A heat dissipation structure and process method for driving fluid flow by chip waste heat

Abstract

The application discloses a heat dissipation structure and process method for driving fluid flow by using chip waste heat, relates to the technical field of fluid dynamics, and comprises a V-shaped flow channel body arranged above a heating body, which comprises a variable cross-section first flow channel section and an equal cross-section second flow channel section, and the two ends are communicated with external fluid, and the inner wall can be provided with an asymmetric non-symmetric electric heating driving electrode with an insulating layer, and the external connecting end is provided with a blind plug connector. The process generates a thermal driving force for the fluid in the flow channel by the waste heat of the heating body, a pressure difference is formed by combining the Venturi effect, the thermal driving force is increased by 100-1000 times by starting the electrode when the liquid medium, and the fluid is driven to flow in one direction. The application drives without additional power by using waste heat, breaks through the limitation of buoyancy convection vortex cell, destroys the thermal boundary layer and reduces the thermal resistance, greatly improves the heat exchange efficiency, and is suitable for precise electronic equipment, servers and other multi-scene heat dissipation requirements.

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