Bonder parameter design method, device, medium and product for bonding structure

Abstract

The present disclosure discloses a bonding parameter design method, device, medium and product of a bonding structure, relating to the technical field of material connection. The method comprises: establishing a finite element model of a structure to be designed, performing load analysis, obtaining the bending moment values of each unit of the structure to be designed, comparing the bending moment values of each unit with the bending moment bearing threshold, determining that the region with the bending moment value greater than the bending moment bearing threshold selects a first material, determining that the region with the bending moment value less than or equal to the bending moment bearing threshold selects a second material, obtaining the mechanical property parameters of the first material, the second material and the adhesive, and determining the minimum bonding length of the adhesive used for connecting the first material and the second material based on the mechanical property parameters. The bonding parameter design method, device, medium and product of the bonding structure provided by the present disclosure are used to ensure that the bonding design of the fiber reinforced resin matrix composite and the metal realizes optimal weight reduction on the premise of meeting the strength and durability requirements.

Description

Technical Field

[0001] This disclosure relates to the field of material bonding technology, and in particular to a method, equipment, medium and product for designing adhesive bonding parameters for an adhesive structure. Background Technology

[0002] Fiber-reinforced resin matrix composites are widely used in aerospace, wind power generation, and transportation due to their excellent properties such as high specific strength and high specific stiffness. To fully realize their weight reduction potential, they are often combined with metals (such as titanium alloys and aluminum alloys) to form hybrid structures. In such hybrid structures, adhesive bonding is the main way to achieve load transfer between fiber-reinforced resin matrix composites and metal materials.

[0003] However, in the existing technology, the bonding design of fiber-reinforced resin matrix composites with metals relies heavily on the experience of engineers, resulting in long design cycles, high R&D costs, and conservative or risky design results, making it difficult to achieve the optimal balance between lightweight and reliability. Summary of the Invention

[0004] This disclosure is made in view of the above-mentioned problems. This disclosure provides a method, apparatus, medium, and product for designing adhesive bonding parameters for bonded structures, improving design efficiency and ensuring that the adhesive bonding design of fiber-reinforced resin matrix composites to metals achieves optimal weight reduction while meeting strength and durability requirements.

[0005] To achieve the above objectives, according to one aspect of this disclosure, the following technical solution is provided: A method for designing adhesive bonding parameters for an adhesive bonding structure, comprising: Establish a finite element model of the structure to be designed, perform load analysis, and obtain the bending moment values ​​of each element of the structure to be designed; Compare the bending moment values ​​of each unit with the bending moment bearing threshold, determine the region where the bending moment value is greater than the bending moment bearing threshold and select the first material, determine the region where the bending moment value is less than or equal to the bending moment bearing threshold and select the second material; Obtain the mechanical property parameters of the first material, the second material, and the adhesive; Based on the aforementioned mechanical property parameters, the minimum adhesive length for bonding the first material and the second material is determined.

[0006] Compared with existing technologies, the adhesive bonding parameter design method for bonded structures provided in this disclosure firstly, by establishing a finite element model and performing load analysis, can accurately obtain the bending moment values ​​of each element in the structure to be designed. Then, the bending moment values ​​of each element are compared with the bending moment bearing threshold. For high-load areas where the bending moment value is greater than the bending moment bearing threshold, a first material suitable for high load bearing requirements is selected; for low-load areas where the bending moment value is less than or equal to the bending moment bearing threshold, a second material is selected. This ensures that the material allocation matches the stress state of the structure, realizing quantitative decision-making for material selection. It eliminates the reliance on engineers' experience in traditional design and effectively avoids the risks of conservative redundancy or overly aggressive approaches that are prone to occur in experience-based design. Secondly, the minimum bonding length is determined by combining the mechanical performance parameters of the first material, the second material, and the adhesive. This provides rigorous theoretical support for the adhesive bonding parameter design process, ensuring that the strength and durability requirements of fiber-reinforced resin matrix composites bonded to metal structures are met, while avoiding structural weight and cost increases due to excessively long bonding lengths, or connection failures caused by excessively short bonding lengths. Furthermore, the entire design process utilizes numerical simulation and parametric analysis, which greatly simplifies the tedious process of repeated testing and iterative correction in traditional design, significantly shortens the design cycle, reduces testing and time costs in the R&D process, improves design efficiency, maximizes the weight reduction potential of composite materials, and successfully achieves the optimal balance between lightweight and reliability of adhesive structures. It provides an efficient and scientific technical solution for the engineering application of hybrid adhesive structures in aerospace, wind power generation, transportation and other fields, and has broad prospects for promotion and practical value.

[0007] According to another aspect of this disclosure, an electronic device is provided, comprising: Processor; and, Memory for stored programs; The program includes instructions that, when executed by the processor, cause the processor to perform the method described herein.

[0008] Compared with the prior art, the beneficial effects of the electronic device provided in this disclosure are the same as those of the adhesive parameter design method for the adhesive structure described in the above technical solution, and will not be repeated here.

[0009] According to another aspect of this disclosure, a computer-readable storage medium is also provided, on which a computer program is stored, which, when executed by a processor, implements a method for designing adhesive parameters for an adhesive structure.

[0010] Compared with the prior art, the beneficial effects of the computer-readable storage medium provided in this disclosure are the same as the beneficial effects of the adhesive parameter design method for the adhesive structure described in the above technical solution, and will not be repeated here.

[0011] According to another aspect of this disclosure, this disclosure also provides a computer program product, the computer program comprising a computer program, wherein, when executed by a processor of a computer, the computer program is used to cause the computer to perform the methods described in this disclosure.

[0012] Compared with the prior art, the beneficial effects of the computer program product provided in this disclosure are the same as the beneficial effects of the adhesive parameter design method for the adhesive structure described in the above technical solution, and will not be repeated here. Attached Figure Description

[0013] The accompanying drawings, which are included to provide a further understanding of this disclosure and form part of this disclosure, illustrate exemplary embodiments of the present disclosure and are used to explain the disclosure, but do not constitute an undue limitation of the disclosure. In the drawings: Figure 1 A flowchart illustrating a method for designing adhesive bonding parameters for an adhesive structure according to an embodiment of the present disclosure is shown.

[0014] Figure 2 A visualization of an exemplary finite element model based on an embodiment of this disclosure is shown.

[0015] Figure 3 A schematic cross-sectional view of a double-sided overlapping adhesive structure according to an embodiment of the present disclosure is shown.

[0016] Figure 4 A schematic cross-sectional view of a stepped overlap adhesive structure according to an embodiment of the present disclosure is shown.

[0017] Figure 5 A schematic diagram of the structure of an electronic device provided in an exemplary embodiment of this disclosure is shown.

[0018] Figure 6 A schematic diagram of the structure of a computer system provided in an exemplary embodiment of this disclosure is shown. Detailed Implementation

[0019] To facilitate a clear description of the technical solutions in the embodiments of this disclosure, the terms "first" and "second" are used to distinguish identical or similar items with substantially the same function and effect. For example, the first threshold and the second threshold are merely used to distinguish different thresholds and do not limit their order. Those skilled in the art will understand that the terms "first" and "second" do not limit the quantity or execution order, and the terms "first" and "second" are not necessarily different.

[0020] It should be noted that in this disclosure, the terms "exemplary" or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplary" or "for example" in this disclosure should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of terms such as "exemplary" or "for example" is intended to present the relevant concepts in a concrete manner.

[0021] In this disclosure, "at least one" means one or more, and "more than one" means two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can mean: A alone, A and B simultaneously, or B alone, where A and B can be singular or plural. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. "At least one of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, at least one of a, b, or c can mean: a, b, c, a combination of a and b, a combination of a and c, a combination of b and c, or a, b, and c, where a, b, and c can be single or multiple.

[0022] In the manufacturing of high-end equipment such as aerospace and automobiles, hybrid structures are often used to fully leverage the performance advantages of different materials. For example, in components such as aero-engine blades, to reduce weight, metallic materials (such as titanium alloys) are often used in critical areas subjected to complex stresses (such as shaft diameters), while fiber-reinforced resin-based composite materials are used in other areas.

[0023] However, the design of the connection between composite materials and metals is a technical challenge. Improper connection design can lead to stress concentration, premature failure, and failure to fully realize the lightweight advantages of composite materials. Current technologies largely rely on experience or extensive testing to determine connection parameters, resulting in long design cycles, high costs, and difficulty in guaranteeing optimal performance under complex loads (such as bending and shear). Particularly when determining the boundary region between the two materials and key parameters of the adhesive interface (such as adhesive length), there is a lack of a systematic, efficient design method that comprehensively considers both material properties and structural loading conditions.

[0024] To overcome the aforementioned problems, this disclosure provides a method, equipment, medium, and product for designing adhesive bonding parameters for bonded structures. This method utilizes numerical simulation and parametric analysis to significantly simplify the tedious process of repeated testing and iterative correction in traditional design, significantly shortening the design cycle, reducing testing and time costs during the R&D process, improving design efficiency, and maximizing the weight reduction potential of composite materials. It should be understood that this adhesive bonding structure is suitable for various bonding scenarios between fiber-reinforced resin matrix composites and metal materials such as titanium alloys and aluminum alloys. For example, it can be applied to aero-engine fan blades and compressor blades.

[0025] Figure 1 A flowchart illustrating a method for designing adhesive parameters for an adhesive structure according to an exemplary embodiment of this disclosure is shown. Figure 1 As shown, the adhesive parameter design method for the adhesive structure provided in this embodiment includes: Step 101: Establish a finite element model of the structure to be designed, perform load analysis, and obtain the bending moment values ​​of each element of the structure. The structure to be designed can be an adhesive structure of fiber-reinforced resin matrix composite material and titanium alloy material.

[0026] For example, the above-mentioned establishment of a finite element model of the structure to be designed, load analysis, and acquisition of the bending moment values ​​of each element of the structure to be designed specifically includes: establishing a conventional shell element finite element model of the structure to be designed: based on the preset geometric dimensions, complex curved surface contours, assembly relationships, and other geometric features of the bonded structure to be designed, a finite element model based on conventional shell elements is established using professional finite element analysis software (such as ABAQUS or ANSYS). Specifically, firstly, the bonded structure to be designed is discretized into a mesh. According to the high-load and low-load regions of the structure, a differentiated mesh is used and initial material property parameters are defined. Subsequently, the loads and boundary conditions corresponding to the actual working conditions are applied to the finite element model, and static analysis calculations are performed to obtain the bending moment response values ​​of each element of the bonded structure to be designed under various loads, including the bending moment value SM1 in the first principal direction and the bending moment value SM2 in the second principal direction.

[0027] Furthermore, by writing a post-processing program (e.g., a program named moment-optimization.py), the finite element calculation result file is read, all elements in the model are traversed, and the SM1 and SM2 values ​​of each element are extracted and recorded to form a complete structural bending moment distribution dataset. This dataset is stored in a structured form and used for material partitioning and optimization design in subsequent steps.

[0028] The aforementioned bending moment values ​​SM1 and SM2 in the first principal direction represent the bending moment per unit length along two mutually orthogonal principal axes (axis 1 and axis 2) in the local coordinate system of the shell element. Specifically, SM1 is the bending moment per unit length about the first principal direction (axis 1), and SM2 is the bending moment per unit length about the second principal direction (axis 2). The bending moment per unit length is obtained by dividing the bending moment of the element section by the effective width in the corresponding direction, and is used to characterize the bending load density of the shell element in the local principal directions.

[0029] Step 102: Compare the bending moment value of each unit with the bending moment bearing threshold. Select the first material for areas where the bending moment value is greater than the bending moment bearing threshold, and select the second material for areas where the bending moment value is less than or equal to the bending moment bearing threshold.

[0030] It should be noted that the bending moment bearing threshold is a critical unit length bending moment value pre-calibrated based on the mechanical property parameters of the first and second materials, the strength requirements and durability requirements of the adhesive structure to be designed, and the adhesive bonding process specifications.

[0031] For example, the bending moment value dataset of each unit obtained in step 101 can be called, and the bending moment values ​​SM1 and SM2 corresponding to each unit can be compared with the bending moment bearing threshold. When at least one of the bending moment values ​​SM1 or SM2 of any unit is greater than the bending moment bearing threshold, the area where the unit is located is determined to be a high-bearing area, and its material property is marked as the first material (e.g., titanium alloy). When both the bending moment values ​​SM1 and SM2 of the unit are less than or equal to the bending moment bearing threshold, the area where the unit is located is determined to be a low-bearing area, and its material property is marked as the second material (e.g., fiber-reinforced resin matrix composite). This dual comparison and determination method can comprehensively cover the bending stress state of the shell unit in the two orthogonal principal directions, avoiding material selection errors caused by the omission of bending moment values ​​in a single direction. It is especially suitable for complex curved surface adhesive structures such as wind turbine blades and aerospace components that bear loads in multiple directions.

[0032] In practice, the above judgment process can be automated using a script: A program is written to iterate through all units, generate a material allocation mapping table based on the comparison rules, and automatically categorize units marked as the first material into independent sets for easier subsequent display and processing. Finally, a complete material partitioning scheme is formed based on the comparison results, providing input for subsequent adhesive bonding parameter design.

[0033] For example, by extracting the spatial coordinates of the first and second material unit sets and the information on the association between adjacent units through a post-processing program, regional spatial contour data of the two types of materials can be automatically generated. For example, for a wind turbine blade structure, a first material region contour extending from the root to the tip along the blade spanwise can be formed, and a second material region contour covering the upper and lower edges of the blade along the chordwise direction can be formed, clearly defining the boundary between the two types of materials.

[0034] Figure 2 A visualization of an exemplary finite element model based on an embodiment of this disclosure is shown. Figure 2 As shown, the green area represents the unit set of the second material (such as fiber-reinforced resin matrix composite). Within this area, the bending moment values ​​SM1 and SM2 of all shell units are less than or equal to a preset bending moment bearing threshold, classifying it as a low-load bearing region. The high specific strength of the second material achieves structural lightweighting while simultaneously meeting the load-bearing requirements of this region. The red area represents the unit set of the first material (such as titanium alloy). Within this area, any one of the SM1 or SM2 values ​​of the shell units exceeds the bending moment bearing threshold, classifying it as a high-load bearing region. The high strength and high fatigue resistance of titanium alloy ensure the reliability of the structure under extreme conditions, avoiding the risk of failure due to load concentration.

[0035] Step 103: Obtain the mechanical property parameters of the first material, the second material, and the adhesive.

[0036] For example, firstly, select the appropriate adhesive type based on the operating temperature, load characteristics, and lifespan requirements. If the long-term operating temperature of the structure is above 150℃, a bismaleimide resin-based adhesive can be used; if the operating temperature is below 150℃, an epoxy resin-based adhesive (e.g., epoxy J29) can be used. For the selected adhesive, obtain its adhesive layer shear stress-strain curve and related mechanical property data using any of the following methods: First, directly use typical mechanical performance parameters provided by the adhesive manufacturer, including the adhesive's shear modulus, plastic shear strain, and elastic shear strain. Second, prepare specimens consistent with the actual structural bonding process according to the test methods specified in national standards (GB) or international standards (such as ASTM), and measure the shear stress-strain relationship of the adhesive under the corresponding temperature environment through circular torsion tests, thick plate shear tests, or V-notch shear tests.

[0037] Because the actual stress-strain curve of the adhesive layer is quite complex, it needs to be simplified into an equivalent model for ease of engineering analysis. Common simplification methods include: an equivalent elastoplastic model, which simplifies the curve to an elastic segment and a plastic plateau segment, making the area under the simplified curve equal to the area under the measured curve; and an equivalent bilinear model, which simplifies the curve to a broken line composed of two straight lines. When using a simplified model, the effects of process variations and adhesive layer defects in actual production must be considered, and a reduction factor (e.g., 0.8) should be introduced for the maximum shear strength. If sufficient experimental data is available, the material property characteristic values ​​under a specified reliability can be analyzed based on statistical methods (such as normal distribution).

[0038] Simultaneously, for the first material (e.g., titanium alloy) and the second material (e.g., fiber-reinforced resin matrix composite) identified in step 102, their key mechanical property parameters are obtained respectively. For the first material, at least the elastic modulus, tensile strength, and thickness are obtained. For the second material, at least the elastic modulus, thickness, and allowable stress value are obtained. These parameters can be obtained from material handbooks, data sheets provided by suppliers, or through standard experimental tests (e.g., tensile tests, compression tests).

[0039] Step 104: Based on the mechanical property parameters, determine the minimum adhesive length for the adhesive used to connect the first material and the second material.

[0040] The calculation method for the minimum bonding length is divided into two cases: the temperature corresponding to the target working condition exceeds the preset temperature threshold (e.g., above 150℃) and the temperature corresponding to the target working condition does not exceed the preset temperature threshold (e.g., below 150℃).

[0041] It should be noted that in this adhesive structure, the actual laying method can be as follows: the second material (fiber-reinforced resin-based composite material) adopts a symmetrical layup design, the first material (titanium alloy) adopts a single-layer layup, and the adhesive is sandwiched in the form of a thin film at the bonding interface between the first material and the second material to form an adhesive laminate structure.

[0042] For example, when the temperature corresponding to the target working condition does not exceed a preset temperature threshold (e.g., ≤150℃), the mechanical properties of the adhesive do not significantly decrease. The above-mentioned determination of the minimum bonding length of the adhesive used to connect the first and second materials based on mechanical property parameters includes: First, determining the shear stress distribution characteristic parameter λ of the adhesive interface based on the shear modulus of the adhesive, the target thickness of the adhesive, the elastic modulus of the first material, the target thickness of the first material, the elastic modulus of the second material, and the target thickness of the second material. This parameter λ reflects the influence of the shear modulus of the adhesive, the thickness of the adhesive layer, and the stiffness matching degree of the two substrates on the shear stress distribution at the interface. The larger the value of λ, the more significant the shear stress concentration effect at the interface. The specific calculation formula is as follows: Where G is the shear modulus of the adhesive.h The target thickness of the adhesive. E 0 represents the elastic modulus of the first material. E i The elastic modulus of the second material. t 01 , t 02 The target thickness of the second material, t i The target thickness of the first material is the thickness of a single layer of the first material in the adhesive region.

[0043] It should be noted that in the mechanical model of this adhesive structure, t 01 The thickness of a single layer of the second material (fiber-reinforced resin matrix composite) on the adhesive interface side. t 02 This refers to the thickness of a single layer of the second material (fiber-reinforced resin matrix composite) on the other side of the adhesive interface. This is relevant in symmetrically laid composite adhesive structures (such as the symmetrical layup design commonly used in wind turbine blades). t 01 and t 02 The values ​​are usually equal, meaning the total thickness of the composite material at the adhesive interface is the sum of the two values. t 01 + t 02 In asymmetric ply designs, the values ​​for both are determined based on the actual ply configuration.

[0044] Under load, the shear stress of the adhesive layer exhibits a non-uniform distribution along the overlap length, with concentrated stress at both ends and low stress in the middle. This low-stress region in the middle is the elastic groove. The existence of the elastic groove gives the adhesive structure both strength and durability: when the overlap length is small, the width of the elastic groove approaches zero, and the shear stress across the entire adhesive layer is close to its peak value, making it prone to entering the plastic deformation stage and leading to rapid joint failure. When the overlap length increases to a critical value, the load-bearing capacity of the adhesive layer no longer increases significantly with length; only the width and depth of the elastic groove continue to expand. At this point, the two ends of the adhesive layer are plastic load-bearing zones, and the middle is an elastic energy storage zone. After unloading, the rebound effect of the elastic zone can restore the residual deformation in the plastic zone, preventing creep accumulation and thus ensuring the long-term durability of the adhesive structure.

[0045] Therefore, the theoretical overlap length at the target temperature can be determined based on the elastic shear strain, plastic shear strain, and shear stress distribution characteristics of the adhesive layer. This refers to the critical overlap length when the width of the elastic groove in the adhesive layer is zero. The specific calculation formula is as follows: ,in, This represents the plastic shear strain of the adhesive layer at the target temperature. This represents the elastic shear strain of the adhesive layer at the target temperature.

[0046] Analysis results show that when the width of the elastic groove satisfies At this point, the minimum shear stress of the adhesive layer can be reduced to 10% of the maximum shear stress, which is the critical condition for the adhesive layer to fully rebound and without creep accumulation after unloading. This length is a necessary compensation to ensure the durability of the bonded structure. When superimposed with the plastic critical overlap length, a complete bond length that balances strength and durability is obtained.

[0047] Therefore, based on the theoretical overlap length and the preset safety factor, the minimum overlap length for the adhesive bonding area to meet the load transfer requirements is determined. The specific calculation formula is as follows: in, The minimum overlap length of the adhesive when the temperature corresponding to the target working condition does not exceed the preset temperature threshold.

[0048] For example, when the temperature corresponding to the target working condition exceeds a preset temperature threshold (e.g., >150℃), the elastic properties of the adhesive decrease significantly, and the plastic deformation characteristics become prominent, making the conventional shear stress distribution model at room temperature no longer applicable. In this case, the shear lag theory model is used to calculate the minimum adhesive bond length under high-temperature conditions. This model can accurately characterize the load transfer characteristics dominated by plasticity of the adhesive at high temperatures and is suitable for working conditions where the adhesive layer fails primarily through plastic shear deformation.

[0049] Based on this, the aforementioned determination of the minimum adhesive bonding length for joining the first and second materials based on mechanical performance parameters includes: determining the minimum adhesive bonding length of the bonding area at the target temperature based on the elastic modulus of the first material, the thickness of the first material, the elastic modulus of the second material, the thickness of the second material, and the plastic shear strength and bending moment bearing threshold of the adhesive. Specifically, the shear hysteresis theory model is used, and the calculation formula is as follows:

[0050] in, The elastic modulus of the second material. The target thickness of the second material, The elastic modulus of the first material is The target thickness of the first material, The target high-temperature plastic shear strength of the adhesive layer is taken as 1.738 MPa (for example, 1.738 MPa at approximately 200°C, with a safety factor of 10). The bending moment of the section, This refers to the adhesive bonding length when the temperature corresponding to the target operating condition exceeds a preset temperature threshold. Therefore, by substituting the material mechanical property parameters at the target high temperature and the preset bending moment bearing threshold M into the above formula, the formula will then contain... The bending moment at the section corresponding to the bending moment bearing capacity threshold is calculated. This refers to the minimum adhesive bonding length required to ensure structural strength under high-temperature conditions.

[0051] In some examples, the bending moment bearing threshold of this disclosure embodiment can be set to a specific value based on engineering experience or standard specifications. For example, for a stepped adhesive structure of fiber-reinforced resin matrix composites and titanium alloys, combined with service data and failure case statistics of similar products, the bending moment bearing threshold can be directly calibrated to 46.6N. mm.

[0052] In other examples, the bending moment bearing threshold of embodiments of this disclosure can be determined based on the minimum adhesive length to be optimized, the elastic modulus of the second material, the thickness of the second material, the elastic modulus of the first material, the thickness of the first material, and the plastic shear strength of the adhesive. Specifically, based on the shear hysteresis theory model, considering the load transfer characteristics dominated by the plastic deformation of the adhesive layer under high temperature conditions, the calculation formula for the minimum adhesive length under high temperature conditions is inversely transformed to derive the bending moment bearing threshold. SM The quantitative relationship between 0 and the bonding length is implemented as follows: Based on the shear hysteresis theory model, under high-temperature conditions (temperature exceeding a preset threshold), the adhesive bonding length is taken as the preset minimum adhesive bonding length. x When the bending moment at that time is equal to the bending moment bearing capacity threshold, the corresponding bending moment at the cross section is equal to the bending moment bearing capacity threshold. SM 0 (At this point, the bonded structure is in a critical load-bearing state, and the shear stress of the adhesive layer reaches the plastic shear strength). SM Substituting 0 into the above shear lag theory model formula and transforming it, we obtain the formula for calculating the bending moment bearing threshold:

[0053] in, The elastic modulus of the second material. The target thickness of the second material, The elastic modulus of the first material is The target thickness of the first material, The target is the plastic shear strength of the adhesive layer at high temperature. The minimum adhesive length to be optimized (pre-set by process constraints, space limitations, or lightweight requirements). SM 0 represents the bending moment bearing threshold.

[0054] In practical engineering applications, the adhesive bonding of resin-based composite materials to metals can take different forms depending on the structural characteristics and process requirements. The design method provided in this disclosure is applicable to two main forms: stepped adhesive bonding and double-sided lap bonding, and achieves parameter design through a unified theoretical framework. Figure 3 A schematic cross-sectional view of a double-sided overlapping adhesive bonding structure according to an embodiment of the present disclosure is shown, as follows: Figure 3 As shown, the adhesive structure includes a first material 301, a second material 302, and an adhesive layer 303. Figure 4 A schematic cross-sectional view of a stepped lap joint adhesive structure according to an embodiment of the present disclosure is shown, as follows: Figure 4 As shown, the adhesive structure includes a first material 401, a second material 402, and an adhesive layer 403.

[0055] For stepped bonding, the essence is a combination of multiple short overlap segments. Each step can be regarded as an independent double-sided overlap unit. Therefore, the total bonding length is the sum of the lengths of each step. The formula for calculating the minimum bonding length has the same mathematical form as that for double-sided overlap, only requiring equivalent treatment of the total thickness of the composite material according to the step distribution. For double-sided overlap (i.e., the composite material is simultaneously overlapped on both sides of the metal plate), the load transfer path is symmetrical, and the calculation formula can be directly represented by the above shear lag theory model. In actual structures with uniform thickness, stepped bonding is often used to achieve a smooth thickness transition. The length of each step can be taken as an empirical value (e.g., 15mm), and the number of steps is determined by the total bonding length and the length of a single step. In areas of uniform thickness or uniform stress, continuous double-sided overlap can be used. The minimum bonding length for both overlap methods needs to be verified by the above formula to ensure that the strength and durability requirements under various temperature conditions are met.

[0056] In some feasible ways, the adhesive parameter design method of the adhesive structure of the present disclosure embodiment further includes: determining the adhesive boundary between the first material and the second material based on the region boundary formed by the first material and the region boundary formed by the second material.

[0057] For example, determining the bonding boundary between the first and second materials based on the boundary of the region formed by the first material and the boundary of the region formed by the second material specifically includes: First, based on the material partitioning results obtained in step 102, extracting the boundary lines or boundary surfaces of the first material (e.g., titanium alloy) region and the second material (e.g., composite material) region in the structure. For the finite element model, by identifying the set of element edges or nodes where the material properties of adjacent elements change, connecting these element edges or nodes to form discrete boundary lines or boundary surfaces, sorting and topologically reconstructing the discrete boundaries, generating continuous and closed preliminary boundaries. Then, generating the bonding boundary; if the first material region and the second material region are directly adjacent, the shared interface between them is defined as the bonding boundary.

[0058] In some examples, the above method further includes elliptical fitting or rounding smoothing of the boundary between the region formed by the first material and the boundary formed by the second material. Specifically, after obtaining the initial adhesive boundary, the boundary geometry is smoothed to optimize stress distribution, improve fatigue performance, and adapt to manufacturing process requirements. Through elliptical fitting or rounding smoothing, the stress distribution at the adhesive boundary can be significantly improved while maintaining the material partitioning function, reducing the risk of fatigue crack initiation, and simultaneously enhancing the manufacturability and assembly compatibility of the structure. The final processed boundary will serve as the reference geometry for the detailed design and process execution of the adhesive joint.

[0059] Example This disclosure uses a blade as an example to illustrate in detail the specific implementation process of the optimized design method for the bonded structure of fiber-reinforced resin matrix composite material and titanium alloy. The blade structure is required to ensure sufficient strength and lifespan while maximizing weight reduction under complex operating conditions of high speed, high temperature, and high aerodynamic load.

[0060] 1) Finite element model construction First, based on the actual geometric dimensions of the blade (maximum thickness at the blade root h0 = 7.17 mm, width of the variable thickness region 83 mm, and uniform thickness along the blade height), a conventional shell element finite element model was established using ABAQUS software. The blade was then discretized into a mesh, with a denser mesh used in high-load regions (such as near the shaft diameter) and a sparser mesh used in low-load regions. The elastic modulus of the titanium alloy was defined. E i =110GPa, thickness t i =3.05mm, elastic modulus of composite material E 0 = 56.556 GPa, single layer thickness t 01 = t 02 =0.5mm (symmetrical ply design).

[0061] Then, the static load conditions of the blade under actual operation are simulated by applying centrifugal load, aerodynamic load and constraint conditions, and static analysis calculations are performed to obtain the first principal direction bending moment value SM1 and the second principal direction bending moment value SM2 of each element of the blade.

[0062] Next, the post-processing program is run to read the finite element calculation result file, traverse all elements of the blade, extract and record the SM1 and SM2 values ​​of each element, and form a structural bending moment distribution dataset.

[0063] 2) Determination of material zoning scheme Bending moment bearing capacity threshold calibration: The bending moment bearing capacity threshold in this embodiment is determined by considering the adhesive properties, material strength, and safety factor requirements. SM 0 = 46.6N mm (calculated based on a shear strength of 1.738 MPa at high temperature (approximately 200°C) and a safety factor of 10).

[0064] Material region filtering: The program iterates through the bending moment dataset, comparing the SM1, SM2, and SM0 values ​​of each element. If either the SM1 or SM2 value of an element exceeds 46.6 N, the filtering is successful. When the value is mm, it is marked as a titanium alloy area; when both are less than or equal to 46.6 N, it is considered a titanium alloy area. When the value is mm, it is marked as a composite material region. Titanium alloy elements are classified as independent sets and displayed using the visualization function of finite element software. The red area is the high load region of titanium alloy, and the green area is the lightweight composite material region.

[0065] Boundary smoothing treatment: The boundary of the initially determined titanium alloy and composite material region is smoothed by elliptical fitting and rounding to avoid stress concentration at the boundary. The optimized boundary is used as the reference geometry for the adhesive joint design.

[0066] 3) Obtaining mechanical performance parameters Adhesive performance testing: Epoxy J29 adhesive samples were prepared using the circular torsion test method. Shear stress-strain curves were measured at room temperature (25℃), and the model was simplified to an equivalent elastoplastic model. Key parameters obtained: Shear modulus G = 1.309 GPa, plastic shear stress τ... p =57.43MPa, elastic shear strain γ e =0.0377, plastic shear strain γ p =0.0452, adhesive layer thickness h=0.15mm (select the optimal value within the range of 0.10~0.25mm based on process requirements).

[0067] Substrate performance parameters: Key parameters of titanium alloys and composite materials were obtained through material handbooks and standard tests, including the elastic modulus of titanium alloys. E i =110GPa, thickness t i =3.05mm, Elastic modulus of composite material E 0 = 56.556 GPa, single-layer thickness on both sides of the adhesive interface t 01 = t 02 =0.5mm.

[0068] 4) Selection of adhesive type and calculation of adhesive length Bonding type determination: Considering the need for gradual transition of blade structure thickness and stress concentration control, a stepped lap bonding scheme (with a stepped bonding surface) is selected to achieve a smooth transition between titanium alloy and composite materials.

[0069] Calculation of adhesive bonding length at room temperature: Based on the formula for calculating adhesive bonding length at temperatures below 150℃ mentioned above, calculate the minimum adhesive bonding length. l ≈15.15mm.

[0070] Regional Bonding Length Optimization: In the blade height direction, due to the uniform thickness of the blade's leading edge along the axial direction, a stepped overlap design is adopted. Each step is 0.5mm thick (4 single layers), with a step length of 15mm, and a total of 5-6 steps are set, resulting in a total bonding length of 75-90mm, meeting load transfer and process assembly requirements. In the chordal direction: In areas where the blade's chordal thickness gradually decreases, the composite material thickness increases by 0.5mm per step (one step each on the blade base and blade back, totaling 1mm). A linear equation is used to approximate the change in blade thickness along the chordal direction. When the decrease in blade thickness equals the cumulative increase in composite material step thickness, this location is determined as the bonding boundary. The chordal bonding length is calculated. x =38.04 45.4mm, this value is less than the width of the variable thickness area of ​​83mm, which meets the processing space requirements.

[0071] 5) Implementation effect verification The blade bonding structure designed using this method achieves the following technical effects: Significant weight reduction effect: composite material density (1.5 kg / cm³) 3 ~1.7kg / cm 3 ) is much lower than that of titanium alloy (4.6kg / cm). 3 While ensuring strength and lifespan, the weight reduction of the blades reaches more than 40%.

[0072] Improved structural reliability: The stepped bonding scheme effectively reduces stress concentration, with the minimum shear stress of the adhesive layer controlled within 10% of the maximum value. There is no creep accumulation after unloading, which improves the durability of the bonded structure.

[0073] Design efficiency optimization: By using finite element simulation and automated programs to screen material regions, the traditional experience-based design and extensive testing are replaced, which significantly shortens the design cycle and reduces R&D costs.

[0074] The process feasibility is met: the bonding length of 75~90mm in the blade height direction and 41.5mm in the chord direction are both within the allowable processing range, and the stepped step size (thickness 0.5mm, length 15mm) is compatible with the existing manufacturing process.

[0075] The foregoing primarily describes the solutions provided by the embodiments of this disclosure from the perspective of the server. It is understood that, in order to implement the above functions, the server includes the corresponding hardware structures and / or software modules for executing each function. Those skilled in the art should readily recognize that, based on the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein, this disclosure can be implemented in hardware or a combination of hardware and computer software. Whether a function is executed in hardware or by computer software driving hardware depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this disclosure.

[0076] The foregoing mainly describes the solutions provided by the embodiments of this disclosure. It is understood that, in order to achieve the above functions, the electronic device includes hardware structures and / or software modules corresponding to the execution of each function. Those skilled in the art should readily recognize that, based on the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein, this disclosure can be implemented in hardware or a combination of hardware and computer software. Whether a function is executed in hardware or by computer software driving hardware depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this disclosure.

[0077] This disclosure embodiment can divide the electronic device into functional units according to the above method example. For example, each function can be divided into a separate functional module, or two or more functions can be integrated into one processing module. The integrated module can be implemented in hardware or as a software functional module. It should be noted that the module division in this disclosure embodiment is illustrative and only represents one logical functional division; other division methods may be used in actual implementation.

[0078] Figure 5 A schematic diagram of the structure of an electronic device provided in an exemplary embodiment of this disclosure is shown. For example... Figure 5 As shown, the electronic device 500 includes at least one processor 501 and a memory 502 coupled to the processor 501. The processor 501 is configured to execute computer program instructions stored in the memory 502 to perform corresponding steps in the adhesive parameter design method for adhesive structures disclosed in embodiments of this disclosure.

[0079] The processor 501 described above can also be called a Central Processing Unit (CPU), which can be an integrated circuit chip with signal processing capabilities. Each step in the method disclosed in this embodiment can be implemented by the integrated logic circuitry in the processor 501 or by software instructions. The processor 501 can be a general-purpose processor, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, or discrete hardware components. The general-purpose processor can be a microprocessor or any conventional processor. The steps of the method disclosed in this embodiment can be directly implemented by a hardware decoding processor, or by a combination of hardware and software modules in the decoding processor. The software modules can be located in the memory 502, such as random access memory, flash memory, read-only memory, programmable read-only memory, electrically erasable programmable memory, registers, or other mature storage media in the art. The processor 501 reads information from the memory 502 and, in conjunction with its hardware, completes the steps of the method described above.

[0080] Furthermore, various operations / processes according to this disclosure, implemented via software and / or firmware, can be transmitted from a storage medium or network to a computer system with a dedicated hardware architecture, such as... Figure 6 The computer system 600 shown is equipped with the programs that constitute the software. When various programs are installed, the computer system is able to perform various functions, including the adhesive parameter design method for adhesive structures as described above. Figure 6 A schematic diagram of the structure of a computer system provided in an exemplary embodiment of this disclosure is shown.

[0081] Computer system 600 is intended to represent various forms of digital electronic computer devices, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. Electronic devices may also represent various forms of mobile devices, such as personal digital assistants, cellular phones, smartphones, wearable devices, and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely illustrative and are not intended to limit the implementation of the present disclosure described and / or claimed herein.

[0082] like Figure 6As shown, the computer system 600 includes a computing unit 601, which can perform various appropriate actions and processes based on a computer program stored in a read-only memory (ROM) 602 or a computer program loaded from a storage unit 608 into a random access memory (RAM) 603. The RAM 603 may also store various programs and data required for the operation of the computer system 600. The computing unit 601, ROM 602, and RAM 603 are interconnected via a bus 604. An input / output (I / O) interface 605 is also connected to the bus 604.

[0083] Multiple components in the computer system 600 are connected to the I / O interface 605, including: an input unit 606, an output unit 607, a storage unit 608, and a communication unit 609. The input unit 606 can be any type of device capable of inputting information into the computer system 600. The input unit 606 can receive input numerical or character information and generate key signal inputs related to user settings and / or function control of the electronic device. The output unit 607 can be any type of device capable of presenting information and may include, but is not limited to, a monitor, speaker, video / audio output terminal, vibrator, and / or printer. The storage unit 608 may include, but is not limited to, a hard disk and an optical disk. The communication unit 609 allows the computer system 600 to exchange information / data with other devices via a network (such as the Internet) and may include, but is not limited to, a modem, network card, infrared communication device, wireless communication transceiver, and / or chipset, such as Bluetooth™ devices, WiFi devices, WiMax devices, cellular communication devices, and / or the like.

[0084] The computing unit 601 can be various general-purpose and / or special-purpose processing components with processing and computing capabilities. Some examples of the computing unit 601 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various special-purpose artificial intelligence (AI) computing chips, various computing units running machine learning model algorithms, a digital signal processor (DSP), and any suitable processor, controller, microcontroller, etc. The computing unit 601 performs the various methods and processes described above. For example, in some embodiments, the adhesive parameter design method for the adhesive structure disclosed in the embodiments of this disclosure can be implemented as a computer software program, which is tangibly contained in a machine-readable medium, such as storage unit 608. In some embodiments, part or all of the computer program can be loaded and / or installed on the computer system 600 via ROM 602 and / or communication unit 609. In some embodiments, the computing unit 601 can be configured to perform the methods disclosed in the embodiments of this disclosure by any other suitable means (e.g., by means of firmware).

[0085] This disclosure also provides a computer-readable storage medium, wherein when the instructions in the computer-readable storage medium are executed by a processor of an electronic device, the electronic device is able to perform the methods disclosed in this disclosure.

[0086] The computer-readable storage medium in this disclosure can be a tangible medium that may contain or store a program for use by or in conjunction with an instruction execution system, apparatus, or device. The aforementioned computer-readable storage medium may include, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, apparatus, or devices, or any suitable combination of the foregoing. More specifically, the aforementioned computer-readable storage medium may include electrical connections based on one or more wires, a portable computer disk, a hard disk, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination of the foregoing.

[0087] The aforementioned computer-readable medium may be included in the aforementioned electronic device; or it may exist independently and not assembled into the electronic device.

[0088] This disclosure also provides a computer program product, including a computer program, wherein when the computer program is executed by a processor, it implements the methods disclosed in the embodiments of this disclosure.

[0089] In embodiments of this disclosure, computer program code for performing the operations of this disclosure can be written in one or more programming languages ​​or a combination thereof. These programming languages ​​include, but are not limited to, object-oriented programming languages ​​such as Java, Smalltalk, and C++, as well as conventional procedural programming languages ​​such as the "C" language or similar programming languages. The program code can be executed entirely on the user's computer, partially on the user's computer, as a standalone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In cases involving remote computers, the remote computer can be connected to the user's computer via any type of network (including a local area network (LAN) or a wide area network (WAN)), or it can be connected to an external computer.

[0090] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of this disclosure. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions indicated in the blocks may occur in a different order than those indicated in the drawings. For example, two consecutively indicated blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, can be implemented using a dedicated hardware-based system that performs the specified function or operation, or using a combination of dedicated hardware and computer instructions.

[0091] The modules, components, or units described in the embodiments of this disclosure can be implemented in software or hardware. The names of the modules, components, or units do not necessarily constitute a limitation on the module, component, or unit itself.

[0092] The functions described above in this document can be performed at least in part by one or more hardware logic components. For example, without limitation, exemplary hardware logic components that can be used include: field-programmable gate arrays (FPGAs), application-specific integrated circuits (ASICs), application-specific standard products (ASSPs), system-on-a-chip (SoCs), complex programmable logic devices (CPLDs), and so on.

[0093] The above description is merely an illustration of some embodiments of this disclosure and the technical principles employed. Those skilled in the art should understand that the scope of this disclosure is not limited to technical solutions formed by specific combinations of the above-described technical features, but should also cover other technical solutions formed by arbitrary combinations of the above-described technical features or their equivalents without departing from the above-described concept. For example, technical solutions formed by substituting the above features with (but not limited to) technical features disclosed in this disclosure that have similar functions.

[0094] While specific embodiments of this disclosure have been described in detail by way of example, those skilled in the art should understand that the examples are for illustrative purposes only and not intended to limit the scope of this disclosure. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of this disclosure. The scope of this disclosure is defined by the appended claims.

Claims

1. A method for designing adhesive bonding parameters for an adhesive structure, characterized in that, include: Establish a finite element model of the structure to be designed, perform load analysis, and obtain the bending moment values ​​of each element of the structure to be designed; Compare the bending moment values ​​of each unit with the bending moment bearing threshold, determine the region where the bending moment value is greater than the bending moment bearing threshold and select the first material, determine the region where the bending moment value is less than or equal to the bending moment bearing threshold and select the second material; Obtain the mechanical property parameters of the first material, the second material, and the adhesive; Based on the aforementioned mechanical property parameters, the minimum adhesive length for bonding the first material and the second material is determined.

2. The method for designing adhesive bonding parameters for an adhesive structure according to claim 1, characterized in that, The first material is a metallic material, and the second material is a fiber-reinforced resin-based composite material.

3. The method for designing adhesive bonding parameters for an adhesive structure according to claim 1, characterized in that, The mechanical performance parameters include the shear modulus of the adhesive, the target thickness of the adhesive, the plastic shear strain of the adhesive, the elastic shear strain of the adhesive, the elastic modulus of the first material, the target thickness of the first material, the elastic modulus of the second material, and the target thickness of the second material. If the temperature corresponding to the target operating condition does not exceed the preset temperature threshold, the step of determining the minimum bonding length of the adhesive used to connect the first material and the second material based on the mechanical performance parameters includes: Based on the shear modulus of the adhesive, the target thickness of the adhesive, the elastic modulus of the first material, the target thickness of the first material, the elastic modulus of the second material, and the target thickness of the second material, the shear stress distribution characteristic parameters of the adhesive interface are determined. The theoretical overlap length is determined based on the elastic shear strain of the adhesive, the plastic shear strain of the adhesive layer, and the characteristic parameters of the shear stress distribution. Based on the theoretical overlap length and the preset safety factor, the minimum overlap length of the adhesive bonding area to meet the load transfer requirements is determined.

4. The method for designing adhesive bonding parameters for an adhesive structure according to claim 3, characterized in that, If the temperature corresponding to the target working condition exceeds a preset temperature threshold, determining the minimum adhesive length for the bonding area connecting the first material and the second material based on the mechanical performance parameters includes: Based on the elastic modulus of the first material, the thickness of the first material, the elastic modulus of the second material, the thickness of the second material, and the plastic shear strength and bending moment bearing threshold of the adhesive at the target temperature, the minimum adhesive length of the bonding area at the target temperature is determined.

5. The method for designing adhesive bonding parameters for an adhesive structure according to claim 1, characterized in that, The method further includes: The bending moment bearing threshold is determined based on the minimum adhesive length to be optimized, the elastic modulus of the second material, the thickness of the second material, the elastic modulus of the first material, the thickness of the first material, and the plastic shear strength of the adhesive.

6. The method for designing adhesive bonding parameters for an adhesive structure according to claim 5, characterized in that, The method further includes: The bonding boundary between the first material and the second material is determined based on the boundary of the region formed by the first material and the boundary of the region formed by the second material.

7. The method for designing adhesive bonding parameters for an adhesive structure according to claim 6, characterized in that, The method further includes: The boundary of the region formed by the first material and the boundary formed by the second material are subjected to elliptical fitting or rounded corner smoothing.

8. An electronic device, characterized in that, include: processor; as well as, Memory for stored programs; The program includes instructions that, when executed by the processor, cause the processor to perform the adhesive parameter design method for the adhesive structure according to any one of claims 1 to 7.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that, When executed by a processor, the computer program implements the steps of the method described in any one of claims 1 to 7.

10. A computer program product, characterized in that, The computer program includes a computer program that, when executed by a computer's processor, causes the computer to perform the adhesive parameter design method for the adhesive structure according to any one of claims 1 to 7.

Images