High modulus glass, protective film, cover plate layer, display module and electronic device
By adjusting the glass composition and processing methods, the elastic modulus of the glass was improved, solving the problem of insufficient stiffness in existing glass and enabling the application of high-stiffness and high-toughness glass, suitable for the housing of electronic devices and the cover layer of display modules.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- HUAWEI TECH CO LTD
- Filing Date
- 2024-12-05
- Publication Date
- 2026-06-05
AI Technical Summary
The low elastic modulus of existing glass results in the glass structure's stiffness failing to meet usage requirements, especially in flexible display modules where creases and poor flatness are prone to occur.
By limiting the specific components and contents of the glass, especially the molar percentages of SiO2, Al2O3, Y2O3, ZrO2, TiO2, etc., the elastic modulus of the glass can be increased. Furthermore, by adding components such as B2O3 and K2O, the fracture toughness can be improved, and ion exchange strengthening treatment can be carried out to form a glass with high stiffness.
The elastic modulus of the glass was increased to over 130 GPa, which enhanced the rigidity of the glass structure, improved the flatness and impact resistance of the flexible display module, and reduced the visibility of creases.
Smart Images

Figure CN122145033A_ABST