Method for detecting a batch transfer process

By using an image detector to monitor image data in real time during the picking and transposition process, the problem of difficulty in defect location in batch transfer processes is solved, thereby improving production stability and efficiency.

CN122180365APending Publication Date: 2026-06-09CONTREL TECH CO LTD
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Patent Information

Application Number
CN202411781484.8
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-05
Publication Date
2026-06-09

AI Technical Summary

Technical Problem

Existing technologies make it difficult to quickly identify the point where defects occur in batch transfer processes, resulting in low production efficiency and product qualification rate.

Method used

During the picking and transposition process, an image detector is used to detect the picking and transposition results in real time, and the image data is recorded and analyzed by the control unit to determine the location of defects.

Benefits of technology

It improves production stability and efficiency, enables rapid identification and correction of process problems, and increases product qualification rate.

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Abstract

The pick-up head picks up the semiconductor elements from the carrying area of the carrier plate first. Then the pick-up head moves the semiconductor elements to the dipping area to dip the flux, and moves the image detector to the carrying area of the carrier plate to detect, so as to obtain a pick-up image. After that, the pick-up head places the semiconductor elements on the placement area of the target substrate. Finally, the pick-up head moves to another carrying area of the carrier plate to pick up the semiconductor elements, and the image detector moves to the placement area of the target substrate to detect, so as to obtain a placement image. Thus, the method can record the pick-up and placement results in time, so as to improve the process and increase the process stability.
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