Topologically optimized flow channel heat sink with embedded profiled metal rods

CN122180050BActive Publication Date: 2026-10-27SHANDONG JIANZHU UNIV +1
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Patent Information

Application Number
CN202610605256.8
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2026-05-06
Publication Date
2026-10-27
Estimated Expiration
2046-05-06

AI Technical Summary

Technical Problem

[0004]在部分现有技术中也公开了采用铝和铜组合形成散热器的设计方案,现有技术中,各种不规则铜片被依次加工好,用耐高温粘合剂粘在与之对应的铝板空隙处,这种散热器不仅铜片和铝板加工难度和加工成本高,也存在黏合不稳定的风险,且铜在引导流体散热过程中,其本身的热量散热慢

Benefits of technology

首先,本发明中散热器的异型铜柱是先将完整铜柱嵌入挖好孔的铝板中粘合好再加工流道后自然得到的,这样做相对于先加工各种不规则铜片后再用耐高温粘合剂粘在与之对应的铝板空隙处做法,大大降低了散热器的加工难度和成本,其次,本发明成形的散热器中,高导热金属棒的部分结构在加工后依然嵌入到基板中,一方面可以利用高导热的金属去引导热流,以实现对热流路径的主动引导与阻隔,提升了冷却流道的热调控性能,使散热效果更好,另外一方面高导热的金属可以通过基板得到快速散热。

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Abstract

The present application relates to the technical field of heat sink structure design, and particularly discloses a topologically optimized flow channel heat sink embedded with a special-shaped metal rod, which comprises a base plate and a cover plate, the base plate is provided with a liquid inlet and a liquid outlet, the liquid inlet and the liquid outlet are communicated through a topologically optimized flow channel, and the topologically optimized flow channel is formed by a special-shaped copper rod embedded in the base plate and an aluminum plate with holes and flow channels engraved thereon. In the formed heat sink, part of the structure of the high-thermal-conductivity metal rod is still embedded in the base plate after processing, on the one hand, the high-thermal-conductivity metal can be used to guide the heat flow, so as to actively guide and block the heat flow path, improve the heat regulation performance of the cooling flow channel, and make the heat dissipation effect better, and on the other hand, the high-thermal-conductivity metal can be quickly cooled through the base plate.
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