inductor component

Abstract

The present application provides an inductor component (2) having: an inductor wiring (10) extending along a plane; pad portions (10A, 10B) at both ends of the inductor wiring (10); vertical wirings (20) extending perpendicularly to the plane from the pad portions (10A, 10B); and first and second magnetic layers (30, 40) sandwiching the inductor wiring (10) from a direction perpendicular to the plane, the end portions of the first and second magnetic layers (30, 40) having inclined portions inclined from the direction perpendicular to the plane when viewed in a cross section orthogonal to the extending direction of the inductor wiring (10). By providing the inductor component, the magnetic flux generated by the inductor wiring is directed toward one anisotropy axis, and the influence of the other anisotropy axis can be suppressed.

Description

Technical Field

[0001] The present invention relates to an inductor component having inductor wiring extending in a planar shape.

[0002] This application claims priority based on Japanese Patent Application No. 2023-191727, filed on November 9, 2023, the entire contents of which are incorporated herein by reference. Background Technology

[0003] Inductor components with inductor wiring extending in a planar shape are becoming increasingly common. Among such inductor components, one has been proposed where the inductor wiring is arranged between an upper magnetic layer and a lower magnetic layer (see, for example, Patent Document 1). By arranging magnetic layers above and below the inductor wiring, high inductance can be obtained.

[0004] Patent Document 1: Japanese Patent Application Publication No. 2014-199902

[0005] On the other hand, in the inductor component described in Patent Document 1, when viewed in cross-section of the inductor wiring, the ends of the upper and lower magnetic layers are formed by vertical surfaces. Therefore, in order to change the characteristics of an inductor, such as an inductor, it is necessary to change the wiring pattern of the inductor wiring or to perform hole processing on the magnetic layers. Summary of the Invention

[0006] Therefore, the purpose of this disclosure is to provide an inductor component that can change the characteristics of the inductor without changing the wiring pattern of the inductor wiring or processing holes in the magnetic layer.

[0007] One aspect of the inductor component disclosed herein includes:

[0008] Inductor wiring extends along the plane;

[0009] The pads are located at both ends of the aforementioned inductor wiring;

[0010] Vertical wiring extends perpendicularly from the aforementioned pad portion relative to the aforementioned plane; and

[0011] The first magnetic layer and the second magnetic layer sandwich the inductor wiring from a direction perpendicular to the aforementioned plane.

[0012] When viewed in a cross-section orthogonal to the extension direction of the inductor wiring, the ends of the first magnetic layer and the second magnetic layer have inclined portions that slope in a direction perpendicular to the plane.

[0013] According to this disclosure, an inductor component is provided that can change the characteristics of the inductor without modifying the wiring pattern or machining holes in the magnetic layer. Attached Figure Description

[0014] Figure 1 This is a top view schematically illustrating an inductor component according to a first embodiment of the present invention.

[0015] Figure 2A It means Figure 1 The side sectional view of section A-A.

[0016] Figure 2B It means Figure 1 The side sectional view of section B-B.

[0017] Figure 3 This diagram schematically illustrates examples where the morphologies of the inclined portions of the first magnetic layer and the second magnetic layer differ in the inductor component according to the first embodiment of the present invention, and is intended to show... Figure 2B A side sectional view of a section at the same location.

[0018] Figure 4 This diagram schematically illustrates examples where the morphologies of the inclined portions of the first magnetic layer and the second magnetic layer differ in the inductor component according to the first embodiment of the present invention, and is intended to show... Figure 2B A side sectional view of a section at the same location.

[0019] Figure 5 This diagram schematically illustrates an example in which the morphology of the inclined portions of the first magnetic layer and the second magnetic layer differs from that in the inductor component of the first embodiment of the present invention, and is intended to show an example of... Figure 2B A side sectional view of a section at the same location.

[0020] Figure 6 It is a graph showing the B-H curves (hysteresis curves) of the easy axis and the difficult axis.

[0021] Figure 7A This is a schematic diagram illustrating a method for manufacturing an inductor component according to a first embodiment of the present invention, and is a side view showing step 1 of preparing substrate material.

[0022] Figure 7B This is a side view showing step 2, which follows step 1, where a first insulating layer is laminated onto the substrate material.

[0023] Figure 7C This is a side view of step 3, which follows step 2, in which a first magnetic layer is stacked on the first insulating layer, and a second insulating layer is stacked on the first magnetic layer.

[0024] Figure 7D This is a side view of step 4, which follows step 3, where inductor wiring is formed on the second insulating layer.

[0025] Figure 7EThis is a side view of step 5, which follows step 4, where a third insulating layer is stacked on the second insulating layer containing inductor wiring.

[0026] Figure 7F This is a side view representing step 6, which follows step 5, where a second magnetic layer is laminated on the third insulating layer.

[0027] Figure 7G This is a side view of step 7, which follows step 6, to form a via from the surface side of the second magnetic layer.

[0028] Figure 7H This is a side view of step 8, which follows step 7 and involves forming vertical wiring in the through-hole.

[0029] Figure 7I This is a side view of step 9, which is the next step, where the substrate material is ground to a substrate of a specified thickness, following step 8.

[0030] Figure 7J This is a side view of step 10, which follows step 9 and involves using a cutting mechanism to produce individual pieces.

[0031] Figure 7K This is a side view of the inductor component formed by monolithization in process 10.

[0032] Figure 8A This is a side view showing the process of forming a positive cone surface at the end of the first magnetic layer or the second magnetic layer.

[0033] Figure 8B This is a side view showing the process of forming an inverted conical surface at the end of the first magnetic layer or the second magnetic layer.

[0034] Figure 9A This is a schematic diagram illustrating a modified example 1 of the inductor component according to the first embodiment of the present invention, and it shows a variation with... Figure 2A A side sectional view of a section at the same location.

[0035] Figure 9B This is a schematic diagram illustrating a modified example 1 of the inductor component according to the first embodiment of the present invention, and it shows a variation with... Figure 2B A side sectional view of a section at the same location.

[0036] Figure 10 This is a schematic diagram illustrating a modified example 2 of the inductor component according to the first embodiment of the present invention, and it shows a variation with... Figure 2A A side sectional view of a section at the same location.

[0037] Figure 11 This is a schematic diagram illustrating a modified example 3 of the inductor component according to the first embodiment of the present invention, and it shows a variation with... Figure 2BA side sectional view of the cross section at the same location, showing the case where the end of the first magnetic layer has a positive conical surface.

[0038] Figure 12 This is a schematic diagram illustrating a modified example 3 of the inductor component according to the first embodiment of the present invention, and it shows a variation with... Figure 2B A side sectional view of the cross section at the same location, showing the case where the end of the first magnetic layer has an inverted conical surface.

[0039] Figure 13A This is a side sectional view schematically showing an example of an inclined section formed by the stepped stacking of inorganic insulating layers and inorganic magnetic layers.

[0040] Figure 13B This is a side sectional view schematically showing an example of an inclined section formed by the stepped stacking of inorganic insulating layers and inorganic magnetic layers.

[0041] Figure 14 This is a schematic diagram illustrating the inductor component 2 according to the second embodiment of the present invention, and it is shown as... Figure 2B A side sectional view of a section at the same location. Detailed Implementation

[0042] Hereinafter, embodiments and variations for carrying out the present invention will be described with reference to the accompanying drawings. In each drawing, corresponding components having the same function are labeled with the same reference numerals. For ease of explanation and understanding, separate embodiments may be shown for convenience, but partial substitutions or combinations of structures shown in different embodiments are possible. In the embodiments described later, descriptions of matters shared with the foregoing embodiments are omitted, and only differences are explained. In particular, the same effects achieved by the same structure are not mentioned sequentially in each embodiment. The sizes and positional relationships of the components shown in the drawings are sometimes enlarged for clarity of explanation.

[0043] The accompanying drawings show an inductor component with a generally rectangular shape, placed on a horizontal plane with the substrate side facing down. The long side direction is taken as the X-axis, the short side direction as the Y-axis, and the height direction, which is orthogonal to both the long and short side directions, as the Z-axis.

[0044] (Inductor component according to the first embodiment of the present invention)

[0045] First, refer to Figures 1 to 5 The inductor component of the first embodiment of the present invention will be described. Figure 1 This is a top view schematically illustrating an inductor component according to a first embodiment of the present invention. Figure 2A It means Figure 1The side sectional view of section A-A. Figure 2B It means Figure 1 The side sectional view of section B-B. Figures 3-5 This diagram schematically illustrates an example in which the morphology of the inclined portions of the first magnetic layer and the second magnetic layer differs from that in the inductor component of the first embodiment of the present invention, and is intended to show an example of... Figure 2B A side sectional view of a section at the same location.

[0046] In this embodiment, the inductor component 2 has a first insulating layer 50A formed on a substrate 60. A first magnetic layer 30 and a second insulating layer 50B are formed on the first insulating layer 50A, covering the first magnetic layer 30. Inductor wiring 10 and a third insulating layer 52 are further formed on the second insulating layer 50B, covering the inductor wiring 10. A second magnetic layer 40 is further formed on the third insulating layer 52. The inductor wiring 10 extends along a plane and has pad portions 10A and 10B at both ends. Vertical wiring 20 extending perpendicularly to the plane extending from the pad portions 10A and 10B at both ends is formed from each of these pad portions. In this embodiment, the inductor wiring 10 is disposed between the first magnetic layer 30 and the second magnetic layer 40 in the Z-axis direction. Additionally, in the Z-axis direction, a first insulating layer 50A, serving as an organic insulating layer, is formed between the substrate 60 and the first magnetic layer 30.

[0047] In this embodiment, a high-resistivity silicon substrate is used as the substrate 60. However, it is not limited to this; any other inorganic substrate, such as a glass substrate or a ceramic substrate, can be used as the substrate 60. From the viewpoint of suppressing eddy current generation, a substrate with high insulation is preferred. The thickness of the substrate 60 can be 5 μm, but it is not limited to this. In this embodiment, the layers constituting the inductor component 2, represented by the first magnetic layer 30, are formed on the inorganic substrate, thus ensuring chip strength even when thin.

[0048] However, as referenced Figure 10 As will be described later, an inductor component 6 without a substrate 60 can also be used.

[0049] The first magnetic layer 30 and the second magnetic layer 40 are formed by a stack of an inorganic insulating layer and an inorganic magnetic layer. The thicknesses of the first magnetic layer 30 and the second magnetic layer 40 are typically around 5 to 6 μm, but are not limited to this. The materials and detailed structures of the first magnetic layer 30 and the second magnetic layer 40 will be described in more detail in the description of the manufacturing method.

[0050] In this embodiment, the first insulating layer 50A, the second insulating layer 50B, and the third insulating layer 52 are formed of polyimide. However, they are not limited to this; other organic resins, such as epoxy resin and phenolic resin, or combinations thereof, can also be used, and insulating fillers may also be included. Furthermore, they can also be formed from inorganic insulators such as SiO2 and TaO. In this embodiment, the thickness of the first insulating layer 50A is 5 μm, but it is not limited to this. The thickness of the second insulating layer 50B is the value obtained by adding approximately 2 to 10 μm to the thickness of the first magnetic layer 30. The thickness of the third insulating layer 52 is the value obtained by adding approximately 2 to 10 μm to the thickness of the inductor wire 10.

[0051] In this embodiment, two inductor wirings 110 are arranged along a plane and have pad portions 10A and 10B at both ends. Each inductor wiring 110 is formed by connecting two regions extending parallel to the long side direction (X-axis direction) with regions extending in a direction intersecting the long side direction (X-axis direction).

[0052] The inductor wiring 10 and the vertical wiring 20 are formed of conductive materials with low resistance, such as copper, silver, and gold. Preferably, a conductor containing copper or a copper compound is used. The vertical wiring 20 is electrically connected to the inductor wiring 10 via pads 10A and 10B at both ends. In this embodiment, a flat wire with a cross-sectional size of 40μm × 20μm is used as the inductor wiring 10, but it is not limited to this. Flat wires of different sizes or wiring other than flat wires can also be used.

[0053] The vertical length of the vertical wiring 20 is determined by the thickness of the third insulating layer 52 and the second magnetic layer 40, as well as the amount of protrusion from the surface of the second magnetic layer 40. In this embodiment, the amount of protrusion of the vertical wiring 20 from the surface of the second magnetic layer 40 is 5 μm, but it is not limited to this.

[0054] The inductor component 2 constructed as described above has a roughly rectangular parallelepiped shape. If the length of the long side (X-axis direction) is set as L, the length of the short side (Y-axis direction) is set as W, and the length of the height (Z-axis direction) is set as T, then it has dimensions of L×W×T=1.0mm×0.5mm×0.5mm. However, this is just an example; inductor components with other arbitrary dimensions can be used.

[0055] By electrically connecting the vertical wiring 20 protruding from the surface of the second magnetic layer 40 to an external circuit, current can flow into the inductor wiring 10 through the vertical wiring 20 to generate magnetic flux, thus functioning as an inductor.

[0056] As shown in Figure 2, in this embodiment, the vertical wiring 20 is formed such that the cross-sectional area increases from the end face 20A on the opposite side to the end face 10A and 10B that are in contact with the pad portions 10A and 10B. As a result, the connection strength with external circuits and external terminals is improved at the end face 20A, and connection resistance can be suppressed.

[0057] In this embodiment, such as Figure 2A As shown, the vertical wiring 20 extends through the second magnetic layer 40. Thus, when viewed from above, the second magnetic layer 40 is formed to cover the entire circumference of the vertical wiring 20, and the area of ​​the second magnetic layer 40 is maximized in the planar direction. This improves the inductor's acquisition efficiency and suppresses leakage flux.

[0058] Furthermore, in the inductor component 2 of this embodiment, multiple conductive layers are formed on the end face 20A of the vertical wiring 20. For example, by forming a Ni layer as a conductive layer on the end face 20A, electromigration resistance can be provided, and by forming an Au layer, Sn layer, or the like as conductive layers, solder wetting properties can be provided. As a result, appropriate functionality can be provided for connection with external circuits.

[0059] <Inclined section>

[0060] like Figure 2B as well as Figures 3-5 As shown, when viewed in a cross-section orthogonal to the extension direction of the inductor wiring 10, the inductor component 2 of this embodiment has inclined portions 32 formed at both ends of the first magnetic layer 30 and inclined portions 42 formed at both ends of the second magnetic layer 40.

[0061] If current flows in the inductor wiring 10, magnetic flux is generated circumferentially in the inductor wiring 10. Therefore, when viewed in cross-section of the inductor wiring 10, for example, the magnetic flux travels along the Y-axis in the first magnetic layer 30, at one end it travels from the first magnetic layer 30 to the second magnetic layer 40, in the second magnetic layer 40 it travels in the opposite direction, and at the other end it travels again from the second magnetic layer 40 to the first magnetic layer 30. Thus, a flow of magnetic flux circulates and travels in the first magnetic layer 30 and the second magnetic layer 40. Furthermore, depending on the direction of the current flowing in the inductor wiring 10, there may also be cases where the magnetic flux travels in the opposite direction.

[0062] In this embodiment, since the first magnetic layer 30 and the second magnetic layer 40 sandwiching the inductor wiring 10 have inclined portions 32 and 42 at both ends when viewed in cross-section, the distribution state of the magnetic layers at the ends can be changed. Therefore, the distribution of magnetic flux traveling between the first magnetic layer 30 and the second magnetic layer 40 can be changed. Hereinafter, refer to... Figure 2B as well as Figures 3 to 5 The example shown illustrates this in more detail.

[0063] Here, the inclined surface that narrows inward from the first magnetic layer 30 toward the second magnetic layer 40 (positive Z-axis direction) towards the end is designated as a positive cone surface, and the inclined surface that widens outward from the first magnetic layer 30 toward the second magnetic layer 40 (positive Z-axis direction) towards the end is designated as an inverted cone surface. Figure 2B In the example shown, both the inclined portion 32 of the first magnetic layer 30 and the inclined portion 42 of the second magnetic layer 40 are positive cones. The angle of the cone can be exemplified as a range of 20 degrees or more and 70 degrees or less.

[0064] Generally, the larger the volume of the magnetic layer, the more magnetic flux can pass through. However, in the second magnetic layer 40, the volume of the magnetic layer near the inductor wiring 10 is large, while in the first magnetic layer 30, the volume of the magnetic layer near the inductor wiring 10 is small. Therefore, the magnetic flux will not be biased towards flowing in the region near or away from the inductor wiring 10. As a result, a balance can be achieved between inductance acquisition efficiency and DC superposition characteristics.

[0065] exist Figure 3 In the example shown, the inclined portion 32 of the first magnetic layer 30 and the inclined portion 42 of the second magnetic layer 40 are both inverted conical surfaces.

[0066] In this example, conversely, in the first magnetic layer 30, the magnetic layer volume is large in the region near the inductor wiring 10, while in the second magnetic layer 40, the magnetic layer volume decreases in the region near the inductor wiring 10. Therefore, the magnetic flux does not tend to flow towards or away from the region near the inductor wiring 10. This achieves a balance between inductance acquisition efficiency and DC superposition characteristics.

[0067] exist Figure 4 In the example shown, the inclined surface of the first magnetic layer 30 is a positive cone, and the inclined portion of the second magnetic layer 40 is an inverted cone.

[0068] As the magnetic layer volume of the regions of the first magnetic layer 30 and the second magnetic layer 40 that are separated from the inductor wiring 10 increases, the magnetic flux also passes through the magnetic layer away from the inductor wiring, thus the magnetic flux density is dispersed and the DC superposition characteristics are improved.

[0069] exist Figure 5 In the example shown, the inclined surface of the first magnetic layer 30 is an inverted cone, and the inclined portion of the second magnetic layer 40 is a normal cone.

[0070] As the volume of the magnetic layers in the regions of the first magnetic layer 30 and the second magnetic layer 40 near the inductor wiring increases, the inductance acquisition efficiency is improved by allowing more magnetic flux.

[0071] As described above, in this embodiment, when viewed in a cross-section orthogonal to the extending direction of the inductor wiring 10, the ends of the first magnetic layer 30 and the second magnetic layer 40 have inclined portions 32 and 42, respectively. This allows for the provision of an inductor component that can change the characteristics of the inductor without altering the wiring pattern of the inductor wiring or machining holes in the magnetic layers.

[0072] In the above embodiment, inclined portions 32 and 42 are formed at the ends of both the first magnetic layer 30 and the second magnetic layer 40. However, it is believed that the above-mentioned effect can be obtained as long as inclined portions 32 and 42 are formed at at least one end. In addition, besides the inclined portions 32 and 42, the characteristics of the inductor can also be changed by varying the widths of the first magnetic layer 30 and the second magnetic layer 40.

[0073] <Direction of Inductor Wiring>

[0074] The inductor component 2, which has a generally rectangular shape, has pad portions 10A and 10B arranged at both ends in the long side direction (X-axis direction). In this embodiment, as described above, the two inductor wirings 10 are arranged along a plane, and each inductor wiring 10 is formed by connecting two regions extending parallel to the long side direction (X-axis direction) through a region extending in a direction intersecting the long side direction (X-axis direction).

[0075] However, the inductor wiring 10 is not limited to this method. It can also be an inductor with serpentine wiring extending along the long side (X-axis direction). In this case, the inductor wiring can be an inductor wiring with alternating straight sections along the long side (X-axis direction) and straight sections along the short side (Y-axis direction), or it can be an inductor wiring with a serpentine shape depicting a smooth curve extending along the long side (X-axis direction). Furthermore, it can also be an inductor with spiral wiring wound more than one turn (more than 360 degrees).

[0076] <Uniaxial magnetic anisotropy>

[0077] In this embodiment, the first magnetic layer 30 and the second magnetic layer 40 have uniaxial magnetic anisotropy in the same direction. In this embodiment, the two anisotropic axes (easy axis and difficult axis) of the first magnetic layer 30 and the second magnetic layer 40 are aligned with the inductor component 2 when viewed from above (refer to...). Figure 1 The long side (X-axis direction) and short side (Y-axis direction) of the magnetic layer 30 are parallel. In addition, considering manufacturing deviations, "the first magnetic layer 30 and the second magnetic layer 40 have uniaxial magnetic anisotropy with the same axis" means that the angle formed by the anisotropy axes of the first magnetic layer 30 and the second magnetic layer 40 converges to less than 10 degrees.

[0078] As described above, the inductor wiring 10 of this embodiment is formed by connecting two regions extending parallel to the long side direction (X-axis direction) by a region extending in a direction intersecting the long side direction (X-axis direction). Therefore, the two ends of the inductor wiring 10 are separately arranged in the direction (X-axis direction) of one of the anisotropic axes in the difficult axis and the easy axis of uniaxial magnetic anisotropy.

[0079] Furthermore, the inductor wiring 10 does not extend orthogonally in the region where it extends along a direction intersecting an anisotropic axis (X-axis direction). In other words, the inductor wiring 10 does not extend orthogonally to an anisotropic axis (X-axis) throughout the entire region.

[0080] For the anisotropic axes of the first magnetic layer 30 and the second magnetic layer 40, which have uniaxial magnetic anisotropy with the same axis, refer to Figure 6 A detailed explanation will follow. Figure 6 It is a graph showing the B-H curves (hysteresis curves) of the easy axis and the difficult axis.

[0081] Methods for determining the easy and difficult axes of uniaxial magnetic anisotropy include, for example, rotating the sample by 90 degrees and measuring the magnetic layer using a VSM (vibrating sample magnetometer) to obtain the B-H curve. The B-H curve is also called the hysteresis curve. An example of a measured B-H curve is shown below. Figure 6 . Figure 6 The vertical axis of the graph shows the magnetic flux density B (in tons), and the horizontal axis shows the magnetic field strength H (in meters).

[0082] If the permeability is set to μ, then the relationship B = μH holds. That is, Figure 6 The slope of the B-H curve shown represents the permeability μ. A steeply rising B-H curve represents the easy axis (easily magnetized axis), while a gently sloping B-H curve represents the difficult axis (difficult to magnetize axis). If the direction of the magnetic flux generated by the current flowing in the inductor wiring 10 is parallel to the easy axis, the acquisition efficiency of the inductor can be improved. On the other hand, if the direction of the magnetic flux generated by the current flowing in the inductor wiring 10 is parallel to the difficult axis, the DC superposition characteristic can be improved or the iron loss can be reduced. Furthermore, for the test specimen for uniaxial magnetic anisotropy testing, a planar shape of circular or square is preferred to eliminate the influence of shape anisotropy, but even other shapes can be measured.

[0083] In this embodiment, the difficult axis of the first magnetic layer 30 and the second magnetic layer 40, which have uniaxial magnetic anisotropy, may be oriented towards the long side (X-axis direction) and the easy axis towards the short side (Y-axis direction), or conversely, the easy axis may be oriented towards the long side (X-axis direction) and the difficult axis towards the short side (Y-axis direction).

[0084] Not only the inductor wiring 10 has Figure 1 The planar shape shown, for example, even when it is serpentine and extends along an anisotropic axis (X-axis direction), can extend throughout the region without being orthogonal to an anisotropic axis (X-axis).

[0085] In this case, the inductor wiring 10 extending between the pads 10A and 10B at both ends always has a vector component in the direction of an anisotropic axis (X-axis direction). There will be no situation where it does not have a vector component in the direction of an anisotropic axis (X-axis direction) but only has a vector component in the direction of another anisotropic axis (Y-axis direction).

[0086] This can also be described as: the wiring centerline G passing through the center in the width direction relative to the inductor wiring 10 (refer to...) Figure 1 It extends across the entire region without being orthogonal to an anisotropic axis (X-axis direction). Alternatively, it can be described as the wiring centerline G intersecting an anisotropic axis (X-axis direction) at an angle of less than 90 degrees.

[0087] Inductor wiring extending along a plane contains spiral wiring. If the case of rotating the spiral wiring 360 degrees is taken as 1 turn, then the so-called extension that is not orthogonal to an anisotropic axis (X-axis) can also be described as being formed by connecting inductor wiring 10 with less than 0.5 turns.

[0088] When the inductor wiring 10 extends along an anisotropic axis (X-axis direction), due to the vector component in the direction of the anisotropic axis (X-axis direction), most of the magnetic flux is directed towards the direction of the other anisotropic axis (Y-axis direction). Assuming that the inductor wiring 10 has a region extending perpendicular to the direction of the anisotropic axis (X-axis direction), in that region, all the magnetic flux is directed towards the direction of the anisotropic axis (X-axis direction), and therefore will be affected by it.

[0089] In this embodiment, the first magnetic layer 30 and the second magnetic layer 40 have uniaxial magnetic anisotropy in the same direction. The two ends of the inductor wiring 10 are separated in the direction of one of the anisotropic axes (X-axis direction) in the difficult axis and easy axis of the uniaxial magnetic anisotropy. The inductor wiring 10 extends in the entire region without being orthogonal to an anisotropic axis (X-axis).

[0090] In this way, since the inductor wiring 10 extends along one anisotropic axis (X-axis direction), most of the magnetic flux can be directed towards the other anisotropic axis (Y-axis direction). This provides the effect of directing the magnetic flux towards the other anisotropic axis (Y-axis direction). Furthermore, since the inductor wiring 10 extends non-orthogonally to one anisotropic axis (X-axis) throughout the entire region, the influence of one anisotropic axis (X-axis) can be suppressed. Therefore, effects such as improved inductance efficiency, improved DC superposition characteristics, or suppression of iron losses are reliably obtained.

[0091] When one anisotropic axis oriented towards the longer side (X-axis) is the difficult axis, the inductance acquisition efficiency can be improved because most of the magnetic flux passes through the easy axis (Y-axis). On the other hand, when one anisotropic axis oriented towards the longer side (X-axis) is the easy axis, the DC superposition characteristic can be improved or the iron loss can be reduced because most of the magnetic flux passes through the difficult axis (Y-axis).

[0092] When the inductor component 2 has a roughly cuboid shape as described above, with the easy axis oriented along the long side of the cuboid, the following advantages are also present. Considering the influence of shape-based magnetic anisotropy, using the long side as the easy axis facilitates anisotropic axis control. Therefore, since the inductor wiring extends non-orthogonally to the easy axis throughout the entire area, most of the magnetic flux passes through the difficult axis, enabling improved DC superposition characteristics and suppression of iron losses.

[0093] As described above, among the multiple inductor wirings 10 arranged along the plane, there are both regions where the inductor wirings 10 are arranged parallel to each other and regions where they are not arranged parallel to each other. The non-parallel regions create regions where the inductor wirings 10 are close to each other and arranged parallel to each other, and regions where the inductor wirings 10 are separated from each other and arranged parallel to each other. With this configuration, the coupling coefficient can be increased in the regions where the inductor wirings 10 are close to each other, and decreased in the regions where the inductor wirings 10 are separated from each other. By connecting the regions where the inductor wirings 10 are arranged parallel to each other with the non-parallel regions, the coupling coefficient of the inductors can be controlled in various ways.

[0094] In addition, such as Figure 2B As shown, in the region where the inductor wirings 10 are close to each other, the second magnetic layer 40 has an uneven shape that covers the inductor wirings 10 from three directions. Thus, when viewed in cross-section of the inductor wirings 10, the second magnetic layer 40 has an uneven shape that covers the inductor wirings 10 from three directions, and together with the first magnetic layer 30, it can cover the entire circumference of the inductor wirings 10, thereby improving the inductor acquisition efficiency.

[0095] In addition, such as Figure 1 and Figure 2BAs can be seen, the second magnetic layer 40 is arranged inside the outer surface of the inductor component 2. Therefore, during monolithic fabrication, there is no concern about damage to the magnetic layer caused by cutting. For example, if the magnetic layer is stretched due to mechanical stress during cutting, leakage will occur between the stacked magnetic layers, resulting in increased iron loss, but this situation can be avoided in this embodiment.

[0096] Furthermore, the inductor component disclosed herein may also be an inductor component with bent wiring formed by alternating straight sections parallel to the long side direction (X-axis direction) and straight sections parallel to the short side direction (Y-axis direction), or an inductor component with spiral wiring. However, in such cases, it will not be in a state where it "does not extend orthogonally to an anisotropic axis (X-axis direction) throughout the entire region".

[0097] <Planar shape of the magnetic layer>

[0098] By arranging multiple inductor wirings 10 along a plane, the planar shapes of the first magnetic layer 30 and the second magnetic layer 40 can be made approximately square. This reduces the influence of shape-based magnetic anisotropy, thus broadening the range of material choices.

[0099] As for the near-square shape, it is preferable that the ratio of the dimension in the direction of one anisotropic axis (X-axis) to the dimension in the direction of the other anisotropic axis (Y-axis) is in the range of 0.5 or more and 1 or less, more preferably in the range of 0.7 or more and 1 or less. If we also consider the case that the first magnetic layer 30 and the second magnetic layer 40 are not of the same shape, it is preferable that when the plane extending from the inductor wiring 10 is viewed from the vertical direction, at least one of the first magnetic layer 30 and the second magnetic layer 40 overlaps with the plurality of inductor wirings 10, and the ratio of the dimension in the direction of one anisotropic axis (X-axis) to the dimension in the direction of the other anisotropic axis (Y-axis) is in the range of 0.5 or more and 1 or less, more preferably in the range of 0.7 or more and 1 or less.

[0100] <Manufacturing Method of Inductor Components>

[0101] Next, refer to Figures 7A to 7K The manufacturing method of the inductor component 2 described above will be explained. Figure 1 This is a top view schematically illustrating an inductor component according to a first embodiment of the present invention. Figure 7A This is a schematic diagram illustrating a method for manufacturing an inductor component according to a first embodiment of the present invention, and is a side view showing step 1 of preparing substrate material. Figure 7B This is a side view following step 1, showing step 2, where a first insulating layer is laminated onto the substrate material. Figure 7CThis is a side view following step 2, showing step 3, which involves stacking a first magnetic layer on the first insulating layer and then stacking a second insulating layer on the first magnetic layer. Figure 7D This is a side view following step 3, showing step 4 where inductor wiring is formed on the second insulating layer. Figure 7E This is a side view following step 4, showing step 5, where a third insulating layer is stacked on the second insulating layer containing inductor wiring. Figure 7F This is a side view following step 5, showing step 6, where the second magnetic layer is laminated on the third insulating layer. Figure 7G This is a side view following step 6, showing step 7 where a via is formed from the surface side of the second magnetic layer. Figure 7H This is a side view following step 7, showing step 8 where vertical wiring is formed in the via. Figure 7I This is a side view of step 9, which follows step 8, and shows the process of grinding the substrate material to make it into a substrate of a specified thickness. Figure 7J This is a side view following step 9, showing step 10, which involves using a cutting mechanism to produce individual pieces. Figure 7K This is a side view of the inductor component formed by monolithization in process 10.

[0102] In these figures, a side cross-section is schematically shown along the extension direction of the inductor wiring 10. For the inclined portions 32, 42 formed on the first magnetic layer 30 and the second magnetic layer 40, inclined portions 32, 42 are formed at both ends of the first magnetic layer 30 and the second magnetic layer 40 in a direction orthogonal to the above figures (the direction in which the inductor wiring 10 is viewed in cross-section).

[0103] - Process 1

[0104] First, such as Figure 7A As shown, step 1, preparing substrate material S, is performed. Substrate material S is formed from high-resistivity silicon as described above. The thickness of substrate material S shown is greater than the final thickness of the finished substrate 60. A process is performed where multiple inductor components are formed on a single substrate material S, and then monolithically assembled to obtain individual inductor components 2.

[0105] - Process 2

[0106] Next, as Figure 7B As shown, step 2 involves stacking a first insulating layer 50A on a substrate material S. Specifically, the first insulating layer 50A can be formed by coating a polyimide, which is an organic resin, onto the substrate material S and then curing it.

[0107] - Process 3

[0108] Next, as Figure 7CAs shown, step 3 involves stacking a first magnetic layer 30 on the first insulating layer 50A (refer to C1) and then stacking a second insulating layer 50B (refer to C2). First, as shown in C1, the step of stacking the first magnetic layer 30 on the first insulating layer 50A will be explained. Figure 7C As shown in the enlarged view on the right, the first magnetic layer 30 is composed of a stack of an inorganic insulating layer 30A and an inorganic magnetic layer 30B. For example, the inorganic insulating layer 30A and the inorganic magnetic layer 30B are sequentially stacked by sputtering. Therefore, the inorganic insulating layer 30A can also be called the sputtered insulating layer 30A, and the inorganic magnetic layer 30B can also be called the sputtered magnetic layer 30B.

[0109] [Method for forming the inclined portion]

[0110] In the inductor component 2 of this embodiment, when viewed in a cross-section orthogonal to the extending direction of the inductor wiring 10, the first magnetic layer 30 and the second magnetic layer 40 have inclined portions 32 and 42 at both ends. (Refer to...) Figure 8A as well as Figure 8B The method of forming the inclined portions 32 and 42 will be explained. Hereinafter, the case in which the inclined portion 32 is formed in the first magnetic layer 30 will be used as an example, and the same applies to the case in which the inclined portion 42 is formed in the second magnetic layer 40. Figure 8A This is a side view showing the process of forming a positive cone surface at the end of the first magnetic layer or the second magnetic layer. Figure 8B This is a side view showing the process of forming an inverted conical surface at the end of the first magnetic layer or the second magnetic layer.

[0111] When forming the inclined portion 32 of the positive cone surface, such as Figure 8A As shown, a first magnetic layer 30 is stacked on a first insulating layer 50A, and then a resist R with a sloping portion having a positive conical surface is formed on the first magnetic layer 30. Then, the resist R and the first magnetic layer 30 are etched by dry etching. As a result, because the thin portion of the resist R (the protruding portion on the lower side of the figure) recedes and is etched, the first magnetic layer 30 forms a sloping portion with a positive conical surface as shown in the bottommost figure.

[0112] On the other hand, when forming the inclined portion 32 of the inverted conical surface, such as Figure 8B As shown, a first magnetic layer 30 is stacked on a first insulating layer 50A, and then a resist R is formed on the first magnetic layer 30. Then, if wet etching is performed, the area directly below the resist R (the area below the protruding part on the upper side of the figure) is not etched, but the first magnetic layer 30 is etched from the part that is easily replaced by liquid in the inclined direction, thus forming an inclined portion with an inverted conical surface as shown in the bottommost figure.

[0113] [Methods for imparting uniaxial magnetic anisotropy]

[0114] In this disclosure, there are cases where the first magnetic layer 30 and the second magnetic layer 40 have uniaxial magnetic anisotropy and cases where they do not have uniaxial magnetic anisotropy. However, the manufacturing method of the case with uniaxial magnetic anisotropy will be described below.

[0115] As an example of imparting uniaxial magnetic anisotropy to the first magnetic layer 30, the following can be illustrated: By sputtering an inorganic magnetic layer 30B in a magnetic field, the atoms inside the inorganic magnetic layer 30B can be arranged in desired positions, with the easy axis oriented towards the direction of the applied magnetic field. If the direction of the applied magnetic field is oriented towards the long side of the inductor component 2, the easy axis is oriented towards the long side; if the direction of the applied magnetic field is oriented towards the short side of the inductor component 2, the difficult axis is oriented towards the long side.

[0116] Inorganic insulating layer 30A can be formed from inorganic insulators such as SiO2 and TaO. In addition, inorganic magnetic layer 30B can be formed from a composite of CZT (Co-Zr-Ta), FeNi alloy, magnetic materials, and inorganic materials. The interlayer thickness between inorganic magnetic layers 30B is preferably thinner than that of each individual inorganic magnetic layer 30B. Since the function of inorganic insulating layer 30A is to insulate between inorganic magnetic layers 30B or to protect inorganic magnetic layers 30B from stress during processing, a thinner layer increases the proportion of the magnetic layer in the overall laminate.

[0117] Thus, the first magnetic layer 30 is composed of a stack of inorganic insulating layer 30A and inorganic magnetic layer 30B, wherein the thickness of inorganic insulating layer 30A is thinner than that of inorganic magnetic layer 30B, and all of inorganic magnetic layer 30B has uniaxial magnetic anisotropy in the same direction. Furthermore, the second magnetic layer 40, described later, is similarly constructed.

[0118] Since the inorganic insulating layer 30A is thinner than the inorganic magnetic layer 30B, sufficient insulation can be achieved between the inorganic magnetic layers 30B, and the magnetic layer ratio can be increased. Furthermore, by arranging a stacked structure of inorganic insulating layers 30A such as TaO and SiO2 between the inorganic insulating layers 30B, the inorganic magnetic layers 30B are insulated from each other, and eddy currents in the inorganic magnetic layers 30B can be suppressed. Therefore, an inductor component 2 with a high Q value at high frequencies can be realized.

[0119] Here, the Q value, also known as the Quality Factor, represents the "sharpness" of the signal at the resonant frequency. The ratio of the resistance (R) of the inductor wiring to the inductance L corresponding to the frequency f (R / 2πf·L) is called the loss coefficient, and its reciprocal is the Q value. The higher the Q value, the lower the loss, resulting in excellent characteristics for high-frequency inductors.

[0120] Furthermore, if the inorganic magnetic layer 30B is thickened with materials such as CZT (Co-Zr-Ta) or FeNi alloy, eddy currents will be generated within the magnetic layer; therefore, a thinner thickness is preferred. Specifically, it is preferable to be thinner than the skin depth derived from the circuit operating frequency, such as the switching frequency of a DC-DC converter. On the other hand, since the inductor is a current-carrying element, the inductor wiring thickness of 10 is preferred to allow for the flow of a large amount of current.

[0121] Considering these factors, in the inductor component 2 of this embodiment, the thickness of the first magnetic layer 30 is less than the thickness of the inductor wiring 10. By making the inorganic magnetic layer 30B thinner, eddy currents generated within the inorganic magnetic layer 30B can be suppressed, and by increasing the thickness of the inductor wiring 10, an inductor component 2 with low DC resistance and high inductor acquisition efficiency can be achieved.

[0122] Furthermore, in this embodiment, the inorganic insulating layer 30A is provided on the surface of the first magnetic layer 30, which is composed of a laminate of an inorganic insulating layer 30A and an inorganic magnetic layer 30B. Thus, since the inorganic insulating layer 30A is provided on the surface of the first magnetic layer 30, reliable insulation from peripheral components such as wiring can be achieved. The same applies to the second magnetic layer 40, which will be described later.

[0123] Furthermore, the magnetic layer can be formed not by a laminate of inorganic insulating layer 30A and inorganic magnetic layer 30B, but by a composite of organic resin and magnetic filler. For example, the organic resin can be epoxy resin, acrylic resin, phenolic resin, or a combination thereof, and the magnetic filler can be ferrite, Fe-based, or Fe alloy. Additionally, to adjust insulation and coefficient of linear expansion, insulating fillers such as silica fillers can be included. For example, an example could be using epoxy resin as the organic resin and FeSiCr as the inorganic filler.

[0124] As mentioned above Figure 7C As shown in C1, after the first magnetic layer 30 is stacked on the first insulating layer 50A, the second insulating layer 50B is then stacked on the first magnetic layer 30 as described above, as shown in C2. Similar to the case of the first insulating layer 50A, the second insulating layer 50B can be formed by coating the first magnetic layer 30 with polyimide, which is an organic resin, and then curing it. Here, as... Figure 2A , Figure 2B As shown, by terminating the first magnetic layer 30 at a position separated from both ends on the first insulating layer 50A, and then stacking the second insulating layer 50B on the first magnetic layer 30, a state can be formed in which the second insulating layer 50B covers the side of the first magnetic layer 30.

[0125] - Process 4

[0126] Next, as Figure 7D As shown, step 4 involves forming the inductor wiring 10 on the second insulating layer 50B formed in step 3 using electrolytic plating. Specifically, a seed layer composed of Ti / Cu is formed on the first insulating layer 50A using sputtering. Then, a dry film resist (DFR) is laminated onto the seed layer, and photolithography is used to expose the seed layer with a shape corresponding to the inductor wiring. Then, power is supplied from the seed layer, and electrolytic plating is used to separate the plating area on the exposed seed layer, forming the inductor wiring. Then, by stripping the dry film resist (DFR) and etching the seed layer, the isolated inductor wiring is obtained.

[0127] - Process 5

[0128] Next, as Figure 7E As shown, step 5 involves stacking a third insulating layer 52 on the second insulating layer 50B, which is disposed on the inductor wiring 10 formed in step 4. Specifically, similar to the first insulating layer 50A and the second insulating layer 50B, the third insulating layer 52 can be formed by coating polyimide, an organic resin, with the coating and curing it. Thus, the third insulating layer 52 is formed to cover the side and top surfaces of the inductor wiring 10. In this way, the second insulating layer 50B and the third insulating layer 52 surrounding the inductor wiring 10 are formed.

[0129] - Process 6

[0130] Next, as Figure 7F As shown, step 6 involves stacking the second magnetic layer 40 onto the third insulating layer 52 formed in step 5. The second magnetic layer 40 can also be stacked using the same process as the first magnetic layer 30. Similar to the first magnetic layer 30, an inclined portion 42 with a positive or inverted conical surface can be formed. Furthermore, the easy axis direction of the inorganic magnetic layer can be oriented towards the direction of the applied magnetic field by sputtering in a magnetic field. By making the applied magnetic field directions the first magnetic layer 30 and the second magnetic layer 40 the same during their formation, the first magnetic layer 30 and the second magnetic layer 40 can possess uniaxial magnetic anisotropy along the same axis.

[0131] - Process 7

[0132] Next, as Figure 7G As shown, step 7 involves forming a via from the surface side of the second magnetic layer 40 formed in step 6. Specifically, a laser is irradiated from the surface side of the second magnetic layer 40 to remove a portion of the second magnetic layer 40 and the second insulating layer 50B, forming a via BH that reaches the pad portions 10A and 10B of the inductor wiring 10. The formed via BH has a shape that narrows as it extends from the surface side of the second magnetic layer into the interior.

[0133] - Process 8

[0134] Next, as Figure 7H As shown, step 8 is performed to form vertical wiring 20 in the via BH formed in step 7. When the via BH is formed by laser irradiation, resin residue called smear is generated. First, a desmearing process is performed to remove the smear (resin residue) generated during laser processing. After cleaning the via BH in the desmearing process, vertical wiring 20 is formed in the via BH. Vertical wiring 20 can be formed in the via BH by electrolytic plating in the same way as the inductor wiring 10 described above. However, it is not limited to this; it can also be formed by SAP (Semi-Additive Process). If SAP is used, low-resistance vertical wiring 20 can be obtained at low cost. Furthermore, vertical wiring 20 can also be formed by plating processes other than SAP, such as sputtering, vapor deposition, coating, etc.

[0135] - Process 9

[0136] Next, as Figure 7I As shown, following step 8, step 9 involves grinding the substrate material S to form a substrate 60 of a predetermined thickness. However, this is not a limitation; if the thickness of the substrate material S is a predetermined thickness, step 9 can be omitted. For example, if a temporary bonding layer is pre-formed on the substrate material S, and a first insulating layer 50A is formed on this temporary bonding layer, the substrate material S can be removed from the first insulating layer 50A after steps 1 to 8. Thus, a substrate 60 can be obtained as shown in step 9. Figure 10 The inductor component 6 shown is without a substrate.

[0137] - Process 10

[0138] Next, as Figure 7J As shown, following step 9 (or step 8 depending on the situation), step 10, which involves single-piece processing using a cutting mechanism, is performed. Figure 7K The image shows an inductor component 2 formed by monolithization in process 10.

[0139] (A variation of the first embodiment)

[0140] Next, refer to Figures 9A to 13B A variation of the first embodiment described above will be explained.

[0141] <Variation Example 1>

[0142] First, refer to Figure 9A and Figure 9B A variation of the inductor component of the first embodiment will be described. Figure 9AThis is a schematic diagram illustrating a modified example 1 of the inductor component according to the first embodiment of the present invention, and it shows a variation with... Figure 2A A side sectional view of a section at the same location. Figure 9B This is a schematic diagram illustrating a modified example 1 of the inductor component according to the first embodiment of the present invention, and it shows a variation with... Figure 2B A side sectional view of a section at the same location.

[0143] In the inductor component 4 of Modified Example 1, the difference from the inductor component 2 of the first embodiment described above is that a fourth insulating layer 70 is formed on the surface of the stacked second magnetic layer 40. The sides of the vertical wiring 20 are covered by the fourth insulating layer 70. The fourth insulating layer 70, which is an inorganic insulating layer, can be formed of the same material as the first insulating layer 50A, the second insulating layer 50B, and the third insulating layer 52 described above, or it can be formed of a different material.

[0144] In Modification 1, since the first magnetic layer 30 is covered by the first insulating layer 50A and the second insulating layer 50B, and the second magnetic layer 40 is covered by the second insulating layer 50B, the third insulating layer 52 and the fourth insulating layer 70, the first magnetic layer 30 and the second magnetic layer 40 can be protected from environmental loads (humidity, etc.).

[0145] Furthermore, since the surface of the fourth insulating layer 70, which forms the outermost surface of the inductor component 8 and covers the second magnetic layer 40, is flatter than the uneven shape of the second magnetic layer 40, the coplanarity during installation can be improved. Here, coplanarity refers to the property or state that multiple points exist on the same plane. It is also referred to as "surface uniformity" or "terminal flatness".

[0146] like Figure 9A As shown, since the sides of the vertical wiring 20 are covered by the fourth insulating layer 70, current leakage to the second magnetic layer 40 and the like can be suppressed.

[0147] The surface 70A of the fourth insulating layer 70 is formed flush with the end face 20A of the vertical wiring 20, and the external terminal 80 is formed to contact the surface 70A of the fourth insulating layer 70 and the end face 20A of the vertical wiring 20. Like the vertical wiring 20, the external terminal 80 can be formed by electrolytic plating, sputtering, electroless plating, or the like.

[0148] Thus, when viewed from the vertical direction, the external terminal 80 extending along the plane overlaps with the second magnetic layer 40. That is, when viewed from above, the external terminal 80 extends further outward compared to the vertical wiring 20. Therefore, since it has an external terminal 80 connected to the vertical wiring 20 and extending along the plane, and the external terminal 80 is formed to overlap with the second magnetic layer 40 when viewed from the vertical direction, the external terminal 80 can be increased, the resistance can be reduced, and the fixing strength can be improved.

[0149] <Variation Example 2>

[0150] Next, refer to Figure 10 A modified example 2 of the inductor component of the first embodiment will be described. Figure 10 This is a schematic diagram illustrating a modified example 2 of the inductor component according to the first embodiment of the present invention, and it shows a variation with... Figure 2A A side sectional view of a section at the same location.

[0151] In Modification 2, the inductor component 6 does not have a substrate 60. Because it lacks a substrate 60, the inductor component 6 can be made thinner and lighter. Furthermore, a vertical wiring 20 (the vertical wiring on the left side of the attached drawing) is similar to that in Modification 1 described above. The vertical wiring 20, which is connected to the pad portion 10A of the inductor wiring 10, is covered by a fourth insulating layer 70, and an external terminal 80 is formed on the end face 20A of the vertical wiring 20.

[0152] On the other hand, another vertical wiring 22 (the vertical wiring on the right side of the figure) is connected to the surface of the first magnetic layer 30 side (the lower side of the figure) of the pad portion 10B of the inductor wiring 10. This other vertical wiring 22 penetrates the first magnetic layer 30 and protrudes outwards. In Modification 2, by extending the vertical wirings 20 and 22 on both sides sandwiching the inductor wiring 10, it is possible to connect to the external circuit from above and below, thus increasing the freedom of mounting position. Furthermore, since there is no substrate, a thin inductor component 6 can be realized.

[0153] Alternatively, a substrate 60, which serves as an inorganic substrate, may be provided, with vertical wiring 22 penetrating through the substrate 60. In this case, since it can be connected to external circuits from both above and below, the freedom of mounting position is increased, and the strength of the substrate can also be ensured by having an inorganic substrate.

[0154] In Modification 2, vertical wirings 20 and 22 penetrate the first magnetic layer 30 and the second magnetic layer 40. However, when vertical wiring 20 (22) penetrates at least one of the first magnetic layer 30 and the second magnetic layer 40, the inductance acquisition efficiency can be improved because the magnetic flux through the magnetic layers 30 and 40 is increased.

[0155] <Variation Example 3>

[0156] Next, refer to Figure 11 and Figure 12 A variation 3 of the inductor component of the first embodiment will be described. Figure 11 This is a schematic diagram illustrating a modified example 3 of the inductor component according to the first embodiment of the present invention, and it shows a variation with... Figure 2B A side sectional view of the cross section at the same location, showing the case where the end of the first magnetic layer has a positive conical surface. Figure 12 This is a schematic diagram illustrating a modified example 3 of the inductor component according to the first embodiment of the present invention, and it shows a variation with... Figure 2B A side sectional view of the cross section at the same location, showing the case where the end of the first magnetic layer has an inverted conical surface.

[0157] In the inductor component 8 of Variation 3, the inductor wiring 10 extending along the plane is composed of multiple layers. Figure 11 and Figure 12 In the example shown, the layer consisting of two inductor wirings 10 arranged along the plane is formed in two layers. That is, when viewed in cross-section, the inductor wirings 10 are arranged in a 2×2 matrix. An insulating material (third insulating layer 52) is filled between the layers of the inductor wirings 10. However, this is not a limitation; an inductor component 8 can be formed by arranging any number of inductor wirings 10 along the plane in a matrix configuration with any number of layers.

[0158] Thus, when the inductor wiring 10 extending along the plane is composed of multiple layers, the degree of freedom of the inductor wiring 110 is increased. Furthermore, by filling the spaces between the inductor wiring 10 with insulating resin as an insulating material, current leakage can be suppressed, and since the inductor wiring 10 can be brought closer together, a thin inductor component 8 can be realized.

[0159] In variation example 3, Figure 11 In the example shown, an insulating layer 54 is formed on the substrate 60, and a first magnetic layer 30 is formed on the insulating layer 54. The insulating layer 50 is then formed to cover the first magnetic layer 30. On the other hand, in... Figure 12 In the example shown, another example of the configuration of the first magnetic layer 30 is illustrated. An insulating layer 54 is formed on the substrate 60, and a first insulating layer 50A is formed on the insulating layer 54. The first magnetic layer 30 is formed on the first insulating layer 50A, and a second insulating layer 50B is further formed to cover the first magnetic layer 30. Furthermore, the second magnetic layer 40 is formed to cover not only the side surface of the third insulating layer 52 covering the inductor wiring 10, but also the side surface of the insulating layer 50 or the first insulating layer 50A and the second insulating layer 50B covering the first magnetic layer 30. Thus, the second magnetic layer 40 is formed on the insulating layer 54. Therefore, in... Figure 11In the example shown, the first magnetic layer 30 and the second magnetic layer 40 can be said to be in the same plane. In this way, with at least a portion of the first magnetic layer 30 and the second magnetic layer 40 sandwiching the inductor wiring 10 located in the same plane parallel to the plane, the entire circumference of the inductor wiring 10, including the sides, can be covered. Thus, leakage flux can be suppressed.

[0160] Through this structure of the second magnetic layer 40, by Figure 11 and Figure 12 It is known that the volume of the second magnetic layer 40 is larger than that of the first magnetic layer 30. Therefore, since the inductor wiring 10 is covered by the second magnetic layer 40, leakage flux can be suppressed, and the inductor acquisition efficiency is improved.

[0161] Furthermore, the second magnetic layer 40 covers the inductor wiring 10, the first magnetic layer 30, and the first insulating layer 50A and the second insulating layer 50B covering the first magnetic layer 30. With this structure, the first magnetic layer 30 and the second magnetic layer 40 are separated, thus suppressing eddy currents between the magnetic layers.

[0162] Furthermore, by Figure 11 and Figure 12 As can be seen, the inclined portions 42A and 42B of the second magnetic layer 40 covering the side of the inductor wiring 10 have multiple inclination angles. In the illustrated example, the inclined portion 42B on the upper side is formed to be gentler than the inclined portion 42A on the lower side. Because the inclined portions 42A and 42B of the second magnetic layer 40 have multiple inclination angles, the degree of freedom in side coverage is increased, and it is possible to suppress the occurrence of wire breaks in the inductor wiring 10 during the formation of the magnetic layer. When the inclined portions 42A and 42B of the second magnetic layer 40 are considered as the first part, it can also be described as the first part having multiple inclination angles.

[0163] Furthermore, the second magnetic layer 40 covers the side surface of the inductor wiring 10 via the third insulating layer 52, and the tilt angles of the tilted portions 42A and 42B of the second magnetic layer 40 are gentler than the side surface of the inductor wiring 10. Thus, due to the third insulating layer 52, current leakage between the second magnetic layer 40 and the inductor wiring 10 can be suppressed. Furthermore, since the second magnetic layer 40 has a tilt angle gentler than the side surface of the inductor wiring 10, the second magnetic layer 40 can be reliably formed without causing the inductor wiring 10 to break. When the tilted portions 42A and 42B of the second magnetic layer 40 are considered as the first portion, it can also be described as follows: the tilt angle of the first portion relative to the direction perpendicular to the plane is gentler than the tilt angle of the side surface of the inductor wiring 10 relative to the direction perpendicular to the plane.

[0164] exist Figure 11In the example shown, both the inclined portion 32 of the first magnetic layer 30 and the inclined portion 42 of the second magnetic layer 40 are conical surfaces. This allows for a balance between inductance acquisition efficiency and DC superposition. On the other hand, in Figure 12 In the example shown, the inclined surface of the first magnetic layer 30 is an inverted cone, and the inclined portion of the second magnetic layer 40 is a regular cone. Therefore, because the magnetic layer volume of the first magnetic layer 30 and the second magnetic layer 40 in the region close to the inductor wiring 10 is increased, more magnetic flux passes through, thus improving the inductance efficiency.

[0165] (Examples of deformation in the inclined section)

[0166] Next, refer to Figure 13A and Figure 13B A modified example of the inclined portions 32 and 42 of the first magnetic layer 30 and the second magnetic layer 40 will be described. Figure 13A and Figure 13B This is a side cross-sectional view schematically showing an example of an inclined section formed by a stepped stacking of inorganic insulating and inorganic magnetic layers.

[0167] exist Figure 13A , 13B In the modified example of the inclined portion shown, the inorganic insulating layer 30A and the inorganic magnetic layer 30B are stacked in a stepped manner. This stepped stacking shape can be formed by different etching rates for the inorganic insulating layer 30A and the inorganic magnetic layer 30B. Even when the inorganic insulating layer 30A and the inorganic magnetic layer 30B are stacked in a stepped manner, they function as the inclined portion 32 in the same way as described above. Specifically, by connecting the ends of each inorganic magnetic layer 30B with a straight line using the least square method, it can be considered as an inclined surface having the inclined angle of that straight line (see reference). Figure 13A , 13B (dashed line).

[0168] At this time, as Figure 13B As shown, there may be cases where the inorganic insulating layer 30A protrudes beyond the inorganic magnetic layer 30B, or where the protruding inorganic magnetic layer 30B is bent. However, since the inclined surface is defined by the inorganic magnetic layer 30B, this does not cause a problem. Similarly, the inclined portion can also be formed in the second magnetic layer 40 by laminating the inorganic insulating layer and the inorganic magnetic layer in a stepped manner. As described above, inclined portions 32 and 42 can be formed in the first magnetic layer 30 and the second magnetic layer 40 using various methods.

[0169] (Inductor component according to the second embodiment of the present invention)

[0170] Next, refer to Figure 14 The inductor component of the fourth embodiment of the present invention will be described. Figure 14This is a schematic diagram illustrating the inductor component 102 according to the second embodiment of the present invention, and is shown in relation to... Figure 2B A side sectional view of a section at the same location.

[0171] The inductor component 102 of the second embodiment has the same planar shape as the inductor component 2 of the first embodiment. That is, it has both regions where the two inductor wirings 110 are arranged parallel to each other and regions where they are not arranged parallel to each other. However, it is not limited to this. For example, it may also be an inductor with serpentine wirings that extend along the long side direction (X-axis direction).

[0172] In the inductor component 2 of the first embodiment described above, the third insulating layer 52 is formed to surround the inductor wiring 10 formed on the second insulating layer 50B. However, in the inductor component 102 of the second embodiment, the organic resin, inorganic filler and composite part 152 are formed to surround the inductor wiring 110 formed on the second insulating layer 150B, instead of the insulating layer.

[0173] In the inductor component 102 of the second embodiment, a magnetic composite portion 152 comprising an organic resin and an inorganic filler is provided between the first magnetic layer 130 and the second magnetic layer 140, which are inorganic magnetic layers. The composite portion 152 is a composite of an organic resin and a magnetic filler. For example, the organic resin may be epoxy resin, acrylic resin, phenolic resin, or a combination thereof, and the magnetic filler may be ferrite, Fe-based, or Fe alloy. In addition, insulating fillers such as silica fillers may be included to adjust insulation and coefficient of linear expansion. Furthermore, in this embodiment, epoxy resin is used as the organic resin, and FeSiCr is used as the inorganic filler.

[0174] By incorporating Si and Cr, the crystallization of the magnetic composite portion 152 generates strain, thereby further improving the permeability of the magnetic layer. In particular, by including Si, the crystallization generates strain, which improves the permeability of the magnetic layer compared to the case where only Fe is present. Since Cr is easily oxidized, if Cr is present on the surface, the surface Cr will oxidize, preventing oxidation into the interior of the magnetic composite portion 152. Thus, by including Si and Cr in the magnetic composite portion 152, a balance between magnetic saturation and the permeability of the magnetic layer can be achieved, thereby improving the permeability of the magnetic layer and enhancing the reliability of the inductor component 102.

[0175] Reducing the distance between the first magnetic layer 130 and the second magnetic layer 140 increases the permeability of the magnetic layers, but there is a concern that eddy currents in the magnetic layers will increase and the Q value will decrease. However, in the inductor component 102 of this embodiment, since a magnetic composite portion 152 containing organic resin and inorganic filler is provided between the first magnetic layer 130 and the second magnetic layer 140, eddy currents can be suppressed even if the distance between the first magnetic layer 130 and the second magnetic layer 140 is reduced, and the inductor component 102 can be made thinner and lighter.

[0176] Furthermore, through the magnetic composite portion 152, eddy currents can be suppressed even when the spacing between the first magnetic layer 130 and the second magnetic layer 140 is reduced, thus achieving a high Q value. Therefore, a thin inductor component 102 can be provided that suppresses eddy currents and achieves a high Q value even when the spacing between the two magnetic layers is reduced.

[0177] (overall)

[0178] As described above, the inductor components 2 and 102 in any of the above embodiments include: inductor wirings 10 and 110 extending along a plane; pad portions 10A and 10B, etc., located at both ends of the inductor wirings 10 and 110; vertical wirings 20, etc., extending perpendicularly from the pad portions 10A and 10B, etc., relative to the plane; and first magnetic layers 30 and 130 and second magnetic layers 40 and 140 sandwiching the inductor wirings 10 and 110 in a direction perpendicular to the plane. When viewed in a cross-section orthogonal to the extending direction of the inductor wirings 10 and 110, the ends of the first magnetic layers 30 and 130 and the second magnetic layers 40 and 140 have inclined portions 32, 42, 132, and 142 that are inclined in a direction perpendicular to the plane.

[0179] When viewed in cross-section of inductor wiring 10, 110, the ends of the first magnetic layers 30, 130 and the second magnetic layers 40, 140 have inclined portions 32, 42, 132, 142, which can provide inductor components 2, 102 that can change the characteristics of the inductor without changing the wiring pattern of the inductor wiring or processing holes in the magnetic layers.

[0180] This disclosure includes the following methods.

[0181] <1> An inductor component comprising:

[0182] Inductor wiring extends along the plane;

[0183] The pads are located at both ends of the aforementioned inductor wiring;

[0184] Vertical wiring extends perpendicularly from the aforementioned pad portion relative to the aforementioned plane; and

[0185] The first magnetic layer and the second magnetic layer sandwich the inductor wiring from a direction perpendicular to the aforementioned plane.

[0186] When viewed in a cross-section orthogonal to the extension direction of the inductor wiring, the ends of the first magnetic layer and the second magnetic layer have inclined portions that slope in a direction perpendicular to the plane.

[0187] <2> The inductor component according to <1>, wherein,

[0188] When the inclined surface that narrows inward from the first magnetic layer toward the second magnetic layer toward the end is designated as a positive cone, and the inclined surface that widens outward from the first magnetic layer toward the second magnetic layer toward the end is designated as an inverted cone,...

[0189] The inclined portions of the first magnetic layer and the second magnetic layer are both positive conical surfaces.

[0190] <3> According to the inductor component described in <1>, wherein,

[0191] When the inclined surface that narrows inward from the first magnetic layer toward the second magnetic layer toward the end is designated as a positive cone, and the inclined surface that widens outward from the first magnetic layer toward the second magnetic layer toward the end is designated as an inverted cone,...

[0192] The inclined portions of the first magnetic layer and the second magnetic layer are both inverted conical surfaces.

[0193] <4> The inductor component according to <1>, wherein,

[0194] When the inclined surface that narrows inward from the first magnetic layer toward the second magnetic layer toward the end is designated as a positive cone, and the inclined surface that widens outward from the first magnetic layer toward the second magnetic layer toward the end is designated as an inverted cone,...

[0195] The inclined surface of the first magnetic layer is a positive cone, and the inclined portion of the second magnetic layer is an inverted cone.

[0196] <5> The inductor component according to <1>, wherein,

[0197] When the inclined surface that narrows inward from the first magnetic layer toward the second magnetic layer toward the end is designated as a positive cone, and the inclined surface that widens outward from the first magnetic layer toward the second magnetic layer toward the end is designated as an inverted cone,...

[0198] The inclined surface of the first magnetic layer is an inverted cone surface, and the inclined portion of the second magnetic layer is a positive cone surface.

[0199] <6> The inductor component according to any one of <1> to <5>, wherein,

[0200] The aforementioned vertical wiring penetrates at least one of the aforementioned first magnetic layer and the aforementioned second magnetic layer.

[0201] <7> The inductor component according to any one of <1> to <6>, wherein,

[0202] At least a portion of the first magnetic layer and the second magnetic layer are located on the same plane parallel to the aforementioned plane.

[0203] <8> The inductor component according to any one of <1> to <7>, wherein,

[0204] The volume of the second magnetic layer is larger than the volume of the first magnetic layer.

[0205] <9> The inductor component according to any one of <1> to <8>, wherein,

[0206] When the surface of the inductor wiring that is parallel to the plane is taken as the side surface, and the portion of the second magnetic layer that is covered by the insulating layer is taken as the first part, the tilt angle of the first part relative to the direction perpendicular to the plane is gentler than the tilt angle of the side surface relative to the direction perpendicular to the plane.

[0207] <10> An inductor component according to any one of <1> to <9>, wherein,

[0208] When the surface in which the wiring of the inductor is oriented parallel to the plane is taken as the side surface, and the portion of the second magnetic layer that is covered by the insulating layer is taken as the first part, the first part has multiple tilt angles.

[0209] <11> An inductor component according to any one of <1> to <10>, wherein,

[0210] It also includes an insulating layer that covers the inductor wiring and the first magnetic layer.

[0211] The second magnetic layer covers the insulating layer.

[0212] <12> An inductor component according to any one of <1> to <11>, wherein,

[0213] The first magnetic layer and the second magnetic layer described above have uniaxial magnetic anisotropy in the same direction.

[0214] The two ends of the aforementioned inductor wiring are separated along one of the anisotropic axes, the difficult axis and the easy axis, in the aforementioned uniaxial magnetic anisotropy.

[0215] The aforementioned inductor wiring extends in a manner that is not orthogonal to the aforementioned anisotropic axis throughout the entire region.

[0216] <13> The inductor component according to <12>, wherein,

[0217] The aforementioned first magnetic layer and the aforementioned second magnetic layer are composed of a laminate of an inorganic insulating layer and an inorganic magnetic layer.

[0218] The thickness of the aforementioned inorganic insulating layer is thinner than the thickness of the aforementioned inorganic magnetic layer.

[0219] All of the aforementioned inorganic magnetic layers exhibit uniaxial magnetic anisotropy in the same direction.

[0220] <14> The inductor component according to any one of <1> to <13>, wherein,

[0221] The aforementioned first magnetic layer is formed on an inorganic substrate.

[0222] <15> An inductor component according to any one of <1> to <14>, wherein,

[0223] The inductor wiring extending along the aforementioned plane consists of multiple layers, with insulating material filling the spaces between the layers of the inductor wiring.

[0224] <16> The inductor component according to any one of <1> to <15>, wherein,

[0225] The first magnetic layer and the second magnetic layer are inorganic magnetic layers, and a magnetic composite portion is provided between the first magnetic layer and the second magnetic layer. The magnetic composite portion contains organic resin and inorganic filler.

[0226] The description of the above embodiments is illustrative in all respects and is not a limiting structure. Suitable modifications and alterations will be apparent to those skilled in the art. The scope of the invention is not defined by the above embodiments, but by the claims. Furthermore, the scope of the invention includes modifications derived from the embodiments within the scope equivalent to the claims.

[0227] Explanation of reference numerals in the attached figures

[0228] 2, 4, 6, 8… Inductor components; 10… Inductor wiring; 10A, 10B… Pads; 20… Vertical wiring; 20A… End face; 22… Vertical wiring; 30… First magnetic layer; 32… Inclined portion; 30A… Inorganic insulating layer (sputtered insulating layer); 30B… Inorganic magnetic layer (sputtered magnetic layer); 40… Second magnetic layer; 42, 42A, 42B… Inclined portion; 50… Insulating layer; 50A… First insulating layer; 50B… Second insulating layer 52… third insulating layer; 54… insulating layer; 60… substrate; 70… fourth insulating layer; 70A… surface; 80… external terminal; 102… inductor component; 110… inductor wiring; 130… first magnetic layer; 132… inclined portion; 140… second magnetic layer; 142… inclined portion; 150A… first insulating layer; 150B… second insulating layer; 152… composite portion; 160… substrate; S… substrate material; BH… via.

Claims

1. An inductor component comprising: Inductor wiring extends along the plane; The pads are located at both ends of the aforementioned inductor wiring; Vertical wiring extends perpendicularly from the aforementioned pad portion relative to the aforementioned plane; and The first magnetic layer and the second magnetic layer sandwich the inductor wiring from a direction perpendicular to the aforementioned plane. When viewed in a cross-section orthogonal to the extension direction of the inductor wiring, the ends of the first magnetic layer and the second magnetic layer have inclined portions, which are inclined from a direction perpendicular to the plane.

2. The inductor component according to claim 1, wherein, When the inclined surface that narrows inward from the first magnetic layer toward the second magnetic layer toward the end is designated as a positive cone, and the inclined surface that widens outward from the first magnetic layer toward the second magnetic layer toward the end is designated as an inverted cone,... The inclined portions of the first magnetic layer and the second magnetic layer are both positive conical surfaces.

3. The inductor component according to claim 1, wherein, When the inclined surface that narrows inward from the first magnetic layer toward the second magnetic layer toward the end is designated as a positive cone, and the inclined surface that widens outward from the first magnetic layer toward the second magnetic layer toward the end is designated as an inverted cone,... The inclined portions of the first magnetic layer and the second magnetic layer are both inverted conical surfaces.

4. The inductor component according to claim 1, wherein, When the inclined surface that narrows inward from the first magnetic layer toward the second magnetic layer toward the end is designated as a positive cone, and the inclined surface that widens outward from the first magnetic layer toward the second magnetic layer toward the end is designated as an inverted cone,... The inclined surface of the first magnetic layer is a positive cone, and the inclined portion of the second magnetic layer is an inverted cone.

5. The inductor component according to claim 1, wherein, When the inclined surface that narrows inward from the first magnetic layer toward the second magnetic layer toward the end is designated as a positive cone, and the inclined surface that widens outward from the first magnetic layer toward the second magnetic layer toward the end is designated as an inverted cone,... The inclined surface of the first magnetic layer is an inverted cone surface, and the inclined portion of the second magnetic layer is a positive cone surface.

6. The inductor component according to any one of claims 1 to 5, wherein, The aforementioned vertical wiring penetrates at least one of the aforementioned first magnetic layer and the aforementioned second magnetic layer.

7. The inductor component according to any one of claims 1 to 6, wherein, At least a portion of the first magnetic layer and the second magnetic layer are located on the same plane parallel to the aforementioned plane.

8. The inductor component according to any one of claims 1 to 7, wherein, The volume of the second magnetic layer is larger than the volume of the first magnetic layer.

9. The inductor component according to any one of claims 1 to 8, wherein, When the surface of the inductor wiring that is parallel to the plane is taken as the side surface, and the portion of the second magnetic layer that is covered by the insulating layer is taken as the first part, the tilt angle of the first part relative to the direction perpendicular to the plane is gentler than the tilt angle of the side surface relative to the direction perpendicular to the plane.

10. The inductor component according to any one of claims 1 to 9, wherein, When the surface in which the wiring of the inductor is oriented parallel to the plane is taken as the side surface, and the portion of the second magnetic layer that is covered by the insulating layer is taken as the first part, the first part has multiple tilt angles.

11. The inductor component according to any one of claims 1 to 10, wherein, It also includes an insulating layer that covers the inductor wiring and the first magnetic layer. The second magnetic layer covers the insulating layer.

12. The inductor component according to any one of claims 1 to 11, wherein, The first magnetic layer and the second magnetic layer described above have uniaxial magnetic anisotropy in the same direction. The two ends of the aforementioned inductor wiring are separated along one of the anisotropic axes, the difficult axis and the easy axis, in the aforementioned uniaxial magnetic anisotropy. The aforementioned inductor wiring extends in a manner that is not orthogonal to the aforementioned anisotropic axis throughout the entire region.

13. The inductor component according to claim 12, wherein, The aforementioned first magnetic layer and the aforementioned second magnetic layer are composed of a laminate of an inorganic insulating layer and an inorganic magnetic layer. The thickness of the aforementioned inorganic insulating layer is thinner than the thickness of the aforementioned inorganic magnetic layer. All of the aforementioned inorganic magnetic layers exhibit uniaxial magnetic anisotropy in the same direction.

14. The inductor component according to any one of claims 1 to 13, wherein, The aforementioned first magnetic layer is formed on an inorganic substrate.

15. The inductor component according to any one of claims 1 to 14, wherein, The inductor wiring extending along the aforementioned plane consists of multiple layers, with insulating material filling the spaces between the layers of the inductor wiring.

16. The inductor component according to any one of claims 1 to 15, wherein, The first magnetic layer and the second magnetic layer are inorganic magnetic layers, and a magnetic composite portion is provided between the first magnetic layer and the second magnetic layer. The magnetic composite portion contains organic resin and inorganic filler.

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