Carrying head for wafer processing and chemical mechanical polishing apparatus

Abstract

The embodiment of the present application provides a kind of for wafer processing's bearing head and chemical mechanical polishing equipment, bearing head includes: bearing head main body;Retaining ring, retaining ring is set to the side of bearing head main body towards wafer, and can limit wafer in middle position, retaining ring is equipped with installation hole along its axial through;Anti-skid piece mechanism, anti-skid piece mechanism is at least partially located in installation hole, the anti-skid piece main body of anti-skid piece mechanism includes axially extending lever and the anti-skid component of the end of lever towards polishing unit, lever is located in installation hole, and can reciprocate between first position and second position, anti-skid component blocks wafer.The embodiment of the present application provides a kind of for wafer processing's bearing head and chemical mechanical polishing equipment, can avoid wafer from bearing head and polishing unit between sliding out.

Description

[0001] This application is a divisional application of the invention patent filed on September 26, 2024, with application number 2024113488318 and title "Carrier Head for Wafer Processing and Chemical Mechanical Polishing Equipment". Technical Field

[0002] This application relates to the field of chemical mechanical polishing technology, specifically to a carrier head for wafer processing and a chemical mechanical polishing device. Background Technology

[0003] Chemical Mechanical Polishing (CMP) is an ultra-precision surface finishing technique that achieves global planarization. In CMP, the wafer is typically held in place by the bottom surface of a support head (also called a polishing head), with a retaining ring at the bottom of the support head radially defining the wafer. The side of the wafer to be polished is pressed against the upper surface of the polishing pad in the polishing unit. The support head rotates relative to the polishing pad under the actuation of a drive assembly, applying a downward load to the wafer. Simultaneously, polishing fluid is supplied to the upper surface of the polishing pad and distributed between the wafer and the pad, allowing the wafer to undergo chemical and mechanical polishing through a combination of chemical and mechanical processes. However, sometimes the wafer slips off the support head, leading to wafer damage. Summary of the Invention

[0004] In view of this, embodiments of this application provide a carrier head and chemical mechanical polishing equipment for wafer processing, which can prevent the wafer from slipping out between the carrier head and the polishing unit.

[0005] According to a first aspect of this application, a carrier head for wafer processing is provided, the carrier head comprising: a carrier head body; a retaining ring disposed on the side of the carrier head body facing the wafer and capable of limiting the wafer to a central position, the retaining ring having a mounting hole extending along its axial direction; and an anti-slip plate mechanism, the anti-slip plate mechanism being at least partially located within the mounting hole, the anti-slip plate body of the anti-slip plate mechanism comprising an axially extending rod and an anti-slip component disposed at one end of the rod facing the polishing unit, the rod being located within the mounting hole and capable of reciprocating between a first position and a second position, the anti-slip component blocking the wafer; wherein, when the carrier head abuts the wafer against the polishing unit, the anti-slip plate body retracts into the mounting hole to be in the first position; when the carrier head is axially separated from the polishing unit, the anti-slip plate body extends out from the mounting hole and is in the second position, and the anti-slip component prevents the wafer from sliding out from the gap formed by the separation of the retaining ring and the polishing unit.

[0006] Optionally, the bearing head body has an assembly hole on the side facing the wafer, the assembly hole corresponding to the mounting hole, the anti-slip plate mechanism includes an anti-slip plate seat, one end of the anti-slip plate seat extends into the assembly hole, the other end of the anti-slip plate seat extends into the mounting hole, and the anti-slip plate seat axially passes through the mounting hole, the interior of the anti-slip plate seat has a receiving cavity extending along its axial direction, the receiving cavity has a through hole opposite to the bottom of the bearing head body, the rod is disposed in the receiving cavity, and the anti-slip component can extend out from the through hole.

[0007] Optionally, the mounting hole includes a first hole segment and a second hole segment that are sequentially located away from the bearing head body. The first hole segment is configured to receive the anti-slip pad seat, and the second hole segment corresponds to the through hole and is configured to allow the anti-slip component to pass through.

[0008] Optionally, the rod includes a first rod segment and a second rod segment that are sequentially moved away from the bearing head body. The outer diameter of the second rod segment is larger than the outer diameter of the first rod segment and the inner diameter of the through hole, so that when the anti-slip plate body moves from the first position to the second position, the rod is confined in the receiving cavity by the second rod segment abutting against the through hole. The anti-slip assembly is connected to the lower surface of the second rod segment.

[0009] Optionally, the anti-slip component includes an anti-slip rod segment connected to the lower surface of the second rod segment. The anti-slip rod segment can pass through the through hole and reciprocates between the first position and the second position as the rod moves. When the anti-slip sheet body is in the second position, the anti-slip rod segment extends from the second hole segment to block the wafer.

[0010] Optionally, the lower surface of the retaining ring is provided with a mating groove, and the edge of the mating groove is tangent to the inner diameter of the retaining ring, or the edge of the mating groove protrudes into the inner diameter of the retaining ring and is no more than 1 mm. The second hole segment and the through hole are both connected to the mating groove.

[0011] Optionally, the anti-slip assembly includes an anti-slip rod segment and an anti-slip pin. The anti-slip rod segment is connected to the lower surface of the second rod segment. The anti-slip pin includes a connecting rod segment and an anti-slip plate. The connecting rod segment is disposed on the upper surface of the anti-slip plate and connected to the anti-slip rod segment. When the anti-slip plate body moves from the second position to the first position, the anti-slip pin can move into the mating groove. When the anti-slip plate body moves from the first position to the second position, the anti-slip pin extends out of the mating groove, and the edge of the anti-slip plate abuts against the edge of the wafer to prevent the wafer from sliding out through the gap formed by the separation of the retaining ring and the polishing unit.

[0012] Optionally, the mating groove is a circular groove, the number of the mating grooves corresponds to the number of anti-slip components in the anti-slip plate mechanism, the anti-slip plate is a circular plate structure, and the center of the anti-slip plate coincides with the axis of the anti-slip plate body.

[0013] Optionally, the anti-slip plate mechanism further includes: an elastic element disposed within the receiving cavity and sleeved on the outer periphery of the first rod segment, one end of the elastic element abutting against the side of the bearing head body facing the wafer, and the other end of the elastic element abutting against the upper surface of the second rod end, so as to provide power for the rod to move from the first position to the second position, and to enable the rod to compress the elastic element to retract back into the receiving cavity.

[0014] Optionally, the elastic element includes a spring, which is sleeved on the outer periphery of the first rod segment, with one end of the spring abutting against the side of the bearing head body facing the wafer, and the other end of the spring abutting against the upper surface of the second rod segment.

[0015] Optionally, the anti-slip pad seat includes a first seat section and a second seat section, wherein the first seat section is threadedly connected to the mounting hole.

[0016] Optionally, the bearing head includes a plurality of anti-slip plate mechanisms distributed circumferentially along the retaining ring.

[0017] Optionally, the retaining ring has multiple grooves on its surface facing the polishing unit. The multiple grooves are evenly distributed along the circumference of the retaining ring, and the opening direction of the grooves coincides with the radial direction of the retaining ring. An anti-slip plate mechanism is provided between two adjacent grooves, or two or more anti-slip plate mechanisms are evenly spaced between two adjacent grooves.

[0018] Optionally, the anti-slip component can be made of a first plastic material or stainless steel, wherein the first plastic material includes one or more of polyetheretherketone, polyphenylene sulfide, polyimide, polyethylene terephthalate, and polytetrafluoroethylene.

[0019] Optionally, the elastic element can be made of a second plastic material, which includes one or more of polyamide, polyetheretherketone, or polytetrafluoroethylene.

[0020] According to a second aspect of this application, a chemical mechanical polishing apparatus is provided, the chemical mechanical polishing apparatus including the bearing head described in the first aspect above.

[0021] According to the embodiments of this application, a carrier head and chemical mechanical polishing (CMP) equipment for wafer processing are provided. By opening a mounting hole in the retaining ring and setting an anti-slip plate mechanism that can reciprocate between a first position and a second position within the mounting hole, the anti-slip plate mechanism can move into the mounting hole when the carrier head abuts against the polishing unit, ensuring that the lower surface of the retaining ring can stably adhere to the polishing unit. When a gap appears between the retaining ring and the polishing unit, the anti-slip plate mechanism can extend from below the retaining ring, thereby preventing the wafer from sliding out of the gap between the retaining ring and the polishing unit. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings.

[0023] Figure 1 This is a schematic diagram of a chemical mechanical polishing apparatus according to one embodiment of the second direction of this application;

[0024] Figure 2 A cross-sectional view of a chemical mechanical polishing device;

[0025] Figure 3 for Figure 2 Enlarged view of point A in the middle;

[0026] Figure 4 This is a cross-sectional view of an embodiment of the bearing head according to the first aspect of this application, in which the anti-slip sheet body is located in the first position;

[0027] Figure 5 for Figure 4 Enlarged view of point B in the image;

[0028] Figure 6 This is a cross-sectional view of an embodiment of the bearing head according to the first aspect of this application, in which the anti-slip sheet body is located in the second position;

[0029] Figure 7 for Figure 6 Enlarged view of point C in the image;

[0030] Figure 8 This is a cross-sectional view of another embodiment of the bearing head according to the first aspect of this application, in which the anti-slip sheet body is located in the first position;

[0031] Figure 9 for Figure 8 Enlarged view of point D in the image;

[0032] Figure 10This is a cross-sectional view of another embodiment of the bearing head according to the first aspect of this application, in which the anti-slip sheet body is located in the second position;

[0033] Figure 11 for Figure 10 Enlarged view of point E in the image;

[0034] Figure 12 for Figure 4 A bottom view of the retaining ring of the bearing head in the diagram.

[0035] Explanation of reference numerals in the attached figures:

[0036] Chemical mechanical polishing equipment 1000;

[0037] Polishing unit 1100; bearing head 100; polishing pad 200; polishing disc 300; dressing device 400; liquid supply unit 500;

[0038] The main body of the bearing head is 110;

[0039] Gas distribution base 111; main base 112; connecting flange 113; bearing plate 114;

[0040] First cover plate 1151; Second cover plate 1152; Elastic membrane 116; Diaphragm 117; Pressure ring 118; Assembly hole 1101;

[0041] Retaining ring 120; mounting hole 121; first hole section 1211; second hole section 1212; groove 122; mating groove 123;

[0042] Anti-slip plate mechanism 130; anti-slip plate seat 131; first seat section 131a; second seat section 131b;

[0043] Receiving cavity 1311; Through hole 1312;

[0044] Anti-slip plate body 132; rod 1321; first rod segment 1321a; second rod segment 1321b;

[0045] Anti-slip component 1322; anti-slip rod section 1322a; anti-slip top pin 1322b; elastic element 133;

[0046] Wafer W; Axis Ax. Detailed Implementation

[0047] To enable those skilled in the art to better understand the technical solutions in the embodiments of this application, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art should fall within the protection scope of the embodiments of this application.

[0048] In the description of this application, it should be understood that the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0049] In addition, in the description of this application, unless otherwise specified and limited, it should be noted that the terms "installation", "connection" and "linking" should be interpreted broadly. For example, they can refer to mechanical or electrical connections, or internal connections between two components. They can be direct connections or indirect connections through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms according to the specific circumstances.

[0050] As mentioned earlier, Chemical Mechanical Planarization (CMP) is an ultra-precision surface processing technique for global planarization. CMP typically involves holding the wafer against the bottom surface of a support head (also called a polishing head), with a retaining ring at the bottom of the support head radially defining the wafer. The side of the wafer to be polished is pressed against the upper surface of a polishing pad. The support head rotates relative to the polishing pad under the actuation of a drive assembly, applying a downward load to the wafer. Simultaneously, polishing fluid is supplied to the upper surface of the polishing pad and distributed between the wafer and the pad, allowing the wafer to undergo chemical mechanical polishing through a combination of chemical and mechanical processes. However, sometimes the wafer slips off the support head, resulting in wafer damage. Therefore, to avoid these problems and reduce wafer scrap rates, this application presents a support head and a CMP device for wafer processing.

[0051] The following will first introduce how... Figure 1 As shown, the chemical mechanical polishing apparatus 1000 according to the second aspect of this application.

[0052] In some embodiments of the present invention, the chemical mechanical polishing apparatus 1000 may include a support head 100. Furthermore, the chemical mechanical polishing apparatus 1000 may also include a polishing unit 1100, a dresser 400, and a liquid supply unit 500. The polishing unit 1100 may specifically include a polishing disc 300 and a polishing pad 200. The polishing pad 200 is disposed on the upper surface of the polishing disc 300 and rotates together with it along an axis Ax. The axis Ax is as follows... Figure 1 As shown in the diagram. The carrier head 100 is horizontally movable and positioned above the polishing pad 200. The lower surface of the carrier head 100 can hold the wafer W to be polished. The dresser 400 includes a dresser arm and a dresser head, which are disposed on one side of the polishing disk 300. The dresser arm drives the rotating dresser head to swing and dress the surface of the polishing pad 200. The liquid supply unit 500 is disposed above the polishing pad 200 to distribute the polishing liquid onto the surface of the polishing pad 200.

[0053] like Figure 2 As shown, a cross-sectional view of a chemical mechanical polishing apparatus 1000 is presented. Figure 3 for Figure 2 Enlarged view at point A. It shows the carrier head 100, polishing unit 1100, and wafer W.

[0054] To control the edge removal rate of wafer W, the pressure of the retaining ring 120 of the carrier head 100 can be adjusted, thereby causing localized deformation of the polishing pad 200. For example... Figure 2 and Figure 3 As shown, the wafer slides out from the gap between the support head 100 and the polishing unit 1100. During wafer polishing, the pressure of the retaining ring 120 usually needs to be adjusted. When the pressure of the retaining ring 120 is too low, the retaining ring 120 may partially separate axially from the polishing unit 1100, causing the wafer W to slide out from the support head 100. To prevent slippage, the pressure of the retaining ring 120 can be increased, i.e., the wafer W is pressed onto the polishing unit 1100 by increasing the pressure of the retaining ring 120. Due to the increased pressure, the friction between the retaining ring 120 and the polishing pad 200 increases, which can easily aggravate the glazing of the polishing pad 200 (i.e., the surface of the polishing pad becomes smooth), making it easier for the wafer W to slide out. Furthermore, there is significant friction between the retaining ring 120 and the polishing pad 200, as well as between the wafer W and the polishing pad 200, which can cause the support head 100 to deflect slightly, creating a gap between the retaining ring 120 and the polishing unit 1100, thus causing the wafer to slide out from the support head. This shows that the pressure control range of the retaining ring is relatively small, and the control is quite difficult.

[0055] To solve one or more of the above problems, Figure 4 A cross-sectional view of a carrier head 100 for wafer fabrication according to a second aspect of this application is shown, which can be used for Figure 1The chemical mechanical polishing equipment 1000 shown is included.

[0056] The following is in conjunction with the instruction manual appendix. Figures 4-12 The carrier head 100 for wafer W processing according to an embodiment of this application is described in detail.

[0057] According to the first aspect of this application, a carrier head 100 for processing wafer W is used to confine the wafer W between the carrier head 100 and the polishing unit 1100 when processing the wafer W, thereby preventing the wafer W from slipping out of the gap and breaking when a gap occurs between the carrier head 100 and the polishing unit 1100.

[0058] like Figure 4 The bearing head 100 mainly includes a bearing head body 110, a retaining ring 120, and an anti-slip plate mechanism 130. The bearing head body 110 has the ability to adsorb the wafer W. The bearing head body 110 may also include a gas distribution substrate 111, a main substrate 112, a connecting flange 113 for connection, a bearing plate 114, a first cover plate 1151, a second cover plate 1152, and an elastic membrane 116. The gas distribution substrate 111 is connected to the main substrate 112 through a diaphragm 117, and the elastic membrane 116 is connected to the bottom of the bearing plate 114 through a pressure ring 118. The retaining ring 120 is located on the side of the bearing head body 110 facing the wafer W, i.e. Figure 4 The bearing head body 110 is located on the lower side. A retaining ring 120 is disposed around the outer periphery of an elastic membrane 116, which carries the wafer W and presses the wafer W against the polishing pad 200 of the polishing unit 1100. The retaining ring 120 radially confines the wafer W therein and, together with the wafer W, abuts against the polishing pad 200 for polishing. The retaining ring 120 is constructed with an axially through mounting hole 121.

[0059] The retaining ring 120 has a mounting hole 121 extending along its axial direction, such as... Figure 5 , Figure 7 , Figure 9 and Figure 11 As shown, the axial direction of the retaining ring 120 is its vertical axis L1. The anti-slip mechanism 130 is at least partially located within the mounting hole 121, and the anti-slip body 132 of the anti-slip mechanism 130 is capable of reciprocating between a first position and a second position within the mounting hole 121 along the axial direction of the mounting hole 121. Therefore, it can be understood that the anti-slip mechanism 130 is capable of reciprocating in the vertical direction within the mounting hole 121, wherein the anti-slip mechanism 130 has two positions, namely the first position and the second position.

[0060] Furthermore, such as Figure 7 and Figure 11As shown, the anti-slip plate mechanism 130 includes an axially extending rod 1321 and an anti-slip assembly 1322 disposed at one end of the rod 1321 facing the polishing unit 1100. The rod 1321 contacts the polishing unit 1100 through the anti-slip assembly 1322. The rod 1321 is located within the mounting hole 121 and can reciprocate between a first position and a second position. When the anti-slip plate body 132 is in the second position, it blocks the wafer W through the anti-slip assembly 1322.

[0061] Specifically, when a gap appears between the lower surface of the support head 100, i.e., the lower surface of the retaining ring 120, and the polishing unit 1100, the anti-slip component 1322 can move from the first position to the second position, thereby blocking the wafer W and preventing the wafer W from sliding out. That is, a limiting structure is formed at the position where a gap appears between the lower surface of the retaining ring 120 and the polishing unit 1100.

[0062] Among them, such as Figure 5 and Figure 9 As shown, when the carrier head presses the wafer W against the polishing unit 1100, the anti-slip plate body 132 retracts into the mounting hole 121 to be in the first position. This allows the lower surface of the carrier head 100 to fit against the polishing unit 1100, ensuring the polishing effect on the wafer W.

[0063] like Figure 7 and Figure 11 As shown, when the support head 100 is slightly tilted and the retaining ring 120 of the support head 100 is slightly separated axially from the polishing unit 1100, the wafer W tends to slide radially out of the retaining ring 120. The anti-slip plate body 132 extends out of the mounting hole 121 and is in a second position, and prevents the wafer W from sliding out of the gap formed by the separation of the retaining ring 120 and the polishing unit 1100 through the anti-slip component 1322. This avoids the wafer W from breaking after sliding out, reducing the scrap rate of the wafer W.

[0064] According to the embodiments of this application, the carrier head 100 and chemical mechanical polishing equipment 1000 for wafer W processing include a mounting hole 121 on a retaining ring 120, and an anti-slip mechanism 130 that can reciprocate between a first position and a second position is provided within the mounting hole 121. This ensures that when the carrier head 100 abuts against the polishing unit, the anti-slip mechanism 130 moves into the mounting hole 121, guaranteeing a stable fit between the lower surface of the retaining ring 120 and the polishing unit 1100. When a gap appears between the retaining ring 120 and the polishing unit 1100, the anti-slip mechanism 130 extends from below the retaining ring 120, thereby preventing the wafer W from sliding out through the gap between the retaining ring 120 and the polishing unit 1100.

[0065] like Figure 5 , Figure 7 , Figure 9 and Figure 11 As shown, the support head body 110 has a mounting hole 1101 on the side facing the wafer W. The mounting hole 1101 corresponds to the mounting hole 121. Therefore, after the support head body 110 is connected to the retaining ring 120, the mounting hole 1101 and the mounting hole 121 are in the same position and can communicate with each other. The anti-slip plate mechanism 130 includes an anti-slip plate seat 131. One end of the anti-slip plate seat 131 extends into the mounting hole 1101, and the other end of the anti-slip plate seat 131 extends into the mounting hole 121 and axially passes through the mounting hole 121. Thus, the anti-slip plate seat 131 can serve as an intermediate connecting rod 1321 for the two to connect. In other words, the anti-slip plate seat 131, as an intermediate connecting member, can connect to the support head body 110 and the retaining ring 120 at both ends respectively.

[0066] The anti-slip plate holder 131 has an axially extending receiving cavity 1311 inside. The bottom of the receiving cavity 1311, facing away from the support head body 110, has a through hole 1312, that is, the bottom wall of the anti-slip plate holder 131 has a through hole 1312. The rod 1321 is disposed in the receiving cavity 1311, and the anti-slip component 1322 can extend out of the through hole 1312, thereby enabling the anti-slip component 1322 to limit the position of the wafer W.

[0067] like Figure 5 , Figure 7 , Figure 9 and Figure 11 As shown, the mounting hole 121 includes a first hole segment 1211 and a second hole segment 1212 that are sequentially located away from the carrier head body 110. That is, the mounting hole 121 includes two connected hole segments, with the first hole segment 1211 located above the second hole segment 1212. The first hole segment 1211 is configured to accommodate the anti-slip plate holder 131, ensuring the stability of the anti-slip plate holder 131's position. The second hole segment 1212 corresponds to the through hole 1312 and is configured to allow the anti-slip component 1322 to pass through. Therefore, it can be understood that the anti-slip component 1322 can pass through the through hole 1312 and extend through the second hole segment 1212 to limit the wafer W.

[0068] like Figure 5 , Figure 7 , Figure 9 and Figure 11As shown, the rod 1321 includes a first rod segment 1321a and a second rod segment 1321b that are sequentially moved away from the bearing head body 110. That is, the rod 1321 includes two structural segments, wherein the first rod segment 1321a is closer to the bearing head body 110 than the second rod segment 1321b. Furthermore, the outer diameter of the second rod segment 1321b is larger than the outer diameter of the first rod segment 1321a and the inner diameter of the through hole 1312, so that when the anti-slip plate body 132 moves from the first position to the second position, the rod 1321 is confined in the receiving cavity 1311 by the second rod segment 1321b abutting against the through hole 1312.

[0069] In other words, such as Figure 5 , Figure 7 , Figure 9 and Figure 11 As shown, compared with the first segment 1321a, the second segment 1321b is thicker and its radial dimension is larger than that of the through hole 1312. This allows the second segment 1321b to abut against the through hole 1312, thus confining the rod 1321 inside the receiving cavity 1311 and preventing the rod 1321 from coming out of the through hole 1312 in the receiving cavity 1311. It also limits the amplitude and distance of the movement of the anti-slip plate body 132 from the first position to the second position.

[0070] Furthermore, the anti-slip component 1322 is connected to the lower surface of the second rod segment 1321b. Therefore, the distance by which the anti-slip component 1322 extends from the lower surface of the retaining ring 120 can be limited by the abutment between the second rod segment 1321b and the through hole 1312.

[0071] In some embodiments of the present invention, such as Figures 4-7 As shown, the anti-slip component 1322 includes an anti-slip rod segment 1322a, which is connected to the lower surface of the second rod segment 1321b. The anti-slip rod segment 1322a can pass through the through hole 1312 and reciprocates between the first and second positions with the rod 1321. Therefore, it can be understood that the outer diameter of the anti-slip rod segment 1322a is smaller than the outer diameter of the second rod segment 1321b, and it can pass through the through hole 1312.

[0072] When the anti-slip plate body 132 is in the second position, the anti-slip rod segment 1322a extends from the second hole segment 1212 to block the wafer W. Figure 4 As shown, when the bearing head 100 and the polishing unit 1100 come into contact, the anti-slip sheet body 132 then... Figure 5 As shown, it is fully retracted into the receiving cavity 1311 and the second hole segment 1212 of the mounting hole 121. Figure 6 As shown, when a gap appears between the bearing head 100 and the polishing unit 1100, the anti-slip sheet body 132 is as follows. Figure 7 As shown, the wafer moves from the first position to the second position, and the anti-slip rod segment 1322a extends from the small surface of the retaining ring 120 to abut against the upper surface of the polishing unit 1100, thereby preventing the wafer W from sliding out of this position.

[0073] In some embodiments of the present invention, such as Figures 8-11 As shown, a mating groove 123 is provided on the lower surface of the retaining ring 120, and the edge of the mating groove 123 is tangent to the inner diameter of the retaining ring 120, or the edge of the mating groove 123 protrudes into the inner diameter of the retaining ring 120 by no more than 1 mm. The second hole section 1212 and the through hole 1312 are both connected to the mating groove 123, wherein the mating groove 123 is specifically as follows: Figure 9 and Figure 11 As shown.

[0074] Specifically, the mating groove 123 is formed on the lower surface of the retaining ring 120, and the inner diameter of the mating groove 123 is tangent to the retaining ring 120, that is, there is a tangent point between the edge of the mating groove 123 and the wall surface of the inner diameter of the retaining ring 120. When the wafer W slides out, the anti-slip pin 1322b can abut against the wafer W at this position. Alternatively, the edge of the mating groove 123 protrudes into the inner diameter of the retaining ring 120 by no more than 1 mm, that is, the mating groove 123 communicates with the space inside the retaining ring 120 through the wall surface where the inner diameter of the retaining ring 120 is located. Thus, when the wafer W slides out, the anti-slip pin 1322b can abut against the wafer W at this position.

[0075] In some embodiments of the present invention, such as Figures 8-11 As shown, the anti-slip assembly 1322 includes an anti-slip rod segment 1322a and an anti-slip top pin 1322b. The anti-slip rod segment 1322a is connected to the lower surface of the second rod segment 1321b. The anti-slip rod segment 1322a can pass through the through hole 1312 and reciprocates between a first position and a second position with the rod 1321. Therefore, it can be understood that the outer diameter of the anti-slip rod segment 1322a is smaller than the outer diameter of the second rod segment 1321b, and it can pass through the through hole 1312.

[0076] The anti-slip pin 1322b includes a connecting rod segment and an anti-slip plate. The connecting rod segment is disposed on the upper surface of the anti-slip plate and connected to the anti-slip rod segment 1322a. The anti-slip plate abuts against the edge of the wafer W. This allows the anti-slip plate to consistently limit the wafer W by abutting against its edge, thus better preventing the wafer W from slipping out.

[0077] like Figure 9 and Figure 11As shown, the contact point between the anti-slip plate and the edge of the wafer W is located within the inner diameter of the retaining ring 120, thereby confining the wafer W to the central region of the retaining ring 120 by the edge of the anti-slip plate. Alternatively, the contact point between the anti-slip plate and the edge of the wafer W is on the same vertical plane as the inner diameter of the retaining ring 120, thereby confining the position of the wafer W within the space inside the retaining ring 120 by the anti-slip plate.

[0078] When the anti-slip plate body 132 moves from the second position to the first position, the anti-slip top pin 1322b can move into the mating groove 123. Figure 8 and Figure 9 As shown, since the lower surface of the retaining ring 120 has a mating groove 123, and the inner wall of the mating groove 123 is an open structure, when the bearing head 100 and the polishing unit 1100 are in contact, the anti-slip pin 1322b can move from the second position to the first position and enter the area inside the mating groove 123. When the anti-slip plate body 132 moves from the first position to the second position, the anti-slip pin 1322b extends out from the mating groove 123, and the edge of the anti-slip plate abuts against the edge of the wafer W to prevent the wafer W from sliding out through the gap formed by the separation of the retaining ring 120 and the polishing unit 1100. That is, when a gap appears between the bearing head 100 and the polishing unit 1100, such as Figure 10 and Figure 11 As shown, the anti-slip top pin 1322b can move from the first position to the second position, restricting the wafer W from sliding out from here.

[0079] Combination Figures 8-11 As shown, by creating a mating groove 123 below the retaining ring 120, the anti-slip component 1322 can always abut against the edge of the wafer W, thereby stably confining the wafer W to the central region of the retaining ring 120 and preventing the wafer W from slipping out and ending up below the retaining ring 120. In other words, while preventing the wafer W from slipping out, even after being blocked and confined, the wafer W still remains at least partially located directly below the retaining ring 120. This prevents the polishing of the wafer W from proceeding smoothly.

[0080] It should be noted that the anti-slip component 1322 can be made of a first plastic material, that is, both the anti-slip rod segment 1322a and the anti-slip pin 1322b can be made of the first plastic material. The first plastic material may include one or more of the following: polyetheretherketone (PEEK), polyphenylene sulfide (PPS), polyimide (PAI), polyethylene terephthalate (PET-P), and polytetrafluoroethylene (PTFE). These plastic materials have good wear resistance and chemical corrosion resistance, which helps to reduce the wear and chemical corrosion of the anti-slip rod segment 1322a and the anti-slip pin 1322b, and ensure the service life of the anti-slip rod segment 1322a and the anti-slip pin 1322b.

[0081] Furthermore, the rod 1321 may also be made of the same or different plastic material as the anti-slip rod segment 1322a and the anti-slip pin 1322b. For example, the rod 1321 may be made of polyetheretherketone (PEEK) or polyphenylene sulfide (PPS). The anti-slip rod segment 1322a and the anti-slip pin 1322b may also be made of the same material.

[0082] In addition, the anti-slip component 1322 can also be made of stainless steel. That is, the anti-slip rod section 1322a and the anti-slip top pin 1322b can be made of stainless steel, thereby ensuring their rigidity.

[0083] In some embodiments of the present invention, the mating groove 123 is a circular groove, and the number of mating grooves 123 corresponds to the number of anti-slip components 1322 in the anti-slip plate mechanism 130. The anti-slip plate is a circular plate structure, and the center of the anti-slip plate coincides with the axis of the anti-slip plate body 132. Thus, the anti-slip plate can more stably abut against the edge of the wafer W.

[0084] In some embodiments of the present invention, such as Figure 5 , Figure 7 , Figure 9 and Figure 11 As shown, the anti-slip plate mechanism 130 also includes an elastic element 133. The elastic element 133 is disposed within the receiving cavity 1311 and sleeved on the outer periphery of the first rod segment 1321a. One end of the elastic element 133 abuts against the side of the bearing head body 110 facing the wafer W, and the other end abuts against the upper surface of the second rod end, thus providing power for the rod 1321 to move from the first position to the second position, and enabling the rod 1321 to compress the elastic element 133 to retract into the receiving cavity 1311. In other words, the elastic element 133, as the power structure for the reciprocating motion of the rod 1321 between the first and second positions, can receive pressure and contract, thereby moving the rod 1321 from the second position to the first position. Similarly, when the external pressure disappears, the elastic force of the elastic element 133 can cause the rod 1321 to move from the first position to the second position.

[0085] The elastic element 133 includes a spring, which is sleeved on the outer periphery of the first rod segment 1321a. One end of the spring abuts against the side of the bearing head body 110 facing the wafer W, and the other end of the spring abuts against the upper surface of the second rod segment 1321b. Specifically, the elastic element 133 can be a spring, which is low in cost and easy to use.

[0086] Furthermore, the elastic element 133 can be made of a second plastic material, which may include one or more of, for example, polyamide (PA, commonly known as nylon), polyetheretherketone (PEEK), or polytetrafluoroethylene (PTFE). Making the elastic element 133 of the second plastic material reduces the chemical corrosion it is subjected to, ensures the stability of its elastic properties, and thus guarantees the effectiveness of its elastic action. This allows the anti-slip mechanism 130 to perform the anti-slip operation in a timely and effective manner, preventing the wafer W from slipping out. The first and second plastic materials can be the same or different. The spring mentioned above can be made using one or more of the aforementioned second plastic materials.

[0087] The invention is not limited thereto; the elastic element 133 can also be a damper. This allows it to elastically abut against the bearing head body 110, thus enabling axial expansion and contraction to retract into the mounting hole 121 when the retaining ring 120 abuts against the polishing unit.

[0088] Similarly, in the selection of materials for the anti-slip component 1322, a corrosion-resistant material can be used. Alternatively, the entire anti-slip plate mechanism 130 can be made of a corrosion-resistant material to reduce the corrosion of the anti-slip plate mechanism 130 by the polishing fluid.

[0089] In some embodiments of the present invention, such as Figure 5 , Figure 7 , Figure 9 and Figure 11 As shown, the anti-slip plate seat 131 includes a first seat section 131a and a second seat section 131b. The first seat section 131a is threadedly connected to the mounting hole 1101, which can ensure a stable connection between the anti-slip plate seat 131 and the bearing head body 110. The outer diameter of the first seat section 131a can be larger than the outer diameter of the second seat section 131b. At the joint, due to the difference in their outer diameters, a chamfer transition can be used to create a smooth connection, thereby avoiding significant stress concentration at this point and improving structural strength.

[0090] In some embodiments of the invention, the bearing head 100 includes a plurality of anti-slip plate mechanisms 130 distributed circumferentially along the retaining ring 120. For example... Figure 12 The diagram shown is a bottom view of the retaining ring 120 of the carrier head 100, illustrating a plurality of anti-slip plate mechanisms 130 distributed circumferentially along the retaining ring 120. These anti-slip plate mechanisms 130 surround the outer periphery of the wafer W, restricting the position of the wafer W in multiple directions. This ensures that the wafer W is contained in multiple directions, thereby preventing it from slipping out in any direction.

[0091] like Figure 12As shown, the retaining ring 120 has multiple grooves 122 on its surface facing the polishing unit. Each groove 122 is a recess formed on the lower surface of the retaining ring 120 facing upwards. The multiple grooves 122 are evenly distributed along the circumference of the retaining ring 120, and the direction of each groove 122 coincides with the radial direction of the retaining ring 120; that is, the direction of the grooves 122 is radially arranged along the retaining ring 120. Figure 12 As shown, the trench 122 penetrates the inner and outer sides of the retaining ring 120 radially, thereby forming a connection between the inner and outer regions of the retaining ring 120, which allows polishing fluid or debris generated during wafer W polishing to flow into or out of the retaining ring 120.

[0092] And, as Figure 12 As shown, an anti-slip plate mechanism 130 is provided between two adjacent grooves 122, or two or more anti-slip plate mechanisms 130 are provided at uniform intervals between two adjacent grooves 122, that is, the number of anti-slip plate mechanisms 130 can be an integer multiple of the number of grooves 122.

[0093] The above embodiments are only used to illustrate the embodiments of this application, and are not intended to limit the embodiments of this application. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the embodiments of this application. Therefore, all equivalent technical solutions also fall within the scope of the embodiments of this application, and the patent protection scope of the embodiments of this application should be defined by the claims.

Claims

1. A chemical mechanical polishing device, characterized in that, include: The polishing unit includes a polishing disc and a polishing pad placed on the upper surface of the polishing disc; The carrier head, whose lower surface adsorbs the wafer, includes a carrier head body, a retaining ring for wafer positioning, and an anti-slip plate mechanism; Chemical mechanical polishing equipment can adjust the pressure of the retaining ring to cause local deformation of the polishing pad, thereby controlling the removal rate of the wafer edge; The retaining ring has a mounting hole extending through it along its axial direction; the anti-slip mechanism is at least partially located within the mounting hole and includes an anti-slip body; the anti-slip body includes an axially extending rod and an anti-slip component located at one end of the rod facing the polishing unit, and is capable of reciprocating along the axial direction of the mounting hole; when the bearing head abuts the wafer against the polishing unit, the anti-slip body retracts into the mounting hole; when the bearing head separates axially from the polishing unit, the anti-slip body extends out of the mounting hole and, through the anti-slip component, prevents the wafer from sliding out of the gap formed by the separation of the retaining ring and the polishing unit; The anti-slip assembly includes an anti-slip top pin; a mating groove is provided on the lower surface of the retaining ring, the edge of the mating groove being tangent to the inner diameter of the retaining ring. When the wafer slides out, the anti-slip top pin can abut against the wafer at the tangent point, or the edge of the mating groove can protrude into the inner diameter of the retaining ring, so that when the wafer slides out, the anti-slip top pin can abut against the wafer inside the inner diameter of the retaining ring, thus preventing the wafer from being blocked from sliding out and still remaining at least partially below the retaining ring.

2. The chemical mechanical polishing equipment according to claim 1, characterized in that, It also includes a dressing device and a liquid supply unit; the dressing device includes a dressing arm and a dressing head, which are disposed on one side of the polishing pad, and the dressing arm drives the rotating dressing head to swing to dress the surface of the polishing pad; the liquid supply unit is disposed above the polishing pad to distribute the polishing liquid on the surface of the polishing pad.

3. The chemical mechanical polishing equipment according to claim 1, characterized in that, The main body of the carrier head has an assembly hole on the side facing the wafer, and the assembly hole corresponds to the mounting hole. The anti-slip plate mechanism includes an anti-slip plate seat, one end of which extends into the assembly hole and the other end of which extends into the mounting hole and axially passes through the mounting hole. The interior of the anti-slip plate seat has a receiving cavity extending along its axial direction. The receiving cavity has a through hole on the bottom of the carrier head body, and the rod is disposed in the receiving cavity. The anti-slip component can extend out of the through hole.

4. The chemical mechanical polishing equipment according to claim 3, characterized in that, The mounting hole includes a first hole segment and a second hole segment that are sequentially located away from the main body of the bearing head. The first hole segment is configured to accommodate the anti-slip pad seat, and the second hole segment corresponds to the through hole and is configured to allow the anti-slip component to pass through.

5. The chemical mechanical polishing equipment according to claim 4, characterized in that, The rod includes a first rod segment and a second rod segment that are sequentially moved away from the main body of the bearing head. The outer diameter of the second rod segment is larger than the outer diameter of the first rod segment and the inner diameter of the through hole, so that when the anti-slip plate body moves from a first position retracted into the mounting hole to a second position extended from the mounting hole, the rod is confined in the receiving cavity by the second rod segment abutting against the through hole. The anti-slip assembly is connected to the lower surface of the second rod segment.

6. The chemical mechanical polishing equipment according to claim 5, characterized in that, The anti-slip component includes an anti-slip rod segment and an anti-slip top pin. The anti-slip rod segment is connected to the lower surface of the second rod segment. The anti-slip top pin includes a connecting rod segment and an anti-slip plate. The connecting rod segment is disposed on the upper surface of the anti-slip plate and connected to the anti-slip rod segment. When the anti-slip plate body moves from the second position to the first position, the anti-slip top pin can move into the mating groove; When the anti-slip plate body moves from the first position to the second position, the anti-slip top pin extends out from the mating groove, and the edge of the anti-slip plate abuts against the edge of the wafer to prevent the wafer from sliding out through the gap formed by the separation of the retaining ring and the polishing unit.

7. The chemical mechanical polishing equipment according to claim 6, characterized in that, The mating groove is a circular groove, and the number of the mating grooves corresponds to the number of anti-slip components in the anti-slip plate mechanism. The anti-slip plate is a circular plate structure, and the center of the anti-slip plate coincides with the axis of the anti-slip plate body.

8. The chemical mechanical polishing equipment according to claim 1, characterized in that, The anti-slip plate mechanism also includes an elastic element, which is located in the receiving cavity of the anti-slip plate seat and sleeved on the outer periphery of the first rod segment of the rod. One end of the elastic element abuts against the side of the bearing head body facing the wafer, and the other end abuts against the upper surface of the second rod segment, so as to serve as the power structure for reciprocating motion.

9. The chemical mechanical polishing apparatus according to any one of claims 1-8, characterized in that, The bearing head includes a plurality of anti-slip plate mechanisms distributed circumferentially along the retaining ring.

10. The chemical mechanical polishing apparatus according to claim 9, characterized in that, The retaining ring has multiple grooves on its surface facing the polishing unit. The multiple grooves are evenly distributed along the circumference of the retaining ring, and the direction of the grooves coincides with the radial direction of the retaining ring. An anti-slip plate mechanism is provided between two adjacent grooves, or two or more anti-slip plate mechanisms are evenly spaced between two adjacent grooves.

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