Substrate cleaning apparatus
By employing a rotating mechanism and a high-speed air-gas confluence mist gas supply technology, the problems of cleaning omissions and large liquid consumption in substrate cleaning devices have been solved, achieving efficient and uniform cleaning results.
CN122161675APending Publication Date: 2026-06-05TMEIC CORP (100 00) +1
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- TMEIC CORP (100 00)
- Filing Date
- 2024-10-04
- Publication Date
- 2026-06-05
AI Technical Summary
Technical Problem
Existing substrate cleaning devices are prone to missing areas when cleaning substrates with multiple uneven regions, failing to effectively remove adhering substances, and requiring a large amount of cleaning solution.
Method used
A rotating mechanism is used to rotate the substrate, and combined with a mist gas supply mechanism and an air gas supply mechanism, the air gas flow rate is set to high speed, and after merging with the mist gas, a mist gas for spraying the substrate is formed. The rotation action ensures that the mist gas covers all areas of the substrate surface.
Benefits of technology
It achieves thorough removal of deposits without any omissions, reduces the amount of cleaning solution used, and improves cleaning efficiency and coverage uniformity.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN122161675A_ABST
Abstract
The present invention aims to provide a substrate cleaning device capable of inhibiting the use amount of cleaning liquid and removing a removed object attached to a cleaning surface of a substrate without cleaning omission. In the substrate cleaning device (70) of the present disclosure, a substrate spraying mist gas (MG2) obtained by combining a cleaning mist gas (MG1) and an air gas (AG0) is supplied to a surface (1s) of a substrate (1). A rotation mechanism (30) causes a rotation motor (35) to perform a worktable rotation operation to rotate the substrate (1). At this time, a rotation direction control process of switching the rotation direction and a rotation speed control process of changing the rotation speed are performed together. Furthermore, a vibration motor (34) can be caused to perform a worktable vibration operation to impart vibration to the substrate (1).
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