一种半导体设备蝶阀清理装置及等离子体处理设备

By designing a butterfly valve cleaning device with rotary drive and cleaning components in semiconductor equipment, in-situ, online cleaning of the valve plate body is achieved, solving the problems of jamming and pressure runaway caused by by-product deposition, and improving equipment stability and production efficiency.

CN122164683BActive Publication Date: 2026-07-17SHANGHAI BANGXIN SEMI TECHNOLOGY CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SHANGHAI BANGXIN SEMI TECHNOLOGY CO LTD
Filing Date
2026-05-13
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

Existing technologies cannot effectively remove byproduct deposits from pressure-controlled butterfly valves in semiconductor equipment, leading to valve plate jamming and pressure runaway, which affects equipment stability and production efficiency.

Method used

A butterfly valve cleaning device for semiconductor equipment was designed. The device uses a rotating drive to drive the first, second, and third cleaning components to perform in-situ, online cleaning of the top, circumferential outer wall, and bottom of the valve plate body. Combined with plasma cleaning and airflow cleaning, it achieves comprehensive physical scraping and chemical decomposition of by-products.

Benefits of technology

It effectively prevents valve plate jamming and pressure runaway caused by the accumulation of by-products, improves equipment operation stability and production efficiency, and avoids frequent vacuum breaking maintenance.

✦ Generated by Eureka AI based on patent content.

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Abstract

本发明涉及晶圆处理设备技术领域,尤其涉及一种半导体设备蝶阀清理装置及等离子体处理设备,包括蝶阀壳体、转动杆、阀板本体和副产物清除组件:阀板本体通过转动杆转动设于蝶阀壳体的内腔;副产物清除组件包括第一清理件、第二清理件、第三清理件;第一清理件与旋转驱动件连接,第一清理件和第三清理件沿径向设置,第二清理件沿轴向设置且两端分别与第一清理件和第三清理件连接;本发明通过设置由旋转驱动件直接驱动、并与阀板本体的顶部、周向外壁及底部全面对应的第一清理件、第二清理件和第三清理件,能够主动、直接地对阀板本体表面的副产物的沉积层进行物理刮除。
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