LED backlight and backlight module

Abstract

An LED backlight source and a backlight module, the LED backlight source comprising a substrate having a bearing surface; at least two light emitting arrays, each of which comprises at least two light emitting chips, and in adjacent light emitting arrays, the number of light emitting chips is different, and / or the arrangement direction of the light emitting chips is non-parallel, and / or the arrangement order of the light emitting chips of corresponding colors is different; a plurality of reflection mechanisms, adjacent light emitting arrays are isolated from each other by the reflection mechanisms; and an encapsulation glue layer arranged in a containing space formed by surrounding the light emitting arrays through the reflection mechanisms and covering each light emitting chip. Since the LED backlight source is provided with a plurality of light emitting arrays, and the arrangement modes of the light emitting chips on adjacent light emitting arrays are different, the arrangement confusion degree of the light emitting chips of the entire LED backlight source is high, thereby weakening the difference in the light emitting effect between the light emitting chips, and finally making the light emitting uniformity of the entire LED backlight source higher.

Description

Technical Field

[0001] This invention relates to the field of LED packaging, and more specifically to an LED backlight and a backlight module. Background Technology

[0002] In related technologies, mini LED backlight modules typically employ an array of multi-color mini LED chips. These multi-color lights are mixed to produce white light, which serves as the backlight source for the module. However, in LED chip manufacturing processes, while chips of the same color are usually produced simultaneously, each chip is an independent entity. Therefore, each chip cannot achieve the exact same luminous effect; each chip has a different luminous curve. This results in the white light emitted by a conventionally arranged LED backlight being irregular, exhibiting color and brightness variations in different areas, leading to uneven light emission from the entire backlight. Summary of the Invention

[0003] The main technical problem solved by this invention is the uneven light output of the backlight in LED backlight modules in related technologies.

[0004] To address the aforementioned technical problems, this application provides an LED backlight, comprising:

[0005] A substrate having a bearing surface;

[0006] At least two light-emitting arrays are disposed on the bearing surface; each light-emitting array includes at least two light-emitting chips, the light-emitting chips including at least two of red light chips, green light chips and blue light chips, and in adjacent light-emitting arrays, the number of light-emitting chips is different, and / or the arrangement direction of the light-emitting chips is not parallel, and / or the arrangement order of the light-emitting chips of corresponding colors is different;

[0007] Multiple reflective mechanisms are provided, each of which is arranged around each of the light-emitting arrays, and adjacent light-emitting arrays are isolated from each other by the reflective mechanisms;

[0008] An encapsulating adhesive layer is disposed within the receiving space formed by the reflection mechanisms surrounding the light-emitting array and covers each of the light-emitting chips.

[0009] In one embodiment, the adjacent light-emitting arrays include at least a first array and a second array. The first array and the second array each include the red light chip, the green light chip, and the blue light chip extending in parallel along the same direction. The arrangement order of the light-emitting chips of corresponding colors in the first array and the second array is different.

[0010] In one embodiment, each of the light-emitting chips in the first array and the second array is arranged along mutually parallel straight lines, and the light-emitting chips at corresponding positions have different colors.

[0011] In one embodiment, the adjacent light-emitting arrays include at least a third array and a fourth array. The third array includes the red light chip, the green light chip, and the blue light chip arranged along a first direction. The fourth array includes the red light chip, the green light chip, and the blue light chip arranged along a second direction. The first direction intersects the second direction. The arrangement order of the light-emitting chips of corresponding colors in the third array and the fourth array is the same.

[0012] In one embodiment, the adjacent light-emitting arrays include at least a fifth array and a sixth array, the fifth array including 3N light-emitting chips, and the sixth array including 3(N+1) light-emitting chips, where N is an integer greater than or equal to 1.

[0013] In one embodiment, each of the light-emitting chips in the fifth array extends along a third direction, and each of the light-emitting chips in the sixth array extends along a fourth direction, wherein the third direction and the fourth direction intersect.

[0014] In one embodiment, at least one of the light-emitting arrays includes three types of chips: the red light chip, the green light chip, and the blue light chip.

[0015] In one embodiment, the emitting surfaces of the red light chip, the green light chip, and the blue light chip have the same area.

[0016] In one embodiment, a light-diffusing layer is further included, which covers the encapsulating adhesive layer; the light-diffusing layer includes a light-transmitting adhesive layer and a plurality of diffusing particles, the diffusing particles being located above the light-emitting array, and the size of the diffusing particles gradually increasing in a direction away from the center of the light-emitting array; and / or,

[0017] The reflective mechanism further includes a textured layer formed on the inner sidewall of the reflective mechanism surrounding the light-emitting array; and / or,

[0018] The light-emitting chip also includes a stacked chip, which is used to emit at least two colors of mixed light.

[0019] Based on the same inventive concept, this application also provides an LED backlight module, including an optical module and the above-mentioned LED backlight source;

[0020] The optical module includes a light guide plate and an optical film assembly stacked along the stacking direction; the light guide plate has a light emitting surface opposite to the optical film assembly and a light incident surface extending along the stacking direction;

[0021] The LED backlight is disposed on one side of the light-incident surface of the light guide plate, and the bearing surface is disposed opposite to the light-incident surface.

[0022] According to the LED backlight and backlight module of the above embodiments, since multiple light-emitting arrays are set on the LED backlight and the light-emitting chips on adjacent light-emitting arrays are arranged in different ways, the light-emitting chip arrangement of the entire LED backlight is highly disordered, thereby reducing the difference in light-emitting effect between the light-emitting chips and ultimately making the light-emitting uniformity of the entire LED backlight higher. Attached Figure Description

[0023] Figure 1 This is a top view of the LED backlight in an embodiment of this application;

[0024] Figure 2 This is a side view of the LED backlight in an embodiment of this application;

[0025] Figure 3 This is a schematic diagram of the arrangement of light-emitting chips in an LED backlight according to an embodiment of this application;

[0026] Figure 4 This is a schematic diagram of the arrangement of light-emitting chips in an LED backlight according to an embodiment of this application;

[0027] Figure 5 This is a schematic diagram of the arrangement of light-emitting chips in an LED backlight according to an embodiment of this application;

[0028] Figure 6 This is a schematic diagram of the arrangement of light-emitting chips in an LED backlight according to an embodiment of this application;

[0029] Figure 7 This is a schematic diagram of the arrangement of light-emitting chips in an LED backlight according to an embodiment of this application;

[0030] Figure 8 This is a schematic diagram of the side-lit backlight module structure in an embodiment of this application.

[0031] Explanation of reference numerals in the attached figures:

[0032] 1-LED backlight; 10-substrate;

[0033] 2-Light-emitting array; 20-Light-emitting chip; 21-First array; 22-Second array; 23-Third array; 24-Fourth array; 25-Fifth array; 26-Sixth array;

[0034] 3-Reflection mechanism;

[0035] 4-Encapsulating adhesive layer;

[0036] 5-Light-monopolizing layer; 51-Light-transmitting adhesive layer; 52-Diffusing particles;

[0037] 6-Light guide plate; 7-Optical film assembly. Detailed Implementation

[0038] The present invention will now be described in further detail with reference to specific embodiments and accompanying drawings. Similar elements in different embodiments are referred to by associated similar element reference numerals. In the following embodiments, many details are described to facilitate a better understanding of this application. However, those skilled in the art will readily recognize that some features may be omitted in different situations, or may be replaced by other elements, materials, or methods. In some cases, certain operations related to this application are not shown or described in the specification. This is to avoid obscuring the core parts of this application with excessive description. For those skilled in the art, detailed description of these related operations is not necessary; they can fully understand the related operations based on the description in the specification and general technical knowledge in the art.

[0039] Furthermore, the features, operations, or characteristics described in the specification can be combined in any suitable manner to form various embodiments. At the same time, the steps or actions in the method description can be rearranged or adjusted in a manner obvious to those skilled in the art. Therefore, the various orders in the specification and drawings are only for the clear description of a particular embodiment and do not imply a necessary order, unless otherwise stated that a particular order must be followed.

[0040] The serial numbers assigned to components in this document, such as "first" and "second," are used only to distinguish the described objects and have no sequential or technical meaning. The terms "connection" and "linkage" used in this application, unless otherwise specified, include both direct and indirect connections (linkages).

[0041] To address the problem of poor light uniformity in LED backlights caused by inconsistent luminous effects of individual light-emitting chips in related technologies, this application provides an LED backlight, please refer to... Figures 1 to 2 As shown, the LED backlight 1 includes:

[0042] Substrate 10, substrate 10 having a bearing surface;

[0043] At least two light-emitting arrays 2 are disposed on a bearing surface; each light-emitting array 2 includes at least two light-emitting chips 20, the light-emitting chips 20 including at least two of red light chips, green light chips and blue light chips, and in adjacent light-emitting arrays 2, the number of light-emitting chips 20 is different, and / or the arrangement direction of the light-emitting chips 20 is not parallel, and / or the arrangement order of the light-emitting chips 20 of corresponding colors is different;

[0044] Multiple reflective mechanisms 3 are arranged around each light-emitting array 2, and adjacent light-emitting arrays 2 are isolated from each other by the reflective mechanisms 3.

[0045] An encapsulating adhesive layer 4 is disposed within the accommodating space formed by the light-emitting array 2 surrounding each reflective mechanism 3, and covers each light-emitting chip 20.

[0046] In this embodiment, the LED backlight 1 can be used as the backlight 1 of a direct-lit backlight module or the backlight 1 of a side-lit backlight module. The LED backlight 1 can be excited and mixed by the light-emitting chip 20 combined with the encapsulating adhesive layer 4 to finally form white light, thereby forming the light source of the backlight module.

[0047] In this embodiment, the LED backlight 1 includes a substrate 10, which has a carrier surface for supporting components. The substrate 10 typically has structures such as a circuit layer and a reflective layer. The circuit layer can be disposed on the carrier surface, and the reflective layer is disposed on the circuit layer. The reflective layer can be a high-reflectivity structure formed from a light-colored material such as white, improving the light emission uniformity and display brightness of the LED backlight 1.

[0048] Multiple light-emitting arrays 2, each including multiple light-emitting chips 20, are provided. In this embodiment, the light-emitting chips 20 can be mini LED chips or micro LED chips, depending on their size and spacing. The light-emitting chips 20 can have various color schemes, such as red chips, blue chips, and green chips. In this embodiment, each light-emitting array 2 has at least two colors of light-emitting chips 20.

[0049] Multiple reflective mechanisms 3 are arranged around each light-emitting array 2, meaning that each individual light-emitting array 2 is separated by the reflective mechanisms 3 to form an individual light-emitting unit. By setting the reflective mechanisms 3, the light output brightness of the light-emitting array 2 can be increased.

[0050] In this embodiment of the application, the multiple reflective mechanisms 3 corresponding to each light-emitting array 2 can be connected as one unit, that is, each reflective mechanism 3 can be directly integrally formed and can be connected to the substrate 10 by injection molding or bonding.

[0051] To reduce the impact of display differences between chips of the same color on the light emission uniformity of backlight 1, please refer to... Figures 1 to 7As shown in the embodiments of this application, the arrangement of light-emitting chips 20 in adjacent light-emitting arrays 2 is different. Corresponding to the specific arrangement results of light-emitting chips 20, the light-emitting chips 20 in adjacent light-emitting arrays 2 specifically include three major categories: different numbers, non-parallel arrangement directions, and different arrangement orders. Moreover, these various situations can be superimposed on each other. In other words, in the embodiments of this application, the adjacent light-emitting arrays 2 specifically include the following situations: 1. Only the number of light-emitting chips 20 is different; 2. The number of light-emitting chips 20 is different and the arrangement directions of the light-emitting chips 20 are non-parallel; 3. The number of light-emitting chips 20 is different and the arrangement order of the light-emitting chips 20 is different; 4. Only the arrangement directions of the light-emitting chips 20 are non-parallel; 5. The arrangement directions of the light-emitting chips 20 are non-parallel and the arrangement order of the light-emitting chips 20 is different; 6. Only the arrangement order of the light-emitting chips 20 is different.

[0052] Please refer to the following: Figure 1 The different arrangement order of the light-emitting chips 20 in this embodiment is specifically manifested in that, among the multiple light-emitting chips 20 of different colors distributed in sequence in adjacent light-emitting arrays 2, at least one light-emitting chip 20 in the same order has a different color. For example, the adjacent light-emitting arrays 2 in this embodiment may include at least a first array 21 and a second array 22, wherein the first array 21 and the second array 22 each include a red light chip R, a green light chip G, and a blue light chip B extending in parallel along the same direction, and the arrangement order of the light-emitting chips 20 of corresponding colors in the first array 21 and the second array 22 is different. Assuming that both the first array 21 and the second array 22 include three types of light-emitting chips: red light chip R, green light chip G, and blue light chip B, in the first array 21, the light-emitting chips 20 are arranged in the RGB sequence, and in the second array 22, the light-emitting chips 20 are arranged in the BRG sequence. This is equivalent to the chip located in the first order being a red chip in the first array 21 and a blue chip in the second array 22. Therefore, the light-emitting chips 20 in the first array 21 and the second array 22 have different arrangement orders. It is worth mentioning that the arrangement of adjacent light-emitting arrays 2 in this embodiment is different, including the number of light-emitting chips 20 is different, the arrangement direction of the light-emitting chips 20 is not parallel, and the arrangement order of the light-emitting chips 20 is different. This only applies to the difference between the light-emitting array 2 and the adjacent light-emitting array 2, and does not limit all light-emitting arrays 2 in the entire LED backlight 1 to be different. As long as the local area formed by the adjacent light-emitting arrays 2 in the LED backlight 1 is disordered, it is equivalent to the arrangement of the light-emitting chips 20 in the entire LED backlight 1 being disordered. This can minimize the impact of different light emission effects of the same light-emitting chips 20 and improve the light emission uniformity of the entire LED backlight 1.

[0053] In some alternative embodiments, please refer to Figure 3In the first array 21 and the second array 22, each light-emitting chip 20 is arranged along a straight line parallel to each other, and the light-emitting chips 20 at corresponding positions are of different colors. In addition, the arrangement order of the light-emitting chips 20 can also vary depending on the arrangement method; for example, the light-emitting chips 20 in the light-emitting array 2 can be arranged in a ring, a square, or other manner.

[0054] In this embodiment, the non-parallel arrangement of the light-emitting chips 20 refers to the fact that in adjacent light-emitting arrays 2, the extension directions of multiple light-emitting chips 20 are different. For example, in this embodiment, adjacent light-emitting arrays 2 may include at least a third array 23 and a fourth array 24. The third array 23 includes red light-emitting chips R, green light-emitting chips G, and blue light-emitting chips B arranged along a first direction, and the fourth array 24 includes red light-emitting chips R, green light-emitting chips G, and blue light-emitting chips B arranged along a second direction. The first and second directions intersect, and the arrangement order of the light-emitting chips 20 of corresponding colors in the third array 23 and the fourth array 24 is the same. The first and second directions intersect, or they may be perpendicular to each other, meaning the arrangement direction of the light-emitting chips 20 in the third array 23 is perpendicular to the arrangement direction in the fourth array 24. In this case, a random distribution of the light-emitting chips 20 can also be achieved, thereby improving the light emission uniformity of the LED backlight 1.

[0055] Please refer to the following: Figure 4 In the embodiments of this application, the different number of light-emitting chips 20 in adjacent light-emitting arrays 2 means that the number of light-emitting chips 20 set in adjacent light-emitting arrays 2 is different, and the number of light-emitting chips 20 set in one light-emitting array 2 is more than that in the other; for example, adjacent light-emitting arrays 2 include at least a fifth array 25 and a sixth array 26, wherein the number of light-emitting chips 20 in the fifth array 25 is less than the number of light-emitting chips 20 in the sixth array 26.

[0056] LED backlight 1 typically uses RGB three-color light-emitting chips 20 as the light source to mix and form white light. In some optional embodiments, to facilitate the arrangement of the RGB three-color light-emitting chips 20, the fifth array 25 may specifically include 3N light-emitting chips 20, and the sixth array 26 may correspondingly include 3 (N+1) light-emitting chips 20, where N is an integer greater than or equal to 1. The number of light-emitting chips 20 in both the fifth array 25 and the sixth array 26 is a multiple of 3, and can be used to correspondingly set the RGB three-color light-emitting chips 20. Specifically, the arrangement of the light-emitting chips 20 in the fifth array 25 and the sixth array 26 can be such that RGB three-color light-emitting chips 20 are set in one column, and then the fifth array 25 can be set with 1 column, 2 columns, 3 columns...N columns of light-emitting chips 20, while the sixth array 26 is set with 2 columns, 3 columns, 4 columns...(N+1) columns of light-emitting chips 20. In addition, it is worth mentioning that the fifth array 25 and the sixth array 26 are arranged adjacent to each other. Other arrays arranged adjacent to the fifth array 25 and the sixth array 26 can be arranged with more or fewer light-emitting chips 20. In this embodiment, the specific number of chips is not limited. The number of light-emitting chips 20 between three adjacent light-emitting arrays 2 can be arranged in the order of less-more-more, less-more-fewer, more-fewer-more, etc.

[0057] In some optional embodiments, to further enhance the disorder of the arrangement of the light-emitting chips 20 in the LED backlight 1, thereby further reducing the difference in luminous effect between the light-emitting chips 20, in addition to the difference in number, the light-emitting chips 20 in the fifth array 25 and the sixth array 26 can also be configured such that each light-emitting chip 20 in the fifth array 25 extends along a third direction, and each light-emitting chip 20 in the sixth array 26 extends along a fourth direction, wherein the third direction and the fourth direction intersect. Since the third direction and the fourth direction intersect, the arrangement directions of the light-emitting chips 20 in the fifth array 25 and the sixth array 26 are also different.

[0058] In this embodiment, the arrangement of the light-emitting chips 20 in adjacent light-emitting arrays 2 can be a combination of two or more of the following: different arrangement order, different arrangement direction, and different number of chips; please refer to Figure 5 This illustrates one combination where the number and arrangement direction of light-emitting chips differ in adjacent light-emitting arrays; please refer to [reference needed]. Figure 6 This illustrates a combination of adjacent light-emitting arrays where the order and orientation of the light-emitting chips differ; please refer to [reference needed]. Figure 7 The diagram illustrates a combination where the number, arrangement order, and arrangement direction of the light-emitting chips in adjacent light-emitting arrays are all different.

[0059] In some optional embodiments, to facilitate the emission of white light from the entire LED backlight 1, at least one light-emitting array 2 includes three types of chips: red, green, and blue. In the embodiments of this application, each light-emitting array 2 can directly contain three-color light-emitting chips 20. Furthermore, depending on the number of light-emitting chips 20 in each light-emitting array 2, three chips 20 can be grouped together for light mixing, meaning the ratio of red, green, and blue light-emitting chips 20 can be 1:1:1. To ensure uniform light mixing, the areas of the emitting surfaces of the red chip R, green chip G, and blue chip B are the same. Alternatively, based on the emitting area, brightness, and lifespan of different colored light-emitting chips 20, different ratios of the number of chips 20 can be configured, such as a ratio of 2:1:1, 1:2:1, or 2:1:2, etc.

[0060] In some optional embodiments, to further improve display uniformity, the LED backlight 1 may also include a light-diffusing layer 5, which is disposed over the encapsulating adhesive layer 4. The light-diffusing layer 5 includes a light-transmitting adhesive layer 51 and a plurality of diffusing particles 52, which are located above the light-emitting array 2, and the size of the diffusing particles 52 gradually increases in the direction away from the center of the light-emitting array 2. The luminous brightness at the center of the light-emitting array 2 is higher than that at the edge of the light-emitting array 2. The function of the light-diffusing layer 5 is to block the light from the center of the light-emitting array 2 and reflect the brightness of the light emitted from the center of the light-emitting array 2 in other directions. This can reduce the brightness of the light emitted from the center of the light-emitting array 2 while increasing the brightness of other areas, thereby improving the overall brightness and uniformity of the LED backlight 1.

[0061] In some optional embodiments, to further enhance light emission uniformity, the reflecting mechanism 3 may also include a concave-convex structure layer formed on the inner sidewall of the reflecting mechanism 3 surrounding the light-emitting array 2. The angle between the inner sidewall of the reflecting mechanism 3 and the substrate 10 can be controlled between 100° and 120°, satisfying high-efficiency light emission while allowing perfect coupling with the light guide plate 6, thereby improving photoelectric conversion efficiency. The concave-convex structure layer can be integrally formed on the reflecting mechanism 3, or the layer structure can be fixedly disposed on the inner sidewall of the reflecting mechanism 3. Specifically, the microstructure type of the concave-convex structure layer may include one or a mixture of convex, concave, or trapezoidal shapes, etc., to improve light mixing uniformity and light emission brightness.

[0062] In some alternative embodiments, to diversify the light emission effect, the light-emitting chip 20 may also include a stacked chip, which is used to emit at least two colors of mixed light. A stacked chip is a single chip that can emit two or more colors of light; for example, the stacked chip may be a blue-green stacked chip, which can emit blue light and green light simultaneously. In this case, a red light chip may be additionally set in the corresponding light-emitting array 2 to form white light through light mixing.

[0063] In addition, this application embodiment also provides an LED backlight module, please refer to... Figure 8 The LED backlight module includes an optical module and the LED backlight 1 in the embodiments of this application;

[0064] The optical module includes a light guide plate 6 and an optical film group 7 stacked along the stacking direction; the light guide plate 6 has a light emitting surface disposed opposite to the optical film group 7 and a light incident surface extending along the stacking direction.

[0065] The LED backlight 1 is disposed on one side of the light-incident surface of the light guide plate 6, and the bearing surface is disposed opposite to the light-incident surface.

[0066] In this application embodiment, the LED backlight module can be used not only as a backlight source 1 in a side-lit backlight module, but also as a backlight source 1 in a direct-lit backlight module.

[0067] This application provides an LED backlight 1. Since multiple light-emitting arrays 2 are arranged on the LED backlight 1, and the light-emitting chips 20 on adjacent light-emitting arrays 2 are arranged in different ways, the arrangement of the light-emitting chips 20 in the entire LED backlight 1 is highly disordered, thereby reducing the difference in light-emitting effect between the light-emitting chips 20, and ultimately making the light-emitting uniformity of the entire LED backlight 1 higher.

[0068] The above examples illustrate the present invention only to aid in understanding it and are not intended to limit the scope of the invention. Those skilled in the art can make various simple deductions, modifications, or substitutions based on the principles of this invention.

Claims

1. An LED backlight, characterized in that, include: A substrate having a bearing surface; At least two light-emitting arrays are disposed on the bearing surface; each light-emitting array includes at least two light-emitting chips, the light-emitting chips including at least two of red light chips, green light chips and blue light chips, and in adjacent light-emitting arrays, the number of light-emitting chips is different, and / or the arrangement direction of the light-emitting chips is not parallel, and / or the arrangement order of the light-emitting chips of corresponding colors is different; Multiple reflective mechanisms are provided, each of which is arranged around each of the light-emitting arrays, and adjacent light-emitting arrays are isolated from each other by the reflective mechanisms; An encapsulating adhesive layer is disposed within the receiving space formed by the reflection mechanisms surrounding the light-emitting array and covers each of the light-emitting chips.

2. The LED backlight as described in claim 1, characterized in that, The adjacent light-emitting arrays include at least a first array and a second array. The first array and the second array each include the red light chip, the green light chip and the blue light chip extending in parallel along the same direction. The arrangement order of the light-emitting chips of the corresponding colors in the first array and the second array is different.

3. The LED backlight as described in claim 2, characterized in that, Each of the light-emitting chips in the first array and the second array is arranged along mutually parallel straight lines, and the light-emitting chips at corresponding positions have different colors.

4. The LED backlight as described in claim 1, characterized in that, The adjacent light-emitting arrays include at least a third array and a fourth array. The third array includes red light chips, green light chips and blue light chips arranged along a first direction. The fourth array includes red light chips, green light chips and blue light chips arranged along a second direction. The first direction intersects the second direction. The arrangement order of the light-emitting chips of corresponding colors in the third array and the fourth array is the same.

5. The LED backlight as described in claim 1, characterized in that, The adjacent light-emitting arrays include at least a fifth array and a sixth array. The fifth array includes 3N light-emitting chips, and the sixth array includes 3(N+1) light-emitting chips, where N is an integer greater than or equal to 1.

6. The LED backlight as described in claim 5, characterized in that, In the fifth array, each of the light-emitting chips extends along a third direction, and in the sixth array, each of the light-emitting chips extends along a fourth direction, wherein the third direction and the fourth direction intersect.

7. The LED backlight as described in claim 1, characterized in that, At least one of the light-emitting arrays includes three types of chips: the red light chip, the green light chip, and the blue light chip.

8. The LED backlight as described in claim 7, characterized in that, The red light chip, the green light chip, and the blue light chip all have the same area of ​​light-emitting surface.

9. The LED backlight according to any one of claims 1-8, characterized in that, It also includes a light-diffusing layer, which covers the encapsulating adhesive layer; the light-diffusing layer includes a light-transmitting adhesive layer and a plurality of diffusing particles, the diffusing particles being located above the light-emitting array, and the size of the diffusing particles gradually increasing in a direction away from the center of the light-emitting array; and / or, The reflective mechanism further includes a textured layer formed on the inner sidewall of the reflective mechanism surrounding the light-emitting array; and / or, The light-emitting chip also includes a stacked chip, which is used to emit at least two colors of mixed light.

10. An LED backlight module, characterized in that, Includes an optical module and an LED backlight as described in any one of claims 1-9; The optical module includes a light guide plate and an optical film assembly stacked along the stacking direction; the light guide plate has a light emitting surface opposite to the optical film assembly and a light incident surface extending along the stacking direction; The LED backlight is disposed on one side of the light-incident surface of the light guide plate, and the bearing surface is disposed opposite to the light-incident surface.

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