Sheet member, resin composition for molding, and electronic component device
By using sheet-like components containing thermosetting, thermoplastic, and inorganic fillers, the problem of high transmission loss in high-frequency communication is solved, achieving a balance between high relative permittivity and low dielectric loss tangent, making it suitable for sealing high-frequency devices and encapsulating antenna systems.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- RESONAC CORP
- Filing Date
- 2024-11-13
- Publication Date
- 2026-06-05
AI Technical Summary
Existing molding resin compositions suffer from high transmission loss and high dielectric loss tangent in high-frequency communication, resulting in reduced communication efficiency and making it difficult to achieve a balance between high relative permittivity and low dielectric loss tangent.
A sheet component comprising thermosetting components, thermoplastic components, and inorganic fillers is used to form a sheet component with a high relative permittivity and a low dielectric loss tangent. The thermosetting components include maleimide resin, ethylene resin, and (meth)acrylic resin; the thermoplastic components include thermoplastic resin or thermoplastic elastomer; and the inorganic fillers include calcium titanate particles and strontium titanate particles.
It achieves a balance between high relative permittivity and low dielectric loss tangent, making it suitable for sealing high-frequency devices, especially antenna sealing in antenna system packages (AiP), improving communication efficiency and device miniaturization capabilities.
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