetically sealed within the opening. The modular adapter can contain one or more process modules designed to interact with or process samples within the vacuum chamber. By configuring the mechanical interface around the opening, different modular adapters containing various process modules can be interchanged and implemented on the metrology equipment. Thus, the mechanical interface around the opening in the vacuum chamber housing provides configurable mounting points for integrating interchangeable modular adapters to reconfigure the metrology equipment.

[0018] The mechanical interface can utilize various types of connectors to attach the modular adapter, as described in more detail with reference to the diagrams. For example, the mechanical interface can employ quick-release clamps, screws, latches, or other fastening mechanisms to secure the modular adapter. These removable fasteners allow for adapter replacement by removing and reinstalling the clamps or screws. The mechanical interface can also utilize gaskets or seals between the opening and the adapter's surface. This creates a hermetically tight connection to maintain a vacuum within the cavity. Gasket materials can include elastomers, metals, or other materials compatible with high vacuum. Additionally, the mechanical interface can include alignment guides, such as pins, shoulders, or other registration devices. These guides enable precise positioning of the modular adapter relative to the interior of the vacuum cavity. Proper alignment helps ensure proper integration of the process module with the sample platform and beam optics. In various instances, the connection itself can involve flanges, lips, or other engagements where the adapter and vacuum cavity interlock. This engagement can be designed for force fit, form fit, friction fit, or material bonding to create a strong attachment, as described in detail below. A vacuum seal is provided between the modular adapter and the vacuum chamber housing.

[0019] Modular adapters can be constructed as a single component containing all the interfaces and receptacles for mounting at least one process module. In this approach, the adapter is a single, complete unit integrating multiple modules. Alternatively, a modular adapter can comprise two or more individual segments or units that combine to form a complete adapter assembly. For example, process module receptacles can be different removable modules attached to the base adapter structure. This allows the adapter to be reconfigured by interchangeing different receptacle modules. Receptacles and ports for receiving individual process modules can also be integral parts of the adapter. Alternatively, receptacles can be different modular components attached to the adapter to implement flexible receptacle configurations. A hybrid approach is also possible, where some parts (such as vacuum seals and main structural elements) are integrated while the modular receptacles remain separate. Attached Figure Description

[0020] Those skilled in the art will understand and appreciate these and other objects of the invention from the detailed description of the preferred embodiments and the following drawings, wherein like reference numerals denote like elements.

[0021] Figure 1 The illustrations schematically depict modular metrology equipment containing SEM process modules and FIB process modules according to various examples.

[0022] Figure 2 The illustrations depict modular metrology equipment containing various additional process modules for processing samples, based on various examples.

[0023] Figure 3The illustrations schematically depict modular metrology equipment comprising a SEM process module, a FIB process module, and a laser interferometer, based on various examples.

[0024] Figure 4 This illustration shows various examples. Figure 3 The working distance of modular metering equipment.

[0025] Figure 5 Further illustrative examples are shown based on various instances. Figure 2 and Figure 3 The working distance of a modular metrology device for a reference mirror of a laser interferometer.

[0026] Figure 6 The schematic diagram illustrates modular adapters according to various examples, wherein a reference mirror for the laser interferometer phase is recessed within the modular adapter.

[0027] Figure 7 This illustration shows various examples. Figure 3 The modular metrology equipment includes different modular adapters with different constructions of SEM and FIB process modules, as well as a laser interferometer with a recessed reference mirror.

[0028] Figure 8 This illustration shows various examples. Figure 7 The working distance of modular metering equipment.

[0029] Figure 9 The illustrations schematically depict modular metering devices containing modular adapters with additional process modules, based on various examples.

[0030] Figure 10 The illustrations schematically depict modular metering devices containing modular adapters with additional process modules, based on various examples.

[0031] Figure 11 The illustrations schematically depict modular metering devices containing modular adapters with additional process modules, based on various examples.

[0032] Figure 12 The schematic diagram illustrates the mechanical interface between the vacuum chamber housing and the modular adapter according to various examples.

[0033] Figure 13 The illustrations show additional mechanical interfaces between the vacuum chamber housing and the modular adapter, according to various examples.

[0034] Figure 14 The illustrations show additional mechanical interfaces between the vacuum chamber housing and the modular adapter, according to various examples.

[0035] Figure 15 The illustrations depict modular metering devices, including SEM and FIB process modules and deflection units integrated into modular adapters, according to various examples. Detailed Implementation

[0036] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. It should be understood that the embodiments described below are not intended to be limiting. The scope of the present invention is not intended to be limited by the embodiments or drawings described below, which are illustrative examples of the overall inventive concept. Unless otherwise specifically stated, features of various embodiments may be combined with each other.

[0037] The illustrations are intended to be schematic, and the elements shown are not necessarily to scale. Rather, the various elements are presented to help those skilled in the art better understand their function and general purpose. Any connection or coupling between functional blocks, devices, components, or other entities or functional units shown in the illustrations or described herein may also be implemented via indirect connection or coupling. Coupling between multiple components may also be established via wireless connection. Functional blocks may be implemented in hardware, firmware, software, or a combination thereof.

[0038] Some embodiments of the present invention generally provide multiple modules or other electrical devices for modular metering devices. The modules and other electrical devices, and all the functions provided by each module and other electrical device, are not intended to be limited to what is shown and described herein. While specific labels may be assigned to the various modules or other electrical devices disclosed, such labels are not intended to limit the scope of operation of the modules and other electrical devices. Such modules and other electrical devices may be combined and / or separated from each other in any way based on a specific type of desired mechanical and / or electrical implementation. It should be understood that any process module or other electrical device disclosed herein may include any number of microcontrollers, graphics processing units (GPUs), integrated circuits, memory devices (e.g., flash memory, random access memory (RAM), read-only memory (ROM), electrically programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EPROM), or other suitable variations), and software that cooperates with each other to perform the operations disclosed herein(s). Additionally, any one or more of the electrical devices may be configured to execute program code embodied in a non-transitory computer-readable medium, which is programmed to perform any number of functions as disclosed.

[0039] The following describes techniques for imaging and processing microscopic samples using charged particle scanning systems such as SEM and FIB. It should be understood that the described techniques can be applied to any metrology equipment employing a vacuum chamber.

[0040] Figure 1The schematic diagram shows a dual-beam modular metrology device 1000 containing a SEM process module 5040 and a FIB process module 5050, wherein the technology according to the present invention can be applied.

[0041] like Figure 1 As shown, metrology equipment 1000 includes a wafer inspection system configured for slicing and imaging methods with a dual-beam configuration. Sample processing in metrology equipment is typically performed in a sealed environment, such as a process chamber, specifically in a vacuum chamber formed by a vacuum chamber housing 10, schematically depicted around metrology equipment 1000. According to the technology of the invention, a process module containing, for example, SEM column 5040, FIB column 5050, and particle detector 1017 can extend from the outside of the vacuum chamber through the vacuum chamber housing 10 into the interior of the vacuum chamber housing 10.

[0042] For wafer 1008, multiple measurement points containing measurement points 1006.1 and 1006.2 are defined in a location map or inspection list generated from inspection tools or design information. Wafer 1008 is placed on wafer stage 1015 (corresponding to sample platform 30). Wafer stage 1015 is mounted on platform 1155, which has actuators and positioning controller 1021. Actuators and components (such as laser interferometers) for precise control 1021 of wafer platform 1155 are known in the art. Control unit 1016 receives information about the actual position of wafer platform 1155 and is configured to control wafer platform 1155 and adjust measurement point 1006.1 of wafer 1008 at intersection 1043 of dual-beam device 1001. The dual-beam device 1001 includes a FIB column 1050 with an FIB optical axis 1048 and a charged particle beam (CPB) imaging system 1040 with an optical axis 1042 (e.g., SEM or HIM; see [link]). Figure 3 (Charged particle scanning microscope 160). At the intersection 1043 of the two optical axes of the FIB and CPB imaging systems, the wafer surface 1055 is configured at an angle GF to the FIB axis 1048. The FIB and CPB jointly observe the sample. The FIB axis 1048 and the CPB imaging system axis 1042 include the angle GFE. Figure 7In the coordinate system, the normal to wafer surface 15 is provided by the z-axis. A focused ion beam (FIB) 1051 is generated by FIB pillars 1050 and impacts surface 1055 of wafer 1008 at an angle GF. The inclined profile surface is ground into the wafer at a predetermined y-position at an angle of approximately GF by ion beam grinding at inspection point 1006.1, controlled by platform 1155 and positioning controller 1021. In the example shown, the angle of inclination GF is approximately 30°. Due to beam divergence of the focused ion beam (e.g., a gallium ion beam), or due to different material properties along the profile grinding, the actual angle of inclination of the inclined profile surface can deviate from the angle of inclination GF by 1° to 4°. An image of the ground surface is acquired using a charged particle beam imaging system 1040. Figure 7 In one example, the charged particle beam imaging system 1040 is configured with a charged particle beam 1044 that is perpendicular to the wafer surface 1055 and parallel to the z-axis. In other configurations, the optical axis 1042 of the charged particle beam imaging system 1040 is configured at an angle to the z-axis.

[0043] During imaging, a charged particle beam 1044 is scanned by the scanning unit of the charged particle beam imaging system 1040 along a scanning path on the cross-sectional surface of the wafer at measurement site 106.1, generating secondary particles and backscattered particles. Particle detector 1017.1 and selective internal particle detector 1017.2 collect at least some of the secondary particles and / or backscattered particles and communicate particle counts to control unit 1019. Other detectors may also be present for other types of interaction products, such as X-rays or photons. Control unit 1019 controls charged particle beam imaging column 1040 and FIB column 1050 and is connected to control unit 1016 to control the position of the wafer mounted on wafer stage 1015 via wafer platform 1155. Operation control unit 1002 communicates with control unit 1019, triggering, for example, the placement and alignment of measurement site 1006.1 of wafer 1008 at intersection 1043 via wafer platform movement, and repeatedly triggering FIB grinding, image acquisition, and platform movement operations. The control unit 1019 and the operation control unit 1002 include a memory for storing instructions in the form of software program code and at least one processor for executing the instructions during operation. The memory also provides for storing digital image data. The operation control unit 1002 may further include a user interface or an interface to other communication interfaces to receive instructions, previous information, and transmit detection results.

[0044] Figure 2 Various process modules 20, 21, 22 of a modular metrology device for processing samples are schematically shown, which can be anchored in a modular adapter according to the technology of the present invention.

[0045] The metrology apparatus is shown as having an SEM process module 21, a focused ion beam process module 22, and other process modules 20 oriented toward the sample platform 30. The process modules can be configured within the vacuum chamber of the modular metrology apparatus, wherein the techniques described herein can be applied to anchoring process modules 20, 21, 22 using a modular adapter (not shown) instead of anchoring process modules 20, 21, 22 individually within the vacuum chamber housing (not shown) of the metrology apparatus. In particular, in FIB-SEM applications, the available space adjacent to the scanning area is limited because auxiliary devices (e.g., precursor gas sources, micromanipulators, or detectors) should be positioned as close to the sample as possible. The modular adapter, sealed within the vacuum chamber housing, provides a mechanical framework for integrating multiple process modules in a miniaturized layout optimized for operation close to the sample platform. The modular adapter specifically allows the SEM column 21 (also referred to as the SEM process module) and the FIB column 22 (also referred to as the FIB process module), along with other auxiliary process modules such as a gas injection system and a micromanipulator, to be positioned close to the sample. Modular metering equipment features a flexible construction via interchangeable modular adapters that are customized to integrate multiple analytical techniques.

[0046] Figure 3 The schematic diagram illustrates a modular metrology device 1 containing a SEM process module 21, a FIB process module 22, and a laser interferometer, according to various examples.

[0047] like Figure 3 As shown, the modular metrology device 1 includes a vacuum chamber housing 10 with an opening, a sample platform 30, a modular adapter 50, a SEM process module 21, a FIB process module 22, and a laser interferometer system 40 with a reference mirror 41.

[0048] Modular adapter 50 is located within the opening of vacuum chamber housing 10 and is attached to vacuum chamber housing 10 via a mechanical interface 60 extending along the opening of vacuum chamber housing 10. Thus, a portion of vacuum chamber housing 10 is schematically depicted as the right and left sides of the modular adapter and positioned around the modular adapter 50 such that the edges of the opening surround the modular adapter 50 to form and seal a closed vacuum chamber housing at least a portion of the sample platform 30 and process modules 21, 22. Inside the vacuum chamber housing is the sample platform 30, in which the sample to be analyzed is mounted. Modular adapter 50 is positioned around SEM and FIB process modules 21, 22, which extend through and are positioned and sealed within the modular adapter 50. It has ports through which the SEM 21 and FIB 22 modules extend.

[0049] exist Figure 3In this example, the FIB process module 21 and the SEM process module 22 are configured in a specific spatial structure defined by the modular adapter 50. The SEM process module 21 is positioned centrally and extends vertically (along the z-axis) upward through the modular adapter 50 and downward toward the sample platform 30. The FIB process module 22 is located to one side of the SEM process module 21. It also extends through the modular adapter to guide its beam to the sample platform 30 and forms an angle relative to the z-axis and the longitudinal axis of the SEM process module. At the bottom is the laser interferometer system 40 and its reference mirror 41. This allows for precise measurement of the distance between the adapter and the sample platform.

[0050] Different modular adapters 50 include different configurations of process modules, i.e., different spatial configurations and / or different modular adapters 20 that can be attached to the vacuum chamber housing 10. For example, additional modular adapters 50 may provide different (selectively adaptable) configurations, i.e., the orientation and / or position of process modules 21, 22 relative to each other and modular adapters 50, as will be explained in more detail with reference to the following figures.

[0051] The vacuum chamber housing 10 provides an opening with a standardized mechanical interface 60 to integrate various modular adapters 50 with corresponding mechanical interfaces in a flexible and interchangeable manner.

[0052] Figure 4 This illustration shows various examples. Figure 3 The working distance of the modular metering device 1.

[0053] The FIB process module 22 is depicted at an angle relative to the z-axis, oriented towards the sample platform 30. This angular orientation of the FIB module 22 facilitates reaching the common overlap point on the sample platform 30 with the SEM process module 21. The process module 20 is also shown arranged around the SEM and FIB pillars 21 and 22. The presence of additional process modules adjacent to the pillars limits the available space around the sample platform 30. The SEM process module 21 is oriented vertically along the z-axis, which is perpendicular to the sample platform 30. Due to the compact construction of the multiple process modules, the working distance between the tip of the SEM pillar and the sample platform 30 is mechanically constrained. (As shown from...) Figure 4 It can be seen that the achievable minimum working distance is limited by the potential collisions or interference between the angled FIB pillar 22 and the vertically oriented SEM pillar 21, as well as the bundle diameter of the SEM and FIB process modules. Typically, the working distance between the pillar tip and the sample is a key parameter that the SEM and / or FIB process modules should minimize, but it is limited by mechanical constraints.

[0054] Figure 5 Further illustrative examples are shown based on various instances. Figure 2 and Figure 3 The working distance of the modular metrology device 1 relative to the reference mirror 41 of the laser interferometer system 40.

[0055] Figure 5 This further illustrates the limitation on the minimum working distance imposed by the laser interferometer system 40 integrated into the modular metrology device. Similar to... Figure 4 The SEM process module 21 and FIB process module 22 are shown anchored to the modular adapter 50 and oriented to the sample platform 30. Additionally, a laser interferometer system 40 is incorporated into the modular adapter 50 and / or the SEM process module 21 assembly. The laser interferometer system 40 includes a reference mirror 41 mounted to the modular adapter 50 and / or the SEM process module 21. The bottom reflective surface of the reference mirror 41 is used for interferometric measurements. The distance between the reference mirror 41 and the sample platform 30 limits how close the SEM and FIB pillar tips can be positioned to the sample platform. This bottom reflective surface of the reference mirror 41 is positioned lower than the lower tip of the SEM process module 21, i.e., closer to the sample platform 30. Because the reference mirror 41 extends closer to the sample platform 30 than the SEM tip, it imposes a limitation on the minimum working distance between the SEM tip and the sample platform.

[0056] Figure 6 The schematic diagram shows a modular adapter 50 mounted to a vacuum chamber housing 10, wherein a reference mirror 41 associated with a laser interferometer 40 is recessed within the modular adapter 50.

[0057] Reference mirror 41 is shown positioned in a recess within the modular adapter 50, recessed rearward from the lower outer boundary / edge of the modular adapter 50, as indicated by the dashed line. This illustrates how recessed and positioned components within the adapter can provide greater flexibility. However, the integrated nature of the modular design means that all components must be fully considered when determining the minimum working distance.

[0058] Figure 7 schematically shown Figure 3 The modular metrology device 1 includes different modular adapters 50 with different structures of SEM and FIB process modules 21 and 22, and a laser interferometer 40 with a recessed reference mirror 41.

[0059] Figure 7 schematically shown Figure 3 Modular metering equipment 1, compared to Figure 3 It has a different modular adapter 50 and process module structure. Similar to... Figure 3 The device includes an SEM process module 21, a FIB process module 22, and a laser interferometer 40 with a recessed reference mirror 41. However, in Figure 7In the diagram, the SEM fabrication module 21 is shown tilted relative to the z-axis, rather than vertically. This tilted orientation of the SEM column 21 and the recessed reference mirror 41 allows for a closer working distance between the SEM tip and the sample platform 30.

[0060] Figure 8 This illustration shows various examples. Figure 7 The working distance of modular metering equipment.

[0061] like Figure 8 As illustrated, in this and various other examples described with reference to other illustrations, the working distance from the SEM and / or FIB to the sample platform can be less than 5 mm. The SEM column tilting capability provided by the modular adapter can further shorten the minimum working distance even faster. This demonstrates how interchangeable modular adapters can change the position of the process module relative to the sample platform. Figure 7 This demonstrates how interchangeable adapters enable flexible positioning of process modules to reduce working distances.

[0062] Figure 9 The schematic illustration shows a modular metering device 1 according to various examples, which includes a modular adapter 50 with an additional pivotable process module construction.

[0063] As shown in the previous diagram, the modular adapter 50 is shown attached to the vacuum chamber housing 10 via a mechanical interface. The mechanical interface between the adapter 50 and the housing 10 is a sealed connection. In this configuration, process modules 22 and 21 can be pivotally moved relative to the modular adapter 50 via an actuator 51. The actuator 51 achieves angular positioning of the process modules by rotating the process modules about a pivot axis relative to the sample platform 30 and / or the modular adapter 50. This allows for flexible orientation of the modules to optimize the incident angle on the sample platform 30. As mentioned above, the reference mirror 41 of the laser interferometer is recessed. Process modules 22 and 21 can be independently pivoted and locked into position using the integrated actuator 51.

[0064] Figure 10 The schematic illustration shows a modular metering device 1 with a modular adapter 50 according to various examples, the modular adapter having an additional configurable process module construction or configuration.

[0065] In this configuration, the FIB process module 22 can be pivoted relative to the modular adapter 50 via an integrated actuator 51. This allows for angular positioning of the FIB module 22 by rotating it about a pivot axis using an additional actuator 52. Specifically, the SEM process module 21 can be translated vertically relative to the modular adapter 50 and / or the sample platform 30 via a linear actuator 52. This allows the SEM module 21 to be positioned closer to or further away from the sample platform 30. The modular adapter 50 combines a rotary actuator 51 for pivoting the FIB module 22 and a linear actuator 52 for translating the SEM module 21. As mentioned above, the reference mirror 41 of the laser interferometer is recessed. This demonstrates how different types of actuators can be integrated into the adapter 50 to provide the flexibility to independently position different process modules. Angle and linear accuracy adjustments are possible.

[0066] Figure 11 The schematic illustration shows a modular metering device 1 according to various examples, which includes a modular adapter 50 with additional process module construction.

[0067] like Figure 11 As shown, the modular metering device 1 with modular adapter 50 is configured to accommodate multiple similar process modules 21, 22, 23 and 24.

[0068] Adapter 50 integrates a first SEM process module 21 and a second SEM process module 23. The adapter also incorporates a first FIB process module 22 and a second FIB process module 24. Additionally, two recessed reference mirrors 41 and 42 related to the laser interferometer system are shown. The first reference mirror 41 is associated with the first SEM module 21. The second reference mirror 42 is associated with the second SEM module 23. By integrating multiple SEM and FIB pillars and multiple recessed reference mirrors, the modular architecture enables multi-beam metrology equipment. Adapter 50 allows for the replication of process modules and flexible placement of components. Multiple electron beam and ion beam pillars enable advanced multimodal inspection and processing. This demonstrates the versatility of the modular adapter-based architecture, allowing for adaptation to multi-tool configurations through customized adapters.

[0069] Figure 12 The mechanical interface 60 between the vacuum chamber housing 10 and the modular adapter 50 is schematically shown according to various examples.

[0070] like Figure 12As shown, a mechanically engaged interface is provided between the vacuum chamber housing 10 and the modular adapter 50. In this example, the mechanical interface is constituted by a screw 61, which attaches and seals the modular adapter 50 to an opening in the vacuum chamber housing 10. The screw 61 provides a force-fit connection between the two components. Tightening the screw presses the adapter 50 against the housing 10 to form a robust engagement. The mechanical force generated by the screw forces the modular adapter 50 to attach to the vacuum chamber housing 10. This force-fit interface ensures a leak-proof seal. The screw 61 also engages with a gasket or O-ring seal between the adapter and the housing surface. A compression gasket provides an airtight connection.

[0071] Although only the force-fit screw interface is shown here, the rest of the modular metrology equipment setup is similar to the previously described examples and figures. This includes the configuration of the process modules, sample platform, and other components integrated via the modular adapter architecture.

[0072] Figure 13 The schematic diagram illustrates the form-fit mechanical interface between the vacuum chamber housing 10 and the modular adapter 50.

[0073] like Figure 13 As shown, the mechanical interface provides a form-fit connection, such as a snap-fit ​​installation. The vacuum chamber housing 10 has an opening with a specific geometric profile. The modular adapter 50 has a corresponding geometry on its underside that matches the profile of the housing opening. During assembly, the complementary shapes on the housing 10 and the modular adapter 50 interlock with each other. This creates a precise form-fit interface between the components that securely attach the adapter 50 to the housing 10. The geometric interlocking of the surfaces prevents lateral movement and separation between the housing 10 and the modular adapter 50. The mechanical interface can be designed to allow the adapter 50 to detach from the housing 10 in a controlled manner, thereby enabling the interchangeability of the modular components.

[0074] Figure 14 The diagram schematically illustrates an additional mechanical interface 60 between the vacuum chamber housing and the modular adapter, according to various examples.

[0075] like Figure 14 As shown, a material-fitting mechanical interface is provided between the vacuum chamber housing 10 and the modular adapter 50. This interface is described as a weld or glue between the housing 10 and the adapter 50. Welding or gluing forms a material-fitting connection by fusing or bonding components together at the molecular level. While welding or gluing helps ensure an airtight seal in a vacuum environment, it lacks the modularity and configurability of removable accessories such as force-fit or form-fit interfaces.

[0076] Figure 15The schematic diagram illustrates a modular metering device 1 according to various examples, which includes SEM and FIB process modules 21, 22 and a deflection unit 70 integrated into a modular adapter 50.

[0077] The deflection unit 70 is fixed to the modular adapter 50 and configured to deflect the ion beam of the FIB system 22 to adjust its incident angle on the sample platform 30. The deflection unit 70 may utilize an electromagnetic lens or an electrostatic deflector (particularly a wire) to influence the path of the FIB beam through a variable magnetic field. The trajectory of the focused ion beam can be manipulated by controlling the voltage / current through the wire.

[0078] Additionally, the deflection unit 70 can be used to make the FIB beam and the SEM beam coincide at the same point without moving the sample platform. This enables dual-beam processing, such as profiling, without moving the sample platform 30.

[0079] In other words, the deflection unit 70 uses a generated magnetic field to guide the current-carrying conductors of the FIB beam. The strength of the magnetic field can be altered by manipulating the current. This allows for tuning and adjustment of the coincidence point and incident angle of the FIB beam on the sample platform 30. A stronger magnetic field provides greater deflection. Manipulating the beam path can include refocusing the FIB optics to compensate for the increased distance and potential astigmatism introduced by the deflection. To restore the FIB and SEM beams to a common coincidence point after deflection, the height of the sample platform 30 may need to be adjusted. Alternatively, the coincidence can be maintained, and the platform 30 can be moved in the x-direction to scan different areas beneath the undeflected beam. Slightly retracting the FIB pillar 22 provides the additional volume required to incorporate the deflector compared to a fixed coincidence design.

[0080] The external deflection unit 70 allows the FIB column 22 to be positioned closer to the SEM column 21 and the sample platform 30. In addition to the mechanical tilting of the FIB column 22, the miniaturized deflector can manipulate the beam within the limited space between the tip of the SEM process module and the sample platform. This tighter component packaging implemented by the deflection unit 70 allows for a reduction in the overall working distance between the tip of the SEM column and the sample platform 30. Without the need for mechanical tilting, columns 21 and 22 can extend further forward toward the sample platform 30. The closely spaced configuration increases beam strength and enables advanced simultaneous imaging and processing capabilities. This further facilitates the development of a modular architecture.

[0081] The external deflection unit described herein is presented as an example, providing additional beam manipulation capabilities. However, it should be understood that the deflection unit can be combined with any other features as illustrated in other figures and various examples. For example, a tilted SEM process module configuration, a rotatable or translational movable process module, an actuable process module, and a multi-column construction. The deflection unit can complement and enhance the functionality provided by other modular components to further reduce working distances by allowing miniaturized process modules to be configured near the sample and by manipulating the FIB beam below the tip of the SEM process module of the metrology equipment. Therefore, considering compatibility with other modular features and configurations, the deflection unit 70… Figure 15 The examples should not be interpreted as restrictive. The modular architecture allows the deflection unit to be integrated as part of various process module constructions.

[0082] The present invention can be further illustrated by the following examples.

[0083] In various instances, the modular metrology device may include a modular adapter with a mechanical interface attached to a vacuum chamber housing. The modular adapter may be configured to receive and seal at least one process module. The modular adapter may include at least one process module configured to process samples placed on a sample platform. The modular adapter may include mechanical and / or electrical sockets for each of the at least one process module.

[0084] Generally, for each of at least one process module, the modular adapter may include a socket, or port, or other mounting point where at least one process module can be mounted. At least one process module may extend from the outside of the vacuum chamber into the inside, facing the sample platform. This allows at least one process module to interact with the sample within the vacuum chamber. At least one process module may be hermetically attached to the modular adapter, such that the vacuum chamber housing, the modular adapter, and the at least one process module maintain a sealed environment within the vacuum chamber.

[0085] The mechanical interface between the modular adapter and the vacuum chamber allows for the interchangeability of the modular adapter and / or process modules. Process modules can be fixedly attached or detachably attached via fasteners, and / or alignment guides, and / or electrical connections, and / or vacuum seals. This allows for the reconfiguration of metering equipment using different process modules on interchangeable modular adapters.

[0086] The entire modular adapter assembly with the process module is interchangeable and detachable from the vacuum chamber housing. This allows the complete modular adapter assembly containing the integrated process module to be interchanged as needed to reconfigure the entire metering device. Mechanical interfaces around the vacuum chamber opening make these modular adapter assemblies interchangeable.

[0087] In various instances, modular metering devices may further include mounting mechanisms with mechanical interfaces that allow modular adapters to be detachably and interchangeably attached to the vacuum chamber housing.

[0088] Modular metering devices may include a mounting mechanism as part of a mechanical interface surrounding an opening in the vacuum chamber housing. This mounting mechanism allows the modular adapter to be attached and detached in a removable manner. It should be understood that the corresponding mechanical interface of the modular adapter may also include at least part or all of the mounting mechanism as described.

[0089] For example, the mounting mechanism may include multiple clamps, screws, latches, or other fasteners to securely hold the modular adapter to the vacuum chamber, while also allowing the adapter to be removed and interchanged as needed. The mounting mechanism may also include alignment guides, seals, and connectors to properly orient and integrate the modular adapter into the vacuum chamber housing.

[0090] The ability to disassemble and interchange modular adapters provides the capability for reconfiguring metering equipment. Different modular adapters containing various process modules are interchangeable by using a removable mounting mechanism as part of the mechanical interface. This allows for optimization of the entire system and adaptation to different inspection, metering, or analytical procedures through the interchangeability of modular adapters.

[0091] In various instances, the modular metrology equipment may further include at least one process module encapsulated within a modular adapter, and at least one process module extending from the outside of the vacuum chamber housing toward the sample into the interior of the vacuum chamber housing.

[0092] Modular metering equipment may include at least one process module mounted within and / or surrounded by a modular adapter assembly. When the modular adapter is attached to a vacuum chamber housing, the process module may be enclosed within the adapter so that it does not come into contact with the vacuum chamber housing itself.

[0093] At least one process module extends from the outside of the vacuum chamber, with supporting peripheral devices located inside the chamber toward the sample platform. This allows the process module to interact with or process the sample on the sample platform housed inside the vacuum chamber, and it can be easily interchanged with a modular adapter.

[0094] Multiple process modules can be integrated and enclosed within a specific modular adapter. Different types of process modules can be interchanged by installing alternative modular adapters containing the desired components. This modularity and configurability enable metrology equipment to be optimized for a variety of analytical procedures.

[0095] In various instances, modular metering devices may incorporate mechanical interfaces that include force-fit connections, and / or form-fit connections, and / or material-fit connections. The mechanical interface between the modular adapter and the vacuum chamber housing can utilize various types of connections for secure attachment. For example, a force-fit connection applies mechanical force or pressure between components to achieve a secure connection. This can be implemented using clamps, screws, interference fits, or other components that generate compressive forces between mating components. Form-fit connections utilize shape and surface geometry to achieve a secure connection. This may involve pins, shoulders, lips, flanges, or other interlocking shapes that prevent movement or separation. Material-fit connections utilize chemical or molecular bonds between materials. Examples include forging, welding, or bonding that creates attachment at the material level. Using one or a combination of these mating principles allows for customization of the mechanical interface for leak-proof and robust connections. The connection must maintain vacuum integrity while also allowing for modular flexibility through interchangeable adapters.

[0096] In various instances, mechanical interfaces can utilize snap-fit ​​mounting as a form-fit connection between the modular adapter and the vacuum chamber housing. Snap-fit ​​mounting can use mating components with corresponding indentations and protrusions that interlock when rotated to the engaged position.

[0097] For example, the mechanical interface of a vacuum chamber may have protruding pins or tabs, while a modular adapter has a groove with a mating shape. By aligning the groove of the adapter with the tab of the chamber and then twisting to engage the turn-lock mechanism, the components are pulled together to achieve a secure installation. This allows for quick interchangeability of modular adapters while also establishing a reliable attachment through a vacuum seal. Snap-fit ​​installation is an example of implementation using a specific shape-fitting interface.

[0098] Other examples of form-fit connections may include threaded fittings, grooves, or equivalent geometric couplings that align and interlock vacuum chamber housings and interchangeable modular adapters.

[0099] In various instances, modular metrology equipment may further include at least one process module selected from the group consisting of: scanning electron microscope (SEM), focused ion beam (FIB) system, gas injection system (GIS), energy dispersive X-ray spectroscopy (EDX) detector, secondary electron detector, backscattered electron detector, and infrared camera.

[0100] Modular metering equipment can be configured to house various types of process modules within interchangeable modular adapter assemblies. Examples of integrable process modules include one or more of the following:

[0101] Components of charged particle beam columns (such as lenses, apertures, deflectors, detectors), charged particle columns (such as scanning electron microscopes or focused ion beams, auxiliary detectors) or analytical components (such as gas injection systems, EDX detectors or electron detectors), complementary detector modules (such as infrared cameras).

[0102] This allows metrology equipment to be optimized for different inspection and analysis capabilities by selecting the desired process modules. Modular adapters can be pre-configured with different process tools or analysis sets to adapt the system as needed. By adapting a range of modular interchangeable process modules, metrology equipment provides flexibility and customization for a variety of metrology applications.

[0103] One or more other process modules can be integrated into the modular metrology device, which can be configured to detect, analyze, or measure samples or processing parameters within a vacuum chamber. Some examples include: optical microscopes for providing visual inspection of samples with high resolution and multiple illumination modes; laser scanning microscopes for performing confocal optical imaging and surface profilometry of samples; spectral analysis modules, such as FTIR, Raman, or UV-Vis spectrometers, for chemical characterization and compositional analysis; ellipsomers for measuring optical properties and film thickness; stress measurement sensors for determining residual stress in structures via strain gauges or other techniques; Hall effect sensors for measuring the electrical properties of semiconductor materials; stylus profilometers for delineating surface topography by dragging a fine stylus across a sample; interferometers for measuring changes in position and distance; mass spectrometers for analyzing composition by ionizing and mass-based classification of chemicals; gas analysis modules for measuring partial pressure and detecting leaks using residual gas analyzers; thermal sensors for determining the temperature or heat flow of a sample; and nanomanipulators for precisely positioning and manipulating nanoscale samples. Modular design allows for the integration of any combination of these detectors, sensors, and analytical components into process modules to enable comprehensive sample characterization.

[0104] In various instances, modular metrology equipment may include modular adapters configured to receive two or more (e.g., three or more) different process modules. Modular adapter assemblies can be designed to accommodate multiple process modules simultaneously. By integrating more than one type of process module, the functionality of the metrology equipment can be expanded. For example, a modular adapter may include both scanning electron beam columns and focused ion beam columns. This provides the ability to perform electron and ion beam imaging, ablation, deposition, and other techniques on a single adapter. Additional process modules, such as dedicated detectors, may also be included.

[0105] In various instances, at least one process module includes a scanning electron microscope (SEM). Modular metrology equipment may include a scanning electron microscope (SEM) as one of several interchangeable process modules. The SEM process module may include one or more electron column assemblies, which include an electron source, lenses, deflectors, and detectors to generate a focused electron beam. This electron beam performs a raster scan on the sample surface to build an image and mapping based on the detected signals. Modular adapters may fully incorporate and integrate the SEM column and related components. By interchangeable modular adapters, the SEM can be changed in different spatial configurations as needed, providing flexibility for reconfiguring metrology equipment for electron microscopy analysis. Replacing the modular adapter allows the SEM to be interchanged with other process modules to reconfigure metrology equipment for electron microscopy analysis. The SEM enables high-resolution imaging, metrology, defect detection, and other analytical techniques on samples within a vacuum chamber.

[0106] In various instances, modular metrology equipment may further incorporate modular adapters configured for tilting and orienting the SEM source column relative to the z-axis of the machine coordinate system defined by the default settings of the sample platform. The modular adapters allow the SEM column to tilt or angle at an offset relative to the vertical z-axis of the sample platform. The SEM column can be intentionally offset from the z-axis by a tilt angle, such as 10–30 degrees. This allows the electron beam to strike the sample surface at an angle rather than perpendicularly. The tilting mechanism can utilize a pivoting or linear offset platform integrated into the modular adapter assembly. Tilting the SEM column provides flexibility in beam positioning for angle-resolved imaging, 3D tomography, sidewall imaging, and optimized detection geometry. This allows the electron beam to strike the sample at an angle or side angle rather than perpendicularly to the sample surface. Tilting the column provides flexibility in how the SEM interrogates the sample.

[0107] In various instances, the modular adapter may further comprise at least two process modules, which include a source column for a scanning electron microscope (SEM) and a beam emitter for a focused ion beam (FIB) system. The modular adapter can integrate both the SEM column and the FIB column. This provides combined electron and ion beam capabilities within a single modular construction. The FIB process module may include one or more of an ion source, beam optics, gas injection, and detectors customized for ion beam processing and imaging. The combined SEM and FIB columns allow metrology equipment to perform operations such as high-resolution profiling measurements by combining FIB grinding with SEM imaging. Correlated, multimodal electron and ion beam analysis can be performed using a replaceable, adaptable system for the SEM-FIB modular adapter. This provides combined electron and ion beam capabilities within a single modular construction. For example, the adapter can be replaced between SEM-only, FIB-only, or combined SEM-FIB operations in various and / or different spatial configurations, and combined with other process modules as described above.

[0108] In various examples, modular metrology equipment may further include a laser interferometer system with a reference mirror integrated into a modular adapter, the laser interferometer configured to measure the distance between the modular adapter and a sample platform. The interferometer uses a laser aimed at the reference mirror integrated into the adapter to monitor distance through an interference pattern. The laser interferometer modules can be combined to accurately measure the relative positioning between the modular adapter and the sample platform. This uses the integrated reference mirror to reflect the interferometer laser for distance measurement and positioning control feedback.

[0109] In various instances, modular metrology equipment may further include a reference mirror recessed into a modular adapter relative to at least one process module, wherein the tip of at least one process module has a forward-facing position towards the sample platform. This allows the column to extend forward closer to the sample platform without interfering with the laser path. Since the process modules need to be as close to the sample as possible, recessing the reference mirror eliminates potential obstacles, thereby minimizing the working distance. For example, a recess greater than 5 mm allows unobstructed access to angled or tilted process modules while maintaining positioning reference. The reference mirror can be positioned in the recessed location such that the tip of the process module extends further towards the sample platform. This allows electron / ion columns or other process modules to be positioned as close as possible for maximum flexibility.

[0110] In various instances, modular metrology equipment may further incorporate a scanning electron microscope (SEM) configured with a working distance of less than 5 mm between the tip of the particle source column and the sample platform. Modular adapters can accommodate SEM columns that allow for a smaller working distance between their lower tip and the sample platform, for example, less than 5 mm. This allows the SEM to be positioned close to the sample to improve resolution and beam intensity. Shorter working distances also enable special modes, such as low-voltage scanning for ultra-sensitive imaging. To achieve working distances below 5 mm, the mechanical and electrical designs must avoid collisions and field interactions between the column and platform. Modular adapters provide an integrated solution for positioning the SEM column within these stringent constraints when scanning the sample. The adaptable modular architecture facilitates the use of unconventional, miniaturized SEM constructions.

[0111] In various instances, modular metrology equipment may further incorporate a modular adapter with a turntable shape, including a rotatable structure to allow at least one process module to be variably positioned relative to a sample platform. The modular adapter utilizes a turntable design to allow the process module to rotate around the sample platform. In the turntable construction, the adapter has a rotating section that can pivot to precisely aim at the attached process module. For example, the adapter may include multiple posts or tools at a fixed port around the turntable. By rotating the turntable section, different process modules can be indicated to align with the sample. This allows for variable positioning without disrupting the vacuum. The rotatable turntable provides the flexibility to reorient the process module to approach the sample from different angles. Discrete rotational increments allow for repeatable positioning. This approach enables unconventional geometries while maintaining the modular interchangeability of the adapter.

[0112] In various instances, modular metrology equipment may further include at least one process module that can be translated and / or pivoted relative to a modular adapter via at least one actuator to position the process module relative to a sample platform. The modular adapter allows for the integrated movement of process modules using actuators. These actuators can translate (linearly position) and / or pivot (rotate) the process module relative to the sample platform. For example, the process module can be mounted on a controllable linear slide or rotary table. This enables precise xyz positioning adjustments and / or angular tilting of the column or tool relative to the sample. Actuators can be used to align the process module with calibration targets, optimize working distances, raster scan beams, implement angular positioning, and further customize the geometry between the module and the sample. The modular adapter provides an integrated mechanical structure to incorporate adjustable actuators. This allows for flexible module positioning after the adapter is installed, thereby enhancing modularity and constructability. The actuators extend the range of possible process module orientations.

[0113] In various instances, modular metrology equipment may further incorporate an external deflection unit, which is fixed to a modular adapter and configured to deflect the ion beam of a focused ion beam (FIB) system to adjust the incident angle on the sample platform. The external deflection unit can be integrated into the modular adapter to manipulate the trajectory of the ion beam within the FIB column. This deflection unit is located outside the FIB column itself and provides additional control over the beam angle. For example, the deflection unit can be implemented using one or more charged wires or electromagnetic lenses placed in the beam path. By controlling the voltage or current, the ion beam can be deflected to change its incident angle on the sample platform. This enables variable beam approach angles, alignment with other beams, non-directional grinding, and platform drift compensation. External operation simplifies changes to the ion beam geometry. Fixed integration into the adapter modularizes the deflector along with the FIB column.

[0114] An external deflection unit may include an electromagnetic or electrostatic lens configured to deflect the ion beam of a focused ion beam (FIB) system to adjust the angle of incidence on the sample platform. The external ion beam deflection unit can influence the beam path using a charged electromagnetic lens or an electrostatic deflector. By controlling the lens voltage or current, the trajectory of the focused ion beam can be manipulated and adjusted as needed. This allows the angle at which the beam impacts the sample surface to be controlled, independent of the alignment of the FIB pillars. In various examples, the external deflection unit may include a conductor traversing the ion beam across the focused ion beam (FIB) system to generate a magnetic field that deflects the ion beam, thereby adjusting the angle of incidence on the sample platform. The ion beam deflection unit can use a current-carrying wire or other conductor placed in the beam path to generate the magnetic field. When the charged ion beam passes through this magnetic field, its trajectory will bend according to the electromagnetic right-hand rule. Changing the current in the wire adjusts the ion beam deflection angle and the incidence on the sample platform. The external deflection unit can be configured to deflect the ion beam of a focused ion beam (FIB) system to adjust the incident angle so as to align it with the electron beam of a scanning electron microscope (SEM) at a common incident point on the sample platform. The ion beam deflector can be used to coincide the FIB and SEM beams at the same point on the sample. By deflecting the ion beam, it strikes the sample at the same location as the stationary electron beam. This allows certain dual-beam operations (such as profiling) to be performed without sample movement. Adjustable ion beam deflection allows for flexible alignment of the two beams.

[0115] In various instances, modular metrology equipment may be a charged particle microscope system or a scanning electron microscope (SEM) system; or in some instances, a combined SEM-FIB system that selectively has additional processing modes provided by additional process modules.

[0116] In various examples, the vacuum chamber housing, modular adapter, and at least one process module are mechanically joined to form the sealed internal space of the vacuum chamber. The vacuum chamber housing, adapter, and process module are sealed together to create the vacuum environment required for charged particle beams. The mechanical joints between these removable components form a closed internal space that can be evacuated to achieve the vacuum conditions required for electron beam or ion beam operation, sample inspection, and processing.

[0117] In various instances, the mechanical interface may include a separation mechanism, such as a quick-release mechanism, for the removal and reattachment of the modular adapter. The mechanical interface may incorporate one or more precision alignment features, such as motion mounts or pin or keyed designs, to ensure the repeatability of the modular adapter.

[0118] For example, the mechanical interface can employ a standardized design compatible with various modular adapters, such as a flange design. In various instances, standardized interfaces allow for interchangeability between different adapter constructions without requiring modification of the vacuum chamber housing.

[0119] Modular adapters can be configured to accept and / or hold multiple (i.e., two or more, or three or more) different process modules. For example, they can position multiple process modules relative to each other in a predefined spatial configuration. For example, they can define the relative positions of the process modules to each other. In various instances, the spatial configuration of the process modules can be predetermined by the adapter.

[0120] Modular adapters for metering equipment can be formed as components separate from at least one process module and configured to attach to a mechanical interface of a vacuum chamber. The modular adapter may include a corresponding mechanical interface corresponding to the mechanical interface of the vacuum chamber housing. The mechanical interface may be configured for releasable attachment of the modular adapter. The modular adapter may be configured as an intermediate mechanical component between the mechanical interfaces of one or more process modules and the vacuum chamber housing.

[0121] Mechanical interfaces provide a unified and / or standardized mechanical and / or electrical and / or fluid connection between one or more process modules and the vacuum chamber. For example, one or more process modules can be configured as one or more integrated units within an adapter in a metrology system. In various instances, they can be interchanged integrally via interfaces separated between the modular adapter and the housing. Thus, the integrated design of the adapter allows different analytical tools to be mounted closer than in separate locations on the vacuum chamber housing.

[0122] Different adapters with different constructions and one or more process modules are interchangeable. In various instances, they can utilize the same standardized mechanical and / or sealed interfaces as the vacuum chamber housing. Therefore, switching between different analytical system configurations can be achieved by simply replacing the adapter.

[0123] The modular adapter can be attached to one or more process modules on one side and to a vacuum chamber housing on the other. The modular adapter can surround each of the one or more process modules. The modular adapter provides a vacuum seal as a single interface to the vacuum chamber housing. This eliminates the need to seal each module directly and individually to the housing.

[0124] Although the invention has been shown and described with reference to certain preferred embodiments, equivalents and modifications will be apparent to those skilled in the art upon reading and understanding this specification. The invention includes all such equivalents and modifications and is limited only by the scope of the appended claims.

[0125] To illustrate this, the various examples above have been disclosed, in which the dwell time was adjusted between image acquisition with low SNR and high SNR, respectively. Alternatively or additionally, different imaging parameters affecting SNR, such as particle flux / particle current, can also be adjusted.

Claims

1. A modular metering device, comprising: - Vacuum chamber housing with an opening having a mechanical interface configured to seal and attach a modular adapter; - The sample platform is located inside the vacuum chamber shell; - At least one charged particle scanning system, each of which is configured to scan a corresponding charged particle beam across the sample platform.

2. The modular metering device as described in claim 1, further comprising: - A modular adapter, attached to the mechanical interface, the modular adapter including at least one process module configured to process samples placed on the sample platform.

3. The modular metrology device as claimed in claim 2, wherein the at least one process module includes at least the source column of the at least one charged particle scanning system.

4. The modular metrology device of claim 3, wherein the modular adapter is configured for the tilt orientation of the source column relative to the z-axis of the machine coordinate system defined by the default settings of the sample platform.

5. The modular metering device as claimed in any of the preceding claims, wherein the mechanical interface between the modular adapter and the vacuum chamber housing extends along the periphery of the opening and includes a mounting mechanism to allow the modular adapter to be detachably attached to the vacuum chamber housing.

6. The modular metering device as claimed in any of the preceding claims, wherein the at least one process module is enclosed within the modular adapter, extending from the outside of the vacuum chamber housing to the inside toward the sample.

7. The modular metering device as claimed in any of the preceding claims, wherein the mechanical interface includes a force-fit connection.

8. The modular metrology device as claimed in any of the preceding claims, wherein the at least one process module comprises at least two process modules selected from the group consisting of: scanning electron microscopes (SEM), focused ion beam (FIB) systems, gas injection systems (GIS), energy dispersive X-ray spectroscopy (EDX) detectors, secondary electron detectors, backscattered electron detectors, and infrared cameras.

9. The modular metrology apparatus as claimed in any of the preceding claims, wherein the at least one process module comprises at least two process modules, including a source column for a scanning electron microscope (SEM) and a beam emitter for a focusing pear beam (FIB) system.

10. The modular metrology device as claimed in any of the preceding claims further includes a laser interferometer system having a reference mirror integrated into the modular adapter and configured to measure the distance between the modular adapter and the sample platform, wherein the reference mirror is recessed within the modular adapter relative to the at least one process module, and wherein the tip of the at least one process module has a foremost position facing the sample platform.

11. The modular metering device as claimed in any of the preceding claims, wherein the at least one process module is translatable relative to the modular adapter in a vertical and / or lateral direction by at least one actuator, so as to position the process module relative to the sample platform.

12. The modular metering device as claimed in any of the preceding claims, wherein the at least one process module is pivotable relative to the modular adapter via the at least one actuator, so as to enable angular positioning of the process module relative to the sample platform.

13. The modular metrology device according to any one of claims 9 to 12, further comprising an external deflection unit fixed to the modular adapter and configured to deflect the ion beam of the focused ion beam (FIB) system to adjust the incident angle on the sample platform.

14. The modular metrology device of claim 13, wherein the external deflection unit includes a conductor that passes through the ion beam of the focused ion beam (FIB) system to generate a variable magnetic field that deflects the ion beam to adjust the incident angle on the sample platform.

15. The modular metrology apparatus of any one of claims 13 and 14, wherein the external deflection unit is configured to deflect the ion beam of the focused ion beam (FIB) system to adjust the incident angle to align with the common incident point on the sample platform, similar to the electron beam of a scanning electron microscope (SEM).

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