半导体流控部件流量系数调节装置
By designing a flow coefficient adjustment device for semiconductor flow control components, the simultaneous flow adjustment and testing were achieved, solving the problem of high adjustment difficulty in existing technologies, improving adjustment speed and accuracy, and making it suitable for vapor deposition processes in semiconductor manufacturing.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- 星奇(上海)半导体有限公司
- Filing Date
- 2026-05-13
- Publication Date
- 2026-07-17
AI Technical Summary
In existing semiconductor vapor deposition processes, the flow coefficient adjustment and measurement of process valves cannot be performed simultaneously, resulting in high adjustment difficulty and inaccuracy.
A flow coefficient adjustment device for semiconductor flow control components was designed. Through the linkage of the operating lever and the pneumatic actuator, the flow adjustment and testing can be carried out simultaneously. The device includes a housing, operating lever, sealing components, limit components and a dial, which simplifies the adjustment steps and improves the adjustment speed and accuracy.
It enables flow coefficient adjustment without repeated disassembly, simplifies the adjustment process, improves adjustment efficiency and accuracy, adapts to existing standard pneumatic actuators, and balances adjustment accuracy and ease of operation.
Smart Images
Figure CN122170248B_ABST