A nickel-platinum alloy, its production and use in high-temperature filaments
CN122147141APending Publication Date: 2026-06-05NANJING JINGTACT ELECTRONIC TECH DEV CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- NANJING JINGTACT ELECTRONIC TECH DEV CO LTD
- Filing Date
- 2026-03-05
- Publication Date
- 2026-06-05
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Figure CN122147141A_ABST
Abstract
The application discloses a nickel-platinum alloy, a preparation method thereof and application of the alloy in a high-temperature bridge wire, the alloy is based on nickel, contains 20-40 wt% of platinum and is doped with 0.1-0.5 wt% of rare earth yttrium, and is prepared through a vacuum smelting and rapid solidification process, etc., the formed nickel-platinum alloy can keep a stable face-centered cubic solid solution structure under a high-current density transient heating condition, has excellent high-temperature strength, resistance stability and oxidation resistance, and the segregation and pinning effect of the rare earth yttrium at the grain boundary effectively inhibit the grain boundary embrittlement and grain growth, so that the structural reliability and service life of the bridge wire under the working condition of being rapidly heated to above 1000 DEG C are significantly improved, and the application is suitable for the field of high-reliability high-temperature bridge wires and related transient heating devices.
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