A double-layer flexible circuit board of thermoelectric separation structure and a production process thereof
By designing a thermoelectric separation structure with heat dissipation bumps on a copper reinforcing plate, a double-layer flexible circuit board has been developed, resolving the conflict between high heat dissipation and 3D bending design in traditional flexible circuit boards. This achieves a balance between efficient heat dissipation and flexible bending, simplifying the production process and reducing costs.
CN122179971APending Publication Date: 2026-06-09SHANGHAI WLCP ELECTRICAL & TECH
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SHANGHAI WLCP ELECTRICAL & TECH
- Filing Date
- 2024-12-06
- Publication Date
- 2026-06-09
Smart Images
Figure CN122179971A_ABST
Abstract
The application discloses a double-layer flexible circuit board with a thermoelectric separation structure and a production process thereof, and the structure comprises a double-sided copper base material, a first protective film, a second protective film, a thermosetting glue and a copper reinforcing plate. The upper and lower surfaces of the double-sided copper base material are respectively provided with the first protective film and the second protective film. The second protective film is provided with the thermosetting glue. The thermosetting glue is connected with the copper reinforcing plate. The copper reinforcing plate penetrates the double-sided copper base material, the second protective film and the thermosetting glue. The copper reinforcing plate is provided with heat dissipation protrusions. Compared with the prior art, the copper reinforcing plate with the thermoelectric separation is used as a heat conduction support plate. The heat dissipation protrusions penetrate the flexible circuit board, so that the high heat dissipation function of the flexible circuit board is realized, and the bending requirement of the 3D flexible circuit board is met.
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