一种复合材料及其制备方法、底盘及半导体设备
By constructing a silicon-carbon bilayer shell structure on the surface of silicon carbide particles and adding carbon nanosheets and amorphous powder, combined with a vacuum pressure infiltration process, the problems of interfacial wettability and thermal expansion coefficient mismatch in aluminum-silicon-silicon carbide composite materials were solved, and the high thermal conductivity and dimensional stability were improved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- NANTONG SANZER PRECISION CERAMICS CO LTD
- Filing Date
- 2026-05-11
- Publication Date
- 2026-07-17
AI Technical Summary
Existing aluminum-silicon-silicon carbide composite materials suffer from bottlenecks in terms of interfacial wettability and thermal expansion coefficient mismatch, resulting in insufficient thermal conductivity and dimensional stability. Traditional modification methods are unable to simultaneously meet the requirements of low interfacial thermal resistance and high interfacial bonding strength.
A silicon-carbon bilayer shell structure was constructed on the surface of silicon carbide particles. Carbon nanosheets and hypereutectic aluminum-silicon amorphous powder were prepared as functional additives. Composite materials were prepared by vacuum pressure infiltration process to form a multilayer composite interface, regulate the matrix structure and interface reaction, and optimize the coefficient of thermal expansion.
The overall thermal conductivity of the material was significantly improved, and the coefficient of thermal expansion was controllably adjusted by regulating the dosage of each additive and process parameters, thereby improving the dimensional stability and mechanical properties of the material.
Smart Images
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