线束加工用多规格导线定长裁切装置
By adjusting the lifting plate status and the support cleaning mechanism, the problem of unstable positioning for cutting wires of different specifications in the existing device was solved, achieving high-precision and high-efficiency wire cutting with a cutting length error of less than ±0.1mm and a smooth cut without burrs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- FU ZHOU SAMGEL ELECTRONICS CO LTD
- Filing Date
- 2026-05-09
- Publication Date
- 2026-07-17
AI Technical Summary
Existing wire length cutting devices are difficult to adapt to different specifications of wires for cutting and positioning. In particular, thin wires are prone to lateral displacement due to insufficient positioning surface, while thick wires are not firmly clamped due to uneven contact pressure distribution. Axial movement and plastic deformation occur during cutting, resulting in large cutting length errors.
A multi-specification wire length cutting device was designed. The cutting mechanism controls the lifting and lowering of the cutting blade, and the lifting state of the lifting plate changes the depth of the positioning groove. Combined with the support and cleaning mechanism, wires of different specifications are cut to a fixed length, and impurities are cleaned to improve the cutting stability.
It achieves stable cutting of wires of different specifications, improves the cutting length accuracy to ±0.1mm, and has good cut smoothness, avoiding wire deformation and positioning deviation, thus improving the efficiency of wire changeover.
Smart Images
Figure CN122142203B_ABST