Positioning device for chip wafer picking

Abstract

The application discloses a positioning device for chip wafer taking, which comprises a support platform; a front-rear driving device is arranged on the support platform, the output end of the front-rear driving device is connected with a support seat, and the support seat is rotatably provided with a positioning seat; the top end of the positioning seat is provided with a positioning fixed ring, and the top end of the positioning seat is also connected with a positioning movable ring assembly; the positioning device further comprises a positioning up-down driving assembly; a left-right driving device is arranged on the support platform, the output end of the left-right driving device is connected with a suction up-down driving device, and the output end of the suction up-down driving device is connected with a suction assembly. The application can perform controllable and pre-tensioning operation on the edge region of the bearing film before taking the crystal, and the process can effectively straighten the region of the bearing film, which is attached with the crystal grain, greatly reduces the elastic deformation allowance of the region when the crystal is taken, greatly reduces the risk of picking failure, flying pieces or crystal grain deviation, and directly improves the effectiveness of the crystal taking process and the product yield.

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