Miniature thin profile harsh environment wireless sensor with tunable antenna

By designing a thin wireless sensor with a tunable miniature antenna, the integration challenge of sensors in harsh environments during semiconductor manufacturing was solved, enabling effective monitoring and multi-band adaptation of semiconductor processing chambers, and reducing costs.

CN122162260APending Publication Date: 2026-06-05APPLIED MATERIALS INC
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
APPLIED MATERIALS INC
Filing Date
2024-10-29
Publication Date
2026-06-05

AI Technical Summary

Technical Problem

In semiconductor manufacturing, sensor devices struggle to achieve effective measurements in harsh processing environments, especially due to size and durability requirements, which make traditional passive sensors and antennas bulky and difficult to integrate.

Method used

A thin wireless sensor with a tunable miniature antenna has been designed, comprising a dielectric substrate, conductive traces, and a tunable antenna structure. It is capable of operating in extreme temperature ranges and is powered by radio frequency energy. The sensor collects data and transmits it out of the chamber through the antenna.

Benefits of technology

It enables effective monitoring of semiconductor processing chambers in harsh environments. The sensor module has a small form factor, is compatible with multiple sensor types, supports wide bandwidth operation, and reduces manufacturing and integration costs.

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Abstract

The detailed description disclosed herein includes an antenna having a dielectric substrate with a first surface and a second surface. A conductive first pad is on the first surface and a plurality of traces are on the first surface. In a detailed description, the plurality of traces are of unequal length. A conductive second pad is on the second surface and a first hole passes through the first pad, the substrate and the second pad. A first gasket is along a sidewall of the first hole and electrically couples the first pad to the second pad. A second hole passes through the first pad and the substrate and a second gasket is along a sidewall of the second hole to electrically couple the first pad to a conductive third pad on the second surface. In a detailed description, an electrically insulating ring is between the second pad and the third pad.
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