A method and apparatus for detecting internal resistance of a device

Abstract

This invention discloses a method and apparatus for detecting the internal resistance of a device. The device includes multiple acquisition probes, multiple switches, and a controller. Each acquisition probe corresponds to one switch, and the acquisition probes are electrically connected to the controller via corresponding switches. Different acquisition probes are used to acquire voltages at different locations within the device. The detection method is executed by the controller and includes: controlling the on / off state of each switch and acquiring the acquisition data from the acquisition probes; determining the resistance at different locations within the device based on the on / off state and the acquired data; and determining the state of the device based on the resistance at different locations within the device. The method and apparatus for detecting the internal resistance of a device provided by this invention can improve detection efficiency.

Description

Technical Field

[0001] The present invention relates to internal resistance detection technology, and more particularly to a method and apparatus for detecting the internal resistance of a device. Background Technology

[0002] For equipment requiring internal resistance testing, such as high-voltage boxes, internal components like circuit breakers, fuses, and contactors all possess internal resistance. To prevent abnormal internal resistance from affecting normal equipment operation, it is necessary to test this internal resistance. Currently, existing methods for testing equipment internal resistance typically involve single-point measurement using an internal resistance measuring instrument, which impacts testing efficiency. Summary of the Invention

[0003] This invention provides a method and apparatus for detecting the internal resistance of a device, thereby improving detection efficiency.

[0004] In a first aspect, embodiments of the present invention provide a method for detecting the internal resistance of a device. The device for detecting the internal resistance of the device includes multiple acquisition probes, multiple switches, and a control device. The acquisition probes and the switches are in one-to-one correspondence. The acquisition probes are electrically connected to the control device through corresponding switches. Different acquisition probes are used to acquire voltages at different locations inside the device. The detection method is executed by the control device. The detection method includes: Control the on / off state of each of the switches and acquire the data collected by the acquisition probe; Based on the on / off state and the collected data, the resistance at different locations inside the device is determined; The state of the device is determined based on the resistance at different locations inside the device.

[0005] Optionally, there are n switches, with the k-th switch and the (k+1)-th switch forming a group, where n is an integer greater than 2, and k is an integer ranging from 1 to n; The control of the on / off state of each of the switches and the acquisition of data from the acquisition probe include: The system controls each set of switches to close sequentially and acquires the acquisition data from the acquisition probes corresponding to the closed switches; the acquisition data corresponding to each set of switches is the voltage at adjacent internal locations of the device.

[0006] Optionally, determining the resistance at different internal locations of the device based on the on / off state and the collected data includes: When a positive current I1 is applied to the device, the first voltage difference V1 between the first and second positions inside the device is determined based on the on / off state and the collected data. When a negative current I2 is applied to the device, a second voltage difference V2 between the first position and the second position is determined based on the on / off state and the collected data. Based on the first voltage difference, the second voltage difference, the positive current, and the negative current, the resistance between the first position and the second position is determined to be (V1-V2) / (I1-I2).

[0007] Optionally, determining the state of the device based on the resistance at different internal locations includes: When the resistance between two locations inside the device is greater than the corresponding preset resistance value, the resistance is determined to be abnormal. If the abnormal resistance is the resistance of an internal component of the device, then it is determined that the internal component of the device needs to be tested. If the abnormal resistance is the resistance of the internal circuit connection point of the device, then the circuit connection point is determined to be faulty.

[0008] Optionally, the resistance at different locations inside the device includes the resistance at different locations in the positive circuit and the resistance at different locations in the negative circuit; one part of the acquisition probe is used to acquire the voltage at different locations in the positive circuit, and the other part of the acquisition probe is used to acquire the voltage at different locations in the negative circuit.

[0009] Optionally, determining the state of the device based on the resistance at different internal locations includes: When the difference between the resistance at two locations within the device and the corresponding historical data exceeds a preset threshold, the resistance is determined to be abnormal.

[0010] Optionally, methods for detecting the internal resistance of the equipment also include: When an abnormal resistance is detected inside the device, a corresponding prompt message is issued and the circuit containing the abnormal resistance is disconnected.

[0011] Secondly, embodiments of the present invention provide a device for detecting the internal resistance of a device, comprising: multiple acquisition probes, multiple switches, and a controller. The acquisition probes and the switches correspond one-to-one. The acquisition probes are electrically connected to the controller through corresponding switches. Different acquisition probes are used to acquire voltages at different locations inside the device. The device internal resistance detection method described in the first aspect is executed by the controller.

[0012] Optionally, the device is a high-voltage box, and the internal resistance of the high-voltage box includes at least one of the following: the contact resistance at the copper busbar connection interface inside the high-voltage box, the internal resistance of the circuit breaker, the internal resistance of the fuse, the internal resistance of the contactor, and the internal resistance of the connector.

[0013] Optionally, the acquisition probe is a magnetic probe.

[0014] The present invention provides a method and apparatus for detecting the internal resistance of a device. The device includes multiple acquisition probes, multiple switches, and a controller. Each acquisition probe and switch corresponds to another, and the acquisition probes are electrically connected to the controller via corresponding switches. Different acquisition probes are used to acquire voltages at different locations within the device. The detection method is executed by the controller and includes: controlling the on / off state of each switch and acquiring the acquisition data from the acquisition probes; determining the resistance at different locations within the device based on the on / off state and the acquired data; and determining the state of the device based on the resistance at different locations within the device. The method and apparatus for detecting the internal resistance of a device provided by the present invention detect the resistance at different locations within the device based on the on / off state of each switch and the acquired data, determining whether the resistance at different locations within the device is abnormal. This solves the problem of single-point measurement using an internal resistance measuring instrument in the prior art, which affects detection efficiency, thereby improving detection efficiency. Attached Figure Description

[0015] Figure 1 This is a flowchart of a method for detecting the internal resistance of a device provided in Embodiment 1 of the present invention; Figure 2 This is a flowchart of a method for detecting the internal resistance of a device provided in Embodiment 2 of the present invention; Figure 3 This is a flowchart of another method for detecting the internal resistance of a device provided in Embodiment 2 of the present invention; Figure 4 This is the structural frame of a device for detecting the internal resistance of an equipment provided in Embodiment 3 of the present invention; Figure 5 This is a schematic diagram of the structure of a device provided in Embodiment 3 of the present invention; Figure 6 This is a schematic diagram of the structure of a terminal provided in Embodiment 4 of the present invention. Detailed Implementation

[0016] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.

[0017] Example 1 Figure 1This is a flowchart of a method for detecting the internal resistance of a device according to Embodiment 1 of the present invention. This embodiment can be applied to detecting the internal resistance of devices, etc. The device for detecting the internal resistance of a device includes multiple acquisition probes, multiple switches, and a controller. The acquisition probes and switches are one-to-one. The acquisition probes are electrically connected to the controller through corresponding switches. Different acquisition probes are used to acquire voltages at different locations inside the device. The detection method is executed by the controller, which can be implemented in software and / or hardware. The method specifically includes the following steps: Step 110: Control the on / off state of each switch and acquire the data collected by the acquisition probe.

[0018] The acquired data consists of voltage data at the acquisition point, specifically the voltage data at a certain location inside the device acquired by the acquisition probe. The specific internal location of the device corresponding to the voltage acquired by the acquisition probe is preset. In one embodiment, all switches are controlled to close and acquire the acquisition data from each acquisition probe. Then, the switches are controlled to open sequentially, and the acquisition data from the acquisition probe corresponding to the closed switch is acquired each time a switch is opened.

[0019] Step 120: Determine the resistance at different locations inside the device based on the on / off state and the collected data.

[0020] Specifically, based on the on / off state of the switch and the data collected by the acquisition probe, the voltage collected by the acquisition probe connected to the closed switch is determined, corresponding to the specific internal location of the device. The resistance is then obtained through DC voltage drop, Kelvin four-wire system, and current reversal method. For example, when the device receives a positive current I+, the voltage difference between two locations inside the device is ΔV1; when the device receives a negative current I-, the voltage difference between the same two locations is ΔV2. The resistance between these two locations is then the ratio of the absolute value of ΔV1-ΔV2 to twice I, thus determining the resistance at different locations inside the device.

[0021] Step 130: Determine the status of the device based on the resistance at different locations inside the device.

[0022] Specifically, when the resistance between two points inside the equipment exceeds the corresponding preset resistance value, this resistance is identified as abnormal. If these two points are internal components of the equipment, such as the two sides of a circuit breaker, then the abnormal resistance is the internal resistance of the circuit breaker, indicating that the equipment may be in an abnormal state and the circuit breaker needs further testing. For example, check if the circuit breaker's torque value is within the set range using a torque wrench. If it is, the circuit breaker needs to be removed. If the internal resistance of the circuit breaker is greater than the corresponding preset resistance value, it can be determined that the internal resistance of the circuit breaker is faulty and needs to be replaced. If it is not within the set range, the torque needs to be retightened, and the process returns to step 110.

[0023] The device internal resistance detection method provided in this embodiment includes: controlling the on / off state of each switch and acquiring data from the acquisition probe; determining the resistance at different locations inside the device based on the on / off state and the acquired data; and determining the device's state based on the resistance at different locations inside the device. This device internal resistance detection method, by detecting the resistance at different locations inside the device based on the on / off state of each switch and the acquired data, determines whether there are any abnormalities in the resistance at different locations inside the device. This solves the problem of existing technologies using internal resistance measuring instruments for single-point measurements, which affects detection efficiency, thereby improving detection efficiency.

[0024] Example 2 Figure 2 This is a flowchart of a method for detecting the internal resistance of a device according to Embodiment 2 of the present invention. This embodiment can be applied to detecting the internal resistance of a device, etc. The device for detecting the internal resistance of a device includes multiple acquisition probes, multiple switches, and a controller. The acquisition probes and switches are in one-to-one correspondence. The acquisition probes are electrically connected to the controller through corresponding switches. Different acquisition probes are used to acquire voltages at different locations inside the device. The detection method is executed by the controller, which can be implemented in software and / or hardware. The method specifically includes the following steps: Step 210: Control the on / off state of each switch and acquire the data collected by the acquisition probe.

[0025] In one implementation, there are n switches, with the k-th switch and the (k+1)-th switch forming a group, where n is an integer greater than 2, and k is an integer ranging from 1 to n; Controlling the on / off state of each switch and acquiring data from the acquisition probe, including: The system controls each set of switches to close sequentially and acquires the data from the acquisition probes corresponding to the closed switches; the data acquired for each set of switches is the voltage at adjacent locations inside the device.

[0026] For example, n is 20, with ten groups of two switches each. These ten groups of switches are closed sequentially, and the data collected for each group is the voltage at adjacent locations inside the device. Furthermore, the number of switches is the same as the number of data acquisition probes; for example, there are 20 switches and 20 data acquisition probes, which collect voltage data at 20 locations inside the device. The first and second switches form a group, and the data collected for the first and second switches is the voltage at the first and second locations inside the device, where the first and second locations are two adjacent locations among the aforementioned 20 locations.

[0027] Furthermore, the resistance at different locations inside the device includes the resistance at different locations in the positive circuit and the resistance at different locations in the negative circuit; one part of the acquisition probe is used to acquire the voltage at different locations in the positive circuit, and the other part of the acquisition probe is used to acquire the voltage at different locations in the negative circuit.

[0028] Step 220: When a positive current I1 is applied to the device, determine the first voltage difference V1 between the first and second positions inside the device based on the on / off state and the collected data.

[0029] Specifically, based on the on / off state and the collected data, the data acquisition probe is determined to correspond to the closed switch. When the collected data includes the voltage at the first position and the voltage at the second position inside the device, the difference between the voltage at the first position and the voltage at the second position, or the difference between the voltage at the second position and the voltage at the first position, is taken as the first voltage difference.

[0030] Step 230: When a negative current I2 is applied to the device, determine the second voltage difference V2 between the first position and the second position based on the on / off state and the collected data.

[0031] Step 240: Based on the first voltage difference, the second voltage difference, the positive current, and the negative current, determine the resistance between the first position and the second position as (V1-V2) / (I1-I2).

[0032] Specifically, if the positive current is I+ and the negative current is I-, then the resistance between the first position and the second position is (V1-V2) / (2×I). If the first voltage difference V1 is the difference between the voltage at the first position and the voltage at the second position, then the second voltage difference V2 is also the difference between the voltage at the first position and the voltage at the second position; if the first voltage difference V1 is the difference between the voltage at the second position and the voltage at the first position, then the second voltage difference V2 is also the difference between the voltage at the second position and the voltage at the first position.

[0033] Step 250: When the resistance between two locations inside the device is greater than the corresponding preset resistance value, the resistance is determined to be abnormal.

[0034] In one embodiment, the device is a high-voltage box. The resistance between two positions inside the high-voltage box is the resistance between two positions in the positive circuit or the resistance between two positions in the negative circuit. If the two positions are in the positive circuit, the abnormal resistance may be the internal resistance of the main positive contactor copper busbar, the internal resistance of the main positive contactor, the internal resistance of the positive terminal of the circuit breaker, the internal resistance of the copper busbar of the circuit breaker, the internal resistance of the copper busbar of the fuse, the internal resistance of the fuse, or the internal resistance of the connector. If the two positions are in the negative circuit, the abnormal resistance may be the internal resistance of the main negative contactor copper busbar, the internal resistance of the main negative contactor, the internal resistance of the negative terminal of the circuit breaker, the internal resistance of the copper busbar of the circuit breaker, the internal resistance of the copper busbar of the shunt, or the internal resistance of the shunt. For example, the preset resistance value corresponding to the internal resistance of a circuit breaker is 0.5mΩ; the preset resistance value corresponding to the internal resistance of a fuse is 0.8mΩ; the preset resistance value corresponding to the internal resistance of a contactor is 0.3mΩ; the preset resistance value corresponding to the internal resistance of a connector is 0.5mΩ; the preset resistance value corresponding to the internal resistance of a lap joint is 0.05mΩ; the internal resistance of a copper busbar usually refers to the DC resistance per unit length, such as 1 meter of copper busbar, at a standard temperature of 20°C under DC or AC conditions. This is an inherent property of the material, depending on the resistivity, cross-sectional area S, and length L of the copper busbar. R20 = ρ20 × S × L, where R20 is the DC resistance (Ω) of the copper busbar at 20°C, and ρ20 is the volume resistivity of the copper busbar at 20°C. For pure copper such as T2Y, the typical value for international standard annealed copper is 1.7241 × 10⁻⁶. -8 Ω·m, or 0.017241Ω·mm 2 / m. For hardened copper busbars, due to work hardening, 1.75×10 is commonly used. -8 Ω·m, which is 0.0175 Ω·mm 2 The internal resistance of the circuit breaker is calculated using the / m value. When the internal resistance of the circuit breaker exceeds 0.5mΩ, the internal resistance of the circuit breaker is determined to be abnormal.

[0035] Additionally, if the difference between the resistance at two locations within the device and the corresponding historical data exceeds a preset threshold, an abnormal resistance is identified. The historical data includes historical resistance data from different locations within the device, representing the resistance data detected when the resistance at each location was normal.

[0036] Step 260: If the abnormal resistance is the resistance of an internal component of the equipment, then the internal component of the equipment needs to be tested.

[0037] Specifically, if the resistance between two locations is abnormal, and the location between the two locations is an internal component of the equipment, then the abnormal resistance can be determined to be the resistance of an internal component of the equipment, such as the internal resistance of a fuse, and the fuse needs to be tested. For example, check whether the torque value of the fuse is within the set range using a torque wrench. If it is, the fuse needs to be removed. If the internal resistance of the fuse is greater than the corresponding preset resistance value, it can be determined that the internal resistance of the fuse is faulty and needs to be replaced. If it is not within the set range, the torque needs to be tightened again, and the process returns to step 210.

[0038] Furthermore, the health status and lifespan of a device can be determined by the difference between the resistance of its internal components, such as the internal resistance of a circuit breaker, and the corresponding preset resistance value. For example, if the difference is within a preset range, the device can be considered relatively healthy.

[0039] Step 270: If the abnormal resistance is the resistance of the internal circuit connection point of the equipment, then the circuit connection point is determined to be faulty.

[0040] Specifically, if the resistance between two locations is abnormal, and the two locations are loop overlap points, then the abnormal resistance can be determined to be the resistance of the loop overlap point. The loop overlap point needs to be tested. After the test is completed, return to step 210.

[0041] Furthermore, whether the resistance between the two locations is the internal resistance of the device, such as the internal resistance of a fuse or circuit breaker, or the resistance of the loop connection point, can be determined by the voltage acquisition probes at the two locations. When the acquisition probes transmit voltage to the control device, they also transmit their own identification information. The control device pre-stores the specific location of the voltage acquired by each acquisition probe and the corresponding probe's identification information. Thus, the control device can determine the specific location of the voltage acquired by each acquisition probe based on the information transmitted by each probe. Moreover, by determining whether the problem lies with the device or the loop, maintenance personnel can make a direct and accurate judgment, enabling timely replacement of devices and determination of the repair point location, thereby improving the efficiency of fault location and analysis.

[0042] Step 280: When it is determined that there is an abnormal resistance inside the device, issue a corresponding prompt message and control the circuit where the abnormal resistance is located to disconnect.

[0043] The notification message includes the specific location of the abnormal resistor, and simultaneously sends the notification to the backend system. Specifically, if an abnormal resistor exists inside the device, both the positive and negative circuits can be disconnected to prevent the abnormal resistor from overheating and affecting the normal operation of the device and its internal components.

[0044] Figure 3 This is a flowchart of another method for detecting the internal resistance of a device provided in Embodiment 2 of the present invention. Figure 3 The detection of the internal resistance of the equipment is divided into the detection of the internal resistance of the positive circuit and the detection of the internal resistance of the negative circuit. The specific execution process of each step can be referred to steps 210-280 above, and will not be repeated here.

[0045] It should be noted that the values ​​of each parameter in this embodiment can be determined according to actual testing requirements, and are not limited here.

[0046] The device internal resistance detection method provided in this embodiment includes: controlling the on / off state of each switch and acquiring data from the acquisition probe; determining the resistance at different locations inside the device based on the on / off state and the acquired data; and determining a resistance anomaly when the resistance between two locations inside the device exceeds a corresponding preset resistance value. This device internal resistance detection method, by detecting the resistance at different locations inside the device based on the on / off state of each switch and the acquired data, determines whether there are any abnormalities in the resistance at different locations inside the device. This solves the problem of existing technologies using internal resistance measuring instruments for single-point measurements, which affects detection efficiency, thereby improving detection efficiency.

[0047] Example 3 Figure 4 This is the structural frame of a device for detecting the internal resistance of an equipment provided in Embodiment 3 of the present invention. Figure 5 This is a schematic diagram of the structure of a device provided in Embodiment 3 of the present invention. (Reference) Figure 4 and Figure 5 The device for detecting the internal resistance of the equipment includes: multiple acquisition probes, multiple switches, and a control device 10. The acquisition probes and switches are in one-to-one correspondence. The acquisition probes are electrically connected to the control device 10 through the corresponding switches. Different acquisition probes are used to acquire the voltage at different locations inside the equipment. The device internal resistance detection method described in any embodiment of the present invention is executed by the control device 10.

[0048] Specifically, Figure 4 The diagram illustrates ten data acquisition probes V1-V10 and ten switches S1-S10. Figure 4 The locations of the acquisition probes V1-V16 in the image are as follows: Figure 5 The device shown has 16 locations, situated between the battery and the energy storage converter, combined with... Figure 4 , Figure 5As in Example 2, when switches S1 and S2 are closed, the acquisition probes V1 and V2 acquire the voltage of the internal resistance of the copper busbar of the positive electrode / main positive contactor on the energy storage converter side. If the resistance corresponding to this voltage is abnormal, it indicates that the internal resistance of the copper busbar is abnormal and needs to be replaced. After replacement, the voltage is acquired again by the acquisition probes V1 and V2. If the resistance corresponding to this voltage is normal, it indicates that the internal resistance of the replaced copper busbar is normal. When switches S2 and S3 are closed, the voltage acquired by the acquisition probes V2 and V3 is the voltage of the internal resistance of the main positive contactor in the positive electrode circuit. If the resistance corresponding to this voltage is abnormal, it indicates that the internal resistance of the main positive contactor is abnormal and the corresponding torque value needs to be checked. If it is in place, the main positive contactor needs to be replaced. If it is not in place, the torque is tightened. After tightening the torque or replacing the component, the voltage is acquired again by the acquisition probes V2 and V3. If the resistance corresponding to this voltage is normal, it can be determined that the internal resistance of the main positive contactor is normal. When switches S3 and S4 are closed, probes V3 and V4 collect the voltage of the internal resistance of the copper busbar of the main positive contactor / circuit breaker in the positive circuit. If the resistance corresponding to this voltage is abnormal, it indicates that the internal resistance of the copper busbar is abnormal. The corresponding torque value needs to be checked. If it is, the copper busbar needs to be replaced; if not, the torque needs to be tightened. After tightening the torque or replacing the copper busbar, probes V3 and V4 collect the voltage again. If the resistance corresponding to this voltage is normal, it indicates that the internal resistance of the replaced copper busbar is normal. When switches S4 and S5 are closed, probes V4 and V5 collect the voltage of the positive internal resistance of the circuit breaker in the positive circuit. If the resistance corresponding to this voltage is abnormal, it indicates that the internal resistance of the circuit breaker is abnormal. The circuit breaker torque value needs to be checked. If it is, the circuit breaker needs to be replaced; if not, the torque needs to be tightened. After tightening the torque or replacing the component, probes V4 and V5 collect the voltage again. If the resistance corresponding to this voltage is normal, it indicates that the internal resistance of the replaced circuit breaker is normal. When switches S5 and S6 are closed, probes V5 and V6 collect the voltage of the internal resistance of the copper busbar of the positive circuit circuit breaker / fuse. If the resistance corresponding to this voltage is abnormal, it indicates that the internal resistance of the copper busbar is abnormal. The corresponding torque value needs to be checked. If it is, the copper busbar needs to be replaced; if not, the torque needs to be tightened. After tightening the torque or replacing the copper busbar, probes V5 and V6 collect the voltage again. If the resistance corresponding to this voltage is normal, it indicates that the internal resistance of the replaced copper busbar is normal. When switches S6 and S7 are closed, probes V6 and V7 collect the voltage of the internal resistance of the fuse in the positive circuit. If the resistance corresponding to this voltage is abnormal, it indicates that the internal resistance of the fuse is abnormal. The corresponding torque value needs to be checked. If it is, the fuse needs to be replaced; if not, the torque needs to be tightened. After tightening the torque or replacing the component, probes V6 and V7 collect the voltage again. If the resistance corresponding to this voltage is normal, it indicates that the internal resistance of the replaced fuse is normal.When switches S7 and S8 are closed, probes V7 and V8 collect the voltage of the internal resistance of the positive circuit fuse / battery side positive copper busbar. If the resistance corresponding to this voltage is abnormal, it indicates that the internal resistance of the copper busbar is abnormal and needs to be replaced. After replacement, probes V7 and V8 collect the voltage again. If the resistance corresponding to this voltage is normal, it indicates that the internal resistance of the replaced copper busbar is normal. When switches S8 and S9 are closed, probes V8 and V9 collect the voltage of the internal resistance of the positive / negative connector on the battery side of the positive circuit. If the resistance corresponding to this voltage is abnormal, it indicates that the internal resistance of the connector is abnormal. It is necessary to check whether the corresponding torque value is in place. If it is in place, the connector needs to be replaced. If it is not in place, the torque needs to be tightened. After tightening the torque or replacing the component, probes V8 and V9 collect the voltage again. If the resistance corresponding to this voltage is normal, it indicates that the internal resistance of the replaced connector is normal. When switches S9 and S10 are closed, probes V9 and V10 collect the voltage of the internal resistance of the copper busbar on the negative terminal of the battery side of the negative circuit / circuit breaker. If the resistance corresponding to this voltage is abnormal, it indicates that the internal resistance of the copper busbar is abnormal and needs to be replaced. After replacement, probes V9 and V10 collect the voltage again. If the resistance corresponding to this voltage is normal, it indicates that the internal resistance of the replaced copper busbar is normal. When switches S10 and S11 are closed, probes V10 and V11 collect the voltage of the internal resistance of the negative terminal of the circuit breaker in the negative circuit. If the resistance corresponding to this voltage is abnormal, it indicates that the internal resistance of the negative terminal of the circuit breaker is abnormal. It is necessary to check whether the corresponding torque value is in place. If it is in place, the circuit breaker needs to be replaced. If it is not in place, the torque needs to be tightened. After tightening the torque or replacing the component, probes V10 and V11 collect the voltage again. If the resistance corresponding to this voltage is normal, it indicates that the internal resistance of the negative terminal of the replaced circuit breaker is normal. When switches S11 and S12 are closed, probes V11 and V12 collect the voltage of the internal resistance of the copper busbar in the negative circuit circuit breaker / shunt. If the resistance corresponding to this voltage is abnormal, it indicates that the internal resistance of the copper busbar is abnormal. If the resistance is not properly adjusted, the torque needs to be tightened. After tightening the torque or replacing the copper busbar, probes V11 and V12 collect the voltage again. If the resistance corresponding to this voltage is normal, it indicates that the internal resistance of the replaced copper busbar is normal. When switches S12 and S13 are closed, probes V12 and V13 collect the voltage of the internal resistance of the shunt in the negative circuit. If the resistance corresponding to this voltage is abnormal, it indicates that the internal resistance of the shunt is abnormal. The corresponding torque value needs to be checked. If it is, the shunt needs to be replaced. If it is not properly adjusted, the torque needs to be tightened. After tightening the torque or replacing the component, probes V12 and V13 collect the voltage again. If the resistance corresponding to this voltage is normal, it indicates that the internal resistance of the replaced shunt is normal. When switches S13 and S14 are closed, the acquisition probes V13 and V14 acquire the voltage of the internal resistance of the copper busbar of the negative circuit shunt / main negative contactor. If the resistance corresponding to the voltage is abnormal, it indicates that the internal resistance of the copper busbar is abnormal and the copper busbar needs to be replaced. After replacement, the acquisition probes V13 and V14 acquire the voltage again. If the resistance corresponding to the voltage is normal at this time, it indicates that the internal resistance of the replaced copper busbar is normal.When switches S14 and S15 are closed, probes V14 and V15 collect the voltage of the internal resistance of the main negative contactor in the negative circuit. If the resistance corresponding to this voltage is abnormal, it indicates that the internal resistance of the main negative contactor is abnormal, and the corresponding torque value needs to be checked. If it is, the main negative contactor needs to be replaced. After replacement, probes V14 and V15 collect the voltage again. If the resistance corresponding to this voltage is normal, it indicates that the internal resistance of the replaced main negative contactor is normal. When switches S15 and S16 are closed, probes V15 and V16 collect the voltage of the internal resistance of the negative copper busbar on the negative circuit side of the main negative contactor / energy storage converter. If the resistance corresponding to this voltage is abnormal, it indicates that the internal resistance of the copper busbar is abnormal, and the copper busbar needs to be replaced. After replacement, probes V15 and V16 collect the voltage again. If the resistance corresponding to this voltage is normal, it indicates that the internal resistance of the replaced copper busbar is normal. In one embodiment, the controller 10 is an MCU, which features monolithic integration, low power consumption, strong real-time control, low cost, and simplicity and reliability, making it suitable for detecting the internal resistance of equipment. Furthermore, the specific detection process of the internal resistance of the equipment by the controller 10 can be referred to any of the above embodiments, and will not be repeated here.

[0049] Furthermore, the device for detecting the internal resistance of the equipment also includes a power supply 20 and a human-machine interface control panel 30, both of which are electrically connected to the controller 10. The power supply 20 supplies power to the controller 10, while the human-machine interface control panel 30 is used for human-machine interaction and to display interactive information. The human-machine interface control panel 30 communicates with the controller 10, transmitting detection commands to it. The controller 10 then transmits detection information, such as whether the internal resistance of the equipment is abnormal, the specific location of any abnormality, and any accompanying warnings, to the human-machine interface control panel 30 for display, allowing relevant personnel to quickly and intuitively understand the detection information.

[0050] Optionally, the equipment is a high-voltage box, and the internal resistance of the high-voltage box includes at least one of the following: the contact resistance at the copper busbar connection interface inside the high-voltage box, the internal resistance of the circuit breaker, the internal resistance of the fuse, the internal resistance of the contactor, and the internal resistance of the connector.

[0051] Specifically, the components inside the high-voltage box, such as circuit breakers, fuses, contactors, and connectors, are located in the positive and negative circuits of the high-voltage box. The voltages collected by each acquisition probe include the voltages across the terminals of each component inside the high-voltage box, in order to detect the internal resistance of each component. In addition, the high-voltage box needs to be disconnected from other equipment during testing. This embodiment can be applied to scenarios such as factory testing of high-voltage boxes and maintenance and repair during use.

[0052] Optionally, the acquisition probe can be a magnetic probe. This configuration allows for flexible movement of the acquisition probe and facilitates installation and removal.

[0053] The device for detecting the internal resistance of a device provided in this embodiment belongs to the same inventive concept as the device internal resistance detection method provided in any embodiment of the present invention, and has corresponding beneficial effects. For technical details not covered in this embodiment, please refer to the device internal resistance detection method provided in any embodiment of the present invention.

[0054] Example 4 Figure 6 This is a schematic diagram of the structure of a terminal provided in Embodiment 4 of the present invention. Figure 6 A block diagram of an exemplary device 412 suitable for implementing embodiments of the present invention is shown. Figure 6 The device 412 shown is merely an example and should not impose any limitations on the functionality and scope of use of the embodiments of the present invention.

[0055] like Figure 6 As shown, device 412 is represented as a general-purpose device. Components of device 412 may include, but are not limited to: one or more processors 416, storage device 428, and bus 418 connecting different system components (including storage device 428 and processor 416).

[0056] Bus 418 represents one or more of several bus architectures, including memory device buses or memory device controllers, peripheral buses, graphics acceleration ports, processors, or local buses using any of the various bus architectures. Examples of these architectures include, but are not limited to, Industry Subversive Alliance (ISA) buses, Micro Channel Architecture (MAC) buses, Enhanced ISA buses, Video Electronics Standards Association (VESA) local buses, and Peripheral Component Interconnect (PCI) buses.

[0057] Device 412 typically includes a variety of computer system readable media. These media can be any available media that can be accessed by device 412, including volatile and non-volatile media, removable and non-removable media.

[0058] Storage device 428 may include computer system readable media in the form of volatile memory, such as random access memory (RAM) 430 and / or cache memory 432. Device 412 may further include other removable / non-removable, volatile / non-volatile computer system storage media. By way of example only, storage system 434 may be used to read and write non-removable, non-volatile magnetic media (… Figure 6 Not shown; usually referred to as a "hard drive"). Although Figure 6 As not shown, a disk drive for reading and writing to a removable non-volatile disk (e.g., a "floppy disk") and an optical disc drive for reading and writing to a removable non-volatile optical disc, such as a Compact Disc Read-Only Memory (CD-ROM), a Digital Video Disc Read-Only Memory (DVD-ROM), or other optical media. In these cases, each drive may be connected to bus 418 via one or more data media interfaces. Storage device 428 may include at least one program product having a set (e.g., at least one) of program modules configured to perform the functions of the embodiments of the present invention.

[0059] A program / utility 440 having a set (at least one) of program modules 442 may be stored in, for example, a storage device 428. Such program modules 442 include, but are not limited to, an operating system, one or more application programs, other program modules, and program data. Each or some combination of these examples may include an implementation of a network environment. Program modules 442 typically perform the functions and / or methods described in the embodiments of the present invention.

[0060] Device 412 can also communicate with one or more external devices 414 (e.g., keyboard, pointing terminal, display 424, etc.), and with one or more terminals that enable a user to interact with device 412, and / or with any terminal that enables device 412 to communicate with one or more other computing terminals (e.g., network card, modem, etc.). This communication can be performed via input / output (I / O) interface 422. Furthermore, device 412 can also communicate with one or more networks (e.g., local area network (LAN), wide area network (WAN), and / or public networks, such as the Internet) via network adapter 420. Figure 6As shown, network adapter 420 communicates with other modules of device 412 via bus 418. It should be understood that, although not shown in the figure, other hardware and / or software modules can be used in conjunction with device 412, including but not limited to: microcode, terminal drivers, redundant processors, external disk drive arrays, Redundant Arrays of Independent Disks (RAID) systems, tape drives, and data backup storage systems.

[0061] The processor 416 (which can be considered as the controller in the aforementioned device internal resistance detection device) executes various functional applications and data processing by running a program stored in the storage device 428, such as implementing the device internal resistance detection method provided in the embodiments of the present invention, which includes: Control the on / off state of each switch and acquire the data collected by the acquisition probe; Based on the on / off state and the collected data, determine the resistance at different locations inside the device; The state of the device is determined by the resistance at different locations inside the device.

[0062] Example 5 Embodiment 5 of the present invention provides a computer-readable storage medium storing a computer program thereon. When executed by a control device, the program implements the device internal resistance detection method provided in the embodiments of the present invention, the method comprising: Control the on / off state of each switch and acquire the data collected by the acquisition probe; Based on the on / off state and the collected data, determine the resistance at different locations inside the device; The state of the device is determined by the resistance at different locations inside the device.

[0063] The computer storage medium of this invention can be any combination of one or more computer-readable media. A computer-readable medium can be a computer-readable signal medium or a computer-readable storage medium. A computer-readable storage medium can be, for example,—but not limited to—an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination thereof. More specific examples of computer-readable storage media (a non-exhaustive list) include: an electrical connection having one or more wires, a portable computer disk, a hard disk, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), optical storage device, magnetic storage device, or any suitable combination thereof. In this document, a computer-readable storage medium can be any tangible medium that contains or stores a program that can be used by or in conjunction with an instruction execution system, apparatus, or device.

[0064] Computer-readable signal media may include data signals propagated in baseband or as part of a carrier wave, carrying computer-readable program code. Such propagated data signals may take various forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination thereof. Computer-readable signal media may also be any computer-readable medium other than computer-readable storage media, capable of sending, propagating, or transmitting programs for use by or in connection with an instruction execution system, apparatus, or device.

[0065] Program code contained on a computer-readable medium may be transmitted using any suitable medium, including—but not limited to—wireless, wire, optical fiber, RF, etc., or any suitable combination thereof.

[0066] Computer program code for performing the operations of this invention can be written in one or more programming languages ​​or a combination thereof, including object-oriented programming languages ​​such as Java, Smalltalk, and C++, as well as conventional procedural programming languages ​​such as "C" or similar programming languages. The program code can be executed entirely on the user's computer, partially on the user's computer, as a standalone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or terminal. In cases involving remote computers, the remote computer can be connected to the user's computer via any type of network—including a local area network (LAN) or a wide area network (WAN)—or can be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0067] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, rearrangements, combinations, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, the scope of which is determined by the scope of the appended claims.

Claims

1. A method for detecting the internal resistance of a device, characterized in that, The device for detecting the internal resistance of the equipment includes multiple acquisition probes, multiple switches, and a control device. Each acquisition probe corresponds to one of the switches, and each acquisition probe is electrically connected to the control device via a corresponding switch. Different acquisition probes are used to acquire voltages at different locations within the equipment. The detection method is executed by the control device and includes: Control the on / off state of each of the switches and acquire the data collected by the acquisition probe; Based on the on / off state and the collected data, the resistance at different locations inside the device is determined; The state of the device is determined based on the resistance at different locations inside the device.

2. The method for detecting the internal resistance of equipment according to claim 1, characterized in that, There are n switches, with the k-th switch and the (k+1)-th switch forming a group. n is an integer greater than 2, and k is an integer that varies from 1 to n. The control of the on / off state of each of the switches and the acquisition of data from the acquisition probe include: Control each group of switches to close sequentially, and acquire the data collected by the acquisition probe corresponding to the closed switch; The data collected for each group of switches is the voltage at adjacent locations inside the device.

3. The method for detecting the internal resistance of equipment according to claim 1, characterized in that, The step of determining the resistance at different locations inside the device based on the on / off state and the collected data includes: When a positive current I1 is applied to the device, the first voltage difference V1 between the first and second positions inside the device is determined based on the on / off state and the collected data. When a negative current I2 is applied to the device, a second voltage difference V2 between the first position and the second position is determined based on the on / off state and the collected data. Based on the first voltage difference, the second voltage difference, the positive current, and the negative current, the resistance between the first position and the second position is determined to be (V1-V2) / (I1-I2).

4. The method for detecting the internal resistance of equipment according to claim 1, characterized in that, Determining the state of the device based on the resistance at different internal locations includes: When the resistance between two locations inside the device is greater than the corresponding preset resistance value, the resistance is determined to be abnormal. If the abnormal resistance is the resistance of an internal component of the device, then it is determined that the internal component of the device needs to be tested. If the abnormal resistance is the resistance of the internal circuit connection point of the device, then the circuit connection point is determined to be faulty.

5. The method for detecting the internal resistance of equipment according to claim 1, characterized in that, The resistance at different locations inside the device includes the resistance at different locations in the positive circuit and the resistance at different locations in the negative circuit; one part of the acquisition probe is used to acquire the voltage at different locations in the positive circuit, and the other part of the acquisition probe is used to acquire the voltage at different locations in the negative circuit.

6. The method for detecting the internal resistance of equipment according to claim 1, characterized in that, Determining the state of the device based on the resistance at different internal locations includes: When the difference between the resistance at two locations within the device and the corresponding historical data exceeds a preset threshold, the resistance is determined to be abnormal.

7. The method for detecting the internal resistance of equipment according to claim 1, characterized in that, Also includes: When an abnormal resistance is detected inside the device, a corresponding prompt message is issued and the circuit containing the abnormal resistance is disconnected.

8. A device for detecting the internal resistance of equipment, characterized in that, include: The device includes multiple acquisition probes, multiple switches, and a control device. Each acquisition probe corresponds to one of the switches. Each acquisition probe is electrically connected to the control device through a corresponding switch. Different acquisition probes are used to acquire voltages at different locations inside the device. The device internal resistance detection method as described in any one of claims 1-7 is executed by the control device.

9. The device for detecting the internal resistance of equipment according to claim 8, characterized in that, The device is a high-voltage box, and the internal resistance of the high-voltage box includes at least one of the following: the contact resistance at the copper busbar connection interface inside the high-voltage box, the internal resistance of the circuit breaker, the internal resistance of the fuse, the internal resistance of the contactor, and the internal resistance of the connector.

10. The device for detecting the internal resistance of an equipment according to claim 8, characterized in that, The acquisition probe is a magnetic probe.

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