Systems and methods for display panels

Abstract

A display panel (65) and a method for manufacturing a display panel (65) comprising a front side and a back side, the display panel (65) comprising a substrate having a plurality of electronic components disposed on the front side of the substrate and an integrated circuit connected to the plurality of electronic components, the integrated circuit being embedded in the substrate. A plurality of edge contacts (54, 62) are further disposed along an edge of the substrate, wherein the plurality of edge contacts (54, 62) are electrically connected with the integrated circuit. A conductive layer (51, 61) covers at least a portion of the front side of the substrate and surrounds the plurality of electronic components, wherein the conductive layer (51, 61) is not in physical contact with the embedded integrated circuit and provides EMI shielding to different components of the display panel (65).

Description

[0001] This application is a divisional application of Chinese Patent Application No. 202180059942.5, filed on June 17, 2021, entitled "System and Method for Display Panel". Technical Field

[0002] This invention relates to the field of LED / OLED displays and video walls, implemented using active matrix technology (e.g., using TFT (thin film technology)). Background Technology

[0003] LED displays can be implemented using a TFT-on-glass design, which reduces costs and allows for smaller pixel sizes. The TFT-on-glass design enables the use of reduced pixel pitch (the distance between adjacent pixels). However, this technology presents several challenges. For example, when LED display modules are tiled side-by-side into a wall-like structure, the seams between modules need to be reduced, such as the pixel pitch between adjacent pixels from two different modules. This reduces the space available for placing electronic components (e.g., driver electronics) within a single module. Flexible cables can be bent around the electronics board to connect the front and back sides. Connections between the front and back sides can also be achieved using vias. To further reduce pixel pitch and when vias are difficult to implement, an alternative solution is needed.

[0004] It is also common to cluster multiple light sources together, so-called "clusters," so that multiple light sources can use a common contact. If PWM (Pulse Width Modulation) is used, higher frequencies may be required, leading to higher requirements for EMC (Electromagnetic Compatibility) management.

[0005] Therefore, at least one objective of at least one embodiment of the present invention is to overcome these deficiencies of the prior art in order to reduce the seams between modules and / or provide EMI shielding due to EMC management requirements. Summary of the Invention

[0006] The present invention provides at least a display panel with an alternative matrix circuit board design, a display device using the display panel, and a method for manufacturing the matrix circuit board. Some embodiments of the present invention offer advantages over the prior art by providing narrower edge regions through a novel structural design, resulting in a lighter and thinner structure.

[0007] Another embodiment of the present invention aims to provide a display panel and a method of manufacturing the display panel, the display panel providing electromagnetic interference (EMI) shielding for the display panel and its components. For example, the display panel includes a front side and a back side, wherein the display panel includes: at least one substrate, the at least one substrate including a plurality of electronic components disposed on the front side of the at least one substrate; an integrated circuit connected to the plurality of electronic components, the integrated circuit being embedded in the substrate; a plurality of edge contacts disposed along the edge of the at least one substrate, the plurality of edge contacts being electrically connected to the integrated circuit; and a conductive layer covering at least a portion of the front side of the at least one substrate and surrounding the plurality of electronic components, the conductive layer not physically contacting the embedded integrated circuit and providing EMI shielding for different components of the display panel. The conductive layer may be present on any one or both outward surfaces / sides of the display panel to provide a closed circuit having an effect similar to a Faraday cage. The at least one substrate may be an insulating substrate with embedded TFT (thin-film technology) electronic circuitry, such as a glass substrate. This substrate structure enables manufacturing methods that can group different types of TFT electronic circuits on the same substrate, such as groups of power supply, drive, or control circuits. Substrates with different groups of TFT electronic circuits can then be cut and connected to the display panel in different configurations, for example, separated and connected to the back side of the main substrate. Attached Figure Description

[0008] These and other technical effects and advantages of the embodiments of the present invention will now be described in more detail with reference to the accompanying drawings, wherein:

[0009] Figure 1 This illustrates a substrate from the prior art, with electronic circuitry connected to a flexible cable;

[0010] Figure 2A , Figure 2B , Figure 2C , Figure 2D An embodiment of the present invention is shown, including a flexible conductor located on the back side of a display panel;

[0011] Figure 3A , Figure 3B , Figure 3C , Figure 3D An embodiment of the present invention is shown, including conductive layers located on both sides of a display panel;

[0012] Figure 4 An embodiment of the present invention is shown, having a conductive layer;

[0013] Figure 5 and Figure 6 It shows Figure 4 Different cross sections of embodiments of the present invention are shown;

[0014] Figure 7 A top view of another embodiment of the invention is shown;

[0015] Figure 8A and Figure 8B An embodiment of the present invention is shown for fabricating multiple processed TFT electronic circuits on a substrate;

[0016] Figure 9A and Figure 9B An embodiment of the present invention is shown for fabricating multiple processed TFT electronic circuits on one or two substrates. Detailed Implementation

[0017] This invention will be described with reference to specific embodiments and certain accompanying drawings, but the invention is not limited thereto; this is merely a description of the invention. The described drawings are merely illustrative and non-limiting, and various descriptions of features may be combined with any of the described embodiments.

[0018] Furthermore, in the specification and claims, the terms first, second, third, and similar terms are used to distinguish similar elements and are not necessarily used to describe order or chronological order. These terms are interchangeable where appropriate, and embodiments of the invention may be implemented in orders other than those described or illustrated herein. Similarly, the terms "front," "back," "top," "bottom," and "middle" are used to distinguish similar elements and are not necessarily used to describe specific locations.

[0019] The term "comprising" as used in the claims should not be interpreted as limited to the features listed thereafter; it does not exclude other elements or steps. It needs to be interpreted as confirming the presence of the mentioned features, integers, steps, or involved components, but does not exclude the presence or addition of one or more other features, integers, steps, or components, or groups thereof. Therefore, the scope of the expression "a device comprising component A and component B" should not be limited to a device consisting solely of component A and component B. This means that, for the purposes of this invention, the only relevant components of the device are A and B. Similarly, it should be noted that the terms "coupled," "bonded," "connected," etc., used in the specification or claims should not be interpreted as limited to direct connections. Therefore, the scope of the expression "device A coupled to device B" should not be limited to devices or systems where the output of device A is directly connected to the input of device B. It means that there is a path between the output of device A and the input of device B, and this path may include other devices or components.

[0020] definition:

[0021] abbreviation:

[0022] COB = Chip On Board.

[0023] DDIC = Display Driver Integrated Circuit;

[0024] EMC = Electromagnetic Compatibility.

[0025] EMI = Electromagnetic Interference;

[0026] ENIG = Electroless Nickel Immersion Gold;

[0027] LED = Light Emitting Diode;

[0028] OLED = Organic Light Emitting Diode.

[0029] PCB = Printed Circuit Board;

[0030] TFT = Thin Film Technology;

[0031] An "active matrix" is an electronic circuit used in display technology to drive display pixels. This circuit is configured to allow individual access to and control of the state of each pixel. For example, an LED light source can be implemented as a COB (Chip-on-Board) using an insulating substrate (such as glass) with electronic components embedded using TFT (Thin-Film) technology. These electronic components are then typically configured as an active matrix.

[0032] A spliced ​​"display wall" can include multiple smaller display units or "display panels or modules" that are joined together adjacent to each other to create a large display. The aforementioned "display panel" can include a substrate carrying the display light source and necessary electronic circuitry (e.g., electronic control or drive circuitry), as well as other electronic components. The aforementioned display module can include display panels and other features, such as supporting mechanical structures; however, a display panel can also serve as a display module.

[0033] An "edge contact" is an electrical contact located on the short side or edge of a substrate. The short side or edge extends in a direction that is not parallel to the front or back side. If the front and back sides of the substrate have electronic circuitry, edge contacts can be used to connect the electronic circuitry on the front and back sides.

[0034] A "peripheral contact" is an electrical contact located at the edge of the front or back side of a substrate and extending parallel to the front or back side of the substrate.

[0035] Flexible conductor:

[0036] There are various methods to connect a display panel to driving and control electronics located on a PCB, and the method described in this invention is not limited to those described herein. For example, if the substrate is rigid (e.g., glass), the display panel and the PCB can be connected using a flexible conductor. Figure 1 An example of a prior art design for a display panel is shown, wherein a rigid substrate 10 includes a display driver integrated circuit (DDIC) 11, which is connected to a printed circuit board (PCB) 13 via a flexible conductor 12. Alternatively, a flexible substrate (not shown), such as a polyimide substrate, can be used, which can be directly connected to the PCB 13. Alternatively, the DDIC can be connected to the flexible conductor or to the flexible substrate.

[0037] A display wall may comprise multiple display modules or display panels mounted adjacent to each other. Flexible conductors are used to connect the display panels to driving electronics and to connect the display panels to each other. The curvature of the flexible conductors is limited, thus restricting the minimum distance between display panels and affecting pixel pitch. This invention avoids the problems of limited minimum distance and pixel pitch by placing the flexible conductors and DDICs on the back side of each display panel. The display driver can be implemented using TFT technology and / or on-board chip technology (e.g., chip-on-glass, chip-on-plastic, or chip-on-film, where integrated circuits are wired to or bonded to the board).

[0038] Flexible conductor located on the back side:

[0039] Figures 2A-2D An embodiment of the present invention is shown. Figure 2A A display panel 20 is shown, including a substrate 21 having multiple electronic components, such as light sources 22, 23, and 24, such as LEDs, OLEDs and their variants, QD-LEDs, EL-QLEDs, AMOLEDs, etc. The display panel 20 has a front side 25, a back side 26 (the side opposite to the light source), and short sides 27 and 28 (only two short sides are shown in the figure). Figure 2BThe back side 26 of the display panel 20 is shown to have a DDIC 30 and a flexible conductor 31 connected thereto, for example, via pin connection, soldering, etc. The substrate may be made of an insulating material, such as glass or a transparent polymer / plastic / polyimide, and includes an embedded TFT active matrix. Light sources 22, 23, 24 located on the front side 25 of the display panel 20 are connected to the DDIC 30 and the flexible conductor 31, for example, via vias through the substrate via conductors / connectors (not shown) and / or via electrical edge contacts connected to the vias / connectors. Figure 2C An electrical side contact 32 disposed on the short side of the display panel 20 is shown, wherein, for example using peripheral contacts and / or embedded integrated circuits, the side contact 32 electrically connects electronic components to the DDIC 30 and the flexible conductor 31. In variations of the embodiment, such as Figure 2D As shown, the display panel 40 includes two substrates 42 and 43, each substrate having a plurality of edge contacts, such as 47 and 48. The two substrates 42 and 43 are connected to each other, wherein the edge contacts 47 and 48 are connected correspondingly to each other, for example by conductive adhesive / gluoride or welding. Alternatively, a non-conductive adhesive may be used in combination with additional side contacts (not shown) that electrically connect the two substrates. The adhesive / gluoride may include spacers (e.g., spheres with a diameter of 0.1 mm) to allow the two substrates forming the display panel to be uniformly aligned. An example of an acrylic adhesive with spheres is Sadechaf Uvacryl 2151 from SADECHAF UV BVBA (Turnhout, Belgium). Thus, electronic components located on the front side 45 of the display panel 40 are connected to a flexible conductor 41 located on the back side 46 of the display panel 40.

[0040] Electromagnetic interference shielding:

[0041] To reduce the area occupied by electrical contacts on a display screen, light sources can be arranged into groups with common contacts, such as laser clusters. While this allows for smaller pixel pitches on the display panel, it may require driving the panel at higher frequencies (e.g., using pulse frequency modulation). This, in turn, increases signal distortion between the display panel and the PCB for transmitting and receiving signals. Therefore, this invention was developed due to the increased need for effective EMI shielding.

[0042] Figure 3AAnother embodiment of the invention is shown, comprising a display panel substrate 50 having at least one substrate, wherein the substrate has a front side, on which a plurality of electronic components (e.g., a light source 53) are disposed and covered with a conductive layer 51 (e.g., a metal film, a conductive polymer, or a colloidal metal layer), the conductive layer 51 having an opening 52 surrounding the light source 53 (and / or other electronic components). A plurality of edge contacts 54 are provided on the short side of the substrate. A second display panel substrate 60 may also be covered with a conductive layer 61 and include a plurality of edge contacts 62. Then, as Figure 3C As shown, the second substrate 60 is coupled to the first substrate 50 such that the second substrate 60 is bonded to the back side of the first substrate 50, and the first and second substrates together form as shown. Figure 3C The display panel 65 shown has conductive layers 51 and 61 sandwiching it, for example, conductive layers 51 and 61 are located on the front and back sides of the display panel. The two substrates can be bonded to each other with non-conductive adhesive, and additional electrical side contacts (not shown) can be added to electrically connect the two substrates. Furthermore, a flexible conductor 66 is connected to the back side of the display panel. However, similar to... Figure 2C The display panel shown may consist of only one substrate, with electronic components disposed on the front and back sides of the display panel and / or substrate. Figure 3D The conductive layer 61 is shown to be deposited directly onto the back side of the substrate 50. A flexible conductor 66 is connected to the back side of the substrate 50. The conductive layer 51 may be the top layer of a TFT stack, as will be discussed later. It should be noted that the conductive layer 51 may include one or more sublayers.

[0043] Disconnect from the EMI layer:

[0044] Unwilling to be bound by theory, the conductive layer of the display panel acts as a Faraday cage to protect the electronic components of the display panel from EMI. As discussed further herein, the protected electronic components / circuits preferably do not come into physical contact with the conductive layer used for EMI shielding.

[0045] Figure 4 The disconnect from the EMI layer is explained by showing a display panel with an area similar to one of the openings 52 in Figure 3. Specifically, Figure 4 A substrate 70 is shown, including a conductive layer 71 having an opening 72. Multiple electronic components, such as multiple light sources including light sources 73, 74, and 75, are disposed within the opening 72. Within the opening 72, the conductive layer 71 is not present; for example, the conductive layer 71 is disconnected from the electronic components. The light source 73 is connected to the substrate 70 and to the conductive layer 77 via a connecting member 76 (e.g., solder or adhesive material). The conductive layer 71 or conductive layer 77 may comprise one or more layers. This is for illustrative purposes only. Figure 4Peripheral contacts are shown, with only peripheral contacts 79, 80, and 84 identified. Peripheral contacts 80 and 84 are connected to light sources 73, 74, and 75 via circuitry located in the underlying layer (e.g., via an active matrix including a TFT layer). For example, light source 73 can be connected via circuitry (or...) Figure 6 The TFT layer connectors 97 and 98 shown are connected to peripheral contacts 80 and 84, respectively. Peripheral contact 79 is connected to conductive layer 71 but not to light source 73. This is an illustrative description to illustrate how light sources are connected to the active matrix and peripheral contacts, wherein the display panel has a plurality of light source groups placed between the peripheral contacts, and the peripheral contacts are then connected to edge contacts for driving and / or controlling electronic components, such as data lines, scan lines, control lines, etc. Conductive layer 71 can directly contact any peripheral contact 79, for example by depositing peripheral contact 79 directly on conductive layer 71.

[0046] Figure 5 It shows along Figure 4 The cross-section of the display panel is captured by cross-sectional line 81. For example, the light source 73 is mounted to the substrate 70 via connecting members 76a and 76b, which may include solder or adhesive material. A conductive layer 77 (e.g., copper, gold, conductive polymer) further connects the light source 73 to the active matrix 99. The connecting members may include a protective layer 76b (e.g., ENIG) to protect the conductive layer 77 from corrosion / oxidation and to promote good solder surface conditions. The substrate 70 also includes an active matrix 99 embedded in the substrate, wherein the active matrix 99 includes at least TFT layers 97 and 98 and via connectors 100 and 101, which electrically connect the TFT layers 97 and 98 to the light source 73. The conductive layer 71 can be configured as the upper layer of the active matrix 99 and includes an opening 72. The opening 72 has a gap that prevents the conductive layer 71 from physically contacting electronic components and embedded integrated circuits (e.g., the light source 73 and the active matrix 99), thereby enabling the conductive layer 71 to provide EMI shielding for the display panel (e.g., the active matrix 99 and / or electronic components). That is, the conductive layer 71 does not physically contact the embedded circuitry; it surrounds (or closely surrounds, e.g., surrounds but does not contact) the electronic components. The conductive layer 71 can also be covered by electrically insulating layers 111 and 112 to prevent corrosion of the conductive layer 71. Figure 5 As shown, it can be understood that the light source 73 is not electrically connected to the surrounding contact 79, as... Figure 4 As shown along cross-sectional line 81. However, the peripheral contact 79 is electrically connected to the conductive layer 71, the edge contact, and the back-side electronic components (as previously described). Furthermore, as along... Figure 4 The cross-section line 82 is taken from Figure 6As shown, the light source 73 is electrically connected to peripheral contacts 80 and 84 via an active matrix 99. Peripheral contacts 80 and 84 are electrically connected to side contacts and back-side electronic components (as previously described).

[0047] Figure 6 It shows along Figure 4 The cross-section of the display panel is captured by cross-sectional line 82. (Compared to...) Figure 5 Similar to the embodiment in the previous example, this cross-section shows the light source 73 mounted on the substrate 70 via connecting members 76a and 76b, wherein a conductive layer 77 connects the light source 73 to an active matrix 99. The active matrix 99 includes TFT layers 97 and 98 and via connectors 100 and 101, connecting the light source 73 to peripheral contacts 80 and 84 to control the light source 73 (or other electronic components). Figure 5 similar, Figure 6 This includes the conductive layer 71, which serves as the upper layer of the active matrix 99. However, Figure 6 It is also shown that the conductive layer 71 further includes a gap 78 located between the peripheral contacts 80 and 84 and the conductive layer 71, causing the conductive layer 71 to not be in physical contact with the peripheral contacts 80 and 84. For example, the gap disconnects the conductive layer 71 from the peripheral contacts 80 and 84.

[0048] Figure 7 A top view of another embodiment of the invention is shown, wherein the display panel 120 has multiple light sources, with only light source 121 identified for clarity. In this embodiment, conductive layers 122 and 124 are deposited / formed on a substrate, wherein multiple gaps 123 are provided between conductive layers 122 and 124. Each “strip” of conductive layer 122 is configured to serve as a power line for multiple light sources, and conductive layer 122 can be connected to a conductive layer (not shown) on the back side of the display panel and / or via an active matrix, such as through edge contacts or via connectors / connectors as described above. For example, current can be directed to light source 121 using the strips of conductive layer 122. Given the multiple gaps 123, it is understood that conductive layer 124 is electrically insulated from conductive layer 122 and can further be maintained at different voltages. Therefore, conductive layer 124 can provide EMI shielding.

[0049] It should be understood that the conductive layer can be patterned into other suitable structures, such as grid patterns, scatter patterns, or mesh patterns, and EMI shielding will still be achieved due to the gaps between the conductive layers between different components of the display panel.

[0050] Manufacturing method:

[0051] The present invention also relates to a method for manufacturing the matrix circuit substrate and display panel as described above. In this example method, the method includes the step of forming at least one main substrate layer, wherein the at least one main substrate layer comprises an insulating material, such as glass or plastic (e.g., polyimide (PI), polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), etc.), and the substrate layer may be a rigid substrate or a flexible substrate. Next, at least one buffer layer is disposed / formed on the at least one main substrate layer to form a substrate, wherein an integrated circuit (e.g., a TFT circuit) is embedded in the substrate. The at least one buffer layer may be the same material as or a different material from the substrate layer, for purposes such as protecting the TFT circuit, improving thermal conductivity, preventing particle diffusion, or other reasons. The TFT circuit may be formed from metal oxide semiconductor materials, metals and their oxides, organometallic powders, conductive polymers, and / or polycrystalline semiconductor materials, but is not limited thereto. Then, a conductive layer is disposed above or on top of the TFT circuit, for example as an upper layer of the TFT circuit or located above the TFT circuit, and an opening is formed in the conductive layer. The opening can be formed by etching, deposition methods, masking processes, etc. Then, an electrically insulating layer and / or peripheral contacts are formed above the conductive layer, and edge contacts are formed along the edge of the substrate, wherein the peripheral contacts and / or edge contacts are formed by electroplating, deposition, etching, etc. Multiple electronic components are formed in the openings of the conductive layer, which are connected to the substrate and electrically connected to the integrated circuit. For example, the multiple electronic components can be connected to the substrate by soldering or using adhesives, and the conductive layer and / or protective layer can be formed to protect the conductive layer from corrosion / oxidation and promote good soldering surface conditions, wherein via connectors for electrical connection to the integrated circuit are formed in the substrate, such as vias passing through the substrate. As described above, this manufacturing process ensures that the conductive layer does not have physical contact with the embedded integrated circuit and / or electronic components. It should be understood that various layers and openings can be formed using deposition methods, photoresist methods, masking processes, chemical etching processes, laser etching processes, lift-off methods, etc. Deposition methods include, for example, laser annealing, plasma-enhanced chemical vapor deposition (PECVD), chemical vapor deposition (CVD), atomic layer deposition (ALD), electrodeposition, thermal expansion plasma, crystallization steps, or similar methods.

[0052] In another embodiment of the invention, the manufacturing method further includes forming driving and power electronics by implementing TFT circuitry on the same substrate as the display panel. This is advantageous because multiplexers and current mirrors can be added within the driving electronics, thereby significantly reducing the number of contacts with driving electronic components on the PCB. Furthermore, the driving and power electronics can include functional designs utilizing TFTs to reduce the driving overhead required to illuminate the display panel. Thus, in some embodiments of the invention, the aforementioned DDIC may no longer be necessary.

[0053] For example, Figure 8A A snapshot of the substrate manufacturing process for a display panel is shown. A substrate 140 with embedded integrated circuits (e.g., TFT electronic circuitry) can be divided into multiple segments 141, 142, and 143, each segment including TFT electronic circuitry for a different purpose. This design is advantageous because it allows for the simultaneous fabrication of electronic circuitry for multiple purposes on the same substrate. For example, display segment 141 may have TFT electronic circuitry for driving a light source. Side segments 142 and 143 can be used to distribute power to the display and have line selection functionality (e.g., accessing each line individually by scanning the display). Segment 144 can be used to handle level shifting, such as converting drive levels to TFT voltage levels. Segment 144 may also include current mirroring functionality, such as multiplying a current source into multiple current sources. Corner segments 145 and 146 can be arranged or used for, for example, test circuitry. In practice, available space on existing etch masks can be used for any segment. The invention is not limited to the specific arrangements and functions of the side segments, but rather provides the above-described arrangements and functions as examples.

[0054] The substrate segments 143, 144, and 142 can then be separated from the display segment 141 and placed back-to-back on the display panel, for example, by using conductive adhesive or soldering. Figure 8B The back side 147 of the substrate is shown, with separated segments 142, 143, and 144 attached to the substrate. It should be understood that the dimensions of the separated segments and the corresponding electronic circuitry are adaptable for mounting on the back side 147.

[0055] A further advantage of this invention is that it provides perfect alignment between the electrical conductors on the display panel and the electrical conductors on the control or drive panel, because they can be drawn continuously as a whole on different segments before being cut, see example line 148. Another advantage of this display panel is that it eliminates the need to allocate space on the front side of the display for power and drive circuitry. If this display panel is used for a tiled display wall, providing this display panel can significantly reduce the distance between pixels on two adjacent display panels.

[0056] Figure 9A Figures 9B and 9B illustrate another embodiment of the invention, wherein the front and back sides of the display panel are processed on two separate substrates. Figure 9A A first substrate 150 is shown, which includes electronic circuitry 151 for processing display segments. Figure 9BA second substrate 160 is shown, which includes power and drive electronics 162, 163, and 164, as well as a display section back side 161. The substrates 150 and 160 can then be connected back-to-back and secured to each other, for example, using conductive adhesive or soldering.

[0057] Alternatively, it should be understood that if dual-sided TFT fabrication is available, the power supply and drive circuits 162, 163, and 164 can be fabricated directly onto the back side of the first substrate 150. This results in a compact design with the thickness of only one substrate or display panel. Another advantage is that monolithic stacking reduces assembly time.

[0058] Figures 8A-8B Embodiments of 9A-9B include components for electronic connections between the front and back sides, such as via connectors, peripheral contacts, or edge contacts as described above. As described above, embodiments may also include a conductive layer on the back side 147 or 161 to achieve EMI shielding.

[0059] The foregoing is illustrative and not restrictive. Any equivalent modifications or alterations to this invention without departing from its scope should be included in the various embodiments of the invention. Therefore, this invention is intended to cover variations and alterations thereof, including various combinations of different aspects of the invention.

Claims

1. A display panel having a front side and a back side, the display panel comprising: At least one substrate, including a plurality of electronic components disposed on the front side of the at least one substrate; Multiple edge contacts are disposed along the edge of the at least one substrate, the multiple edge contacts being electrically connected to the multiple electronic components, wherein the edge is disposed between the front and back sides of the at least one substrate; A conductive layer, covering at least a portion of the front side of the at least one substrate and surrounding the plurality of electronic components, and A plurality of peripheral contacts are disposed on at least one of the front and back sides of the at least one substrate and extend parallel to the at least one of the front and back sides, the plurality of peripheral contacts being located entirely within the outer periphery of the at least one substrate. The plurality of peripheral contacts are connected to the plurality of edge contacts.

2. The display panel of claim 1, further comprising an integrated circuit connected to the plurality of electronic components, wherein the plurality of edge contacts are electrically connected to the integrated circuit.

3. The display panel according to claim 2, wherein the at least one substrate is configured such that the conductive layer does not physically contact the integrated circuit.

4. The display panel according to claim 1, wherein the plurality of electronic components includes a plurality of light sources.

5. The display panel according to any one of claims 2 to 4, wherein the conductive layer provides an opening for the plurality of electronic components, wherein the plurality of electronic components are placed within the opening such that the conductive layer does not physically contact the integrated circuit.

6. The display panel according to claim 1, wherein the plurality of electronic components are electrically connected to the at least one substrate via a connecting member.

7. The display panel according to any one of claims 1 to 4 and 6, wherein the electrically insulating layer is disposed above the conductive layer.

8. The display panel according to any one of claims 1 to 4, 6, wherein the conductive layer comprises a first portion and a second portion separated by a gap, the first portion being configured as a power line for the plurality of electronic components, wherein the first portion and the second portion are electrically insulated from each other.

9. The display panel of claim 8, wherein the first portion of the conductive layer and the second portion of the conductive layer are maintained at different voltages.

10. The display panel according to any one of claims 1 to 4, 6, further comprising at least one second substrate, wherein the second substrate includes a second conductive layer and a plurality of second edge contacts, wherein the at least one second substrate is connected to the at least one substrate to form the display panel.

11. The display panel of claim 10, wherein the second conductive layer covers the back side.

12. The display panel according to any one of claims 1 to 4, 6, wherein the at least one substrate comprises an insulating material.

13. The display panel according to claim 12, wherein the insulating material is glass.

14. The display panel according to claim 1, in, The conductive layer covers at least a portion of the front side or at least a portion of the back side of the at least one substrate.

15. A method for forming a display panel, comprising the steps of: Form at least one substrate; A conductive layer is provided on at least the front surface of the at least one substrate; An opening is provided in the conductive layer; Multiple electronic components are connected to the at least one substrate through the openings in the conductive layer, and the multiple electronic components are electrically connected to multiple edge contacts; as well as A plurality of peripheral contacts are provided on at least one of the front and back sides of the at least one substrate, the plurality of peripheral contacts extending parallel to at least one of the front and back sides and the plurality of peripheral contacts being located entirely within the outer periphery of the at least one substrate, wherein the plurality of peripheral contacts are connected to the plurality of edge contacts.

16. The method of claim 15, wherein the integrated circuit is connected to the plurality of edge contacts, and the plurality of electronic components are electrically connected to the integrated circuit.

17. The method of forming a display panel according to claim 16, wherein, The at least one substrate is configured such that the conductive layer does not physically contact the integrated circuit.

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