一种含有嵌入式Fe3O4 / BN复合填料的导热环氧树脂膜、该复合填料及应用
By embedding Fe3O4/BN composite filler in boron nitride sheets and using magnetic field-induced orientation, the problem of insufficient vertical thermal conductivity of boron nitride in polymer-based thermal conductive materials is solved, achieving high-efficiency thermal conductivity and stable dielectric properties, making it suitable for heat dissipation of high-power electronic devices.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- 南京红太阳医药研究院有限公司
- Filing Date
- 2026-05-08
- Publication Date
- 2026-07-17
AI Technical Summary
Among existing polymer-based thermally conductive materials, boron nitride has a vertical thermal conductivity (out-of-plane thermal conductivity) that is much lower than its in-plane thermal conductivity. Furthermore, magnetic field induction technology is insufficient in terms of orientation capability and stability, making it difficult to balance magnetic responsiveness and thermal conductivity.
By preparing embedded Fe3O4/BN composite fillers, Fe/Fe3C particles are embedded in boron nitride sheets through high-temperature pyrolysis and oxidation treatment, and then converted into Fe3O4. Combined with orientation induced by an external magnetic field, a thermally conductive network that penetrates the thickness is constructed.
It significantly improves the out-of-plane thermal conductivity of composite materials, enhances the stability and dielectric properties of the materials, meets the heat dissipation requirements of high-power electronic devices, and achieves synergistic optimization of thermal conductivity and mechanical properties.
Smart Images
Figure CN122145980B_ABST