A press and test mechanism for semiconductor panels

Abstract

The application relates to the technical field of semiconductor plate manufacturing, and provides a pressing and testing mechanism for a semiconductor plate, which comprises a cross beam, left supporting arms, right supporting arms, supporting plates and vertical driving devices, each of the supporting plates is provided with a pressing and testing assembly at two inner corner positions, the left supporting arms are provided with two groups of opposite infrared emitters, the right supporting arms are provided with opposite infrared receivers corresponding to the two groups of opposite infrared emitters, a first pressing finger sleeve and an elastic testing needle are integrated in the same pressing and testing assembly, the pressing and electrical testing processes are synchronously executed, the semiconductor plate does not need to be transferred between a testing device and a pressing device, the time consumption of process connection is reduced, and the overall efficiency of the packaging process is remarkably improved. According to the detection design of the opposite infrared light hole coaxiality, whether the plate is pressed in place can be judged during the pressing action execution process, instead of the post-detection after traditional pressing.

Description

Technical Field

[0001] This invention relates to the field of semiconductor board manufacturing technology, and in particular to a semiconductor board pressing and testing mechanism. Background Technology

[0002] In the field of semiconductor packaging manufacturing, the packaging process of semiconductor boards is one of the core links that determines the performance and reliability of the final product. Among them, the lamination process, as a key step before packaging, requires pressing the semiconductor board into the corresponding mold cavity with preset precision to ensure that the board and the pins and circuit structures inside the mold are precisely aligned, laying the foundation for subsequent packaging (such as molding and bonding). As semiconductor products develop towards miniaturization and high density, the dimensional accuracy and circuit integration of semiconductor boards continue to improve, and the positional accuracy requirements of the lamination process have reached the micrometer level, gradually highlighting the technical limitations of traditional lamination mechanisms.

[0003] Currently, in semiconductor packaging processes, the lamination mechanism and the electrical testing stage generally operate independently. To ensure the circuit reliability of semiconductor boards (such as avoiding product failure due to internal circuit breaks or short circuits), the industry typically sets up a separate electrical testing station before the lamination process. This station uses probes to contact test points on the board to detect parameters such as circuit continuity and resistance. This separate operation mode has significant drawbacks: Firstly, the semiconductor board needs to be transferred between the testing and lamination equipment, which not only increases production time and reduces overall packaging efficiency, but also may cause board displacement or surface damage due to vibration and collisions during transfer, further affecting subsequent lamination accuracy. Secondly, the connection between testing and lamination lacks coordination. Boards that pass testing may undergo new changes in state after transfer (such as minor deformation caused by environmental temperature and humidity), and these changes cannot be detected in time, requiring lamination according to the original parameters, increasing the risk of defective products.

[0004] Meanwhile, existing pressing mechanisms generally lack effective real-time detection and intervention mechanisms during the lamination process. Semiconductor boards may exhibit minor deformations (such as warping caused by stress release after cutting), which can lead to uneven stress during clamping and fixation, resulting in positional shifts during lamination. Trace amounts of packaging debris or foreign matter may remain inside the mold cavity, interfering with the board during lamination and hindering its proper insertion. Because existing pressing mechanisms can only complete the pressing action according to a preset program, they cannot monitor the relative position and stress of the board and mold during lamination in real time. When such positional deviations or interference occur, they are often only detected through manual sampling or subsequent testing after the lamination process is complete. By this time, irreversible consequences such as incomplete board lamination, mold cavity damage, or even crushing of the semiconductor board's circuit structure have already occurred. This not only increases material waste and rework costs but also severely impacts the yield and production stability of packaged products.

[0005] It is evident that existing technologies still need improvement and enhancement. Summary of the Invention

[0006] In view of the shortcomings of the prior art, the purpose of the present invention is to provide a bonding and testing mechanism for semiconductor boards, so as to realize the simultaneous execution of bonding and electrical testing processes.

[0007] To achieve the above objectives, the present invention adopts the following technical solution: A semiconductor board lamination and testing mechanism includes a crossbeam, a left support arm at one end of the crossbeam, a right support arm at the other end of the crossbeam, two support plates mounted on the crossbeam and located between the left and right support arms, and a vertical drive device for driving the support plates and the crossbeam to move up and down as a whole. Each support plate has a pressure testing component at two inner corners. The left support arm has two sets of through-beam infrared emitters, and the right support arm has through-beam infrared receivers corresponding to the two sets of through-beam infrared emitters. Each pressure testing component includes a first guide seat fixed at a corner of the support plate, a first pressure rod extending vertically and moving up and down along the first guide seat, and a... The first limiting head is placed on the top of the first pressure rod, the elastic probe is set on the bottom surface of the first pressure rod, the first pressure finger sleeve is sleeved on the bottom of the first pressure rod, and the first spring is sleeved between the first pressure finger sleeve and the first guide seat. The first guide seat has a first light-perforated hole, and the first pressure rod has a second light-perforated hole. When the first pressure finger sleeve presses the semiconductor board into place, the first light-perforated hole on the first guide seat and the second light-perforated hole on the first pressure rod are coaxial. The infrared light emitted by the through-beam infrared emitter can pass through the first light-perforated hole and the second light-perforated hole on the two pressure testing components located between the through-beam infrared emitter and the through-beam infrared receiver.

[0008] As a further improvement to the above technical solution, the bottom surface of the first pressure rod is provided with a positioning ring, and the elastic probe includes an upper insertion post, a hollow shape and a needle head connected in sequence from top to bottom. The positioning ring is docked with the upper insertion post and fixedly connected.

[0009] As a further improvement to the above technical solution, the positioning ring has a mounting hole on its circumference, and the upper insertion post has a first threaded hole corresponding to the mounting hole. The locking screw passes through the mounting hole and connects to the first threaded hole. The positioning ring has a wiring groove, and the upper insertion post is electrically connected to the spring wire.

[0010] As a further improvement to the above technical solution, the hollow shape includes four circumferentially spaced angled conductive springs, and the four angled conductive springs form a three-dimensional rhombus.

[0011] As a further improvement to the above technical solution, an elastic rubber ball is placed inside the four angled conductive spring pieces.

[0012] As a further improvement to the above technical solution, the first pressure finger sleeve includes a circular sleeve body and a semi-circular pressure block disposed at the bottom of the circular sleeve body. The semi-circular pressure block is provided with a C-shaped hole that mates with the positioning ring and a conical hole for avoiding the hollow deformation. The circular sleeve body is connected to the first pressure rod by a cotter pin.

[0013] As a further improvement to the above technical solution, the cross-section of the first pressure rod is D-shaped, the first guide seat is provided with a guide hole that matches the shape of the first pressure rod, and the first limiting head is connected to the first pressure rod through a cotter pin.

[0014] As a further improvement to the above technical solution, each of the support plates is provided with an external pressure component at both outer corners.

[0015] As a further improvement to the above technical solution, the external pressure assembly includes a second guide seat fixed at the corner of the support plate, a second pressure rod extending vertically and moving up and down along the second guide seat, a second limiting head disposed at the top of the second pressure rod, a second pressure finger sleeve sleeved at the bottom of the second pressure rod, and a second spring sleeved between the second pressure finger sleeve and the second guide seat. The second guide seat has a third light-perforated hole, and the second pressure rod has a fourth light-perforated hole. When the second pressure finger sleeve presses the semiconductor board into place, the third light-perforated hole on the second guide seat and the fourth light-perforated hole on the second pressure rod are coaxial. The infrared light emitted by the through-beam infrared emitter can pass through the third light-perforated hole and the fourth light-perforated hole on the two external pressure assemblies located between the through-beam infrared emitter and the through-beam infrared receiver.

[0016] As a further improvement to the above technical solution, a guide groove that cooperates with the crossbeam is provided in the middle of the bottom surface of the support plate, a horizontally extending waist-shaped hole is provided on the support plate, and a second threaded hole corresponding to the waist-shaped hole is provided on the crossbeam. The adjusting screw passes through the waist-shaped hole and connects to the second threaded hole.

[0017] Beneficial effects: Compared with existing technologies, the semiconductor board lamination and testing mechanism provided by this invention integrates a first pressure finger and an elastic probe in the same pressure testing component, enabling simultaneous execution of lamination and electrical testing processes without the need to transfer the semiconductor board between the testing and lamination equipment. On the one hand, this reduces the time spent on process connections, significantly improving the overall efficiency of the packaging process; on the other hand, it completely avoids board position displacement or surface damage caused by vibration and collision during transportation, reducing the risk of subsequent lamination accuracy deviations from the source. Based on the coaxial detection design of the through-beam infrared light penetration, it can instantly determine whether the board is properly laminationd during the lamination process, rather than the traditional post-lamination inspection. If board deformation, foreign object interference in the mold cavity, or other issues lead to incomplete lamination, the first and second light penetrations will not be coaxial, blocking the infrared light. This immediately triggers a stop or adjustment signal, preventing irreversible consequences such as board circuit crushing and mold damage caused by incomplete lamination or overpressure, effectively reducing the risk of defective products and improving the yield of packaged products. Attached Figure Description

[0018] Figure 1 This is a perspective view of the pressing and testing mechanism provided by the present invention in a non-working state.

[0019] Figure 2 This is a perspective view of the pressing and testing mechanism provided by the present invention in a non-working state.

[0020] Figure 3 This is a schematic diagram of the structure of the pressure testing component and the external testing component.

[0021] Figure 4 This is a three-dimensional view of the elastic probe.

[0022] Figure 5 This is a schematic diagram of the first compression member.

[0023] Figure 6 This is a schematic diagram of the structure of the first pressure finger sleeve.

[0024] Key component symbols: 1-Crossbeam, 2-Left support arm, 3-Right support arm, 4-Support plate, 41-Guide groove, 42-Oval hole, 5-Pressure testing assembly, 51-First guide seat, 52-First pressure rod, 53-First limiting head, 54-Elastic probe, 541-Upper insertion post, 542-Hollow shape, 5421-Angled conductive spring, 5422-Elastic ball, 543-Needle, 544-First threaded hole, 545-Spring wire, 55-First pressure finger sleeve, 551-Circular sleeve, 5 52-Semicircular pressure block, 553-C-shaped hole, 554-Conical hole, 56-First spring, 57-First light-emitting hole, 58-Second light-emitting hole, 59-Positioning ring, 591-Mounting hole, 592-Wire routing groove, 50-Locking screw, 61-Through-beam infrared transmitter, 62-Through-beam infrared receiver, 7-Cocker pin, 8-External pressure assembly, 81-Second guide seat, 82-Second pressure rod, 83-Second limit head, 84-Second pressure finger sleeve, 85-Second spring, 86-Third light-emitting hole. Detailed Implementation

[0025] This invention provides a bonding and testing mechanism for semiconductor boards. To make the objectives, technical solutions, and effects of this invention clearer and more explicit, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only for explaining the invention and are not intended to limit the invention.

[0026] In the description of this invention, it should be understood that the terms "upper," "lower," "left," and "right," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or a specific orientational structure and operation. Therefore, they should not be construed as limitations on the invention. Furthermore, "first" and "second" are only for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "multiple" means two or more.

[0027] Please see Figures 1 to 6As shown, the present invention provides a pressing and testing mechanism for semiconductor boards, including a crossbeam 1, a left support arm 2 disposed at one end of the crossbeam 1, a right support arm 3 disposed at the other end of the crossbeam 1, two support plates 4 disposed on the crossbeam 1 and located between the left support arm 2 and the right support arm 3, and a vertical driving device for driving the support plates 4 and the crossbeam 1 to move up and down as a whole. Each support plate 4 has a pressure testing component 5 at two inner corners. The left support arm 2 is provided with two sets of through-beam infrared emitters 61, and the right support arm 3 is provided with through-beam infrared receivers 62 corresponding to the two sets of through-beam infrared emitters 61. Each pressure testing component 5 includes a first guide seat 51 fixed at the corner of the support plate 4, a first pressure rod 52 extending vertically and moving up and down along the first guide seat 51, and a first pressure rod 52 disposed at the first pressure rod 4. The first limiting head 53 at the top of the rod 52, the elastic probe 54 disposed on the bottom surface of the first pressure rod 52, the first pressure finger sleeve 55 sleeved on the bottom of the first pressure rod 52, and the first spring 56 sleeved between the first pressure finger sleeve 55 and the first guide seat 51. The first guide seat 51 has a first light-passing hole 57 and the first pressure rod 52 has a second light-passing hole 58. When the first pressure finger sleeve 55 presses the semiconductor board into place, the first light-passing hole 57 on the first guide seat 51 and the second light-passing hole 58 on the first pressure rod 52 are coaxial. The infrared light emitted by the through-beam infrared emitter 61 can pass through the first light-passing hole 57 and the second light-passing hole 58 on the two pressure testing components 5 located between the through-beam infrared emitter 61 and the through-beam infrared receiver 62.

[0028] When the mechanism is in standby mode during operation, the vertical drive device is not activated, and the crossbeam 1, support plate 4, and pressure testing assembly 5 are all in a high position. At this time, the first spring 56 is in a naturally extended state, the first pressure rod 52 extends relative to the first guide seat 51 under the elastic force of the first spring 56, the lower end face of the elastic probe 54 is lower than the lower end face of the first pressure finger sleeve 55, and the through-beam infrared transmitter 61 and receiver are in a power-on standby state. However, because the first light-perforating hole 57 of the first guide seat 51 and the second light-perforating hole 58 of the first pressure rod 52 are not coaxial, the infrared light is blocked by the first pressure rod 52, and the receiver has no signal feedback.

[0029] When the pressing and testing are to be performed, the vertical drive device is activated, driving the crossbeam 1, left support arm 2, right support arm 3, and support plate 4 to move vertically downwards as a whole, causing the four sets of pressure testing components 5 to synchronously approach the semiconductor board. First, the lower end face of the first pressure finger sleeve 55 contacts the surface of the semiconductor board. As the whole continues to move downwards, the first pressure finger sleeve 55 receives the reaction force from the semiconductor board, pushing the first pressure rod 52 to move upwards relative to the first guide seat 51. The first spring 56 is compressed and generates elastic pressure, which is transmitted to the semiconductor board through the first pressure finger sleeve 55, realizing the pressing action on the semiconductor board. At the same time, during the downward movement of the first pressure rod 52, the elastic probe 54 at its lower end synchronously contacts the test point of the semiconductor board. Through the reliable contact between the elastic probe 54 and the test point, the real-time testing of parameters such as the continuity and resistance value of the board circuit is completed.

[0030] When the first pressing finger sleeve 55 fully presses the semiconductor board into the preset position of the mold cavity, the upward movement of the first pressing rod 52 relative to the first guide seat 51 reaches the preset value. At this time, the first light-emitting hole 57 on the first guide seat 51 and the second light-emitting hole 58 on the first pressing rod 52 are precisely aligned and coaxial. The infrared light emitted by the through-beam infrared emitter 61 can pass through the first light-emitting hole 57 and the second light-emitting hole 58 on the same side in sequence, and is finally received by the through-beam infrared receiver 62. The receiver outputs a pressing-in signal, indicating that the pressing accuracy and position meet the requirements, and the test data is collected simultaneously.

[0031] After pressing and testing are completed, the vertical drive device drives the crossbeam 1 and all components to move vertically upward. Under the elastic restoring force of the first spring 56, the first pressure rod 52 resets downward relative to the first guide seat 51. The elastic probe 54 and the first pressure finger sleeve 55 disengage from the semiconductor board. The first light penetration hole 57 and the second light penetration hole 58 are misaligned again, the infrared light is blocked, and the mechanism returns to its initial state, waiting for the next operation cycle.

[0032] The following are three situations where the pressing is not in place: (1) Foreign objects such as encapsulation debris and metal impurities remain inside the mold cavity. When the first pressing finger sleeve 55 pushes the semiconductor board into the cavity, the foreign objects will form a supporting resistance on the bottom of the board, preventing the board from continuing to move down to the preset position. Affected by the resistance of the foreign objects, the first pressing finger sleeve 55 cannot push the board down further, resulting in the first pressing rod 52 moving up less than the preset value relative to the first guide seat 51. At this time, the first light-perforated hole 57 of the first guide seat 51 and the second light-perforated hole 58 of the first pressing rod 52 are not completely aligned (or completely misaligned), and the light emitted by the through-beam infrared emitter 61 is blocked by the side wall of the first pressing rod 52, so the through-beam infrared receiver 62 has no signal input.

[0033] If the controller detects that the infrared receiver 62 has no signal (or the signal is interrupted), it determines that the pressing is not in place (foreign object interference), immediately triggers the vertical drive device to stop, and outputs a mold foreign object alarm signal to prompt the staff to clean the foreign object in the cavity.

[0034] (2) The semiconductor board warps due to stress release during early cutting and changes in temperature and humidity in the storage environment (such as a bulge in the middle or an upward curve at the edge). During pressing, the fit between different areas of the semiconductor board and the mold cavity is inconsistent, resulting in some pressure testing components 5 failing to press properly. When the vertical drive device moves the four sets of pressure testing components 5 downwards synchronously, the high convex area of ​​the warped board will first contact the first pressure finger sleeve 55 at the corresponding position. The first pressure rod 52 in this area will move upwards first due to the reaction force. However, because there is a gap between the concave area of ​​the warped board and the mold cavity, the first pressure finger sleeve 55 at the corresponding position cannot press down sufficiently, and the upward movement of its first pressure rod 52 is insufficient. Ultimately, this manifests as the light penetration of some pressure testing components 5 being coaxial (the convex area is pressed in place, and the infrared light path is open), and the light penetration of some pressure testing components 5 being misaligned (the concave area is not pressed in place, and the infrared light path is broken).

[0035] If the controller detects that the two sets of infrared signals of the left and right support arms 3 are on and off (or that a single set of infrared signals is partially on and off), it determines that the pressing is not in place (board warping), immediately stops the vertical drive action, and outputs a board deformation alarm signal to avoid damage to the board circuit due to local overvoltage.

[0036] (3) Due to incorrect parameter settings (such as setting the stroke threshold too low) or mechanical failure, the vertical drive device caused the downward movement of the crossbeam 1 and the pressure testing assembly 5 to not reach the preset stroke required for pressing into place. The first pressure finger sleeve 55 of all pressure testing assemblies 5 were in contact with the plate, but due to insufficient overall downward movement, the upward movement of the first pressure rod 52 relative to the first guide seat 51 was generally less than the standard value. The infrared light penetrations of the four sets of pressure testing assemblies 5 were not coaxial, and the two sets of through infrared receivers 62 of the left and right support arms 3 had no signal.

[0037] The controller detected that two sets of infrared signals were continuously interrupted, and the vertical drive device had reached its set maximum stroke. It determined that the pressing was not in place (insufficient drive stroke), triggered a shutdown and output an alarm for abnormal drive parameters, prompting the staff to check the drive device parameters or repair the mechanical transmission structure.

[0038] The semiconductor board lamination and testing mechanism provided by this invention integrates a first pressure finger sleeve 55 and an elastic probe 54 in the same pressure testing component, enabling simultaneous execution of lamination and electrical testing processes without the need to transfer the semiconductor board between the testing equipment and the lamination equipment. On the one hand, this reduces the time spent on process connections, significantly improving the overall efficiency of the packaging process; on the other hand, it completely avoids board position displacement or surface damage caused by vibration and collision during transportation, reducing the risk of subsequent lamination accuracy deviations from the source. Based on the coaxial detection design of the through-beam infrared light-perforation holes, it can instantly determine whether the board is properly laminationd during the lamination process, rather than the traditional post-lamination detection. If board deformation, foreign object interference in the mold cavity, or other issues lead to incomplete lamination, the first light-perforation hole 57 and the second light-perforation hole 58 will not be coaxial, blocking the infrared light. This can immediately trigger a stop or adjustment signal, avoiding irreversible consequences such as board circuit crushing and mold damage caused by incomplete lamination or overpressure, effectively reducing the risk of defective products and improving the yield of packaged products.

[0039] In addition, the elastic probe itself is elastic in the pressure testing assembly, and the movement of the first pressure rod 52 is buffered by the first spring 56. The dual elastic design can ensure reliable contact between the elastic probe 54 and the test point of the semiconductor board (avoiding poor contact leading to test errors), while also offsetting the small impact force during the pressing process, preventing the elastic probe 54 or the test point of the board from being damaged due to rigid contact, thus balancing test accuracy and board protection.

[0040] Pressure testing components 5 are respectively installed at the four inner corners of the two support plates 4, forming a layout for four-point synchronous pressing and testing. This design can ensure that the semiconductor board is subjected to uniform force during the pressing process, avoiding board warping and positional displacement caused by single-point or asymmetrical pressing, and further adapting to the micron-level pressing accuracy requirements of the miniaturization and high-density development of semiconductor boards.

[0041] Specifically, the bottom surface of the first pressure rod 52 is provided with a positioning ring 59. The elastic probe 54 includes an upper insertion post 541, a hollow shape 542, and a needle tip 543 connected sequentially from top to bottom. The positioning ring 59 is mated with and fixedly connected to the upper insertion post 541, which can strictly align the axis of the elastic probe 54 with the axis of the first pressure rod 52, avoiding radial displacement of the probe due to installation deviation. At the same time, the fixed connection between the positioning ring 59 and the upper insertion post 541 can withstand the small impact force during the pressing process, preventing the probe from loosening or shifting, ensuring that the needle tip 543 is always accurately aligned with the test point of the semiconductor board, fundamentally eliminating problems such as missed contact and poor contact caused by the offset of the elastic probe 54, and ensuring the accuracy of electrical test data.

[0042] The hollow deformable part 542 of the elastic probe 54 adopts an axially hollow structure. Compared with the traditional solid elastomer, its deformation direction is more controllable and the deformation is more uniform. When the probe 543 contacts the test point, the hollow deformable part 542 can be uniformly compressed along the axis to generate a stable elastic recovery force, so that the probe 543 and the test point maintain a preset contact pressure. At the same time, the hollow structure has a stronger deformation buffering capacity, which can absorb the small vibration of the first pressure rod 52 or the small undulation of the board surface during the pressing process, avoid rigid impact damage to the test point or the probe 543, extend the service life of the probe, and protect the circuit structure integrity of the semiconductor board.

[0043] Furthermore, the positioning ring 59 has a mounting hole 591 on its circumferential surface, and the upper insertion post 541 has a first threaded hole 544 corresponding to the mounting hole 591. The locking screw 50 passes through the mounting hole 591 and connects to the first threaded hole 544. The locking screw 50 passes through the mounting hole 591 of the positioning ring 59 and is tightened into the threaded hole of the upper insertion post 541, which can rigidly lock the upper insertion post 541 and the positioning ring 59, completely offsetting the vibration of the first pressure rod 52 or the axial or radial impact force brought about by the reaction force of the plate during the pressing process, avoiding the elastic probe 54 from becoming slightly loose or offset due to long-term stress, ensuring that the elastic probe 54 is always coaxial with the first pressure rod 52, and the needle tip 543 is accurately aligned with the test point.

[0044] During maintenance, simply unscrewing the locking screw 50 is sufficient to separate the upper insertion post 541 from the positioning ring 59, avoiding damage to the inner wall of the positioning ring 59 or the surface of the upper insertion post 541, ensuring positioning accuracy after repeated installation, and reducing the difficulty of replacing the elastic probe 54.

[0045] In addition, the positioning ring 59 has a wiring groove 592, and the upper insertion post 541 is electrically connected to the spring wire 545. The wiring groove 592 of the positioning ring 59 provides a dedicated storage channel for the spring wire 545: one end of the spring wire 545 is electrically connected to the upper insertion post 541, and the other end can extend along the wiring groove 592 to the external test circuit. The wiring groove 592 can restrict the arrangement path of the spring wire 545, preventing it from getting tangled, rubbing, or being squeezed with components such as the first guide seat 51 and the first spring 56 when the pressure rod moves up and down, fundamentally eliminating problems such as circuit jamming causing obstruction of the pressing action and wire wear causing signal interruption.

[0046] The elasticity of the spring wire 545 adapts to the movement stroke. During the pressing process, the first pressure rod 52 will move up and down with the pressing action. The spring wire 545 can move and stretch synchronously with the pressure rod. It will not cause the wire to break due to stretching, nor will it cause the line to accumulate due to contraction. It always maintains a stable conductive path, ensuring that the test signal is transmitted in real time and without loss, and avoiding the distortion of test data due to line problems.

[0047] In this embodiment, the hollow deformable type 542 includes four circumferentially spaced angled conductive spring pieces 5421, which together form a three-dimensional rhombus. When not pressed, the four angled conductive spring pieces 5421 are circumferentially evenly spaced, forming a three-dimensional rhombus structure with the opening facing downwards. At this time, the spring pieces are in a naturally extended state, the angles (usually obtuse angles of 120°-150°) are not compressed by external force, the axial height of the three-dimensional rhombus is at its maximum, and the needle tip 543 maintains a preset relative position with the first pressure finger sleeve 55 under the support of the spring pieces. The spring wire 545 and the top of the spring piece (connected to the upper insertion post 541) have achieved a stable conductive connection.

[0048] The four angled conductive springs 5421 are all made of conductive materials (such as beryllium copper or phosphor bronze), and their top ends are tightly welded to the upper post 541 (metal material), while their bottom ends are welded and fixed to the needle 543 (conductive material). During the compression deformation process, the angled conductive springs 5421 always maintain conductive contact with the upper post 541 and the needle 543, forming four parallel conductive paths: the upper post 541, the four angled conductive springs 5421, the needle 543, and the test point. Test signals (such as current and voltage) can be transmitted through any one or more paths. Even if one spring has poor contact due to minor impurities, the other springs can still ensure stable signal transmission, avoiding test interruption caused by a single path failure.

[0049] After pressing and testing are completed, the vertical drive device moves the pressure testing component 5 upward, the needle 543 disengages from the test point, and the axial reaction force on the angled conductive spring 5421 disappears. Relying on the elastic memory of their own materials, the four angled conductive springs 5421 synchronously return to their initial state, the three-dimensional rhomboid structure extends axially, and the height returns to its maximum. The needle 543 returns to its initial position along with the springs, awaiting the next operating cycle.

[0050] In a preferred embodiment, elastic balls 5422 (typically made of high-temperature resistant elastic materials such as silicone rubber or fluororubber) are placed inside the four angled conductive spring pieces 5421, filling the three-dimensional rhombus formed by the four angled conductive spring pieces 5421. When not pressed, the four angled conductive spring pieces 5421 are naturally unfolded in a three-dimensional rhombus shape, and the elastic balls 5422 are in a natural state without external compression, tightly filling the hollow area inside the rhombus. At this time, the elastic balls 5422 only play a slight supporting role, using their own elastic tension to help the spring pieces maintain the regular shape of the three-dimensional rhombus, avoiding slight collapse or deflection of the spring pieces due to transportation, static placement, etc., and ensuring that the initial position of the needle 543 is accurately aligned with the test point of the semiconductor board.

[0051] When the needle 543 contacts the test point and is subjected to axial reaction force, the four angled conductive springs 5421 bend synchronously towards the central axis of the rhombus. Their internal space (rhombus volume) gradually shrinks with deformation, thus compressing the built-in elastic ball 5422. The compressed ball generates a uniform radial reaction force, which acts in the opposite direction on the inner wall of each spring, forcibly constraining the deformation direction of the spring. This prevents excessive bending and lateral deflection of any spring due to slight material differences or uneven force, ensuring that the four springs always deform symmetrically along the axial direction, and that the rhombus structure remains regular.

[0052] The elastic ball 5422 is a non-conductive insulating material. When filled inside the spring sheet, it only makes physical contact with the inner wall of the spring sheet and does not participate in the conductive process. After the compression test is completed, the needle 543 is removed from the test point, and the axial reaction force on the spring sheet disappears. The elastic ball 5422 quickly recovers its natural volume due to its own elasticity. Through the outward expansion tension, it pushes the four spring sheets to expand outward synchronously, helping the spring sheets overcome the slight fatigue resistance of their own material and more quickly return to their initial three-dimensional rhomboid shape.

[0053] Specifically, the first pressure finger sleeve 55 includes a circular sleeve 551 and a semi-circular pressure block 552 disposed at the bottom of the circular sleeve 551. The semi-circular pressure block 552 has a C-shaped hole 553 that mates with the positioning ring 59 and a conical hole 554 for avoiding the hollow deformation 542. The circular sleeve 551 is connected to the first pressure rod 52 by a cotter pin 7.

[0054] During assembly, the circular sleeve 551 of the first pressure finger sleeve 55 is inserted from the bottom of the first pressure rod 52, so that the inner wall of the circular sleeve 551 fits against the outer wall of the first pressure rod 52 (ensuring coaxiality); at the same time, the C-shaped hole on the semi-circular pressure block 552 must be precisely aligned with the positioning ring 59 on the bottom surface of the first pressure rod 52. Finally, the cotter pin 7 is inserted through the pre-set pin holes on the circular sleeve 551 and the first pressure rod 52 to lock them axially and circumferentially, preventing the circular sleeve 551 from falling off the first pressure rod 52. At this time, the conical hole 554 of the semi-circular pressure block 552 is precisely aligned with the hollow shape 542 of the elastic probe 54.

[0055] The determination of proper semiconductor board bonding relies on the coaxiality of the light penetration holes. However, the circular pressure rod is prone to rotation due to vibration and friction, leading to misalignment of the penetration holes and misjudgment of infrared signals. Therefore, the cross-section of the first pressure rod 52 is D-shaped, and the first guide seat 51 has a guide hole that matches the shape of the first pressure rod 52. When the vertical drive device moves the pressure testing component 5 downward, the first pressure rod 52 moves axially along the D-shaped guide hole of the first guide seat 51 without circumferential rotation.

[0056] The first limiting head 53 is connected to the first pressure rod 52 through a cotter pin 7. After the cotter pin 7 is inserted, it forms an axial rigid lock, which can withstand the instantaneous impact force when the pressure rod moves upward, and prevent the limiting head from loosening and causing the pressure rod to move excessively, thus protecting the first spring 56 and the semiconductor board from damage.

[0057] In fact, although the four pressure testing components 5 can detect whether the product is fully inserted into the mold, the relatively central position of the first pressure rod 52 causes the left and right ends of the semiconductor board to not be fully engaged in the mold insert position. Instead, it is pressed into place when the mold is closed. During the production process, quality abnormalities such as glue overflow or breakage are inevitable, and it may even damage the mold and the loading rack. To address this, each of the two outer corners of the support plate 4 is equipped with an external pressure component 8. The external pressure component 8 uses elastic pressure to force the two ends of the board to be fully engaged in the mold insert position.

[0058] Specifically, the external pressure assembly 8 includes a second guide seat 81 fixed at the corner of the support plate 4, a second pressure rod 82 extending vertically and moving up and down along the second guide seat 81, a second limiting head 83 disposed at the top of the second pressure rod 82, a second pressure finger sleeve 84 sleeved at the bottom of the second pressure rod 82, and a second spring 85 sleeved between the second pressure finger sleeve 84 and the second guide seat 81. The second guide seat 81 has a third light-perforating hole 86, and the second pressure rod 82 has a fourth light-perforating hole. When the second pressure finger sleeve 84 presses the semiconductor board into place, the third light-perforating hole 86 on the second guide seat 81 and the fourth light-perforating hole on the second pressure rod 82 are coaxial. The infrared light emitted by the through-beam infrared emitter 61 can pass through the third light-perforating hole 86 and the fourth light-perforating hole on the two external pressure assemblies 8 located between the through-beam infrared emitter 61 and the through-beam infrared receiver 62.

[0059] The pressure testing component 5 and the external pressure component 8 are positioned at a high position along with the crossbeam 1 and the support plate 4. In the pressure testing component 5, the first spring 56 extends naturally, the first pressure rod 52 extends, and the first light-perforating hole 57 and the second light-perforating hole 58 are misaligned to block infrared light. In the external pressure component 8, the second spring 85 extends naturally, the second pressure rod 82 extends, and the third light-perforating hole 86 and the fourth light-perforating hole are misaligned to block infrared light.

[0060] The vertical drive device is activated, and the four sets of pressure testing components 5 and the four sets of external pressure components 8 move downwards synchronously. The second pressure finger sleeve 84 of the external pressure component 8 first contacts the upper surfaces of the left and right ends of the plate. As it continues to move downwards, the second pressure rod 82 moves upwards to compress the second spring 85. The elastic pressure pushes the two ends of the plate into the mold insert position. At the same time that the external pressure components 8 push the two ends, the first pressure finger sleeve 55 of the pressure testing component 5 contacts the upper surface of the middle part of the plate. The first pressure rod 52 moves upwards to compress the first spring 56. The elastic pressure presses the middle part of the plate into the mold cavity. At the same time, the elastic probe 54 contacts the test point to start the electrical test.

[0061] When both ends of the board are fully engaged in the mold insert positions and the middle is fully pressed into the cavity, the first pressure rod 52 and the second pressure rod 82 move upward to the preset stroke. The first light-perforating hole 57, the second light-perforating hole 58, the third light-perforating hole 86, and the fourth light-perforating hole are precisely coaxial. The infrared light first penetrates the third light-perforating hole 86 and the fourth light-perforating hole of the nearby external pressure component 8. Then, the infrared light can penetrate the first light-perforating hole 57 and the second light-perforating hole 58 of the two middle pressure testing components 5. Finally, the infrared light penetrates the third light-perforating hole 86 and the fourth light-perforating hole of the far external pressure component 8 and is fully received by the receiver. The system determines that the semiconductor board is fully pressed in place. After the electrical test data is synchronously confirmed to be qualified, the next process begins. After the pressing and testing are completed, the vertical drive device moves the entire board upward.

[0062] It should be noted that the first pressure finger sleeve 55 and the second pressure finger sleeve 84 have the same structure, both having a circular sleeve body 551 and a semi-circular pressure block 552. The difference lies in the orientation of the semi-circular pressure block 552. The semi-circular pressure block 552 of the first pressure finger sleeve 55 extends along the length of the semiconductor board, while the semi-circular pressure block 552 of the second pressure finger sleeve 84 extends along the width of the semiconductor board. On the one hand, this avoids the electrical components of the semiconductor board, and on the other hand, the semi-circular pressure block 552 can apply pressure to the semiconductor board evenly over the largest possible area.

[0063] Preferably, the bottom surface of the support plate 4 has a guide groove 41 that mates with the crossbeam 1. The support plate 4 has a laterally extending oblong hole 42, and the crossbeam 1 has a second threaded hole corresponding to the oblong hole 42. The adjusting screw passes through the oblong hole 42 and connects to the second threaded hole. The guide groove 41 can forcibly restrict the displacement of the support plate 4 along the longitudinal direction (perpendicular to the extension direction of the oblong hole 42), avoiding the back-and-forth offset of the support plate 4 during installation. If there is a slight offset in the pressing position (such as the pressure testing component 5 deviating from the test point of the plate), there is no need to replace the worn parts. It is only necessary to loosen the adjusting screw and make a slight adjustment to the position of the support plate 4 along the oblong hole 42 to correct the deviation, avoiding the scrapping of the mechanism due to small errors and extending the service life of the overall mechanism.

[0064] Vertical drive devices can actually be linear drive mechanisms (such as cylinders, hydraulic cylinders, etc.) and screw lifting mechanisms.

[0065] It is understood that those skilled in the art can make equivalent substitutions or modifications to the technical solution and inventive concept of the present invention, and all such substitutions or modifications should fall within the protection scope of the appended claims.

Claims

1. A mechanism for laminating and testing semiconductor boards, characterized in that, The system includes a crossbeam, a left support arm at one end of the crossbeam, a right support arm at the other end of the crossbeam, two support plates mounted on the crossbeam and located between the left and right support arms, and a vertical drive device for moving the support plates and the crossbeam as a whole up and down. Each support plate has pressure testing components at its two inner corners. The left support arm has two sets of through-beam infrared emitters, and the right support arm has through-beam infrared receivers corresponding to the two sets of emitters. Each pressure testing component includes a first guide seat fixed at a corner of the support plate, a first pressure rod extending vertically and moving up and down along the first guide seat, and a pressure rod positioned at the top of the first pressure rod. The device comprises a first limiting head, an elastic probe disposed on the bottom surface of the first pressure rod, a first pressure finger sleeve sleeved on the bottom of the first pressure rod, and a first spring sleeved between the first pressure finger sleeve and the first guide seat. The first guide seat has a first light-perforated hole, and the first pressure rod has a second light-perforated hole. When the first pressure finger sleeve presses the semiconductor board into place, the first light-perforated hole on the first guide seat and the second light-perforated hole on the first pressure rod are coaxial. The infrared light emitted by the through-beam infrared emitter can pass through the first light-perforated hole and the second light-perforated hole on the two pressure testing components located between the through-beam infrared emitter and the through-beam infrared receiver.

2. The semiconductor board lamination and testing mechanism according to claim 1, characterized in that, The bottom surface of the first pressure rod is provided with a positioning ring, and the elastic probe includes an upper insertion post, a hollow shape and a needle head connected in sequence from top to bottom. The positioning ring is docked with the upper insertion post and fixedly connected.

3. The semiconductor board lamination and testing mechanism according to claim 2, characterized in that, The positioning ring has mounting holes on its circumference, and the upper insertion post has a first threaded hole corresponding to the mounting holes. The locking screw passes through the mounting holes and connects to the first threaded hole. The positioning ring has a wiring groove, and the upper insertion post is electrically connected to the spring wire.

4. The semiconductor board lamination and testing mechanism according to claim 2, characterized in that, The hollow shape includes four circumferentially spaced angled conductive springs, which together form a three-dimensional rhombus.

5. The semiconductor board lamination and testing mechanism according to claim 4, characterized in that, The four angled conductive springs each contain an elastic rubber ball.

6. The semiconductor board lamination and testing mechanism according to claim 2, characterized in that, The first pressure finger sleeve includes a circular sleeve body and a semi-circular pressure block disposed at the bottom of the circular sleeve body. The semi-circular pressure block has a C-shaped hole that mates with the positioning ring and a conical hole for avoiding the hollow deformation. The circular sleeve body is connected to the first pressure rod by a cotter pin.

7. The semiconductor board lamination and testing mechanism according to claim 1, characterized in that, The cross-section of the first pressure rod is D-shaped, and the first guide seat has a guide hole that matches the shape of the first pressure rod. The first limiting head is connected to the first pressure rod through a cotter pin.

8. The semiconductor board lamination and testing mechanism according to claim 1, characterized in that, Each of the support plates is provided with an external pressure assembly at both outer corners.

9. The semiconductor board lamination and testing mechanism according to claim 8, characterized in that, The external pressure assembly includes a second guide seat fixed at the corner of the support plate, a second pressure rod extending vertically and moving up and down along the second guide seat, a second limiting head disposed at the top of the second pressure rod, a second pressure finger sleeve sleeved at the bottom of the second pressure rod, and a second spring sleeved between the second pressure finger sleeve and the second guide seat. The second guide seat has a third light-perforated hole, and the second pressure rod has a fourth light-perforated hole. When the second pressure finger sleeve presses the semiconductor board into place, the third light-perforated hole on the second guide seat and the fourth light-perforated hole on the second pressure rod are coaxial. The infrared light emitted by the through-beam infrared emitter can pass through the third and fourth light-perforated holes on the two external pressure assemblies located between the through-beam infrared emitter and the through-beam infrared receiver.

10. The semiconductor board lamination and testing mechanism according to claim 1, characterized in that, The bottom surface of the support plate has a guide groove that mates with the crossbeam. The support plate has a laterally extending waist-shaped hole. The crossbeam has a second threaded hole corresponding to the waist-shaped hole. The adjusting screw passes through the waist-shaped hole and connects to the second threaded hole.

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