A coil-enclosed case and a gas-enclosing method
CN122161108APending Publication Date: 2026-06-05HEFEI JUNENG ELECTRO PHYSICS HIGH-TECH DEV CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- HEFEI JUNENG ELECTRO PHYSICS HIGH-TECH DEV CO LTD
- Filing Date
- 2026-04-16
- Publication Date
- 2026-06-05
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Figure CN122161108A_ABST
Abstract
The application discloses a coil-encapsulated shell and a gas encapsulation method, relates to the technical field of coil encapsulation, and comprises a shell structure, wherein a coil and a gas composition are arranged in the shell structure, the gas composition comprises nitrogen and helium, and the application further discloses a gas encapsulation method, which comprises the following steps: S1, closing a first valve group and opening an air extraction device. The method can solve the problems of easy leakage pollution, difficult rapid leakage detection and difficult insulation requirement satisfaction of semiconductor coil encapsulation, through a process of step-by-step vacuum extraction, independent gas distribution and micro-positive-pressure gas charging, and by using mixed gas of nitrogen and helium, the requirements of coil insulation operation of greater than or equal to 1000V can be met, atmospheric infiltration can be avoided, and the air release rate can be reduced; meanwhile, helium can realize leakage detection, and the test period can be greatly compressed. The method is simple to operate, can complete sealing verification in advance, reduces the defective rate, and guarantees the safe operation of high-vacuum equipment.
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