Adjustable pressing device for PCB production

By using an adjustable pressing device, which combines an electric heating plate and a rectangular plate, the problem of residual adhesive sticking together after the printed circuit boards are separated is solved, thereby improving production efficiency and reducing the risk of damage.

CN122179982APending Publication Date: 2026-06-09WANAN CHUANGFENG ELECTRONIC TECHNOLOGY CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
WANAN CHUANGFENG ELECTRONIC TECHNOLOGY CO LTD
Filing Date
2026-04-01
Publication Date
2026-06-09

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Abstract

This invention relates to the field of PCB manufacturing technology, and more particularly to an adjustable pressing device for PCB manufacturing, comprising a mounting frame; further comprising a connecting ring, a collecting plate, an electric heating plate I, a cylinder, and a mounting plate; the mounting frame is rotatably connected to the connecting ring; the connecting ring is fixedly connected to the collecting plate; the collecting plate is fixedly connected to several electric heating plates I; the mounting frame is fixedly connected to the cylinder; and the extension end of the cylinder is fixedly connected to the mounting plate. The invention uses a rectangular plate to restrict and clamp the PCB body, ensuring stable separation of the electric heating plate I and the PCB body while keeping the separated PCB body away from the electric heating plate I, preventing residual semi-cured adhesive from adhering to the PCB body and affecting subsequent handling of the PCB body by operators.
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Description

Technical Field

[0001] This invention relates to the field of PCB manufacturing technology, and in particular to an adjustable pressing device for PCB manufacturing. Background Technology

[0002] As a core process in the production of printed circuit boards (PCBs), the lamination device uses high temperature and high pressure to bond the various layers of materials together. However, during the lamination process, the melted semi-cured adhesive seeps out, causing the PCB to stick to the support plate, making it difficult to remove later. To solve this problem, for example, Chinese Patent No. CN118265239A discloses a lamination device for PCB production. This device sets a placement component on the upper end of a lifting assembly and drives the placement component to cooperate with the lifting assembly. After the PCB is laminated, the relative movement between the lifting assembly and the placement component drives the placement component to separate, thereby effectively achieving the separation of the PCB from the placement component.

[0003] However, after the printed circuit board is separated from the placement component, some adhesive remains on the printed circuit board, and the adhesive has a certain stickiness. As a result, the printed circuit board is still bound to the placement component due to the influence of the residual adhesive, making it inconvenient for operators to remove and affecting production efficiency. Summary of the Invention

[0004] To overcome the drawback that after the printed circuit board is separated from the placement assembly, it still adheres to the placement assembly due to the influence of residual adhesive, making it inconvenient for operators to remove. This invention provides an adjustable pressing device for PCB board production.

[0005] The technical solution is as follows: An adjustable pressing device for PCB board production includes a mounting frame; it also includes a connecting ring, a collecting plate, an electric heating plate I, a cylinder, a mounting plate, an electric heating plate II, a motor, and a limiting component; the mounting frame is rotatably connected to the connecting ring; the connecting ring is fixedly connected to the collecting plate; the collecting plate is fixedly connected to several electric heating plates I; the mounting frame is fixedly connected to the cylinder; the telescopic end of the cylinder is fixedly connected to the mounting plate; the mounting plate is fixedly connected to several electric heating plates II, and the number and position of the electric heating plates II correspond to those of the electric heating plates I; the mounting frame is fixedly connected to the motor, and the output shaft of the motor is fixedly connected to the collecting plate; the mounting frame is connected to a limiting component for limiting the PCB board body.

[0006] As an improvement to the above solution, the limiting components include an electric push rod I, a connecting plate, a rectangular plate, a fixing plate, and an electric push rod II; a mounting bracket is fixedly connected to several electric push rods I; the telescopic ends of all electric push rods I are fixedly connected to a connecting plate; several rectangular slots are opened on the connecting plate, and electric heating plate I and electric heating plate II are directly opposite the corresponding rectangular slots; several electric push rods II are fixedly connected to the connecting plate, and the telescopic ends of all electric push rods II face the corresponding rectangular slots; a fixing plate is fixedly connected to the telescopic end of each electric push rod II; two fixing plates located on the same side of the rectangular slots are connected to a rectangular plate, and the rectangular plate is located inside the corresponding rectangular slot.

[0007] As an improvement to the above scheme, the collecting plate is provided with several guide surfaces, and the guide surfaces are inclined away from the electric heating plate I.

[0008] As an improvement to the above scheme, the surfaces of electric heating plate I and electric heating plate II are rough.

[0009] As an improvement to the above solution, it also includes an electric drive shaft; two fixed plates on the same side of the rectangular slot are rotatably connected to an electric drive shaft, and the electric drive shaft is fixedly connected to the corresponding rectangular plate; the connecting plate has several cleaning slots, all of which are rectangularly distributed in the corresponding rectangular slots, and all of the cleaning slots are connected to the corresponding rectangular slots, and each cleaning slot is connected to a cleaning cotton.

[0010] As an improvement to the above solution, the cleaning cotton installed inside the cleaning tank is detachably connected to the connecting plate.

[0011] As an improvement to the above solution, magnets are provided on all the fixing plates.

[0012] As an improvement to the above scheme, each rectangular plate is provided with an arc-shaped part.

[0013] As an improvement to the above solution, the curved part is made of rubber.

[0014] As an improvement to the above solution, a pressure sensor is installed between the electric push rod I and the connecting plate.

[0015] The beneficial effects are: the present invention restricts and clamps the PCB board body by using a rectangular plate, ensuring stable separation of the electric heating plate I and the PCB board body, while keeping the separated PCB board body away from the electric heating plate I, thus preventing residual semi-cured adhesive from adhering to the PCB board body and affecting subsequent operations of the operator to handle the PCB board body.

[0016] The four rectangular plates surrounding the PCB board body form a complete rectangular frame, which allows for the timely removal of excess adhesive during the lamination process. This prevents the adhesive from hardening on the sides of the PCB board body, which is difficult to remove manually and can easily damage the PCB board body. At the same time, it reduces the amount of residual semi-cured adhesive in the contact area between the PCB board body and the edge of the electric heating plate I, reducing the adhesion strength between the PCB board body and the electric heating plate I, facilitating the subsequent separation of the PCB board body and the electric heating plate I, and reducing the pulling force during separation, thus reducing the risk of damage. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the adjustable laminating device for PCB board production disclosed in this invention. Figure 2 This is a partial structural diagram of the combination of the connecting ring, collecting plate, mounting plate and electric heating plate II disclosed in this invention; Figure 3 This is a schematic diagram of the collection plate structure disclosed in this invention; Figure 4 This is a partial structural diagram of the combination of the collecting plate and the electric heating plate I disclosed in this invention; Figure 5 This is a partial structural diagram of the limiting component disclosed in this invention; Figure 6 This is a cross-sectional view of the collecting plate and connecting plate disclosed in this invention; Figure 7 This is a partial structural diagram of the combination of the connecting plate, electric drive shaft, rectangular plate and fixing plate disclosed in this invention; Figure 8 This is a diagram showing the rectangular plate splicing state disclosed in this invention; Figure 9 This is a diagram showing the rectangular plate rotated to a horizontal position as disclosed in this invention.

[0018] The labels in the diagram are as follows: 1-Mounting bracket, 4-PCB board body, 101-Connecting ring, 102-Collection plate, 103-Electric heating plate I, 104-Cylinder, 105-Mounting plate, 106-Electric heating plate II, 107-Electric push rod I, 108-Connecting plate, 109-Electric drive shaft, 1010-Rectangular plate, 1011-Fixing plate, 1012-Electric push rod II, 1021-Guide surface, 1081-Rectangular groove, 1082-Cleaning groove, 1001-Arc-shaped part, 21-Motor. Detailed Implementation

[0019] The present invention will be further described below with reference to the embodiments shown in the accompanying drawings.

[0020] Example 1: An adjustable laminating device for PCB board production, such as... Figures 1-9 As shown, it includes a mounting bracket 1; It also includes a connecting ring 101, a collecting plate 102, an electric heating plate I 103, a cylinder 104, a mounting plate 105, an electric heating plate II 106, a motor 21, and a limiting component; the mounting frame 1 is rotatably connected to the connecting ring 101; the connecting ring 101 is fixedly connected to the collecting plate 102; the collecting plate 102 is fixedly connected to several electric heating plates I 103; the mounting frame 1 is bolted to the cylinder 104; the telescopic end of the cylinder 104 is fixedly connected to the mounting plate 105; the mounting plate 105 is fixedly connected to several electric heating plates II 106, and the number and position of the electric heating plates II 106 correspond to the electric heating plates I 103; the mounting frame 1 is bolted to the motor 21, and the output shaft of the motor 21 is fixedly connected to the collecting plate 102; the mounting frame 1 is connected to a limiting component for limiting the PCB board body 4.

[0021] The limiting components include an electric push rod I 107, a connecting plate 108, a rectangular plate 1010, a fixing plate 1011, and an electric push rod II 1012; the mounting bracket 1 is bolted to two electric push rods I 107; the telescopic ends of all electric push rods I 107 are fixedly connected to a connecting plate 108; the connecting plate 108 has several rectangular slots 1081, and the electric heating plate I 103 and the electric heating plate II 106 are directly opposite the corresponding rectangular slots 1081; the connecting plate 108 is bolted to several electric push rods II 1012, and the telescopic ends of all electric push rods II 1012 face the corresponding rectangular slots 1081; each telescopic end of electric push rod II 1012 is fixedly connected to a fixing plate 1011; two fixing plates 1011 located on the same side of the rectangular slots 1081 are connected to a rectangular plate 1010, and the rectangular plate 1010 is located inside the corresponding rectangular slots 1081.

[0022] The collecting plate 102 has several guide surfaces 1021, and the guide surfaces 1021 are inclined away from the electric heating plate I 103. This allows the adhesive scraped off by the rectangular plate 1010 and the overflowing adhesive to flow onto the collecting plate 102. Under the guiding effect of the inclined guide surfaces 1021, the adhesive flows along the guide surfaces 1021 in a direction away from the electric heating plate I 103, so that the adhesive is collected on the side of the collecting plate 102 away from the electric heating plate I 103, reducing the amount of adhesive adhering to the electric heating plate I 103.

[0023] The surfaces of electric heating plate I 103 and electric heating plate II 106 are rough, which increases the friction between electric heating plate I 103, electric heating plate II 106 and PCB board body 4, and avoids slippage of PCB board body 4 during the pressing process.

[0024] In use, the operator places multiple PCB board bodies 4 to be pressed onto the corresponding electric heating plate I 103. Then, the control cylinder 104 causes the mounting plate 105 to move the electric heating plate II 106 downward until the electric heating plate II 106 is pressed tightly against the upper surface of the PCB board body 4. Next, the electric heating plate I 103 and the electric heating plate II 106 are energized, so that the electric heating plate I 103 and the electric heating plate II 106 heat and press the lower and upper surfaces of the PCB board body 4 respectively. During the heating and pressing process, the semi-cured sheet in the PCB board body 4 will become fluid at high temperature. Therefore, the collecting plate 102 collects the semi-cured adhesive that seeps out from the sides of the PCB board body 4 during the pressing process.

[0025] After pressing is completed, power to electric heating plate I 103 and electric heating plate II 106 is stopped. Then, cylinder 104 is controlled to move mounting plate 105 upwards, causing electric heating plate II 106 to detach from the PCB board body 4 and return to its initial position. Next, all electric push rods II 1012 are sequentially controlled to move fixing plate 1011 towards the side closer to the PCB board body 4, until rectangular plate 1010 clamps and fixes the PCB board body 4. Then, motor 21 is started, and its output shaft drives collecting plate 102 and connecting ring 101 to rotate. 102 drives all the electric heating plates I103 to rotate, causing relative movement between all the electric heating plates I103 and the corresponding PCB board body 4. This causes the semi-cured adhesive between the electric heating plates I103 and the corresponding PCB board body 4 to break, separating the electric heating plates I103 and the corresponding PCB board body 4. This prevents the PCB board body 4 from being fixed to the electric heating plates I103 due to the influence of the semi-cured adhesive, which would affect the operator's material handling. It should be noted that the lower end of the rectangular plate 1010 is far away from the rotation path of the electric heating plates I103 and will not interfere with the rotation of the electric heating plates I103.

[0026] Furthermore, after the electric heating plate I103 and the corresponding PCB board body 4 separate from each other, the electric push rod I107 is controlled to move the connecting plate 108 and its parts upward, so that the four rectangular plates 1010 around the PCB board body 4 move the PCB board body 4 upward away from the electric heating plate I103, so as to avoid the semi-cured adhesive residue on the edge of the PCB board body 4 and the edge of the electric heating plate I103 remaining sticky and adhering to the PCB board body 4, which would affect the subsequent operation of the operator to pick up the PCB board body 4.

[0027] This invention improves production efficiency by setting up multiple pressing work areas (composed of multiple electric heating plates I103 and multiple electric heating plates II106, etc.) to achieve batch pressing of PCB board bodies 4.

[0028] Example 2, based on Example 1, such as Figures 5-8 As shown, it also includes an electric drive shaft 109; two fixed plates 1011 located on the same side of the rectangular slot 1081 are rotatably connected to an electric drive shaft 109, and the electric drive shaft 109 is fixedly connected to the corresponding rectangular plate 1010; the connecting plate 108 has a number of cleaning slots 1082, all of which are rectangularly distributed at the corresponding rectangular slot 1081, and all of which are connected to the corresponding rectangular slot 1081, and each cleaning slot 1082 is connected to a cleaning cotton.

[0029] The cleaning cotton inside the cleaning tank 1082 is detachably connected to the connecting plate 108, making it easy to disassemble, replace, and clean.

[0030] Magnets are provided on all the fixing plates 1011 to improve the docking stability of the rectangular plates 1010.

[0031] Each rectangular plate 1010 has an arc-shaped part 1001 at its lower end.

[0032] The curved part 1001 is made of rubber.

[0033] During the heat pressing process, the semi-cured adhesive seeping from the sides of the PCB board body 4 overflows not only at the junction with the edge of the electric heating plate I 103, but also remains on its sides, requiring subsequent manual handling. However, manual handling after the adhesive has cured is inconvenient and easily damages the PCB board body 4. Therefore, during the heat pressing process, all electric push rods II 1012 are sequentially controlled to move the rectangular plate 1010 closer to the PCB board body 4 until the side of the rectangular plate 1010 closest to the corresponding electric heating plate II 106 is on the same vertical plane as the side of the PCB board body 4. At this point, if... Figure 8As shown, two adjacent fixing plates 1011 contact each other and are magnetically attracted to each other, so that two adjacent rectangular plates 1010 are spliced ​​together at the corners, thereby forming a complete rectangular frame with four rectangular plates 1010 located around the same PCB board body 4. Then, the electric push rod I 107 is controlled to drive the connecting plate 108 and its components to move down, so that the lower ends of the four rectangular plates 1010 move down and scrape the sides of the PCB board body 4, scraping the glue overflowing from the sides of the PCB board body 4 onto the collecting plate 102 for collection. After the lower ends of the rectangular plates 1010 move down beyond the lower surface of the PCB board body 4, the electric push rod I 107 is controlled to drive the connecting plate 108 and its components to move up and reset. Then, the electric push rod I 107 is controlled to drive the connecting plate 108 and its components to move down again, so that the four rectangular plates 1010 move down and scrape the glue overflowing from the sides of the PCB board body 4 onto the collecting plate 102 for collection. The lower end of the rectangular plate 1010 continuously scrapes the four sides of the PCB board body 4. This process is repeated, and during the pressing process, the four rectangular plates 1010 form a complete rectangular frame to scrape the four sides of the PCB board body 4 in real time. This removes the excess adhesive that overflows during the pressing process, preventing the adhesive from hardening on the four sides of the PCB board body 4 and causing damage to the PCB board body 4. At the same time, the timely removal of excess adhesive by the four rectangular plates 1010 during the pressing process reduces the amount of residual semi-cured adhesive in the contact area between the PCB board body 4 and the edge of the electric heating plate I 103, reducing the adhesion strength between the PCB board body 4 and the electric heating plate I 103, facilitating the subsequent separation of the PCB board body 4 and the electric heating plate I 103, and reducing the pulling force during separation, thus reducing the risk of damage.

[0034] When the adhesive is scraped off the rectangular plate 1010, some adhesive will adhere to the underside of the rectangular plate 1010. Therefore, after the PCB board body 4 is pressed, the control electric drive shaft 109 drives the rectangular plate 1010 to rotate until the underside of the rectangular plate 1010 enters the cleaning tank 1082. The cleaning cotton in the cleaning tank 1082 wraps around the tip of the underside of the rectangular plate 1010. The relative movement between the underside of the rectangular plate 1010 and the cleaning cotton in the cleaning tank 1082 causes the cleaning cotton to remove the adhesive adhering to the underside of the rectangular plate 1010, thus achieving self-cleaning of the rectangular plate 1010. Subsequently, the cleaning cotton in the cleaning tank 1082 can be replaced manually periodically.

[0035] When the rectangular plate 1010 moves down along the side of the PCB board body 4 to scrape the adhesive, the arc-shaped part 1001 provided at the lower end of the rectangular plate 1010 reduces the scraping force between the lower end of the rectangular plate 1010 and the side of the PCB board body 4, thereby reducing the scratches on the PCB board body 4. Furthermore, the arc-shaped part 1001 of the rectangular plate 1010 is made of rubber, which further reduces the scratches on the PCB board body 4.

[0036] Example 3, based on Example 2, such as Figure 2 and Figure 9 As shown, a pressure sensor is installed between the electric push rod I107 and the connecting plate 108.

[0037] When the operator places the PCB board body 4 to be pressed onto the electric heating plate I103, due to the uncertainty of manual operation, the PCB board body 4 cannot completely adhere to the surface of the electric heating plate I103, affecting the pressing operation. Therefore, after the operator places the PCB board body 4 to be pressed onto the electric heating plate I103, the electric push rod I107 is first controlled to drive the connecting plate 108 and its connected parts to move down. Then, all the electric push rods II1012 drive the rectangular plate 1010 to move towards the side closer to the PCB board body 4, pushing and adjusting the offset PCB board body 4 so that the PCB board body 4 is accurately aligned with the surface of the electric heating plate I103, ensuring that the subsequent pressing is stable.

[0038] After lamination, to ensure the quality of the PCB board body 4, operators usually need to conduct a quality assessment after lamination to determine if there are any defects such as warping. However, if the assessment is conducted manually after removal, the operation steps increase and efficiency is reduced. Therefore, after lamination, the cylinder 104, mounting plate 105, and electric heating plate II 106 are first moved upwards, so that the electric heating plate II 106 is away from the PCB board body 4. Then, the electric drive shaft 109 is controlled to rotate the rectangular plate 1010 to a horizontal state. Next, the electric push rod I 107 is controlled to move the connected components downwards through the connecting plate 108. If the upper surface of the PCB board body 4 is uneven and there are warping defects, the connecting plate 108 will not be able to continue to descend. At this time, the electric push rod I 107 is triggered by the pressure sensor set between it and the connecting plate 108. The pressure sensor feeds the signal back to the background to automatically complete the quality inspection of the PCB board body 4 after lamination, thus optimizing the production process.

[0039] The above embodiments are merely preferred embodiments of the present invention and are not intended to limit the scope of the present invention. Therefore, all equivalent changes made to the content described in the claims of the present invention should be included within the scope of the claims of the present invention.

Claims

1. An adjustable pressing device for PCB board production, comprising a mounting bracket (1); characterized in that: It also includes a connecting ring (101), a collecting plate (102), an electric heating plate I (103), a cylinder (104), a mounting plate (105), an electric heating plate II (106), a motor (21), and a limiting component; the mounting frame (1) is rotatably connected to the connecting ring (101); the connecting ring (101) is fixedly connected to the collecting plate (102); the collecting plate (102) is fixedly connected to several electric heating plates I (103); the mounting frame (1) is fixedly connected to the cylinder (104); the telescopic end of the cylinder (104) is fixedly connected to the mounting plate (105); the mounting plate (105) is fixedly connected to several electric heating plates II (106), and the number and position of the electric heating plates II (106) correspond to the electric heating plates I (103); the mounting frame (1) is fixedly connected to the motor (21), and the output shaft of the motor (21) is fixedly connected to the collecting plate (102); the mounting frame (1) is connected to a limiting component for limiting the PCB board body (4).

2. The adjustable laminating device for PCB board production according to claim 1, characterized in that, The limiting components include an electric push rod I (107), a connecting plate (108), a rectangular plate (1010), a fixing plate (1011), and an electric push rod II (1012); a mounting bracket (1) is fixedly connected to several electric push rods I (107); the telescopic ends of all electric push rods I (107) are fixedly connected to a connecting plate (108); several rectangular slots (1081) are provided on the connecting plate (108), and electric heating plate I (103) and electric heating plate II (106) are located in the corresponding rectangular slots. (1081) facing; several electric push rods II (1012) are fixedly connected to the connecting plate (108), and the telescopic ends of all electric push rods II (1012) face the corresponding rectangular groove (1081); each electric push rod II (1012) has a fixed plate (1011) fixedly connected to its telescopic end; two fixed plates (1011) located on the same side of the rectangular groove (1081) are connected to a rectangular plate (1010), and the rectangular plate (1010) is located inside the corresponding rectangular groove (1081).

3. The adjustable laminating device for PCB board production according to claim 1, characterized in that, The collecting plate (102) has several guide surfaces (1021), and the guide surfaces (1021) are inclined away from the electric heating plate I (103).

4. The adjustable laminating device for PCB board production according to claim 1, characterized in that, The surfaces of electric heating plate I (103) and electric heating plate II (106) are rough.

5. The adjustable laminating device for PCB board production according to claim 2, characterized in that, It also includes an electric drive shaft (109); two fixed plates (1011) located on the same side of the rectangular slot (1081) are rotatably connected to an electric drive shaft (109), and the electric drive shaft (109) is fixedly connected to the corresponding rectangular plate (1010); the connecting plate (108) has a number of cleaning slots (1082), all the cleaning slots (1082) are rectangularly distributed at the corresponding rectangular slot (1081), and all the cleaning slots (1082) are connected to the corresponding rectangular slot (1081), and each cleaning slot (1082) is connected to a cleaning cotton.

6. The adjustable laminating device for PCB board production according to claim 5, characterized in that, The cleaning cotton provided inside the cleaning tank (1082) is detachably connected to the connecting plate (108).

7. The adjustable laminating device for PCB board production according to claim 5, characterized in that, Magnets are provided on all the mounting plates (1011).

8. The adjustable laminating device for PCB board production according to claim 5, characterized in that, Each rectangular plate (1010) is provided with an arc-shaped part (1001).

9. An adjustable laminating device for PCB board production according to claim 8, characterized in that, The curved part (1001) is made of rubber.

10. An adjustable laminating device for PCB board production according to claim 1, characterized in that, A pressure sensor is provided between the electric push rod I (107) and the connecting plate (108).