Device control method, device, apparatus and storage medium for chip testing

By detecting the static current value of the memory chip and inverting the junction temperature, the temperature adjustment of the test socket is controlled, which solves the problems of low test efficiency and poor data consistency caused by the slow temperature rise of the memory chip, and achieves rapid thermal stability and consistent test data.

CN122152021BActive Publication Date: 2026-07-21GUANGZHOU CANSEMI TECH INC
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
GUANGZHOU CANSEMI TECH INC
Filing Date
2026-05-11
Publication Date
2026-07-21

AI Technical Summary

Technical Problem

The LQFP package structure of memory chips has a larger thermal capacity than the bare wafer, which results in slower temperature rise during ATE testing, low testing efficiency, and when relying solely on the test socket temperature to determine whether the preset temperature has been reached, the internal junction temperature of the chip may not have reached the target temperature, leading to poor consistency of test data.

Method used

By detecting the static current value and inverting the junction temperature, the test socket temperature is controlled to enable the memory chip to quickly reach a thermally stable state. This includes preheating to a first preset temperature, maintaining the temperature and detecting the current value, determining the junction temperature based on the current-temperature mapping relationship, and deciding whether to perform a temperature drop operation based on the junction temperature and current value to ensure that the internal temperature of the chip reaches the target junction temperature.

Benefits of technology

This effectively shortens the time for memory chips to reach thermal stability, improves testing efficiency, ensures the consistency of test data, and enhances test accuracy.

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Abstract

The application provides an equipment control method and device for chip testing, equipment and a storage medium, relates to the technical field of electronic testing, and solves the problem of poor consistency of test data caused by a long temperature rising time and difficulty in grasping the temperature rising time in the related art. According to the scheme, the static current value is detected, and the junction temperature is inverted, so that the temperature of the test seat in the test cavity is adjusted, the time for the storage chip to reach thermal stability can be effectively shortened, the test efficiency is improved, the junction temperature used in the test is ensured to be the same as that used in CP testing, the consistency of test data is ensured, and the accuracy of the test is improved.
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