A portable eddy current sensor coil measuring device
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- HUANENG SHANGHAI GAS TURBINE POWER GENERATION CO LTD
- Filing Date
- 2026-02-03
- Publication Date
- 2026-06-09
Smart Images

Figure CN122170742A_ABST
Abstract
Description
Technical Field
[0001] The embodiments of the present invention belong to the field of sensor technology, specifically relating to a portable eddy current sensor coil measuring device. Background Technology
[0002] Eddy current sensors can measure the distance between a measured metal conductor and the probe surface in a non-contact, highly linear, and high-resolution manner, both statically and dynamically. It is a non-contact, linearized metrological tool. Eddy current sensors accurately measure the static and dynamic relative displacement changes between the measured object (which must be a metal conductor) and the probe end face. The principle of eddy current sensors is based on the eddy current effect, accurately measuring the relative position between the measured object (which must be a metal conductor) and the probe end face. Its characteristics include high long-term reliability, high sensitivity, strong anti-interference ability, non-contact measurement, fast response speed, and immunity to the influence of media such as oil and water. It is often used for long-term real-time monitoring of parameters such as shaft displacement, shaft vibration, and shaft speed in large rotating machinery, enabling analysis of equipment operating conditions and fault causes, effectively protecting and preventing equipment failures.
[0003] However, the design of coil parameters currently relies mainly on experience and lacks systematic optimization methods, resulting in significant uncertainty in the design results, which makes it difficult to fully meet the needs of high-precision and large-range measurements. Summary of the Invention
[0004] The embodiments of the present invention aim to at least solve one of the technical problems existing in the prior art, such as the problem that the design of coil parameters in the prior art mainly relies on experience, lacks a systematic optimization method, and the design results have great uncertainty, making it difficult to fully meet the needs of high precision and large range measurement, and provide a portable eddy current sensor coil measurement device.
[0005] Embodiments of the present invention provide a portable eddy current sensor coil measuring device, comprising: Copper coil; The copper coil is encapsulated by the encapsulation component, the encapsulation component comprising: A probe base, on which a mounting groove is formed; A coil fixing component is provided, wherein the coil fixing component is disposed in the mounting groove and the upper surface of the coil fixing component has a groove; the copper coil is disposed in the coil fixing component through the groove; It also includes a determination module for determining the coil material and basic dimensional parameters: Based on finite element simulation analysis, sample data on the relationship between coil parameters and performance are generated; a BP neural network model is constructed, trained, and fitted to fit the nonlinear relationship between coil parameters and measurement performance; The BP neural network model is optimized using the particle swarm optimization algorithm to achieve the optimal combination of coil parameters. Based on the optimization results, an eddy current sensor is designed and manufactured. The coil parameters include the number of turns, inner diameter, line width, line height, and spacing. The finite element simulation analysis is used to generate inductance, resistance, and magnetic flux density data under different combinations of coil parameters.
[0006] Optionally, the coil holder is detachably connected to the probe base; The coil fixing component includes: The main body portion has the groove in its middle section; A mating part is provided on the lower surface of the body and extends toward the probe base.
[0007] Optionally, the probe base has a positioning hole that matches the mating part; The coil fixing component is positioned on the probe base through the positioning hole.
[0008] Optionally, the main body is provided with a first mounting hole; The inner bottom surface of the mounting groove has a first screw hole corresponding to the first mounting hole. The screw is adapted to pass through the first mounting hole and the first screw hole to connect the coil fixing member to the probe base screw.
[0009] Compared with the prior art, the beneficial effects of the present invention are: This invention is simple in design, can significantly reduce the time cost of experimental design and testing, avoid the complexity of multiple trial and error in traditional design, and its optimization results can be directly applied to sensor manufacturing or sensor calibration in equipment, with a wide range of applications.
[0010] This invention is easy to install in CMP equipment and can be used in conjunction with subsequent signal processing modules to sense changes in the thickness of the copper layer on the wafer surface during the copper CMP process, thus providing a good solution for realizing online measurement in copper CMP.
[0011] Furthermore, the eddy current sensor coil measuring device of this invention possesses high accuracy and reliability, thanks to its unique design and manufacturing process. Advanced materials and precision machining techniques are employed during sensor manufacturing to ensure the dimensional accuracy and consistency of the coil, thereby guaranteeing the accuracy and repeatability of the measurement data. In practical applications, this device can withstand the harsh environment of CMP equipment, including the effects of high temperature, high pressure, and corrosive chemicals.
[0012] To further enhance the durability of the device, the probe base and coil fixing parts are made of high-temperature and corrosion-resistant materials, ensuring long-term stable operation.
[0013] To achieve accurate measurement of the copper layer thickness on the wafer surface, the eddy current sensor coil measurement device of this invention is also equipped with an advanced signal processing module. This module can process the signal induced from the coil in real time, and through complex algorithm analysis, convert the signal into an accurate thickness reading, providing real-time feedback for the CMP process.
[0014] In terms of system integration, the eddy current sensor coil measuring device of this invention can be easily integrated into existing CMP equipment without requiring large-scale modifications. Its compact design and modular structure make installation and maintenance simple and quick, greatly reducing the user's operating difficulty and maintenance costs.
[0015] In summary, the portable eddy current sensor coil measuring device of the present invention is not only technically innovative, but also demonstrates significant advantages in practical applications. It provides an efficient, accurate, and reliable solution for copper layer thickness measurement in CMP processes, contributing to improved semiconductor manufacturing quality and production efficiency.
[0016] To further improve the performance of the eddy current sensor coil measurement device, this invention also relates to an intelligent calibration system. This system can automatically adjust the sensor parameters based on changes in the copper layer thickness on the wafer surface, ensuring the accuracy of the measurement results. By using advanced machine learning algorithms, the calibration system can learn and adapt to different CMP process conditions, thereby achieving more intelligent and personalized measurements.
[0017] In terms of safety, the eddy current sensor coil measuring device of this invention also performs excellently. It possesses self-diagnostic capabilities, enabling it to monitor its own operating status in real time. Once an anomaly is detected, it automatically activates a protection program to prevent damage to CMP equipment. Furthermore, the device complies with international safety standards, ensuring safe use in various working environments.
[0018] The eddy current sensor coil measuring device of this invention also possesses excellent scalability. Its measurement range and accuracy can be improved by adding additional sensor units to meet the measurement needs of wafers of different sizes. Simultaneously, the device supports multiple communication protocols, enabling easy data exchange and integration with other devices or systems. In future applications, the eddy current sensor coil measuring device of this invention is expected to be further optimized by integrating more intelligent technologies, such as the Internet of Things (IoT) and big data analytics, to achieve more intelligent production management and quality control. This will bring revolutionary changes to the semiconductor manufacturing industry, driving the entire industry towards higher efficiency and higher quality. Attached Figure Description
[0019] Figure 1 This is a schematic diagram of the process structure of the present invention. Detailed Implementation
[0020] To enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.
[0021] like Figure 1 As shown, a portable eddy current sensor coil measuring device includes: Copper coil.
[0022] The copper coil is encapsulated by the encapsulation component, the encapsulation component comprising: The probe base has a mounting groove formed on it.
[0023] A coil fixing component is provided, which is positioned in the mounting groove and has a groove on its upper surface. The copper coil is positioned in the coil fixing component through the groove.
[0024] As a specific embodiment of the present invention, continue to refer to Figure 1 It also includes a determination module for determining coil materials and basic dimensional parameters. This includes generating sample data on the relationship between coil parameters and performance based on finite element simulation analysis. A BP neural network model is constructed, trained, and fitted to fit the nonlinear relationship between coil parameters and measurement performance. The BP neural network model is optimized using a particle swarm optimization algorithm to achieve the optimal combination of coil parameters. Based on the optimization results, an eddy current sensor is designed and manufactured. The coil parameters include the number of turns, inner diameter, line width, line height, and spacing. The finite element simulation analysis is used to generate inductance, resistance, and magnetic flux density data under different combinations of coil parameters. In operation, the design is simple, significantly reducing the time cost of experimental design and testing, avoiding the complexity of multiple trial-and-error processes in traditional designs. Its optimization results can be directly applied to sensor manufacturing or sensor calibration in equipment, making it widely applicable and easy to install in CMP equipment.
[0025] For example, the coil holder is detachably connected to the probe base.
[0026] The coil fixing component includes: The main body has the groove in its middle section.
[0027] A mating part is provided on the lower surface of the body and extends toward the probe base.
[0028] The probe base has positioning holes that match the mating part.
[0029] The coil fixing component is positioned on the probe base through the positioning hole.
[0030] The main body is provided with a first mounting hole.
[0031] The inner bottom surface of the mounting groove has a first screw hole corresponding to the first mounting hole. The screw is adapted to pass through the first mounting hole and the first screw hole to connect the coil fixing member to the probe base screw.
[0032] The portable eddy current sensor coil measuring device of the present invention can be easily installed in CMP equipment during operation, and can be used in conjunction with subsequent signal processing modules to sense changes in the thickness of the copper layer on the wafer surface online during the copper CMP process, thereby providing a good solution for realizing online measurement of copper CMP.
[0033] Furthermore, the eddy current sensor coil measuring device of this invention possesses high accuracy and reliability, thanks to its unique design and manufacturing process. Advanced materials and precision machining techniques are employed during sensor manufacturing to ensure the dimensional accuracy and consistency of the coil, thereby guaranteeing the accuracy and repeatability of the measurement data. In practical applications, this device can withstand the harsh environment of CMP equipment, including the effects of high temperature, high pressure, and corrosive chemicals.
[0034] To further enhance the durability of the device, the probe base and coil fixing parts are made of high-temperature and corrosion-resistant materials, ensuring long-term stable operation.
[0035] To achieve accurate measurement of the copper layer thickness on the wafer surface, the eddy current sensor coil measurement device of this invention is also equipped with an advanced signal processing module. This module can process the signal induced from the coil in real time, and through complex algorithm analysis, convert the signal into an accurate thickness reading, providing real-time feedback for the CMP process.
[0036] In terms of system integration, the eddy current sensor coil measuring device of this invention can be easily integrated into existing CMP equipment without requiring large-scale modifications. Its compact design and modular structure make installation and maintenance simple and quick, greatly reducing the user's operating difficulty and maintenance costs.
[0037] In summary, the portable eddy current sensor coil measuring device of the present invention is not only technically innovative, but also demonstrates significant advantages in practical applications. It provides an efficient, accurate, and reliable solution for copper layer thickness measurement in CMP processes, contributing to improved semiconductor manufacturing quality and production efficiency.
[0038] To further improve the performance of the eddy current sensor coil measurement device, this invention also relates to an intelligent calibration system. This system can automatically adjust the sensor parameters based on changes in the copper layer thickness on the wafer surface, ensuring the accuracy of the measurement results. By using advanced machine learning algorithms, the calibration system can learn and adapt to different CMP process conditions, thereby achieving more intelligent and personalized measurements.
[0039] In terms of safety, the eddy current sensor coil measuring device of this invention also performs excellently. It possesses self-diagnostic capabilities, enabling it to monitor its own operating status in real time. Once an anomaly is detected, it automatically activates a protection program to prevent damage to CMP equipment. Furthermore, the device complies with international safety standards, ensuring safe use in various working environments.
[0040] The eddy current sensor coil measuring device of this invention also possesses excellent scalability. Its measurement range and accuracy can be improved by adding additional sensor units to meet the measurement needs of wafers of different sizes. Simultaneously, the device supports multiple communication protocols, enabling easy data exchange and integration with other devices or systems. In future applications, the eddy current sensor coil measuring device of this invention is expected to be further optimized by integrating more intelligent technologies, such as the Internet of Things (IoT) and big data analytics, to achieve more intelligent production management and quality control. This will bring revolutionary changes to the semiconductor manufacturing industry, driving the entire industry towards higher efficiency and higher quality.
[0041] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of the present invention, and the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.
Claims
1. A portable eddy current sensor coil measuring device, characterized in that, include: Copper coil; The copper coil is encapsulated by the encapsulation component, the encapsulation component comprising: A probe base, on which a mounting groove is formed; A coil fixing component is provided, wherein the coil fixing component is disposed in the mounting groove and the upper surface of the coil fixing component has a groove; the copper coil is disposed in the coil fixing component through the groove; The determination module is used to determine the coil material and basic dimensional parameters: Based on finite element simulation analysis, sample data on the relationship between coil parameters and performance are generated; a BP neural network model is constructed, trained, and fitted to fit the nonlinear relationship between coil parameters and measurement performance; The BP neural network model is optimized using the particle swarm optimization algorithm to achieve the optimal combination of coil parameters. Based on the optimization results, an eddy current sensor is designed and manufactured. The coil parameters include the number of turns, inner diameter, line width, line height, and spacing. The finite element simulation analysis is used to generate inductance, resistance, and magnetic flux density data under different combinations of coil parameters.
2. The portable eddy current sensor coil measuring device according to claim 1, characterized in that, The coil fixing component is detachably connected to the probe base; The coil fixing component includes: The main body portion has the groove in its middle section; A mating part is provided on the lower surface of the body and extends toward the probe base.
3. The portable eddy current sensor coil measuring device according to claim 2, characterized in that, The probe base has a positioning hole that matches the mating part; The coil fixing component is positioned on the probe base through the positioning hole.
4. The portable eddy current sensor coil measuring device according to claim 2, characterized in that, The main body is provided with a first mounting hole; The inner bottom surface of the mounting groove has a first screw hole corresponding to the first mounting hole. The screw is adapted to pass through the first mounting hole and the first screw hole to connect the coil fixing member to the probe base screw.