Techniques for securing an outer cover to a wearable ring device

Abstract

Methods, systems, and devices for manufacturing a wearable ring device are described. An outer cover can be placed around a ring assembly including a printed circuit board (PCB) coupled to an inner cover, thereby creating a first slot between the outer cover and the inner cover at a first lateral side of the wearable ring device and a second slot between the outer cover and the inner cover at a second lateral side of the wearable ring device. Additionally, first and second side covers can be inserted into the first and second slots, respectively, where the insertion causes the first and second side covers to mechanically deform. In this case, the mechanical deformation can cause the first and second side covers to engage one or more locking mechanisms of the inner cover, the outer cover, or both, to secure the inner cover to the outer cover.

Description

[0001] Cross-referencing This patent application claims the benefit of U.S. Patent Application No. 18 / 471,143, filed September 20, 2023, entitled “TECHNIQUES FORFIXING AN OUTER COVER TO A WEARABLE RING DEVICE”, which has been assigned to its assignee and is expressly incorporated herein by reference. Technical Field

[0002] The following content relates to wearable devices and data processing, including technologies for securing the outer cover to a wearable ring device. Background Technology

[0003] Some wearable devices can be configured to collect data from users to help them better understand their overall physical health and condition. However, wearable devices may be exposed to external forces when worn by a user, which could cause one or more components of the wearable device to loosen or move in an unexpected way, thus shortening the wearable device's lifespan. Attached Figure Description

[0004] Figure 1 An example of a system supporting a technology for securing an outer cover to a wearable ring device is shown, according to various aspects of this disclosure.

[0005] Figure 2 An example of a system supporting a technology for securing an outer cover to a wearable ring device is shown, according to various aspects of this disclosure.

[0006] Figure 3 An example of a system supporting a technology for securing an outer cover to a wearable ring device is shown, according to various aspects of this disclosure.

[0007] Figure 4A and Figure 4B An exemplary cross-sectional view of a wearable ring device is shown, which supports techniques for attaching an outer cover to a wearable ring device according to various aspects of this disclosure.

[0008] Figure 5 A flowchart is shown illustrating a method for supporting techniques for attaching an outer cover to a wearable ring device according to various aspects of this disclosure. Detailed Implementation

[0009] Some wearable devices, such as wearable rings, consist of a metal outer cover and an epoxy resin inner cover. Therefore, wearable ring manufacturing technology can employ an "outside-in" approach, where the electrical components, such as a printed circuit board (PCB) and one or more optical sensors, are manufactured within the metal outer cover or shell and secured with the epoxy resin inner cover or shell to form the wearable ring. That is, the outer cover containing the electrical components is placed in a mold, and the epoxy resin inner cover is injection molded onto the outer cover. However, this manufacturing technology has several drawbacks, including the need for tedious manual alignment of the optical components on the PCB within the mold, the need for post-manufacturing polishing which carries the risk of damaging the wearable ring, and the inefficiency in supporting different wearable ring covers.

[0010] Therefore, compared to wearable ring devices manufactured "from the outside in" (e.g., from the outer cover to the inner cover), wearable ring devices can be manufactured in an "inside-out" manner. Specifically, electrical components (e.g., a PCB and one or more optical sensors) can be attached to the metal inner shell of the wearable ring device, and the inner shell (e.g., along with the attached electrical components) can be placed in a mold, allowing transparent epoxy resin to be injection molded to secure the electrical components to the inner shell. Injection molding can further fill one or more orifices of the inner shell with transparent epoxy resin, allowing one or more optical sensors to be secured relative to one or more orifices to enable data acquisition. The result of injection molding the inner shell to the electrical components can be referred to as the inner cover, or ring engine assembly, which is essentially an operable ring without an outer cover. Subsequently, different outer covers can be slid around the inner cover, and side covers can be used to secure the inner cover to complete the ring. However, the method of securing the side covers to the outer and inner covers may have defects, such as the outer cover unintentionally rotating around the inner cover, the side covers becoming loose, or popping out of the wearable ring device.

[0011] Therefore, the technology described herein can support the manufacturing process of wearable ring devices to secure the outer cover of the wearable ring device to the inner cover of the wearable ring device, thereby reducing unintended movement of the side covers, outer cover, or both when exposed to external forces. Specifically, the outer cover can slide around the inner cover (e.g., a ring engine assembly), and the side covers (e.g., ring fittings) can be positioned on each side of the ring, aligned with corresponding slots between the outer and inner covers on each side of the ring. Each side cover can be slightly wider than the slot between the outer and inner covers, such that the side cover undergoes mechanical deformation when inserted into the slot under applied force (e.g., when pressed into the slot). Additionally, the outer cover, inner cover, or both may include one or more mechanical locking features, or grooves, at least partially located within the slots on either side of the ring, such that mechanical deformation of the side cover causes the side cover to engage, or fills the mechanical locking features within the outer cover, inner cover, or both, thereby locking the outer cover to the inner cover. In some cases, the side covers can be easily removed and replaced, allowing multiple outer covers to be supported by the wearable ring device and interchangeable. Additionally, or alternatively, heat may be applied to the side cover, causing it to permanently deform under the applied heat to create a tighter fit or to fill mechanical locking features.

[0012] Additionally, or alternatively, the side cover may include one or more flanges or locking wings to enable the side cover to engage or fill mechanical locking features within the outer cover, inner cover, or both. In other words, each side cover may have the same width as the slot (e.g., or within a threshold tolerance), except for flanges on the inner radius of the side cover, flanges on the outer radius of the side cover, or both. Thus, when the side cover is inserted into the slot under applied force (e.g., pressed into the slot), the flanges may deform or compress inward as they are pushed into the slot, and may return to their original shape or “pop out” when they reach or enter the mechanical locking features on the outer cover, inner cover, or both, thereby locking the outer cover to the inner cover. In this case, the frictional force generated between the outer and inner covers prevents the outer cover from sliding around the inner cover and prevents the side cover from popping out of the slot.

[0013] Additionally, or alternatively, an adhesive may be applied between the outer and inner covers to lock or secure the outer cover to the inner cover. For example, a photosensitive adhesive, such as a UV adhesive, may be applied to both the outer and inner covers such that slots (e.g., and any gaps between the inner and outer covers) are at least partially filled or coated with the UV adhesive. Additionally, the UV adhesive may be exposed to UV light (e.g., directly or through the side cover) to cure and harden, thereby locking the outer cover to the inner cover. In some other examples, a heat-activated film (HAF) may be applied to the outer cover, the inner cover, or both, such that the HAF contacts both the outer and inner covers when the outer cover is placed around the inner cover. Additionally, the HAF may be activated by exposing the outer cover, the inner cover, the side cover, or any combination thereof to heat, thereby locking the outer cover to the inner cover.

[0014] Additionally, or alternatively, the texture of the outer cover, inner cover, or both can be modified to increase the friction between the side cover and the outer cover, inner cover, or both (e.g., compared to an unmodified texture). For example, the portion of the outer cover aligned with the slot, the portion of the inner cover aligned with the slot, or both can be laser-engraved, sandblasted, polished, or similarly treated to increase the coefficient of friction between the inner side cover and the outer cover, inner cover, or both (e.g., relative to an unmodified component). Therefore, the force required to cause the outer cover to rotate around the inner cover, the side cover to loosen, or to pop out of the wearable ring device, or both, can be increased to a value that the wearable ring device is unlikely to experience when worn by a user.

[0015] The various aspects of this disclosure are initially described in the context of systems supporting the collection of physiological data from users via wearable devices. The various aspects of this disclosure are further illustrated in cross-sectional views of a wearable ring device. The various aspects of this disclosure are further shown and described with reference to apparatus diagrams, system diagrams, and flowcharts relating to techniques for attaching an outer cover to a wearable ring device.

[0016] Figure 1 An example of a system 100 supporting techniques for attaching an outer cover to a wearable ring device according to various aspects of this disclosure is shown. System 100 includes multiple electronic devices (e.g., wearable device 104, user device 106) that can be worn and / or operated by one or more users 102. System 100 further includes a network 108 and one or more servers 110.

[0017] Electronic devices may include any electronic devices known in the art, including wearable device 104 (e.g., a ring wearable device, a watch wearable device, etc.) and user device 106 (e.g., a smartphone, a laptop computer, a tablet computer). Electronic devices associated with a corresponding user 102 may include one or more of the following functions: 1) measuring physiological data; 2) storing the measured data; 3) processing the data; 4) providing output (e.g., via a GUI) to user 102 based on the processed data; and 5) communicating data with each other and / or with other computing devices. Different electronic devices may perform one or more of these functions.

[0018] Example wearable device 104 may include wearable computing devices, such as ring computing devices (hereinafter referred to as "rings") configured to be worn on the finger of user 102, wrist computing devices (e.g., smartwatches, fitness bands, or bracelets) configured to be worn on the wrist of user 102, and / or head-mounted computing devices (e.g., glasses / goggles). Wearable device 104 may also include cords, straps (e.g., flexible or non-flexible cords or straps), hook and loop sensors, etc., that can be positioned in other locations, such as straps around the head (e.g., forehead bands), arms (e.g., forearm straps and / or double headbands), and / or legs (e.g., thigh or calf straps), behind the ears, under the armpits, etc. Wearable device 104 may also be attached to or included in clothing items. For example, wearable device 104 may be included in pockets and / or pouches on clothing. As another example, wearable device 104 may be clipped and / or pinned to clothing, or may otherwise be held near user 102. Exemplary clothing items may include, but are not limited to, hats, shirts, gloves, trousers, socks, outerwear (e.g., jackets), and underwear. In some implementations, wearable device 104 may be included in other types of equipment, such as training / sports equipment used during physical activity. For example, wearable device 104 may be attached to or included in a bicycle, skis, tennis racket, golf club, and / or training weights.

[0019] Many aspects of this disclosure can be described in the context of the ring wearable device 104. Therefore, unless otherwise indicated herein, the terms "ring 104," "wearable device 104," and similar terms may be used interchangeably. However, the use of the term "ring 104" should not be considered limiting, as it is contemplated herein that various aspects of this disclosure can be implemented using other wearable devices (e.g., watch wearable devices, necklace wearable devices, bracelet wearable devices, earring wearable devices, ankle wearable devices, etc.).

[0020] In some aspects, user equipment 106 may include handheld mobile computing devices, such as smartphones and tablet computing devices. User equipment 106 may also include personal computers, such as laptop and desktop computing devices. Other example user equipment 106 may include server computing devices capable of communicating with other electronic devices, such as via the Internet. In some implementations, the computing device may include medical devices, such as external wearable computing devices (e.g., Holter monitors). Medical devices may also include implantable medical devices, such as pacemakers and defibrillators. Other example user equipment 106 may include home computing devices, such as Internet of Things (IoT) devices (e.g., IoT devices), smart TVs, smart speakers, smart displays (e.g., video call displays), hubs (e.g., wireless communication hubs), security systems, smart appliances (e.g., thermostats and refrigerators), and fitness equipment.

[0021] Some electronic devices (e.g., wearable device 104, user device 106) can measure physiological parameters of the corresponding user 102, such as photoplethysmography waveforms, continuous skin temperature, pulse waveforms, respiratory rate, heart rate, heart rate variability (HRV), body motion monitoring, skin conductance response, pulse oxygen saturation, oxygen saturation (SpO2), blood glucose levels (e.g., glucose indicators), and / or other physiological parameters. Some electronic devices that measure physiological parameters may also perform some / all of the calculations described herein. Some electronic devices may not measure physiological parameters but may perform some / all of the calculations described herein. For example, a ring (e.g., wearable device 104), a mobile device application, or a server computing device may process physiological data received from other devices.

[0022] In some implementations, user 102 may operate or be associated with multiple electronic devices, some of which can measure physiological parameters, and some of which can process the measured physiological parameters. In some implementations, user 102 may have a ring (e.g., wearable device 104) for measuring physiological parameters. User 102 may also have or be associated with user device 106 (e.g., a mobile device, a smartphone), wherein wearable device 104 and user device 106 are communicatively coupled to each other. In some cases, user device 106 may receive data from wearable device 104 and perform some / all of the calculations described herein. In some implementations, user device 106 may also measure physiological parameters described herein, such as motion / activity parameters.

[0023] For example, such as Figure 1As shown, a first user 102-a (user 1) can operate, or be associated with, a wearable device 104-a (e.g., ring 104-a) and a user device 106-a that can operate as described herein. In this example, the user device 106-a associated with user 102-a can process / store physiological parameters measured by ring 104-a. In contrast, a second user 102-b (user 2) can be associated with ring 104-b, a watch-wearable device 104-c (e.g., watch 104-c), and user device 106-b, wherein the user device 106-b associated with user 102-b can process / store physiological parameters measured by ring 104-b and / or watch 104-c. Furthermore, an nth user 102-n (user N) can be associated with an arrangement of electronic devices (e.g., ring 104-n, user device 106-n) described herein. In some respects, wearable devices 104 (e.g., ring 104, watch 104) and other electronic devices can be communicatively coupled to user equipment 106 of the corresponding user 102 via Bluetooth, Wi-Fi and other wireless protocols.

[0024] In some implementations, the ring 104 of system 100 (e.g., wearable device 104) can be configured to collect physiological data from the corresponding user 102 based on arterial blood flow within the user's finger. Specifically, the ring 104 may utilize one or more light-emitting components (such as LEDs (e.g., red LEDs, green LEDs)) that emit light on the palmar side of the user's finger to collect physiological data based on arterial blood flow within the user's finger. Generally, the terms light-emitting component, light-emitting element, and similar terms may include, but are not limited to, LEDs, micro LEDs, mini LEDs, laser diodes (LDs) (e.g., vertical-cavity surface-emitting lasers (VCSELs), etc.).

[0025] In some cases, system 100 can be configured to collect physiological data from a corresponding user 102 based on blood flow diffusing into the skin's microvascular bed, which has capillaries and arterioles. For example, system 100 can collect PPG data based on the measured blood volume diffusing into the microvascular system of capillaries and arterioles. In some embodiments, ring 104 may use a combination of both green and red LEDs to acquire physiological data. Physiological data may include any physiological data known in the art, including but not limited to temperature data, accelerometer data (e.g., movement / exercise data), heart rate data, HRV data, blood oxygen level data, or any combination thereof.

[0026] The use of both green and red LEDs offers several advantages over other solutions, as they have been found to have distinct strengths in acquiring physiological data under different conditions (e.g., bright / dark, active / inactive) and through different parts of the body. For example, green LEDs have been found to exhibit better performance during exercise. Furthermore, wearable devices using multiple LEDs distributed around a ring 104 (e.g., green and red LEDs) have been found to exhibit superior performance compared to wearable devices using LEDs positioned close together (such as within a watch). Additionally, blood vessels in the fingers (e.g., arteries, capillaries) are more easily accessed via LEDs than those in the wrist. Specifically, arteries in the wrist are located at the base of the wrist (e.g., the palmar side of the wrist), meaning that only capillaries are accessible at the top of the wrist (e.g., the back of the wrist on the palmar side), where wearable watches and similar devices are typically worn. Accordingly, it has been found that using LEDs and other sensors within the ring 104 exhibits superior performance compared to wearable devices worn on the wrist, because the ring 104 has greater access to arteries (compared to capillaries), resulting in stronger signals and more valuable physiological data.

[0027] Electronic devices of system 100 (e.g., user equipment 106, wearable device 104) can be communicatively coupled to one or more servers 110 via wired or wireless communication protocols. For example, such as Figure 1 As shown, electronic devices (e.g., user device 106) can be communicatively coupled to one or more servers 110 via network 108. Network 108 can implement Transmission Control Protocol and Internet Protocol (TCP / IP) such as the Internet, or it can implement other network 108 protocols. The network connection between network 108 and the corresponding electronic device can facilitate data transmission via email, web, text messaging, mail, or any other suitable form of interaction within computer network 108. For example, in some implementations, a ring 104-a associated with a first user 102-a can be communicatively coupled to user device 106-a, wherein user device 106-a is communicatively coupled to server 110 via network 108. In additional or alternative cases, wearable device 104 (e.g., ring 104, watch 104) can be directly communicatively coupled to network 108.

[0028] System 100 can provide on-demand database services between user equipment 106 and one or more servers 110. In some cases, server 110 can receive data from user equipment 106 via network 108, and can store and analyze that data. Similarly, server 110 can provide data to user equipment 106 via network 108. In some cases, server 110 may be located in one or more data centers. Server 110 can be used for data storage, management, and processing. In some implementations, server 110 may provide a web-based interface to user equipment 106 via a web browser.

[0029] In some respects, system 100 can detect the duration of user 102's sleep and categorize the duration of user 102's sleep into one or more sleep stages (e.g., sleep stage classification). For example, as... Figure 1 As shown, user 102-a can be associated with wearable device 104-a (e.g., ring 104-a) and user device 106-a. In this example, ring 104-a can collect physiological data associated with user 102-a, including temperature, heart rate, HRV, respiratory rate, etc. In some aspects, the data collected by ring 104-a can be fed into a machine learning classifier, which is configured to determine the time period during which user 102-a is asleep (or previously asleep). Furthermore, the machine learning classifier can be configured to classify the time period into different sleep stages, including awake sleep, rapid eye movement (REM) sleep, light sleep (non-REM (NREM)), and deep sleep (NREM). In some aspects, the classified sleep stages can be displayed to user 102-a via the GUI of user device 106-a. The sleep stage classification can be used to provide user 102-a with feedback on the user's sleep patterns, such as recommended sleep times, recommended wake-up times, etc. Furthermore, in some implementations, the sleep stage classification technique described in this paper can be used to calculate scores for the corresponding user, such as sleep score, readiness score, etc.

[0030] In some respects, system 100 can leverage features derived from circadian rhythms to further improve physiological data collection, data processing procedures, and other techniques described herein. The term circadian rhythm can refer to the natural internal processes that regulate an individual's sleep-wake cycle, which repeats approximately every 24 hours. In this regard, the techniques described herein can utilize circadian rhythm regulation models to improve physiological data collection, analysis, and data processing. For example, a circadian rhythm regulation model, along with physiological data collected from user 102-a via wearable device 104-a, can be fed into a machine learning classifier. In this example, the circadian rhythm regulation model can be configured to "weight" or regulate physiological data collected throughout the user's natural, approximately 24-hour circadian rhythm. In some implementations, the system can initially start with a "baseline" circadian rhythm regulation model and can modify the baseline model using physiological data collected from each user 102 to generate a customized, personalized circadian rhythm regulation model specific to each respective user 102.

[0031] In some respects, System 100 can utilize other circadian rhythms to further improve the collection, analysis, and processing of physiological data through phases of these other rhythms. For example, if a weekly rhythm is detected within an individual's baseline data, the model can be configured to adjust the "weights" of the data according to the days within that week. Circadian rhythms that may require adjustment of the model in this manner include: 1) ultradian rhythms (faster than the day rhythm, including sleep cycles during sleep and oscillations in physiological variables measured during waking states ranging from less than an hour cycle to several hours cycle; 2) diurnal rhythms; 3) non-endogenous daily rhythms that are applied over diurnal rhythms, such as in a work schedule; 4) weekly rhythms, or other exogenously applied artificial time cycles (e.g., a 12-day rhythm can be used in a hypothetical culture with a "week" of 12 days); 5) multi-day ovarian rhythms in women and spermatogenesis rhythms in men; 6) lunar rhythms (associated with individuals living in low or no artificial light); and 7) seasonal rhythms.

[0032] Biorhythms are not always resting rhythms. For example, many women experience variability in ovarian cycle length between cycles, and even within a single user, it is not expected that superdial rhythms will occur at exactly the same time or cycle over several days. Thus, signal processing techniques sufficient to quantify frequency components while maintaining temporal resolution of these rhythms in physiological data can be used to improve the detection of these rhythms, assign phases of each rhythm to each moment measured, and thereby modify regulatory models and comparisons of time intervals. Biorhythm regulatory models and parameters can be added, in linear or nonlinear combinations as appropriate, to more accurately capture the dynamic physiological baseline of an individual or group of individuals.

[0033] In some respects, the corresponding devices of system 100 can be manufactured according to the techniques described herein. For example, each ring 104 may include an inner cover and an outer cover. In some cases, electrical components (e.g., PCB, optical sensors, etc.) may be fixed or otherwise attached to the inner cover / shell of the ring, wherein the inner cover / shell and the electrical components may be collectively referred to as a “ring engine assembly,” which is essentially a complete ring without an outer cover. In some cases, the electrical components may be fixed to a metal inner shell using injection molding with a transparent epoxy resin, thereby forming a ring engine assembly.

[0034] Subsequently, the outer cover can be placed or slid around the inner cover, and side covers (e.g., annular fittings) can be placed on each side of the ring 104, aligned with corresponding slots between the outer and inner covers on each side of the ring 104. Each side cover may be slightly wider than the slot between the outer and inner covers, such that the side cover undergoes mechanical deformation when inserted into the slot under applied force (e.g., when pressed into the slot). Additionally, the outer cover, inner cover, or both may include one or more mechanical locking features, or recesses, at least partially located within the slots on either side of the ring 104, such that mechanical deformation of the side cover causes the side cover to engage, or fills the mechanical locking features within the outer cover, inner cover, or both, thereby locking the outer cover to the inner cover. In some cases, the side covers can be easily removed and replaced, such that multiple outer covers can be supported by the ring 104 and are interchangeable. For example, user 102 can insert a removal tool at least partially into a slot including a side cover, such that the removal tool “pops” the side cover out from between the outer and inner covers. Therefore, user 102 can remove both side covers and replace the outer cover with a new outer cover, which can be selected from a number of outer covers compatible with ring 104.

[0035] Those skilled in the art will understand that one or more aspects of this disclosure can be implemented in system 100 to additionally or alternatively address problems beyond those described above. Furthermore, various aspects of this disclosure can provide technical improvements to "conventional" systems or processes as described herein. However, the specification and drawings only include exemplary technical improvements derived from implementing aspects of this disclosure and therefore do not represent all technical improvements provided within the scope of the claims.

[0036] Figure 2 An example of a system 200 supporting techniques for attaching an outer cover to a wearable ring device according to various aspects of this disclosure is shown. System 200 may implement or be implemented by system 100. Specifically, system 200 shows examples of a ring 104 (e.g., wearable device 104), a user device 106, and a server 110, as referenced. Figure 1 As described.

[0037] In some aspects, the ring 104 can be configured to be worn on a user's finger and, when worn on the user's finger, can determine one or more user physiological parameters. Examples of measurements and determinations may include, but are not limited to, user skin temperature, pulse waveform, respiratory rate, heart rate, HRV, blood oxygen level (SpO2), blood glucose level (e.g., glucose index), etc.

[0038] System 200 further includes a user device 106 (e.g., a smartphone) that communicates with the ring 104. For example, the ring 104 may communicate wirelessly and / or via a wired connection with the user device 106. In some implementations, the ring 104 may transmit measured and processed data (e.g., temperature data, photoplethysmography (PPG) data, motion / accelerometer data, ring input data, etc.) to the user device 106. The user device 106 may also send data to the ring 104, such as firmware / configuration updates for the ring 104. The user device 106 may process the data. In some implementations, the user device 106 may transmit data to a server 110 for processing and / or storage.

[0039] The ring 104 may include a housing 205, which may include an inner housing 205-a and an outer housing 205-b. In some aspects, the housing 205 of the ring 104 may store or otherwise include various components of the ring, including but not limited to device electronics, power sources (e.g., battery 210, and / or capacitors), one or more substrates (e.g., printed circuit boards) interconnecting the device electronics and / or power sources, etc. The device electronics may include device modules (e.g., hardware / software), such as: processing module 230-a, memory 215, communication module 220-a, power module 225, etc. The device electronics may also include one or more sensors. Example sensors may include one or more temperature sensors 240, PPG sensor assemblies (e.g., PPG system 235), and one or more motion sensors 245.

[0040] These sensors may include association modules (not shown) configured to communicate with corresponding components / modules of the ring 104 and generate signals associated with the corresponding sensors. In some aspects, each of the components / modules of the ring 104 may be communicatively coupled to each other via a wired or wireless connection. Furthermore, the ring 104 may include additional and / or alternative sensors or other components configured to collect physiological data from the user, including light sensors (e.g., LEDs), pulse oximeters, etc.

[0041] Reference Figure 2 The ring 104 shown and described is provided for illustrative purposes only. Therefore, the ring 104 may include, for example... Figure 2Additional or alternative components, such as those shown, can be manufactured. Other rings 104 that provide the functionality described herein can be manufactured. For example, rings 104 with fewer components (e.g., sensors) can be manufactured. In a particular example, a ring 104 can be manufactured having a single temperature sensor 240 (or other sensor), a power supply, and device electronics configured to read the single temperature sensor 240 (or other sensor). In another particular example, the temperature sensor 240 (or other sensor) can be attached to a user's finger (e.g., using adhesive, wrapping, clamp, spring-loaded clamp, etc.). In this case, the sensor can be wired to another computing device, such as a wrist-worn computing device that reads the temperature sensor 240 (or other sensor). In other examples, rings 104 can be manufactured that include additional sensors and processing functionality.

[0042] Housing 205 may include one or more housing 205 assemblies. Housing 205 may include an outer housing 205-b assembly (e.g., a housing) and an inner housing 205-a assembly (e.g., a molded part). Housing 205 may be included in... Figure 2 Additional components not explicitly shown (e.g., additional layers). For example, in some implementations, ring 104 may include one or more insulating layers that electrically insulate device electronics and other conductive materials (e.g., electrical traces) from housing 205-b (e.g., metal housing 205-b). Housing 205 may provide structural support for device electronics, battery 210, one or more substrates, and other components. For example, housing 205 may protect device electronics, battery 210, and one or more substrates from mechanical forces such as pressure and shock. Housing 205 may also protect device electronics, battery 210, and one or more substrates from water and / or other chemicals.

[0043] The housing 205-b can be made of one or more materials. In some implementations, the housing 205-b may include a metal, such as titanium, which provides strength and abrasion resistance at a relatively light weight. The housing 205-b may also be made of other materials, such as polymers. In some implementations, the housing 205-b can be both protective and decorative.

[0044] The inner housing 205-a can be configured to engage with a user's finger. The inner housing 205-a can be formed of a polymer (e.g., a medical-grade polymer) or other materials. In some implementations, the inner housing 205-a can be transparent. For example, the inner housing 205-a can be transparent to light emitted by a PPG light-emitting diode (LED). In some implementations, the inner housing 205-a assembly can be molded onto the outer housing 205-b. For example, the inner housing 205-a can include a polymer molded (e.g., injection molded) to fit into the metal casing of the outer housing 205-b.

[0045] Ring 104 may include one or more substrates (not shown). Device electronics and battery 210 may be included on one or more substrates. For example, device electronics and battery 210 may be mounted on one or more substrates. Example substrates may include one or more PCBs, such as flexible PCBs (e.g., polyimide). In some implementations, electronics / battery 210 may include surface-mount devices (e.g., surface mount technology (SMT) devices) on a flexible PCB. In some implementations, one or more substrates (e.g., one or more flexible PCBs) may include electrical traces providing electrical communication between device electronics. The electrical traces may also connect battery 210 to device electronics.

[0046] Device electronics, battery 210, and substrate can be arranged in various ways within the ring 104. In some implementations, a substrate including the device electronics may be mounted along the bottom (e.g., lower half) of the ring 104, such that sensors (e.g., PPG system 235, temperature sensor 240, motion sensor 245, and other sensors) engage with the underside of the user's finger. In these implementations, the battery 210 may be included along the top portion of the ring 104 (e.g., on another substrate).

[0047] The various components / modules of ring 104 may represent functions (e.g., circuits and other components) that can be included in ring 104. A module may include any discrete and / or integrated electronic circuit components that implement analog and / or digital circuits capable of producing the functions attributed to the modules herein. For example, a module may include analog circuits (e.g., amplifier circuits, filter circuits, analog / digital converter circuits, and / or other signal conditioning circuits). A module may also include digital circuits (e.g., combinational or sequential logic circuits, memory circuits, etc.).

[0048] The memory 215 (memory module) of ring 104 may include any volatile, non-volatile, magnetic, or electrical medium, such as random access memory (RAM), read-only memory (ROM), non-volatile RAM (NVRAM), electrically erasable programmable ROM (EEPROM), flash memory, or any other memory device. Memory 215 may store any data described herein. For example, memory 215 may be configured to store data collected by the corresponding sensor and PPG system 235 (e.g., motion data, temperature data, PPG data). Furthermore, memory 215 may include instructions that, when executed by one or more processing circuits, cause the module to perform various functions belonging to the modules herein. The device electronics of ring 104 described herein are merely example device electronics. Therefore, the type of electronic components used to implement the device electronics may vary based on design considerations.

[0049] The functionality of the modules belonging to the Ring 104 described herein can be embodied in one or more processors, hardware, firmware, software, or any combination thereof. Describing different features as modules is intended to highlight different functional aspects and does not necessarily imply that these modules must be implemented by separate hardware / software components. Rather, the functionality associated with one or more modules can be performed by separate hardware / software components or integrated within common hardware / software components.

[0050] The processing module 230-a of ring 104 may include one or more processors (e.g., processing units), microcontrollers, digital signal processors, system-on-a-chip (SoC), and / or other processing devices. Processing module 230-a communicates with modules contained within ring 104. For example, processing module 230-a may send / receive data to / from modules and other components (such as sensors) of ring 104. As described herein, modules may be implemented from various circuit components. Therefore, modules may also be referred to as circuits (e.g., communication circuits and power supply circuits).

[0051] Processing module 230-a can communicate with memory 215. Memory 215 may include computer-readable instructions that, when executed by processing module 230-a, cause processing module 230-a to perform various functions belonging to processing module 230-a herein. In some implementations, processing module 230-a (e.g., a microcontroller) may include additional features associated with other modules, such as communication functions provided by communication module 220-a (e.g., an integrated Bluetooth Low Energy transceiver) and / or additional onboard memory 215.

[0052] Communication module 220-a may include circuitry providing wireless and / or wired communication with user equipment 106 (e.g., communication module 220-b of user equipment 106). In some implementations, communication modules 220-a and 220-b may include wireless communication circuitry, such as Bluetooth circuitry and / or Wi-Fi circuitry. In some implementations, communication modules 220-a and 220-b may include wired communication circuitry, such as Universal Serial Bus (USB) communication circuitry. Using communication module 220-a, ring 104 and user equipment 106 may be configured to communicate with each other. The ring's processing module 230-a may be configured to transmit / receive data to / from user equipment 106 via communication module 220-a. Example data may include, but is not limited to, motion data, temperature data, pulse waveform, heart rate data, HRV data, PPG data, and status updates (e.g., charging status, battery charge level, and / or ring 104 configuration settings). The ring's processing module 230-a can also be configured to receive updates (e.g., software / firmware updates) and data from the user equipment 106.

[0053] Ring 104 may include a battery 210 (e.g., a rechargeable battery 210). Example battery 210 may include a lithium-ion or lithium-polymer type battery 210, but various battery options are possible. Battery 210 can be wirelessly charged. In some implementations, ring 104 may include a power source other than battery 210, such as a capacitor. The power source (e.g., battery 210 or capacitor) may have a curved geometry that matches the curves of ring 104. In some aspects, the charger or other power source may include additional sensors that can be used to collect data in addition to or supplement the data collected by ring 104 itself. Furthermore, the charger or other power source of ring 104 may act as user equipment 106, in which case the charger or other power source of ring 104 may be configured to receive data from ring 104, store and / or process data received from ring 104, and communicate data between ring 104 and server 110.

[0054] In some aspects, the ring 104 includes a power module 225 that controls the charging of the battery 210. For example, the power module 225 may engage with an external wireless charger that charges the battery 210 when engaged with the ring 104. The charger may include a reference structure that mates with a reference structure of the ring 104 to create a specified orientation of the ring 104 during charging. The power module 225 may also regulate the voltage of device electronics, regulate the power output to device electronics, and monitor the state of charge of the battery 210. In some implementations, the battery 210 may include a protection circuit module (PCM) that protects the battery 210 from high-current discharge, overvoltage during charging, and undervoltage during discharging. The power module 225 may also include electrostatic discharge (ESD) protection.

[0055] One or more temperature sensors 240 may be electrically coupled to processing module 230-a. Temperature sensors 240 may be configured to generate temperature signals (e.g., temperature data) indicating the temperature read or sensed by the temperature sensors 240. Processing module 230-a may determine the temperature of a user at the location of the temperature sensors 240. For example, in ring 104, the temperature data generated by the temperature sensors 240 may indicate the user's temperature at the finger (e.g., skin temperature). In some implementations, the temperature sensors 240 may contact the user's skin. In other implementations, a portion of housing 205 (e.g., inner housing 205-a) may form a barrier (e.g., a thin thermally conductive barrier) between the temperature sensors 240 and the user's skin. In some implementations, the portion of ring 104 configured to contact the user's finger may have a thermally conductive portion and a thermally insulating portion. The thermally conductive portion conducts heat from the user's finger to the temperature sensors 240. The thermally insulating portion insulates portions of ring 104 (e.g., temperature sensors 240) from ambient temperature.

[0056] In some implementations, temperature sensor 240 can generate a digital signal (e.g., temperature data), which processing module 230-a can use to determine the temperature. As another example, if temperature sensor 240 includes a passive sensor, processing module 230-a (or temperature sensor 240 module) can measure the current / voltage generated by temperature sensor 240 and determine the temperature based on the measured current / voltage. Example temperature sensor 240 may include a thermistor (such as a negative temperature coefficient (NTC) thermistor) or other types of sensors, including resistors, transistors, diodes, and / or other electrical / electronic components.

[0057] Processing module 230-a can sample the user's temperature over time. For example, processing module 230-a can sample the user's temperature based on a sampling rate. An example sampling rate might include one sample per second, but processing module 230-a can be configured to sample the temperature signal at other sampling rates, higher or lower than one sample per second. In some implementations, processing module 230-a can continuously sample the user's temperature throughout the day and night. Sampling at a sufficient rate (e.g., one sample per second) throughout the day can provide sufficient temperature data for the analysis described herein.

[0058] Processing module 230-a can store the sampled temperature data in memory 215. In some implementations, processing module 230-a can process the sampled temperature data. For example, processing module 230-a can determine the average temperature value over a time period. In one example, processing module 230-a can determine the average temperature value for a minute by summing all temperature values ​​collected per minute and dividing by the number of samples in that minute. In a specific example of sampling temperature at one sample per second, the average temperature could be the sum of all sampled temperatures for one minute divided by sixty seconds. Memory 215 can store the average temperature value over time. In some implementations, memory 215 can store the average temperature (e.g., one per minute) instead of the sampled temperatures to save memory 215.

[0059] The sampling rate, which can be stored in memory 215, can be configurable. In some implementations, the sampling rate can be the same throughout the day and night. In other implementations, the sampling rate can vary throughout the day / night. In some implementations, ring 104 can filter / reject temperature readings, such as large spikes in temperature that do not indicate physiological changes (e.g., temperature spikes from a hot shower). In some implementations, ring 104 can filter / reject temperature readings that may be unreliable due to other factors, such as excessive movement during exercise (e.g., as indicated by motion sensor 245).

[0060] The ring 104 (e.g., a communication module) can transmit sampled temperature data and / or average temperature data to the user equipment 106 for storage and / or further processing. The user equipment 106 can transmit the sampled temperature data and / or average temperature data to the server 110 for storage and / or further processing.

[0061] Although ring 104 is shown as including a single temperature sensor 240, ring 104 may include multiple temperature sensors 240 in one or more locations, such as arranged along the inner housing 205-a near the user's finger. In some implementations, the temperature sensor 240 may be a standalone temperature sensor 240. Additionally or alternatively, one or more temperature sensors 240 may be included with other components (e.g., packaged together with other components), such as with an accelerometer and / or a processor.

[0062] Processing module 230-a can acquire and process data from multiple temperature sensors 240 in a manner similar to that described with respect to a single temperature sensor 240. For example, processing module 230 can sample, average, and store temperature data from each of the multiple temperature sensors 240 separately. In other examples, processing module 230-a can sample the sensors at different rates and average / store different values ​​for different sensors. In some implementations, processing module 230-a can be configured to determine a single temperature based on the average of two or more temperatures determined by two or more temperature sensors 240 at different locations on the finger.

[0063] Temperature sensors 240 on ring 104 can acquire the distal temperature at a user's finger (e.g., any finger). For example, one or more temperature sensors 240 on ring 104 can acquire the user's temperature from the underside of the finger or different locations on the finger. In some implementations, ring 104 can continuously acquire distal temperatures (e.g., at a sampling rate). While distal temperatures measured by ring 104 at a finger are described herein, other devices can measure temperatures at the same / different locations. In some cases, the distal temperature measured at a user's finger may differ from the temperature measured at the user's wrist or other external body locations. Furthermore, the distal temperature measured at a user's finger (e.g., "shell" temperature) may differ from the user's core temperature. Thus, ring 104 can provide a useful temperature signal that may not have been acquired at other internal / external locations of the body. In some cases, continuous temperature measurements at the finger can capture temperature fluctuations (e.g., small or large fluctuations) that may not be apparent in the core temperature. For example, continuous temperature measurements at the fingertips can capture temperature fluctuations minute by minute or hour by hour, providing additional insights that other temperature measurements in other parts of the body may not offer.

[0064] Ring 104 may include a PPG system 235. The PPG system 235 may include one or more light emitters that emit light. The PPG system 235 may also include one or more light receivers that receive light emitted by the one or more light emitters. The light receivers may generate a signal (hereinafter referred to as a "PPG" signal) indicating the amount of light received by the light receivers. The light emitters may illuminate an area of ​​the user's finger. The PPG signal generated by the PPG system 235 may indicate blood perfusion in the illuminated area. For example, the PPG signal may indicate changes in blood volume in the illuminated area caused by the user's pulse pressure. Processing module 230-a may sample the PPG signal and determine the user's pulse waveform based on the PPG signal. Processing module 230-a may determine various physiological parameters, such as the user's respiratory rate, heart rate, HRV, oxygen saturation, and other circulatory parameters, based on the user's pulse waveform.

[0065] In some implementations, the PPG system 235 can be configured as a reflective PPG system 235, wherein one or more light receivers receive transmitted light reflected from an area of ​​the user's finger. In some implementations, the PPG system 235 can be configured as a transmissive PPG system 235, wherein one or more light emitters and one or more light receivers are arranged opposite each other such that light is directly transmitted through a portion of the user's finger to one or more light receivers.

[0066] The number and ratio of transmitters and receivers included in the PPG system 235 can vary. Example light transmitters may include light-emitting diodes (LEDs). Light transmitters may emit light in the infrared spectrum and / or other spectra. Example light receivers may include, but are not limited to, photoelectric sensors, phototransistors, and photodiodes. Light receivers can be configured to generate PPG signals in response to wavelengths received from the light transmitter. The positions of the transmitters and receivers can be varied. Furthermore, a single device may include a reflective and / or transmissive PPG system 235.

[0067] In some implementations, Figure 2 The PPG system 235 shown may include a reflective PPG system 235. In these implementations, the PPG system 235 may include a centrally located optical receiver (e.g., at the bottom of ring 104) and two optical emitters located on each side of the optical receiver. In this implementation, the PPG system 235 (e.g., the optical receiver) may generate a PPG signal based on light received from one or both of these optical emitters. In other implementations, other placements, combinations, and / or configurations of one or more optical emitters and / or optical receivers are considered.

[0068] Processing module 230-a can control one or both of the optical emitters to emit light while sampling the PPG signal generated by the optical receiver. In some implementations, processing module 230-a can cause the optical emitter with a stronger received signal to emit light while sampling the PPG signal generated by the optical receiver. For example, when the PPG signal is sampled at a sampling rate (e.g., 250 Hz), the selected optical emitter can emit light continuously.

[0069] Sampling the PPG signal generated by the PPG system 235 can produce a pulse waveform, which may be referred to as "PPG". The pulse waveform can indicate the blood pressure pair (vs) time over multiple cardiac cycles. The pulse waveform may include peak values ​​indicating cardiac cycles. Furthermore, the pulse waveform may include respiratory-induced changes that can be used to determine respiratory rate. In some implementations, the processing module 230-a may store the pulse waveform in memory 215. The processing module 230-a may process the pulse waveform when it is generated and / or when it is retrieved from memory 215 to determine the user physiological parameters described herein.

[0070] Processing module 230-a can determine a user's heart rate based on a pulse waveform. For example, processing module 230-a can determine the heart rate (e.g., in heartbeats per minute) based on the time between peaks in the pulse waveform. The time between peaks may be referred to as the inter-beat interval (IBI). Processing module 230-a can store the determined heart rate value and IBI value in memory 215.

[0071] Processing module 230-a can determine the HRV over time. For example, processing module 230-a can determine the HRV based on changes in the IBI. Processing module 230-a can store the HRV value over time in memory 215. Furthermore, processing module 230-a can determine the user's respiratory rate over time. For example, processing module 230-a can determine the respiratory rate based on the user's IBI value over a time period using frequency modulation, amplitude modulation, or baseline modulation. The respiratory rate can be calculated as breaths per minute or as another respiratory rate (e.g., breaths every 30 seconds). Processing module 230-a can store the user's respiratory rate value over time in memory 215.

[0072] Ring 104 may include one or more motion sensors 245, such as one or more accelerometers (e.g., 6-D accelerometers) and / or one or more gyroscopes. Motion sensors 245 may generate motion signals indicating the motion of the sensors. For example, ring 104 may include one or more accelerometers that generate acceleration signals indicating the acceleration of the accelerometers. As another example, ring 104 may include one or more gyroscope sensors that generate gyroscope signals indicating angular motion (e.g., angular velocity) and / or changes in orientation. Motion sensors 245 may be included in one or more sensor packages. An example accelerometer / gyroscope sensor is the Bosch BM1160 inertial microelectromechanical system (MEMS) sensor, which can measure angular rate and acceleration on three vertical axes.

[0073] Processing module 230-a can sample motion signals at a sampling rate (e.g., 50 Hz) and determine the motion of ring 104 based on the sampled motion signals. For example, processing module 230-a can sample acceleration signals to determine the acceleration of ring 104. As another example, processing module 230-a can sample gyroscope signals to determine angular motion. In some implementations, processing module 230-a can store motion data in memory 215. Motion data may include sampled motion data and motion data calculated based on the sampled motion signals (e.g., acceleration and angle values).

[0074] The ring 104 can store various types of data described herein. For example, the ring 104 can store temperature data, such as raw sampled temperature data and calculated temperature data (e.g., average temperature). As another example, the ring 104 can store PPG signal data, such as pulse waveforms and data calculated based on the pulse waveforms (e.g., heart rate values, IBI values, HRV values, and respiratory rate values). The ring 104 can also store motion data, such as sampled motion data indicating linear and angular motion.

[0075] The ring 104 or other computing device can calculate and store additional values ​​based on the sampled / computed physiological data. For example, the processing module 230 can calculate and store various metrics, such as sleep metrics (e.g., sleep score), activity metrics, and readiness metrics. In some implementations, the additional value / metric may be referred to as a "derived value." The ring 104 or other computing / wearable device can calculate various values / metrics related to movement. Example derived values ​​of movement data may include, but are not limited to, movement count values, regularity values, intensity values, metabolic equivalence (MET) of task values, and orientation values. Movement counts, regularity values, intensity values, and MET can indicate the amount of user movement over time (e.g., speed / acceleration). Orientation values ​​can indicate how the ring 104 is oriented on the user's finger and whether the ring 104 is worn on the left or right hand.

[0076] In some implementations, motion counts and regularity values ​​can be determined by counting the number of acceleration peaks over one or more time periods (e.g., one or more time periods of 30 seconds to 1 minute). Intensity values ​​can indicate the number of motions and the associated intensity of the motions (e.g., acceleration values). Depending on the associated threshold acceleration value, intensity values ​​can be categorized as low, medium, and high. MET can be determined based on the intensity of motions during a time period (e.g., 30 seconds), the regularity / irregularity of the motions, and the number of motions associated with different intensities.

[0077] In some implementations, processing module 230-a can compress the data stored in memory 215. For example, processing module 230-a can delete sampled data after performing calculations based on the sampled data. As another example, processing module 230-a can average data over a longer time period to reduce the number of stored values. In a particular example, if the user's average temperature over one minute is stored in memory 215, processing module 230-a can calculate the average temperature over a five-minute time period for storage and then erase the one-minute average temperature data. Processing module 230-a can compress data based on various factors, such as the total amount of memory 215 used / available and / or the time elapsed since the last data transmission from ring 104 to user device 106.

[0078] While a user's physiological parameters can be measured by sensors included on the ring 104, other devices can also measure these parameters. For example, while a user's temperature can be measured by a temperature sensor 240 included in the ring 104, other devices can also measure it. In some examples, other wearable devices (e.g., wrist devices) may include sensors for measuring a user's physiological parameters. Furthermore, medical devices such as external medical devices (e.g., wearable medical devices) and / or implantable medical devices can measure a user's physiological parameters. The techniques described herein can be implemented using one or more sensors on any type of computing device.

[0079] Physiological measurements can be acquired continuously throughout the day and / or night. In some implementations, physiological measurements can be acquired during various parts of the day and / or night. In some implementations, physiological measurements can be acquired in response to determining that the user is in a specific state (e.g., active, resting, and / or sleeping). For example, ring 104 can perform physiological measurements in a resting / sleeping state to obtain a cleaner physiological signal. In one example, ring 104 or other devices / systems can detect when the user is resting and / or sleeping and acquire physiological parameters (e.g., temperature) of the detected state. When the user is in other states, the devices / systems can use the resting / sleeping physiological data and / or other data to implement the techniques of this disclosure.

[0080] In some implementations, as described previously herein, ring 104 may be configured to collect, store, and / or process data, and may transfer any data described herein to user device 106 for storage and / or processing. In some aspects, user device 106 includes wearable application 250, operating system (OS) 285, web browser application (e.g., web browser 280), one or more additional applications, and GUI 275. User device 106 may further include other modules and components, including sensors, audio devices, haptic feedback devices, etc. Wearable application 250 may include examples of applications (e.g., “apps”) that can be installed on user device 106. Wearable application 250 may be configured to acquire data from ring 104, store the acquired data, and process the acquired data as described herein. For example, wearable application 250 may include user interface (UI) module 255, acquisition module 260, processing module 230-b, communication module 220-b, and storage module (e.g., database 265) configured to store application data.

[0081] The various data processing operations described herein can be performed by ring 104, user equipment 106, server 110, or any combination thereof. For example, in some cases, data collected by ring 104 may be preprocessed and transmitted to user equipment 106. In this example, user equipment 106 may perform some data processing operations on the received data, transmit the data to server 110 for data processing, or both. For example, in some cases, user equipment 106 may perform processing operations requiring relatively low processing power and / or requiring relatively low latency, while user equipment 106 may transmit data to server 110 for processing operations requiring relatively high processing power and / or allowing relatively high latency.

[0082] In some aspects, the ring 104 of system 200, user device 106, and server 110 can be configured to assess a user's sleep patterns. Specifically, the corresponding components of system 200 can be used to collect data from the user via ring 104 and generate one or more scores (e.g., sleep score, readiness score) for the user based on the collected data. For example, as previously noted herein, the ring 104 of system 200 can be worn by the user to collect data from the user, including temperature, heart rate, HRV, etc. The data collected by ring 104 can be used to determine when the user fell asleep to assess the user's sleep for a given "sleep day." In some aspects, a score can be calculated for each corresponding sleep day, such that a first sleep day is associated with a first set of scores, and a second sleep day is associated with a second set of scores. The score for each corresponding sleep day can be calculated based on data collected by ring 104 during the corresponding sleep day. The scores can include, but are not limited to, sleep scores, readiness scores, etc.

[0083] In some cases, a "sleep day" can be aligned with a traditional calendar day, allowing a given sleep day to extend from midnight to midnight on the corresponding calendar day. In other cases, a sleep day can be offset relative to a calendar day. For example, a sleep day can extend from 6:00 PM (6:00 PM) on a calendar day to 6:00 PM (6:00 PM) on a subsequent calendar day. In this example, 6:00 PM can serve as a "deadline," where data collected from the user before 6:00 PM is counted for the current sleep day, and data collected from the user after 6:00 PM is counted for subsequent sleep days. Because most individuals sleep the most at night, offsetting the sleep day relative to the calendar day allows System 200 to assess the user's sleep patterns in a manner consistent with their sleep schedule. In some cases, users may be able to selectively adjust (e.g., via a GUI) the timing of their sleep day relative to the calendar day, aligning the sleep day with the duration of the corresponding user's typical sleep.

[0084] In some implementations, a user's total score for each corresponding day (e.g., sleep score, readiness score) can be determined / calculated based on one or more "contributors," "factors," or "contribution factors." For example, a user's total sleep score can be calculated based on a set of contributors, including: total sleep, efficiency, restfulness, REM sleep, deep sleep, wait time, timing, or any combination thereof. The sleep score can include any number of contributors. A "total sleep" contributor can refer to the sum of all sleep periods on a sleep day. A "efficiency" contributor can reflect the percentage of time spent asleep compared to the time spent waking up while sleeping, and can be calculated using the average efficiency of the long sleep periods (e.g., the main sleep period) of the sleep day, weighted by the duration of each sleep period. A "restfulness" contributor can indicate how restful a user's sleep is, and can be calculated using the average of all sleep periods of the sleep day, weighted by the duration of each period. Tranquility contributors can be based on “wake-up count” (e.g., the sum of all wake-ups detected during different sleep periods when the user wakes up), excessive movement, and “get-out count” (e.g., the sum of all get-outs detected during different sleep periods when the user gets out of bed).

[0085] A “REM sleep” contributor can refer to the sum of REM sleep durations across all sleep segments on a sleep day that includes REM sleep. Similarly, a “deep sleep” contributor can refer to the sum of deep sleep durations across all sleep segments on a sleep day that includes deep sleep. A “waiting time” contributor can represent how long it takes a user to fall asleep (e.g., average, median, longest) and can be calculated using the average of long sleep segments between sleep days, weighted by the duration of each segment and the number of such segments (e.g., combining one or more given sleep stages can be its own contributor or can be weighted by other contributors). Finally, a “timed” contributor can refer to the relative timed sleep segments within a sleep day and / or calendar day and can be calculated using the average of all sleep segments on a sleep day weighted by the duration of each segment.

[0086] As another example, a user's overall readiness score can be calculated based on a set of contributors, including: sleep, sleep balance, heart rate, HRV balance, recovery index, temperature, activity, activity balance, or any combination thereof. The readiness score can include any number of contributors. A "sleep" contributor can refer to the combined sleep score of all sleep segments within a sleep day. A "sleep balance" contributor can refer to the cumulative duration of all sleep segments within a sleep day. Specifically, sleep balance can indicate to a user whether the sleep a user has taken over a certain period (e.g., the past two weeks) is in line with the user's needs. Typically, adults need 7-9 hours of sleep per night to maintain health, alertness, and optimal mental and physical performance. However, occasional nights with poor sleep are common, so sleep balance contributors consider long-term sleep patterns to determine whether each user's sleep needs are being met. A "resting heart rate" contributor can indicate the lowest heart rate from the longest sleep segment of the sleep day (e.g., the main sleep segment) and / or the lowest heart rate from a nap that occurs after the main sleep segment.

[0087] Continuing to reference the "contributors" (e.g., factors, contributing factors) of the readiness score, the "HRV balance" contributor can indicate the highest average HRV from the main sleep period and naps that occur after the main sleep period. The HRV balance contributor helps users track their recovery status by comparing their HRV trend over a first time period (e.g., two weeks) with the average HRV over a second, longer time period (e.g., three months). The "recovery index" contributor can be calculated based on the longest sleep period. The recovery index measures how long it takes for a user's resting heart rate to stabilize during the night. A very good sign of recovery is that the user's resting heart rate stabilizes during the first half of the night (at least six hours before the user wakes up), leaving time for the body to recover the next day. If the user's highest temperature during a nap is at least 0.5°C higher than the highest temperature during the longest sleep period, the "body temperature" contributor can be calculated based on the longest sleep period (e.g., the main sleep period) or based on naps that occur after the longest sleep period. In some aspects, the ring can measure the user's body temperature while the user is asleep, and the system 200 can display the user's average temperature relative to the user's baseline temperature. If a user's body temperature is outside their normal range (e.g., clearly above or below 0.0), the body temperature contributor can be highlighted (e.g., put into "attention" status) or otherwise generate an alert for the user.

[0088] In some aspects, system 200 can support the method of manufacturing ring 104 according to the technology described herein. For example, electrical components of ring 104 (e.g., battery 210, memory 215, communication module 220-a, power module 225, processing module 230-a, PPG system 235, one or more temperature sensors 240, one or more motion sensors 245, or any combination thereof) can be attached to a metal inner cover or housing. Furthermore, the metal inner housing with the attached electrical components can be placed in a mold, allowing transparent epoxy resin to be injection molded to secure the electrical components to the metal inner housing. Injection molding can also fill one or more orifices of the metal inner housing with transparent epoxy resin, allowing one or more optical sensors, such as PPG system 235, to be fixed relative to one or more orifices to enable data acquisition through one or more orifices. The result of injection molding the metal inner housing to the electrical components can be referred to as the inner housing 205-a of ring 104, or engine assembly, which is essentially an operable ring 104 without an outer housing 205-b.

[0089] Subsequently, the outer casing 205-b (e.g., an outer cover) can be slidable or positioned around the inner casing 205-a and can be secured to the inner casing 205-a using side covers (e.g., ring fittings). That is, side covers can be positioned on each side of the ring 104, aligned with a corresponding slot between the outer casing 205-b and the inner casing 205-a on each side of the ring 104. Each side cover can be slightly wider than the slot between the outer casing 205-b and the inner casing 205-a, such that the side cover undergoes mechanical deformation when inserted into the slot under applied force (e.g., when pressed into the slot). Additionally, the outer casing 205-b, the inner casing 205-a, or both may include one or more mechanical locking features or grooves, which are at least partially located within a slot on either side of the ring 104, such that mechanical deformation of the side cover causes the side cover to engage, or fills the mechanical locking features within the outer casing 205-b, the inner casing 205-a, or both, thereby locking the outer casing 205-b to the inner casing 205-a.

[0090] Figure 3 An example of a system 300 supporting techniques for securing an outer cover to a wearable ring device is shown according to various aspects of this disclosure. In other words, system 300 may support techniques in which the ring 104 is manufactured "from the inside out," securing the outer cover 325 to an inner cover 305 including electrical components of the ring 104 via a plurality of side covers 330, in a manner that reduces unintended movement of the side covers 330, the outer cover 325, or both, when exposed to external forces.

[0091] For example, electrical components of ring 104 (e.g., a PCB and one or more optical sensors) can be attached to an inner cover 305 (e.g., an inner annular housing) of ring 104, and the inner cover 305 (e.g., and the attached electrical components) can be placed in a mold such that a filler 315 (e.g., a clear epoxy resin) can be injected into the mold to secure the electrical components to the inner cover 305. Additionally, injection molding can result in the filler 315 filling one or more orifices 310 of the inner cover 305, such as orifices 310-a and 310-b, such that one or more optical sensors can be secured relative to the orifices 310 to enable data acquisition. The result of injection molding the inner cover 305 to the electrical components can be referred to as ring assembly 302 (e.g., a ring engine assembly). Ring assembly 302 can essentially be an operable ring 104 without an outer cover 325 (e.g., an outer annular housing). Subsequently, different outer covers 325 can slide around the inner cover 305 (e.g., ring assembly 302), and can be secured to the inner cover 305 using side covers 330 (e.g., side covers 330-a and side covers 330-b) to complete the ring. However, the method of securing the side covers 330 to the outer cover 325 and the inner cover 305 may be defective, causing the outer cover 325 to rotate around the inner cover 305, the side covers 330 to loosen or pop off the ring 104, or both.

[0092] Therefore, the technology described herein can support the manufacturing process of ring 104 to secure outer cover 325 to inner cover 305 (e.g., ring assembly 302), thereby reducing or eliminating unintended movement of side cover 330, outer cover 325, or both when exposed to external forces. Specifically, outer cover 325 can slide around inner cover 305 (e.g., ring assembly 302), and side cover 330 (e.g., annular fitting) can be positioned on each side of ring 104, aligned with a corresponding slot between outer cover 325 and inner cover 305 on each side of ring 104. For example, side cover 330-a can be positioned on a first lateral side of ring 104, aligned with a first slot between outer cover 325 and inner cover 305 (e.g., on the first lateral side), and side cover 330-b can be positioned on a second lateral side of ring 104 opposite to the first lateral side, aligned with a second slot between outer cover 325 and inner cover 305 (e.g., on the second lateral side). Therefore, side cover 330-a can be inserted into the first slot, and side cover 330-b can be inserted into the second slot.

[0093] In some examples, each side cover 330 may be slightly wider than the slot between the outer cover 325 and the inner cover 305, such that the side cover 330 undergoes mechanical deformation when inserted into or pressed into the slot under applied force. In this case, the mechanical deformation of the side cover 330 may result in the side cover 330 engaging with one or more mechanical locking features on the outer cover 325, the inner cover 305, or both, as referenced. Figure 4A Further description.

[0094] Additionally, or alternatively, each side cover 330 may include one or more flanges or locking wings to enable the side cover 330 to engage with one or more mechanical locking features on the outer cover 325, the inner cover 305, or both, as referenced. Figure 4B Further description.

[0095] In some examples, an adhesive may be applied or dispensed between the outer cover 325 and the inner cover 305 to lock or secure the outer cover 325 to the inner cover 305. For example, a heat-sensitive or photosensitive adhesive (e.g., UV adhesive) may be applied to a slot (e.g., and any gap) between the outer cover 325 and the inner cover 305, such that a thin layer of adhesive exists between the side cover 330 and the outer cover 325 and the inner cover 305. In the case of a photosensitive adhesive, the side cover 330 may be made of a light-transparent material, allowing light (e.g., UV light) to be applied to the adhesive through the side cover 330 to cure it. Similarly, in the case of a heat-sensitive adhesive, heat may be applied to the adhesive through the side cover 330, the outer cover 325, the inner cover 305, or any combination thereof to cure it. Curing the adhesive can cause it to harden, thereby locking the outer cover 325 to the inner cover 305 (e.g., and locking the side cover 330 into place).

[0096] In some cases, heat-sensitive or photosensitive adhesives can be used instead of side cover 330. For example, UV adhesive can be applied to the slot (e.g., and any gaps) between outer cover 325 and inner cover 305, such that the UV adhesive fills the entire slot. In this case, UV light can be applied directly to the UV adhesive to cure it, causing the UV adhesive to cure at the location of side cover 330, thereby locking outer cover 325 to inner cover 305. In additional or alternative implementations, self-curing adhesives or composite materials can also be used. Such self-curing materials can be cured by mixing polymerizable components or by exposure to air.

[0097] In some other examples, HAF may be applied to the inner surface of the outer cover 325, the outer surface of the inner cover 305, or both, such that when the outer cover 325 is placed around the inner cover 305, the HAF contacts both the outer cover 325 and the inner cover 305. Additionally, the HAF may be activated by exposing the outer cover 325, the inner cover 305, the side cover 330, or any combination thereof to heat, thereby locking the outer cover 325 to the inner cover 305.

[0098] Additionally, or alternatively, the texture of the outer cover 325, the inner cover 305, or both may be modified to increase the friction between the side cover 330 and the outer cover 325, the inner cover 305, or both (e.g., compared to an unmodified texture). For example, one or more portions of the outer cover 325 aligned with the slot, one or more portions of the inner cover 305 aligned with the slot, or both may be laser-engraved, sandblasted, polished (e.g., using sandpaper), or treated similarly to increase the coefficient of friction between the side cover 330 and one or more portions of the outer cover 325, one or more portions of the inner cover 305, or both within the slot (e.g., creating a high-friction locking mechanism) (e.g., relative to an unmodified component). Therefore, after the side cover 330 is inserted into the slot, the force required to cause the outer cover 325 to rotate about the inner cover 305, to cause the side cover 330 to loosen or pop off the wearable ring device, or both, can increase to reach or exceed a threshold, where the threshold is based on the external force applied to the ring 104 when the user 102 wears it (e.g., the threshold is greater than the maximum force that the user 102 may apply to the ring 104 when wearing it).

[0099] In some implementations, the light-emitting component (e.g., an LED) can extend from the filler 315 of the ring assembly 302, and the side covers 330-a and 330-b can be at least partially transparent to light, allowing the light emitted by the light-emitting component to be seen through the side cover 330. In this case, the light-emitting component can be configured to emit light of different colors or flash in different patterns to convey information to the user through the side cover 330. For example, the side cover 330 can be illuminated with light of different colors or patterns (e.g., a flashing pattern) to indicate the battery level of the ring 104, confirm the receipt of commands or gestures input by the ring, etc.

[0100] Figure 4A and Figure 4B Exemplary cross-sectional views 400 (e.g., cross-sectional views 400-a, 400-b, and 400-c) of the ring 104, which support techniques for securing the outer cover to the ring 104 according to various aspects of this disclosure, are shown.

[0101] In some examples, such as reference Figure 3 The side cover 430 (e.g., side cover 330) can be inserted into or pressed into a slot between the outer cover 425 (e.g., outer cover 325) and the inner cover 405 (e.g., inner cover 305) to secure the outer cover 425 to the inner cover 405, thereby reducing unintended movement of the side cover 430, the outer cover 425, or both when exposed to external forces. For example, as... Figure 4A and Figure 4BAs described in the context, the inner cover 405 (e.g., a ring engine assembly) can be manufactured by attaching electrical components of the ring 104 (e.g., a PCB 420 and one or more optical sensors (e.g., among other electrical components)) to a metal inner housing (e.g., an inner annular housing) and placing the metal inner housing and the attached electrical components into a mold. Thus, a filler 415 can be injected into the mold such that the electrical components of the ring 104 are secured to the metal inner housing. Furthermore, injecting the filler 415 into the mold can cause the filler 415 to fill one or more orifices 410 of the metal inner housing (e.g., of the ring 104), such as orifices 410-a and 410-b, so that one or more optical sensors aligned with orifices 410 can collect data (e.g., physiological data) via signaling (e.g., light) transmitted through the orifices 410. As previously described, the component produced by the injection molding process (e.g., a metal inner housing molded to the electrical components by filler 415) can be referred to as the ring assembly 302 (e.g., a ring engine assembly).

[0102] Therefore, an outer cover 425 (e.g., an outer annular housing) can be placed around an inner cover 405, creating a slot 445-a between the outer cover 425 and the inner cover 405 on a first lateral side of the ring 104, and a slot 445-b between the outer cover 425 and the inner cover 405 on a second lateral side of the ring 104 opposite to the first lateral side. In this case, a side cover 430 can be inserted into each slot 445. To insert the side cover 430 into the slot 445, the side cover 430 can be aligned with the slot 445 on the first lateral side of the ring 104, and the inner cover 405, the outer cover 425, and the aligned side cover 430 can be placed between two uniform surfaces, or plates, and placed into a press (e.g., a machine press). Thus, the press can apply a force (e.g., a distributed force) to the uniform surface to uniformly transmit at least a portion of the force to the side cover 430, thereby pressing (e.g., press-fitting) the side cover 430 into the slot 445. For example, a press can apply a distributed force along the circular surface (e.g., the circular edge) of ring 104, thereby forcing the side cover 430 into the corresponding slot 445. This process can then be repeated on a second lateral side of ring 104 (e.g., or simultaneously with the first lateral side). In this case, the side cover 430 can undergo mechanical deformation during (e.g., after) insertion into the slot 445, such that the side cover 430 engages with the outer cover 425, the inner cover 405, or one or more of the recesses 435 of both, thereby securing the outer cover 425 to the inner cover 405 by “locking” the side cover 430.

[0103] For example, as described in reference cross-sectional view 400-a, side cover 430-a can be inserted into or pressed into slot 445-a, and side cover 430-b can be inserted into or pressed into slot 445-b. In this case, side cover 430-a and side cover 430-b may be slightly wider than slots 445-a and 445-b, respectively, such that pressing or inserting side cover 430 into or into slot 445 causes mechanical deformation of side cover 430. In other words, side cover 430 can be "squeezed" into slot 445 and can engage with outer cover 425, inner cover 405, or recess 435 in both. For example, outer cover 425 may include recesses 435-a and 435-b, wherein each recess 435 is at least partially located within slots 445-a and 445-b, respectively. That is, each slot 445 may have a first width in the portion of the slot 445 excluding the recess 435, and may have a second width in the portion of the slot 445 including the recess 435, wherein the second width is wider or greater than the first width. Therefore, after being inserted into the slot 445 (e.g., when inserted into the slot 445), as shown in cross-sectional view 400-b, the side cover 430 (which may exhibit a third width wider than both the first and second widths) may deform from the third width to the first width in the portion of the slot 445 excluding the recess 435, and deform from the third width to the second width in the portion of the slot 445 including the recess 435, thereby filling or engaging the recess 435.

[0104] Therefore, the deformation of the side cover 430 from the third width to a width smaller than the third width (e.g., the first width and the second width) can cause forces to be generated between the side cover 430 and the outer cover 425 and the inner cover 405, securing the side cover 430 in place between the outer cover 425 and the inner cover 405. Additionally, the deformation of the side cover 430 into the recesses 435-a and 435-b can lock the side cover 430 in the slot 445, preventing the side cover 430 from "popping" out or being released from the slot 445.

[0105] Additional, or alternative, land, as per reference Figure 4A As shown in cross-sectional view 400-c, side cover 430-c can be inserted into or pressed into slot 445-a, and side cover 430-d can be inserted into or pressed into slot 445-b. In this case, side cover 430-c and side cover 430-d may each include one or more flanges 440. For example, side cover 430-c may include flange 440-a on its outer periphery (e.g., surface) and flange 440-b on its inner periphery. Similarly, side cover 430-d may include flange 440-c on its outer periphery and flange 440-d on its inner periphery. Flange 430 may also be referred to as a "locking wing".

[0106] In some cases, the first portion of side covers 430-c and 430-d, excluding the flange 440, may be equal to the width of the slot 445, and the second portion of side covers 430-c and 430-d, including the flange 440, may be wider than the slot 445. In other words, the flange 440 may extend beyond the width of the slot 445. Therefore, when side covers 430-c and 430-d are inserted into the slot 445, the flange 440 may deform or recess, allowing the side cover 430 to enter the slot 445. Additionally, the flange 440 may deform back to its original shape or pop back when it enters the recess 435 of the outer cover 425, inner cover 405, or both (once fully inserted into the slot 445). For example, the outer cover 425 may include a recess 435-c (e.g., aligned with slot 445-a) and a recess 435-e (e.g., aligned with slot 445-b), and the inner cover 405 may include a recess 435-d (e.g., aligned with slot 445-a) and a recess 435-f (e.g., aligned with slot 445-b). Therefore, once the side cover 430-c is inserted into slot 445-a, the flange 440-a may engage (e.g., pop out or release into) the recess 435-a, and the flange 440-b may engage the recess 435-d. Similarly, once the side cover 430-d is inserted into slot 445-b, the flange 440-c may engage the recess 435-e, and the flange 440-d may engage the recess 435-f. Therefore, the engagement of the flange 440 with the recess 435 can cause forces to be generated between the side cover 430 (e.g., the flange of the side cover 430) and the outer cover 425 and the inner cover 405, securing the side cover 430 in place between the outer cover 425 and the inner cover 405. Additionally, the engagement of the flange 440 with the recess 435 can lock the side cover 430 in the slot 445, preventing the side cover 430 from "popping" out or being released from the slot 445.

[0107] In some examples, such as reference Figure 4A and Figure 4BHeat can be applied to the ring 104 to further deform the side cover 430 into the recess 435. That is, after insertion into the slot 445, space or gaps may still exist between the side cover 430 and the recess 435. Therefore, heat can be applied directly to the side cover 430, through the outer cover 425, through the inner cover 405, or any combination thereof, to cause the side cover 430 to deform (e.g., melt) into the recess 435. In other words, deformation of the side cover 430 due to the applied heat can cause the side cover 430 to fill the space or gap between the side cover 430 and the recess 435. In this case, the side cover 430 may include additional material to allow deformation due to heat to occur. In other words, when inserted into the slot 445, a portion of the side cover 430 may extend beyond the surfaces of the inner cover 405 and the outer cover 425 (e.g., creating a protrusion on the surface of the ring 104) before heat is applied. However, as previously stated, when heat is applied, the side cover 430 can deform into the recess 435, making the side cover 430 flush with the outer cover 425 and the inner cover 405. In other words, the portion of the side cover 430 that previously extended beyond the surfaces of the inner cover 405 and the outer cover 425 can be eliminated (e.g., reduced to create a smooth surface for the ring 104).

[0108] In some examples, such as reference Figure 4A and Figure 4B The side cover 430 may be removable, allowing the outer cover 425 to be replaced or replaced. For example, a removal tool may be inserted into one or more features of the side cover 430, into the slot 445, or both, and manipulated in a manner that causes the side cover 430 to be released from the slot 445 (e.g., from the recess 435). Thus, the user 102 can remove the outer cover 425 from around the inner cover 405 and place a new outer cover 425 around the inner cover 405. Additionally, the user 102 can reinsert the side cover 430 (e.g., a new side cover 430 or the same side cover 430 removed from the ring 104) into the slot 445 between the new outer cover 425 and the inner cover 405. In this case, the user 102 can use one or more push-in tools to reinsert the side cover 430 into the slot 445.

[0109] Although described in the context of various techniques for securing the outer cover 425 to the inner cover 405, this should not be construed as limiting the present disclosure. That is, any combination of techniques described herein can be used to secure or lock the outer cover 425 of the ring 104 to the inner cover 405 of the ring 104. Conversely, any of the techniques described herein can be used independently to secure or lock the outer cover 425 of the ring 104 to the inner cover 405 of the ring 104.

[0110] Figure 5A flowchart illustrating a method 500 for securing an outer cover to a wearable ring device according to various aspects of this disclosure is shown. Operation of method 500 can be implemented by a wearable device or its components as described herein. For example, operation of method 500 can be achieved by referring to... Figures 1 to 5 The wearable device performs the function. In some examples, the wearable device may execute a set of instructions to control the functional elements of the wearable device to perform the function. Additionally, or alternatively, the wearable device may use dedicated hardware to perform various aspects of the function.

[0111] At 505, the method may include coupling the PCB to an inner annular housing to form a ring assembly, wherein the inner annular housing defines an inner circumferential surface of the ring assembly. Operation of block 505 may be performed according to the examples disclosed herein.

[0112] At 510, the method may include placing an outer annular housing around the ring assembly such that the outer annular housing covers at least a portion of the outer peripheral surface of the ring assembly, wherein placing the outer annular housing around the ring assembly creates a first slot between the outer annular housing and an inner annular housing on a first lateral side of the wearable ring device, and creates a second slot between the outer annular housing and the inner annular housing on a second lateral side of the wearable ring device opposite the first lateral side. Operation of block 510 may be performed according to the examples disclosed herein.

[0113] At 515, the method may include inserting a first annular accessory into a first slot and inserting a second annular accessory into a second slot, the first and second annular accessories extending circumferentially around the wearable ring device on a first and second lateral side of the wearable ring device, respectively, wherein the insertion causes mechanical deformation of the shapes of the first and second annular accessories, wherein the mechanical deformation of the first and second annular accessories causes them to engage with one or more features of an inner annular housing, an outer annular housing, or both, to couple the outer annular housing to the inner annular housing. Operation of block 515 may be performed according to the examples disclosed herein.

[0114] It should be noted that the methods described above describe possible implementations, and these operations and steps can be rearranged or otherwise modified, and other implementations are possible. Furthermore, aspects from two or more of these methods can be combined.

[0115] A wearable ring device (e.g., apparatus) is described. The wearable ring device may include an inner annular housing comprising one or more apertures, wherein the inner annular housing defines an inner circumferential surface of the wearable ring device; one or more sensors at least partially disposed within the inner annular housing, the sensors being configured to acquire physiological data from a user through the one or more apertures; an outer annular housing at least partially surrounding the inner annular housing, wherein the outer annular housing defines an outer circumferential surface of the wearable ring device; a first annular fitting at least partially disposed within a first slot between the outer and inner annular housings on a first lateral side of the wearable ring device; and a second annular fitting at least partially disposed within a second slot between the outer and inner annular housings on a second lateral side of the wearable ring device, wherein the first and second annular fittings are configured to undergo mechanical deformation upon insertion into the first and second slots, respectively, wherein the mechanical deformation of the first and second annular fittings causes them to engage with one or more features of the inner annular housing, the outer annular housing, or both, to couple the outer annular housing to the inner annular housing.

[0116] In some examples, the wearable ring device may include an outer annular housing, an inner annular housing, or one or more of the above first recesses, one or more of the first recesses being at least partially located within a first slot, and an outer annular housing, an inner annular housing, or one or more of the above second recesses, one or more of the second recesses being at least partially located within a second slot, one or more features including one or more first recesses and one or more second recesses, wherein a first annular accessory may be configured to deform into one or more first recesses, and a second annular accessory may be configured to deform into one or more second recesses.

[0117] In some examples, the wearable ring device may include a first set of flanges on a first ring accessory, wherein the first set of flanges may be configured to undergo mechanical deformation from a first shape to a second shape during insertion of the first ring accessory into a first slot, wherein the first set of flanges may be configured to undergo a second mechanical deformation from the second shape back to the first shape after insertion into the first slot, wherein the second mechanical deformation causes the first set of flanges to engage with one or more first recesses, and a second set of flanges on a second ring accessory, wherein the second set of flanges may be configured to undergo mechanical deformation from the first shape to the second shape during insertion of the second ring accessory into a second slot, wherein the second set of flanges may be configured to undergo a third mechanical deformation from the second shape back to the first shape after insertion into the second slot, wherein the third mechanical deformation causes the second set of flanges to engage with one or more second recesses.

[0118] In some examples, the first set of flanges on the first annular fitting may extend wider than the width of the first slot, and the second set of flanges on the second annular fitting may extend wider than the width of the second slot.

[0119] In some examples, the first annular fitting and the second annular fitting may be configured to undergo mechanical deformation upon application of heat after being inserted into the first slot and the second slot, respectively, and the application of heat may cause the first annular fitting and the second annular fitting to deform at least partially into the shape of one or more first grooves and one or more second grooves, respectively.

[0120] In some examples, the thickness of the first annular fitting may be wider than the first slot, and the thickness of the second annular fitting may be wider than the second slot.

[0121] In some examples, the wearable ring device may include a bonding agent located between an outer ring housing and an inner ring housing, wherein the outer ring housing may be coupled to the inner ring housing at least in part based on the adhesive.

[0122] In some examples, the binder includes a thermally activated or photoactivated adhesive configured to cure upon application of heat or light via a first annular fitting, a second annular fitting, or both, and wherein the outer annular shell is coupled to the inner annular shell at least in part based on the cured thermally activated or photoactivated adhesive.

[0123] In some examples, the binder includes a thermally activated membrane configured to be activated when heat is applied through an outer annular shell, an inner annular shell, a first annular fitting, a second annular fitting, or any combination thereof, and the outer annular shell may be coupled to the inner annular shell at least in part based on the activated thermally activated membrane.

[0124] In some examples, the inner annular housing, the outer annular housing, or both include a textured surface, which can be configured to engage with the textured surface of the first annular fitting, the second annular fitting, or both.

[0125] In some examples, the first annular fitting and the second annular fitting can be configured to be removed by inserting a removal tool at least partially into the first slot and the second slot, respectively.

[0126] In some examples, the inner annular shell and the outer annular shell may be made of the same material or different materials.

[0127] In some examples, the first and second ring fittings include one or more non-metallic materials, which can be configured to allow wireless signals to propagate into and out of the wearable ring device through the first and second ring fittings, respectively.

[0128] In some examples, a waterproof seal is formed between the outer annular housing and the inner annular housing by inserting a first annular fitting into a first slot and a second annular fitting into a second slot to couple the outer annular housing to the inner annular housing.

[0129] In some examples, the wearable ring device may include a filler material that can be injected into a cavity between the inner annular housing and the mold surface to fill at least a portion of one or more orifices of the inner annular housing, wherein the filler material may be further configured to bond the PCB to the inner annular housing.

[0130] A method for manufacturing a wearable ring device by means of an apparatus is described. The method may include: coupling a PCB to an inner annular housing to form a ring assembly, wherein the inner annular housing defines an inner circumferential surface of the ring assembly; placing an outer annular housing around the ring assembly such that the outer annular housing covers at least a portion of the outer circumferential surface of the ring assembly, wherein placing the outer annular housing around the ring assembly creates a first slot between the outer annular housing and the inner annular housing on a first lateral side of the wearable ring device, and a second slot between the outer annular housing and the inner annular housing on a second lateral side of the wearable ring device opposite to the first lateral side; and inserting a first annular fitting into the first slot and a second annular fitting into the second slot, the first and second annular fittings extending circumferentially around the wearable ring device on the first and second lateral sides of the wearable ring device, respectively, wherein the insertion causes mechanical deformation of the shapes of the first and second annular fittings, wherein the mechanical deformation of the first and second annular fittings causes the first and second annular fittings to engage with one or more features of the inner annular housing, the outer annular housing, or both, to couple the outer annular housing to the inner annular housing.

[0131] An apparatus for manufacturing a wearable ring device is described. The apparatus may include one or more memories storing processor executable code, and one or more processors coupled to the one or more memories. The one or more processors may be operable individually or collectively to execute code, thereby coupling the PCB to an inner annular housing to form a ring assembly, wherein the inner annular housing defines an inner circumferential surface of the ring assembly, and an outer annular housing is placed around the ring assembly such that the outer annular housing covers at least a portion of the outer circumferential surface of the ring assembly, wherein placing the outer annular housing around the ring assembly creates a first slot between the outer annular housing and the inner annular housing on a first lateral side of the wearable ring device, and creates a second slot between the outer annular housing and the inner annular housing on a second lateral side of the wearable ring device opposite to the first lateral side, and inserts a first annular fitting into the first slot and a second annular fitting into the second slot, the first annular fitting and the second annular fitting extending circumferentially around the wearable ring device on the first lateral side and the second lateral side of the wearable ring device, respectively, wherein the insertion causes mechanical deformation of the shape of the first annular fitting and the shape of the second annular fitting, wherein the mechanical deformation of the first annular fitting and the second annular fitting causes the first annular fitting and the second annular fitting to engage with one or more features of the inner annular housing, the outer annular housing, or both, to couple the outer annular housing to the inner annular housing.

[0132] Another apparatus for manufacturing a wearable ring device is described. The apparatus may include: means for coupling a PCB to an inner annular housing to form a ring assembly, wherein the inner annular housing defines an inner circumferential surface of the ring assembly; means for placing an outer annular housing around the ring assembly such that the outer annular housing covers at least a portion of the outer circumferential surface of the ring assembly, wherein placing the outer annular housing around the ring assembly creates a first slot between the outer annular housing and the inner annular housing on a first lateral side of the wearable ring device, and creates a second slot between the outer annular housing and the inner annular housing on a second lateral side of the wearable ring device opposite to the first lateral side; and means for inserting a first annular accessory into the first slot and a second annular accessory into the second slot, the first annular accessory and the second annular accessory extending circumferentially around the wearable ring device on the first lateral side and the second lateral side, respectively, wherein the insertion causes mechanical deformation of the shape of the first annular accessory and the shape of the second annular accessory, wherein the mechanical deformation of the first annular accessory and the second annular accessory causes the first annular accessory and the second annular accessory to engage with one or more features of the inner annular housing, the outer annular housing, or both, to couple the outer annular housing to the inner annular housing.

[0133] A non-transitory computer-readable medium is described, storing code for manufacturing a wearable ring device. The code may include instructions executable by a processor to couple a PCB to an inner annular housing to form a ring assembly, wherein the inner annular housing defines an inner circumferential surface of the ring assembly; to place an outer annular housing around the ring assembly such that the outer annular housing covers at least a portion of the outer circumferential surface of the ring assembly; wherein placing the outer annular housing around the ring assembly creates a first slot between the outer and inner annular housings on a first lateral side of the wearable ring device, and creates a second slot between the outer and inner annular housings on a second lateral side of the wearable ring device opposite the first lateral side; and to insert a first annular fitting into the first slot and a second annular fitting into the second slot, the first and second annular fittings extending circumferentially around the wearable ring device on the first and second lateral sides, respectively; wherein the insertion causes mechanical deformation of the shapes of the first and second annular fittings, wherein the mechanical deformation causes the first and second annular fittings to engage with one or more features of the inner and outer annular housings to couple the outer annular housing to the inner annular housing.

[0134] In some examples of the methods, apparatus, and non-transitory computer-readable media described herein, one or more features of the inner annular housing, the outer annular housing, or both include one or more first recesses at least partially located in one or more first slots and one or more second recesses at least partially located in one or more second slots, one or more features including one or more first recesses and one or more second recesses, insertion of the first annular fitting causes the first annular fitting to deform into one or more first recesses, and insertion of the second annular fitting causes the second annular fitting to deform into one or more second recesses.

[0135] Some examples of the methods, apparatuses, and non-transitory computer-readable media described herein may further include operations, features, devices, or instructions for applying heat to the first and second annular fittings after inserting the first and second annular fittings into the first and second slots, respectively, wherein applying heat to the first and second annular fittings causes the first and second annular fittings to deform, at least partially, into the shape of one or more first grooves and one or more second grooves, respectively.

[0136] Some examples of the methods, apparatuses, and non-transitory computer-readable media described herein may further include operations, features, devices, or instructions for inserting a thermally activated or photoactivated adhesive between an outer annular housing and an inner annular housing, and for applying heat or light to the thermally activated or photoactivated adhesive via a first annular fitting, a second annular fitting, or both, to cure the thermally activated or photoactivated adhesive, wherein coupling the outer annular housing to the inner annular housing may be at least partially based on curing the thermally activated or photoactivated adhesive.

[0137] Some examples of the methods, apparatuses, and non-transitory computer-readable media described herein may further include operations, features, devices, or instructions for inserting a thermally activated membrane between an outer annular housing and an inner annular housing and for applying heat to the thermally activated membrane by means of the outer annular housing, the inner annular housing, a first annular fitting, a second annular fitting, or any combination thereof to activate the thermally activated membrane, wherein coupling the outer annular housing to the inner annular housing may be at least partially based on activating the thermally activated membrane.

[0138] The description herein, illustrated with reference to the accompanying drawings, describes exemplary configurations and does not represent all examples that can be implemented or that are within the scope of the claims. The term "exemplary" as used herein means "serving as an example, instance, or illustration," and not "preferred" or "superior to other examples." Detailed descriptions include specific details for the purpose of providing an understanding of the described techniques. However, these techniques can be practiced without these specific details. In some instances, well-known structures and devices are shown in block diagram form to avoid obscuring the concepts of the described examples.

[0139] In the accompanying drawings, similar components or features may have the same reference numerals. Furthermore, various components of the same type can be distinguished by a reference numeral marked with a dash and a second numeral to differentiate them. If only the first reference numeral is used in the specification, the description applies to any of the similar components having the same first reference numeral, without regard to the second reference numeral.

[0140] The information and signals described herein can be represented using any of a variety of different techniques and means. For example, data, instructions, commands, information, signals, bits, symbols, and chips referred to in the above description can be represented by voltage, current, electromagnetic waves, magnetic fields or magnetic particles, light fields or light particles, or any combination thereof.

[0141] The various illustrative boxes and modules described in connection with this disclosure may be implemented or performed using a general-purpose processor, DSP, ASIC, FPGA or other programmable logic device, discrete gate or transistor logic, discrete hardware components, or any combination thereof designed to perform the functions described herein. The general-purpose processor may be a microprocessor, but alternatively, it may be any conventional processor, controller, microcontroller, or state machine. The processor may also be implemented as a combination of computing devices (e.g., a combination of a DSP and a microprocessor, multiple microprocessors, one or more microprocessors incorporating a DSP core, or any other such configuration).

[0142] The functions described herein can be implemented in hardware, software executed by a processor, firmware, or any combination thereof. If implemented in software executed by a processor, the functions can be stored on or transmitted via a computer-readable medium as one or more instructions or code. Other examples and implementations are within the scope of this disclosure and the appended claims. For example, due to the nature of software, the functions described above can be implemented using software executed by a processor, hardware, firmware, hardwired, or any combination thereof. Features implementing the functions can also be physically located in various locations, including being distributed such that different parts of the functions are implemented in different physical locations. Furthermore, as used herein, including in the claims, the word "or" as used in a list of items (e.g., a list of items beginning with phrases such as "at least one of" or "one or more") indicates an inclusive list, such that, for example, a list of at least one of A, B, or C means A or B or C, or AB or AC or BC, or ABC (i.e., A and B and C). Moreover, as used herein, the phrase "based on" should not be construed as referring to a set of closing conditions. For example, without departing from the scope of this disclosure, an exemplary step described as "based on condition A" may be based on both condition A and condition B. In other words, as used herein, the phrase "based on" should be interpreted in the same way as the phrase "at least partially based on".

[0143] Computer-readable media includes both non-transitory computer storage media and communication media, including any media that facilitates the transfer of a computer program from one place to another. Non-transitory storage media can be any available medium accessible by a general-purpose or special-purpose computer. By way of example, and not limitation, non-transitory computer-readable media may include RAM, ROM, electrically erasable programmable ROM (EEPROM), disc-on-CD ROM or other optical disk storage, magnetic disk storage or other magnetic storage devices, or any other means of carrying or storing desired program code in the form of instructions or data structures and accessible by a general-purpose or special-purpose computer, or a general-purpose or special-purpose processor. Furthermore, any connection is appropriately referred to as computer-readable media. For example, if software is transmitted from a website, server, or other remote source using coaxial cable, fiber optic cable, twisted pair, digital subscriber line (DSL), or wireless technologies such as infrared, radio, and microwave, then coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwave are included in the definition of media. As used in this article, disks and optical discs include CDs, laser discs, optical discs, digital versatile discs (DVDs), floppy disks, and Blu-ray discs, where disks typically reproduce data magnetically, while optical discs use lasers to reproduce data optically. Combinations of these are also included within the scope of computer-readable media.

[0144] The description herein is provided to enable those skilled in the art to make or use this disclosure. Various modifications to this disclosure will be apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the scope of this disclosure. Therefore, this disclosure is not limited to the examples and designs described herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A wearable ring device, comprising: An inner annular housing, the inner annular housing including one or more openings, wherein the inner annular housing defines an inner peripheral surface of the wearable ring device; One or more sensors, said one or more sensors being at least partially disposed within said inner annular housing, said one or more sensors being configured to acquire physiological data from the user through said one or more orifices; An outer annular housing at least partially surrounds the inner annular housing, wherein the outer annular housing defines the outer peripheral surface of the wearable ring device; A first annular accessory is disposed at least partially in a first slot between the outer annular housing and the inner annular housing on a first lateral side of the wearable ring device; as well as A second annular accessory is disposed at least partially on a second lateral side of the wearable ring device within a second slot between the outer annular housing and the inner annular housing, wherein the first annular accessory and the second annular accessory are configured to undergo mechanical deformation upon being inserted into the first slot and the second slot, respectively, wherein the mechanical deformation of the first annular accessory and the second annular accessory causes the first annular accessory and the second annular accessory to engage with one or more features of the inner annular housing, the outer annular housing, or both, to couple the outer annular housing to the inner annular housing.

2. The wearable ring device according to claim 1, further comprising: One or more first grooves, said one or more first grooves being located in the outer annular housing, the inner annular housing, or both, wherein said one or more first grooves are at least partially located within the first slot; as well as One or more second grooves, said one or more second grooves being located in the outer annular housing, the inner annular housing, or both, said one or more second grooves being at least partially located within the second slot, said one or more features including said one or more first grooves and said one or more second grooves, said first annular fitting being configured to deform into said one or more first grooves, and second annular fitting being configured to deform into said one or more second grooves.

3. The wearable ring device according to claim 2, further comprising: A first set of flanges is located on the first annular fitting, wherein the first set of flanges is configured to undergo mechanical deformation from a first shape to a second shape during insertion of the first annular fitting into the first slot, wherein the first set of flanges is configured to undergo a second mechanical deformation from the second shape back to the first shape after insertion into the first slot, wherein the second mechanical deformation causes the first set of flanges to engage with the one or more first grooves; as well as A second set of flanges is located on the second annular fitting, wherein the second set of flanges is configured to undergo mechanical deformation from the first shape to the second shape during insertion of the second annular fitting into the second slot, wherein the second set of flanges is configured to undergo a third mechanical deformation from the second shape back to the first shape after insertion into the second slot, wherein the third mechanical deformation causes the second set of flanges to engage with the one or more second grooves.

4. The wearable ring device of claim 3, wherein the first set of flanges on the first annular accessory extends wider than the width of the first slot, and the second set of flanges on the second annular accessory extends wider than the width of the second slot.

5. The wearable ring device of claim 2, wherein the first annular accessory and the second annular accessory are configured to undergo the mechanical deformation upon application of heat after being inserted into the first slot and the second slot, respectively, and wherein the application of heat causes the first annular accessory and the second annular accessory to deform at least partially into the shape of the one or more first grooves and the shape of the one or more second grooves, respectively.

6. The wearable ring device of claim 1, wherein the thickness of the first annular accessory is wider than the first slot, and the thickness of the second annular accessory is wider than the second slot.

7. The wearable ring device according to claim 1, further comprising: A binder is located between the outer annular housing and the inner annular housing, wherein the outer annular housing is coupled to the inner annular housing at least in part based on the binder.

8. The wearable ring device of claim 7, wherein the binder comprises a thermally activated or photoactivated adhesive, the thermally activated or photoactivated adhesive being configured to cure upon application of heat or light by the first annular fitting, the second annular fitting, or both, respectively, and wherein the outer annular housing is coupled to the inner annular housing at least in part based on the cured thermally activated or photoactivated adhesive.

9. The wearable ring device of claim 7, wherein the binder comprises a thermally activated film configured to be activated upon application of heat through the outer annular housing, the inner annular housing, the first annular fitting, the second annular fitting, or any combination thereof, and wherein the outer annular housing is coupled to the inner annular housing at least in part based on the activation of the thermally activated film.

10. The wearable ring device of claim 1, wherein the inner annular housing, the outer annular housing, or both comprise a textured surface configured to engage with the textured surface of the first annular accessory, the second annular accessory, or both.

11. The wearable ring device of claim 1, wherein the first ring accessory and the second ring accessory are configured to be removed by inserting a removal tool at least partially into the first slot and the second slot, respectively.

12. The wearable ring device of claim 1, wherein the inner annular housing and the outer annular housing are made of the same material or different materials.

13. The wearable ring device of claim 1, wherein the first ring accessory and the second ring accessory comprise one or more non-metallic materials, the one or more non-metallic materials being configured such that wireless signals propagate into and out of the wearable ring device through the first ring accessory and the second ring accessory, respectively.

14. The wearable ring device of claim 1, wherein a waterproof seal is formed between the outer annular housing and the inner annular housing by inserting the first annular accessory into the first slot and inserting the second annular accessory into the second slot to couple the outer annular housing to the inner annular housing.

15. The wearable ring device according to claim 1, further comprising: A filler material is injected into a cavity between the inner annular housing and the surface of the mold to fill at least a portion of the one or more orifices of the inner annular housing, wherein the filler material is further configured to bond a printed circuit board to the inner annular housing.

16. A method for manufacturing a wearable ring device, comprising: A printed circuit board is coupled to an inner annular housing to form a ring assembly, wherein the inner annular housing defines an inner peripheral surface of the ring assembly; An outer annular housing is placed around the ring assembly such that the outer annular housing covers at least a portion of the outer peripheral surface of the ring assembly, wherein placing the outer annular housing around the ring assembly creates a first slot between the outer annular housing and the inner annular housing on a first lateral side of the wearable ring device, and creates a second slot between the outer annular housing and the inner annular housing on a second lateral side of the wearable ring device opposite to the first lateral side; as well as A first annular fitting is inserted into the first slot, and a second annular fitting is inserted into the second slot. The first and second annular fittings extend circumferentially around the wearable ring device on the first and second lateral sides, respectively. The insertion causes mechanical deformation of the shapes of the first and second annular fittings. The mechanical deformation of the first and second annular fittings causes them to engage with one or more features of the inner annular housing, the outer annular housing, or both, to couple the outer annular housing to the inner annular housing.

17. The method of claim 16, wherein the inner annular housing, the outer annular housing, or one or more of the features thereon include one or more first grooves at least partially located in one or more of the first slot and one or more second grooves at least partially located in one or more of the second slot, wherein the one or more features include the one or more first grooves and the one or more second grooves, wherein insertion of the first annular fitting causes the first annular fitting to deform into the one or more first grooves, and wherein insertion of the second annular fitting causes the second annular fitting to deform into the one or more second grooves.

18. The method of claim 17, further comprising: After the first annular fitting and the second annular fitting are respectively inserted into the first slot and the second slot, heat is applied to the first annular fitting and the second annular fitting, wherein the application of heat to the first annular fitting and the second annular fitting causes the first annular fitting and the second annular fitting to deform at least partially into the shape of the one or more first grooves and the shape of the one or more second grooves, respectively.

19. The method of claim 16, further comprising: A thermally activated or photoactivated adhesive is inserted between the outer annular shell and the inner annular shell; as well as Heat or light is applied to the thermally activated or photoactivated adhesive by the first annular fitting, the second annular fitting, or both, to cure the thermally activated or photoactivated adhesive, wherein the coupling of the outer annular shell to the inner annular shell is at least partially based on the curing of the thermally activated or photoactivated adhesive.

20. The method of claim 16, further comprising: The thermally activated membrane is inserted between the outer annular shell and the inner annular shell; as well as Heat is applied to the thermally activated membrane via the outer annular housing, the inner annular housing, the first annular fitting, the second annular fitting, or any combination thereof to activate the thermally activated membrane, wherein coupling the outer annular housing to the inner annular housing is at least partially based on activating the thermally activated membrane.

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