Fiber laser machining device and system

Abstract

The application discloses a kind of optical fiber laser processing device and system, the optical fiber laser processing device includes cutting plate and optical fiber, cutting plate has the air inlet hole along the air inlet hole in the upper and lower direction through cutting plate, so that air inlet hole is suitable for high-pressure gas, optical fiber is set in cutting plate, optical fiber is suitable for laser, laser is irradiated on workpiece to form cutting groove after being emitted by optical fiber, the thickness of cutting plate is less than the width of cutting groove, so that cutting plate is worn in cutting groove to continuously cut workpiece, the air outlet of air inlet hole is adjacent to optical fiber, so that high-pressure gas is blown away to cutting groove by air inlet hole.The optical fiber laser processing device of the application has the advantages of high processing efficiency, low cost and the like.

Description

Technical Field

[0001] This invention relates to a special processing field, specifically to a fiber laser processing device and system. Background Technology

[0002] Large-sized workpieces are typically represented by semiconductor materials such as silicon wafers and silicon carbide wafers. These materials possess superior electronic and physical properties and are widely used in industries such as photovoltaics and electronics. However, with the continuous advancement of these industries, the market demand for complex and high-performance electronic circuits is increasing, placing higher requirements on the diameter and processing quality of materials such as silicon wafers and silicon carbide wafers. For example, the maximum diameter of silicon wafers currently exceeds 300 mm, while the thickness typically does not exceed 350 μm.

[0003] Among related technologies, the processing methods for silicon and silicon carbide have low processing efficiency and high processing costs. Summary of the Invention

[0004] This invention is based on the inventor's discoveries and understanding of the following facts and problems:

[0005] Because silicon and silicon carbide are typically brittle materials that are difficult to process, traditional machining methods (such as turning and milling) are not suitable, and existing specialized machining methods also have limitations. For example, laser machining and water-guided laser machining methods are limited by their effective machining depth and cannot cut large-diameter silicon or silicon carbide rods; wire electrical discharge machining (EDM) relies on the electrical conductivity of the material and is only suitable for machining silicon materials where the parts are conductive (such as aluminum-based silicon carbide). Therefore, the main method for machining large-diameter silicon and silicon carbide materials is still wire sawing.

[0006] Wire sawing technology can be categorized in principle into free abrasive cutting and fixed abrasive cutting, and in terms of method into single-wire cutting and multi-wire cutting. The operation of this device is relatively cumbersome, and maintenance costs are high. Furthermore, the processing area requires continuous flushing with cutting fluid during the process, generating a large amount of processing waste fluid, which may pollute the environment and increase treatment costs. In addition, the low processing efficiency of wire sawing technology leads to high slicing costs, making it difficult to meet the growing demands of modern industry.

[0007] The present invention aims to at least partially solve one of the technical problems in the related art.

[0008] Therefore, embodiments of the present invention propose a fiber laser processing device with high processing efficiency and low processing cost.

[0009] This invention proposes a fiber laser processing system with a simple structure and high processing efficiency. The fiber laser processing apparatus according to an embodiment of the present invention includes: a cutting plate disposed below the mounting base, the cutting plate having an air inlet hole extending through the cutting plate in a vertical direction, so that high-pressure gas can be introduced into the air inlet hole; an optical fiber disposed within the cutting plate, the optical fiber being adapted to transmit laser light, the laser light being emitted through the optical fiber and irradiating the workpiece to form a cutting groove, the thickness of the cutting plate being less than the width of the cutting groove, so that the cutting plate passes through the cutting groove to continuously cut the workpiece, and the air outlet of the air inlet hole being disposed adjacent to the optical fiber, so that the high-pressure gas can be blown through the air inlet hole to purge the cutting groove.

[0010] The fiber laser processing apparatus of this invention includes a cutting plate and an optical fiber. Because the laser beam experiences minimal energy loss during propagation within the fiber, its energy density, viewed from the cross-sectional direction, approximates a Gaussian distribution after exiting the fiber end face. Based on the characteristics of fiber lasers, when the vertical distance between the lower end face of the fiber and the bottom of the cutting groove on a large workpiece directly below it remains within a reasonable range, the laser energy can still maintain a high concentration, thus enabling effective processing of large workpieces. Compared to related technologies, the laser energy transmission loss is low, and the cutting speed is fast. Compared to the reciprocating cutting mode of wire sawing, the processing efficiency is significantly improved, effectively reducing slicing costs. Furthermore, high-pressure gas is used for purging through the air inlet of the cutting plate, replacing traditional cutting fluid flushing, eliminating the generation of processing waste liquid from the source. This avoids environmental pollution, saves on waste liquid treatment costs, and reduces the processing and cutting costs of the fiber laser processing apparatus.

[0011] In some embodiments, the cutting plate includes a first plate and a second plate, and the air inlet is formed on at least one of the first plate and the second plate by electrical discharge wire cutting or etching, wherein the high-pressure gas is an inert gas.

[0012] In some embodiments, the air inlet extends from top to bottom and is tilted toward the direction adjacent to the optical fiber.

[0013] In some embodiments, there are multiple air inlets, which are spaced apart along the length of the cutting plate.

[0014] In some embodiments, the diameter of the fiber core is The thickness of the cutting plate is The divergence angle of the laser emitted from the optical fiber is . The laser beam exits from the lower end face of the optical fiber at point [point number]. The intersection point of the laser beam and the bottom of the cutting groove is a point. , the point and the points mentioned The distance between them is The laser is positioned directly below the lower end face of the optical fiber. The diameter of the light spot on the plane parallel to the lower end face of the optical fiber is The width of the cutting groove is The power of the laser is The workpiece ablation energy threshold is The safety correction factor is The width of the cutting groove and the thickness of the cutting plate Satisfying the formula: , The Satisfy the following formula: .

[0015] In some embodiments, the fiber laser processing apparatus further includes a mounting base, the cutting plate is disposed below the mounting base, the upper end of the optical fiber is disposed within the mounting base, and the mounting base is provided with an air inlet chamber communicating with the air inlet hole, so that the high-pressure gas flows into the air inlet hole through the air inlet hole.

[0016] In some embodiments, the lower end face of the optical fiber is flat and flush with the lower end face of the cutting plate.

[0017] In some embodiments, in a projection plane orthogonal to the width direction of the cutting plate, the intersection point of the laser at the bottom of the cutting groove is a point. The center of rotation of the workpiece is point . ,straight line Angle between the vertical and horizontal directions Constant, the included angle Less than or equal to 30°.

[0018] The fiber laser processing system of this invention includes: a mounting frame; a fiber laser processing device, wherein the fiber laser processing device is any of the fiber laser processing devices described in the above embodiments, the laser processing device is disposed on the mounting frame and is movable relative to the mounting frame in the vertical direction; and a clamping assembly, wherein the clamping assembly is disposed on the mounting frame and located below the laser processing device, the clamping assembly is used to clamp a workpiece, the clamping assembly is rotatable relative to the mounting frame about the length direction of the mounting frame, and the clamping assembly is movable relative to the mounting frame in the horizontal direction.

[0019] In some embodiments, the fiber laser processing system further includes a monitoring component for monitoring the depth of the cutting groove of the workpiece, such that when the relative position between the lower end face of the fiber and the bottom surface of the cutting groove of the workpiece directly below it exceeds a preset requirement, at least one of the fiber laser processing apparatus and the clamping component moves on the mounting frame. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the structure of the fiber laser processing device according to an embodiment of the present invention.

[0021] Figure 2 This is a schematic diagram of the cutting plate of the fiber laser processing device according to an embodiment of the present invention.

[0022] Figure 3 This is a cross-sectional view of the fiber laser processing apparatus according to an embodiment of the present invention.

[0023] Figure 4 This is a schematic diagram of the processing principle of the fiber laser processing device according to an embodiment of the present invention.

[0024] Figure 5 This is a schematic diagram of the fiber laser processing system according to an embodiment of the present invention.

[0025] Figure 6 This is a schematic diagram of the processing principle of the fiber laser processing system according to an embodiment of the present invention.

[0026] 100. Fiber laser processing equipment; 10. Fiber laser processing system; 1. Cutting plate; 11. Air inlet; 12. First plate; 13. Workpiece; 14. Cutting groove; 2. Optical fiber; 3. Mounting bracket; 4. Clamping assembly; 5. Monitoring assembly; 6. Mounting base; 61. Air intake chamber; 611. First section; 612. Second section; 63. Mounting base body; 64. Mounting base pressure plate; 7. Horizontal motion platform; 8. Vertical motion platform; 9. Sealing plug; 101. Fiber laser. Detailed Implementation

[0027] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0028] The fiber laser processing apparatus 100 according to an embodiment of the present invention is described below with reference to the accompanying drawings.

[0029] like Figure 1-4As shown, the fiber laser processing apparatus 100 according to an embodiment of the present invention includes a cutting plate 1 and an optical fiber 2.

[0030] The cutting plate 1 has an air inlet 11 extending through it in a vertical direction, so that high-pressure gas can be introduced into the air inlet 11. Specifically, as shown... Figures 1-3 As shown, the cutting plate 1 can be a rectangular plate extending in the vertical direction. The cutting plate 1 has an air inlet 11 that runs through the cutting plate 1 in the vertical direction. The upper end of the air inlet 11 is the inlet and can be detachably connected to an external high-pressure gas delivery pipeline, so that high-pressure gas flows into the air inlet.

[0031] An optical fiber 2 is disposed within the cutting plate 1. The optical fiber 2 is adapted to transmit laser light. After the laser light exits through the optical fiber 2, it irradiates the workpiece 13 to form a cutting groove 14. The thickness of the cutting plate 1 is less than the width of the cutting groove 14, so that the cutting plate 1 can pass through the cutting groove 14 to continuously cut the workpiece 13. The outlet of the air inlet 11 is disposed adjacent to the optical fiber 2, so that high-pressure gas can blow through the air inlet 11 to clean the cutting groove 14. Specifically, as shown... Figures 1-3 As shown, optical fiber 2 is embedded in a channel inside the cutting plate 1. The channel's orientation is consistent with the vertical extension direction of the cutting plate 1, ensuring the assembly accuracy of optical fiber 2. The upper end of optical fiber 2 extends out from the top of the cutting plate 1 and is connected to the fiber laser 101. The laser is generated from the fiber laser 101 and transmitted into optical fiber 2. The lower end of optical fiber 2 is located at the lower end of the cutting plate 1, and its output port is flush with or slightly convex with the lower surface of the cutting plate 1, ensuring the stability of the laser emission direction. During operation, the high-energy laser beam generated by the laser generator is transmitted through optical fiber 2 to the lower output port, perpendicularly irradiating the surface of the workpiece 13 to be processed. Through the thermal effect of the laser, continuous cutting grooves 14 are formed on the workpiece 13. To achieve continuous cutting, the thickness of the cutting plate 1 is less than the width of the cutting groove 14, allowing the cutting plate 1 to pass through the cutting groove 14. A small gap is reserved between the two sides of the plate and the inner wall of the cutting groove 14 (to prevent mechanical friction damage to the workpiece 13 or the cutting plate 1). When the workpiece 13 or the device moves along the cutting trajectory, the cutting plate 1 remains within the cutting groove 14. The optical fiber 2 continuously emits laser light to cut the workpiece 13 in front, while the already formed cutting groove 14 provides space for the movement of the cutting plate 1, thus achieving uninterrupted continuous cutting operations. Meanwhile, the air outlet of the air inlet 11 is positioned adjacent to the optical fiber 2, and the air outlet of the air inlet 11 faces the same direction as or at a slight angle to the light output direction of the optical fiber 2, ensuring that the high-pressure gas can be directly blown into the cutting groove 14 area. During the cutting process, the high-pressure gas can quickly blow away impurities such as slag and debris generated during cutting, preventing impurities from adhering to the inner wall of the cutting groove 14 or the light output port of the optical fiber 2, thus ensuring the flatness of the cut surface and the light output efficiency of the optical fiber 2.

[0032] The fiber laser processing apparatus 100 of this invention comprises a cutting plate 1 and an optical fiber 2. The laser exhibits low energy loss during transmission within the optical fiber 2, and the energy density of the beam emitted from the lower end face of the optical fiber 2 follows an approximately Gaussian distribution, demonstrating high energy concentration. Even when the lower end face of the optical fiber 2 maintains a reasonable processing distance from the large-sized workpiece 13 directly below it, the laser maintains high efficiency, enabling the processing of large-sized silicon crystal rods, silicon carbide rods, and other workpieces 13. Compared to related technologies, the direct cutting characteristics of the laser overcome the limitations of reciprocating cutting with wire saws, improving cutting speed and processing efficiency, and effectively reducing the slicing cost per unit workpiece 13. Simultaneously, a high-pressure gas purging mechanism is employed, precisely guiding high-pressure gas to the cutting area through the pre-set air inlet 11 on the cutting plate 1. This replaces the traditional method of relying on cutting fluid flushing, eliminating the generation of processing waste liquid. This avoids the environmental pollution risks caused by waste liquid and saves the additional costs of waste liquid collection and treatment, thereby reducing the processing cost of the fiber laser processing apparatus 100.

[0033] In some embodiments, the cutting plate 1 includes a first plate 12 and a second plate, and an air inlet 11 is formed on at least one of the first plate 12 and the second plate by electrical discharge wire cutting or etching, wherein the high-pressure gas is an inert gas. Specifically, as Figure 3 As shown, the cutting plate 1 adopts a split structure in which the first plate 12 and the second plate are spliced ​​and bonded together. Both are made of high melting point metal sheets (such as tungsten alloy, molybdenum alloy, etc.), which can withstand the local high temperature during laser cutting and avoid the plate body from affecting the cutting accuracy due to thermal deformation. The first plate 12 and the second plate are both designed as vertically extending rectangular plates to ensure the stability and consistency of the overall structure after splicing. On the bonding surface of the first plate 12 facing the second plate, an air inlet 11 and an optical fiber 2 mounting channel that meet the size requirements are first processed by wire electrical discharge machining and etching. At the same time, on the bonding surface of the second plate facing the first plate 12, matching air inlets 11 and channel grooves are processed at positions completely corresponding to the first plate 12 using the same wire electrical discharge machining and etching process. This allows the air inlets 11 on both sides to be spliced ​​together to form a complete vertical through-type air channel after the first plate 12 and the second plate are bonded. The optical fiber 2 mounting channel can also form a closed receiving space, effectively avoiding the problems of precision deviation and channel blockage that are prone to occur when the integrated cutting plate 1 processes deep holes and long channels. The fiber laser processing device 100 of this invention uses an inert gas (preferably argon) as the high-pressure purging gas. Compared with traditional oxygen and compressed air, argon, as a monatomic inert gas, has stable chemical properties and will not undergo oxidation reaction with the workpiece 13 during laser cutting. This effectively avoids quality problems such as oxide layers and discoloration at the cutting edges. Simultaneously, argon has a low thermal conductivity, reducing heat loss in the cutting area and helping to maintain the local high-temperature environment required for laser cutting, thus improving cutting efficiency. Furthermore, the inert gas quickly removes slag and debris generated during cutting (preventing impurities from adhering to the light output port of the fiber 2, causing laser energy attenuation, or getting stuck in the cutting groove 14, affecting subsequent cutting trajectories). It also creates an inert gas protective atmosphere in the cutting area, isolating air from contact with the cutting surface. The argon gas used for purging can be directly discharged into the air without the need for additional recovery and treatment devices (because argon is non-toxic and harmless, and its content in the air is extremely low, direct discharge will not cause environmental impact), simplifying the overall structure of the device and reducing operating costs. In some embodiments, the air inlet 11 extends downwards and is inclined toward the direction adjacent to the optical fiber 2. Specifically, as Figure 2 As shown, the air inlet 11 is an inclined straight hole, and the air outlet of the air inlet 11 is located near the lower end of the optical fiber 2. After the high-pressure gas flows in from the upper end of the air inlet 11, it flows steadily downward along the inclined straight hole and finally exits from the air outlet located near the lower end of the optical fiber 2. Compared with the vertical straight hole (the airflow is vertically downward and is easy to deviate from the center of the cutting groove 14) or the curved hole (the airflow is prone to turbulence and pressure loss), the directional airflow of the inclined straight hole can directly impact impurities, improve the removal efficiency, and especially can efficiently remove the fine slag attached to the side wall of the cutting groove 14, avoiding impurities from affecting the subsequent cutting trajectory.

[0034] In some embodiments, there are multiple air inlets 11, and the multiple air inlets 11 are spaced apart along the length direction of the cutting plate 1. Specifically, as shown in the figure Figure 2 As shown, the air inlet 11 may include a plurality of first holes and a plurality of second holes, both of which are formed within the cutting plate 1. The plurality of first holes are located on the left side of the optical fiber 2, and the plurality of second holes are located on the right side of the optical fiber 2. The first holes extend downward from top to bottom and tilt to the right, while the second holes extend downward from top to bottom and tilt to the left. Thus, the purging efficiency is improved by using the plurality of air inlets 11.

[0035] In some embodiments, the diameter of the fiber core of optical fiber 2 is The thickness of cutting plate 1 is The divergence angle of the laser emitted from fiber 2 is The laser beam exits from the lower end face of fiber 2 at point [point number missing]. The intersection of the laser and the bottom of the cutting groove 14 is point . ,point and points The distance between them is The laser beam is positioned directly below the lower end face of fiber 2. The diameter of the light spot on the plane parallel to the lower end face of fiber 2 is... The width of the cutting groove 14 is The power of the laser is The ablation energy threshold for workpiece 13 is The width of the cutting groove 14 and the thickness of the cutting plate Satisfying the formula: .

[0036] Specifically, such as Figure 4 As shown, It is the diameter of the fiber core, through which the laser beam propagates; It is the thickness of cutting plate 1; It is the divergence angle of the fiber laser; It is a point and points The distance between them; It is the distance between the laser beam and the lower end face of fiber 2. The diameter of the light spot on the plane parallel to the lower end face of fiber 2; It is the width of the cutting groove 14, which is subject to , , Laser power Workpiece ablation energy threshold The influence of these variables. When the above variables satisfy a certain quantitative relationship, fiber lasers can achieve the cutting and processing of large-sized workpieces. The following is the specific derivation process of the quantitative relationship.

[0037] Fiber laser divergence angle Size and numerical aperture of the optical fiber The relevant calculation formula is shown in Equation 1, where Let be the refractive index of the laser beam in air.

[0038]

[0039] Due to the conical distribution of the fiber laser beam in space, the distance from the fiber end face... The diameter of the light spot on the workpiece at that location It can be calculated using Equation 2.

[0040]

[0041] Establish a Cartesian coordinate system on the workpiece surface with the center of the light spot as the origin. Then, a point inside the light spot on the workpiece surface... Energy density It can be represented by Equation 3.

[0042]

[0043] Only when At that time, the material was removed, so the point on the boundary of the ablation zone... It should satisfy equation 4.

[0044]

[0045] As can be seen from the above, point Based on geometric relationships, Equation 5 holds true for the circle centered at the origin in the aforementioned Cartesian coordinate system.

[0046]

[0047] Therefore, the width of the cutting groove 14 It can be determined by Equation 6.

[0048]

[0049] By properly adjusting the above parameters, such as the distance between the fiber end face and the workpiece surface... Laser power And so on, and combined with the actual processing experiment results, to make the thickness of the cutting plate 1... Equation 7 is always satisfied.

[0050]

[0051] At this time, the width of the cutting groove 14 will always be greater than the thickness of the cutting plate 1, so that the cutting plate 1 can be inserted into the cutting groove 14 for processing, thereby achieving efficient cutting of large-sized workpieces 13.

[0052] Satisfy the following formula: .

[0053] Specifically, in the actual processing, the thickness of the cutting plate 1 after its fabrication is... Generally, the laser power remains unchanged and can be considered a given value; meanwhile, within a processing cycle, the laser power... Generally, no adjustment is made, and these parameters can be considered as a given value. Based on the above analysis, only a few parameters can be monitored and adjusted. It needs to be deduced by reversing equations 6 and 7. The expression is used to control and adjust the position of cutting plate 1. Since equation 7 must always be satisfied, a proportionality coefficient slightly greater than 1 can be taken. (for example =1.1), making Equation 8 true.

[0054]

[0055] Substituting equation 8 into equation 6, we get

[0056] Transforming Equation 9, we get

[0057] Take both sides of Formula 10 The index,

[0058] Transforming Equation 11, we get

[0059] remember

[0060] Substituting equation 13 into equation 12, we get

[0061] Equation 14 can be viewed as a matter of unknowns. For the equation to have a solution, it must satisfy the following condition:

[0062] At this point, the solution to equation 14 is

[0063] In Equation 16 For Lamb The function (Lambert W Function) is used to make... Smaller Pick ,Right now .

[0064] Substituting equation 17 into equation 13, we get The expression is shown in Equation 18. When other parameters are determined, The value is determined.

[0065] .

[0066] In some embodiments, within a projection plane orthogonal to the width direction of the cutting plate 1, the intersection point of the laser at the bottom of the cutting groove 14 is a point. The center of rotation of workpiece 13 is point . ,straight line Angle between the vertical and horizontal directions Constant, included angle Less than or equal to 30°.

[0067] Specifically, such as Figure 6 As shown, the cutting plate 1 is in Figure 6 The width direction perpendicular to the cutting plate 1 (e.g.) Figure 5 (As shown in the left-right direction), in order to ensure continuous processing of workpiece 13 by the fiber laser, workpiece 13 should have relative movement with respect to the cutting plate 1, so that the cutting groove 14 is in... Figure 6 The cutting groove 14, perpendicular to the width of the cutting plate 1, has sufficient width to accommodate the cutting plate 1. Since the workpiece 13 is generally cylindrical, based on practical processing experience, a feasible method is to allow the workpiece 13 to rotate around its own axis. In this case, the cutting groove 14 will form around the workpiece and grow towards the axis, providing sufficient space for the cutting plate 1 to penetrate into the cutting groove 14. Simultaneously, to ensure that the laser can always process the workpiece 13, the cutting plate 1 needs to move horizontally towards the workpiece's axis. Based on the above method, while ensuring… While satisfying equation 18, it is also necessary to keep the position of the fiber laser beam landing point on the bottom of the cutting groove 14 relative to the bottom of the cutting groove 14 unchanged. Both are ensured by the monitoring component 5 for real-time monitoring of the depth of the cutting groove 14 and the control system.

[0068] In more detail, consider as follows Figure 6 The diagram illustrates a principle for controlling the spacing and landing point position. The cutting plate 1 is fixed to a vertically movable platform 8. The workpiece 13 is fixed to a clamping assembly 4 and can rotate around its own axis. The clamping assembly 4 is fixed to a horizontally movable platform 7. The monitoring assembly 5 is fixed to the horizontally movable platform 7 after being aligned with the cutting groove 14 and at the same height as the axis of the workpiece 13. The horizontally movable platform 7 can move left, right, forward, and backward. Let the center of the cross-section of the workpiece 13 in the cutting plane be... Therefore, the aforementioned requirement for the landing point of the fiber laser beam can be described in detail as follows: throughout the entire processing process, the landing point of the fiber laser beam at the bottom of the cutting groove 14 and the center of the circle... The angle between the line connecting the two points and the vertical direction The displacements of the vertical motion platform 8 and the horizontal motion platform 7 are given below in relation to the radial displacement of the bottom of the cutting groove 14 measured by the monitoring component 5. Let the radial displacement of the bottom surface of the workpiece cutting groove 14 measured by the monitoring component 5 between two certain moments be... The point where the laser beam landed at the bottom of the cutting groove 14 at the previous moment was The point where the laser beam lands at the bottom of the cutting groove 14 at the next moment is From the included angle If it remains constant, then we can know , , Since the three points are collinear, Equation 19 holds true.

[0069]

[0070] Passing point Draw a vertical line passing through the point. Draw a horizontal line, and the two lines intersect at point [point missing]. , It is a right angle. To maintain... Assuming the descent height of cutting plate 1, which is also the descent height of the vertical motion platform, remains unchanged. Then equation 20 holds true.

[0071]

[0072] To keep the landing point unchanged, let the leftward displacement of the workpiece, i.e., the leftward displacement of the horizontal motion platform, be . Then Equation 21 holds true.

[0073]

[0074] It should be noted that equations 1-18 are derived when the bottom of the cutting groove 14 is flat and perpendicular to the axis of the fiber laser beam. When using a cylindrical workpiece 13, although the bottom surface of the cutting groove 14 has a curvature and the beam has an angle with the tangent of that surface, (Equal to the angle between the line connecting the centers of the aforementioned landing points and the vertical direction), but since the cross-sectional area of ​​the beam at this point is much smaller than the diameter of workpiece 13, the angle... Take the smaller value ( In the case of ), Equations 1-18 can be used.

[0075] In some embodiments, the fiber laser processing apparatus 100 further includes a mounting base 6, a cutting plate 1 disposed below the mounting base 6, and the upper end of the optical fiber 2 disposed within the mounting base 6. The mounting base 6 has an air inlet chamber 61 communicating with an air inlet 11, so that high-pressure gas flows into the air inlet 11 through the air inlet 11. Specifically, as... Figures 1-3 As shown, the mounting base 6 is disposed on the upper end of the cutting plate 1, and the upper end of the mounting plate is disposed in the lower end of the mounting base 6. The mounting base 6 has an air inlet chamber 61 extending in the vertical direction. The air inlet chamber 61 includes a first section 611 and a second section 612 that are connected to each other. The first section 611 is a vertical cavity extending in the vertical direction, and the second section 612 is a rectangular cavity. The lower end of the first section 611 is connected to the upper end of the second section 612. The mounting base 6 is provided with a mounting hole that penetrates the mounting base 6 in the vertical direction. The upper end of the cutting plate 1 is inserted into the lower end of the mounting base 6. The mounting hole is connected to the channel. The optical fiber 2 passes through the mounting hole and is inserted into the through hole. The lower end of the air inlet chamber 61 is connected to the air inlet hole 11, so that high-pressure gas flows into the air inlet hole 11 through the air inlet chamber 61 and flows out through the air inlet hole 11.

[0076] In some embodiments, the lower end face of the optical fiber 2 is flat and flush with the lower end face of the cutting plate 1. Specifically, the lower end face of the optical fiber 2 is cut by an optical fiber 2 cutting machine to ensure the flatness of the lower end face of the optical fiber 2. The flat end face of the optical fiber 2 can ensure that the energy distribution of the emitted laser beam is uniform. In addition, the lower end face of the optical fiber 2 is flush with the lower end face of the cutting plate 1. If the lower end face of the optical fiber 2 is lower than the lower end face of the cutting plate 1, that is, the optical fiber 2 is partially embedded inside the cutting plate 1, the emitted laser will come into contact with the material of the cutting plate 1 in advance, causing the laser energy to be absorbed or scattered by the cutting plate 1, resulting in energy loss, affecting the actual working efficiency, and may also cause the optical fiber 2 to burn out. If the lower end face of the optical fiber 2 is higher than the lower end face of the cutting plate 1, that is, the optical fiber 2 is exposed outside the cutting plate 1, lacking the wrapping and protection of the cutting plate 1, the optical fiber 2 is susceptible to the effects of external dust, collisions, wear, etc., which will not only reduce the flatness of the end face, but may also cause the optical fiber 2 to break, affecting the stability and service life of the equipment.

[0077] The fiber laser processing system 10 of this invention includes a mounting frame 3, a fiber laser processing device 100, and a clamping assembly 4.

[0078] The fiber laser processing apparatus 100 is any one of the fiber laser processing apparatuses 100 described in the above embodiments. The laser processing apparatus is mounted on the mounting frame 3 and is movable relative to the mounting frame 3 in the vertical direction. Specifically, as shown... Figure 5 As shown, the mounting frame 3 is a machine tool, and the fiber laser processing device 100 is mounted on the mounting frame 3 via the vertical motion platform 8, so that the fiber laser processing device 100 can move up and down on the mounting frame 3 via the vertical motion platform 8.

[0079] The clamping assembly 4 is mounted on the mounting frame 3 and located below the laser processing device. The clamping assembly 4 is used to clamp the workpiece 13. The clamping assembly 4 is rotatable relative to the mounting frame 3 about its length and is also movable relative to the mounting frame 3 in the horizontal direction. Specifically, as... Figure 5 As shown, the clamping assembly 4 is mounted on the mounting frame 3 via the horizontal motion platform 7. The clamping assembly 4 moves horizontally (i.e., in the front-back and left-right directions) on the mounting frame 3 via the horizontal motion platform 7. The clamping assembly 4 can clamp the workpiece 13 and drive the workpiece to rotate around the front-back direction. The clamping assembly 4 is located below the fiber laser processing device 100, and the clamping assembly 4 can drive the workpiece 13 to move horizontally, thereby enabling the fiber laser processing device 100 to process the workpiece 13.

[0080] The fiber laser processing system 10 of this invention has the advantages of simple structure and high cutting efficiency.

[0081] In some embodiments, the fiber laser processing system 10 further includes a monitoring component 5 for monitoring the depth of the cutting groove 14 of the workpiece 13, so that when the relative position between the lower end face of the fiber 2 and the bottom surface of the cutting groove 14 of the workpiece 13 directly below it exceeds a preset requirement, at least one of the fiber laser processing device 100 and the clamping component 4 moves on the mounting frame 3.

[0082] Specifically, such as Figure 5 As shown, the monitoring component 5 is mounted on the mounting bracket 3 and can be located on one side of the clamping component 4. The monitoring component 5 can be an infrared sensor or an ultrasonic sensor. Before processing, the monitoring component 5 needs to be pre-aligned with the processing position. During processing, it can monitor the bottom of the cutting groove 14 in real time. When it detects an increase in the depth of the cutting groove 14, the monitoring component 5 collects the radial displacement distance of the workpiece 13 axis (i.e.: Figure 6 midpoint and points The straight-line distance between them), and transmit the monitoring data to the control system. Based on the above formulas (1)-(21), the control system dynamically adjusts the end face height of the optical fiber 2 and the horizontal position of the cutting groove 14 in real time, so as to ensure that the relative position between the end face of the optical fiber 2 and the bottom of the cutting groove 14 remains constant.

[0083] In some embodiments, the fiber laser processing system 10 further includes a fiber laser 101, which generates laser light and is connected to the upper end of the fiber optic cable 2 of the fiber laser processing apparatus 100 so that the laser light generated by the fiber laser 101 enters the fiber optic cable 2. Specifically, the fiber laser 101 serves as a light source and its output end is connected to the upper end of the fiber optic cable 2, and the laser light generated by the laser is transmitted through the fiber optic cable 2.

[0084] The following is based on the appendix Figures 1-6 Specifically, the overall structure of the fiber laser processing device 100 according to this embodiment of the invention includes an optical fiber 2, a mounting base 6, a sealing plug 9, a rubber ring, a cutting plate 1, and fixing screws (not shown). The cutting plate 1 is made of stacked and bonded high-melting-point metal sheets of equal thickness. One side of the sheet has grooves created by methods such as wire cutting or etching. Its design aims to protect the optical fiber 2 and provide a well-sealed channel for the flow of high-pressure gas. The quick-connect fitting of the high-pressure gas pipe is not shown in the figure; the white arrow indicates a feasible high-pressure gas flow trajectory. The high-pressure gas source is an inert gas (such as argon), which can be directly discharged into the air.

[0085] The assembly process of the fiber laser processing apparatus 100 according to an embodiment of the present invention is as follows: 1. Fabrication of Cutting Plate 1 The length of the cutting plate 1 is determined according to the size of the workpiece 13 to be processed. To minimize air leakage, the cutting plate 1 is made of two high-melting-point metal sheets stacked and bonded together. At the same position on a large surface of each sheet, the air passage groove and the fiber optic 2 channel groove are processed by methods such as wire EDM and etching. The radius of the air passage groove depends on the protective gas flow rate requirement, and the radius of the fiber optic 2 channel depends on the fiber core diameter. Then, the two sides with the grooves are aligned and bonded together to form a complete air passage and fiber optic 2 channel (central groove). When bonding, it is necessary to ensure that the internal air passage is unobstructed and there is no air leakage.

[0086] 2. Connection between cutting plate 1 and mounting base 6 Place the completed cutting plate 1 into the special square groove on the mounting base body 63. After ensuring that the air passage is unobstructed, place a rubber ring on the mounting base body 63, press the cutting plate 1 with the mounting base pressure plate 64, and tighten it with fixing screws to ensure good sealing at the connection.

[0087] 3. Processing and installation of fiber optic cable 2 Use a fiber optic cleaver to cut the end face of fiber optic 2 to a flat state, and determine the distance between the end face of fiber optic 2 and the end face of fiber optic 2's outer shell based on the length of the cleaver plate 1. Then, insert the sealing plug 9 into the outer shell of fiber optic 2, adjust it to a suitable position, and insert fiber optic 2 through the mounting base 6 into the fiber optic 2 channel (central groove) of the cleaver plate 1. Adjust the end face of fiber optic 2 to align with the bottom of the cleaver plate 1, and use sealant to adhere and fix the sealing plug 9 to the mounting base 6, ensuring the overall structure is airtight.

[0088] 4. Installation and testing of the fiber laser processing device 100 After assembling the fiber laser processing device 100, connect the high-pressure gas path to the fiber laser processing device 100 and fix the entire fiber laser processing device 100 to the machine tool. Open the gas path valve to ensure that the nozzle at the bottom of the cutting plate 1 can stably release high-pressure gas. Finally, start the fiber laser 101 to output energy and cut the large-sized workpiece 13.

[0089] The fiber laser processing device 100 effectively removes molten material and particulate matter generated during processing with the assistance of high-pressure gas, while protecting the optical fiber 2 from damage caused by the processing environment. Its overall design is simple and compact, easy to install and maintain, and can significantly improve the processing efficiency and stability of large-sized workpieces 13.

[0090] First, fix the fiber laser processing device 100 onto the vertical motion platform 8 of the machine tool. Simultaneously, clamp the large workpiece 13 onto the clamping assembly 4 fixed on the horizontal motion platform 7. Install the monitoring assembly 5 onto the horizontal motion platform 7, aligning it with the processing position, ensuring the measurement center is flush with the center of the workpiece 13. The rotation axis of the clamping assembly 4 should be perpendicular to the fiber laser processing device 100.

[0091] The following steps are performed sequentially during the processing: 1. Fiber laser processing device 100 positioning The indicator light of the fiber laser 101 is activated, and the position of the fiber laser processing device 100 is adjusted by the indicator light so that it is precisely positioned above the designated position of the workpiece 13 to be processed, so as to meet the relative position requirements between the cutting plate 1 and the workpiece 13 calculated by the aforementioned formula.

[0092] 2. Start the equipment Start the clamping assembly 4 and the high-pressure gas path in sequence. After the gas path system of the fiber laser processing device 100 reaches a stable state, start the fiber laser 101 to output energy.

[0093] 3. Processing Operation After the laser outputs energy, the fiber laser processing device 100 cuts the large workpiece 13 by layer-by-layer ablation, creating an annular groove (the annular groove is the cutting groove 14). As the processing progresses, the depth of the annular groove gradually increases until the workpiece 13 is completely cut off.

[0094] During this process, the position of the fiber laser processing device 100 needs to be adaptively adjusted by the control system based on the data collected by the sensors, and the processing depth needs to be monitored in real time to ensure... To maintain a constant angle, ensure that the line connecting the point where the laser beam from fiber 2 lands at the bottom of the cutting groove 14 and the center of the workpiece 13 cross-section makes constant angle with the vertical direction (e.g., ...). Figure 6 (As shown). The stability of the spacing and angle is an important factor in ensuring the consistency and accuracy of the processing results.

[0095] In summary, the fiber laser processing device 100 is compact, simple in structure, easy to manufacture, easy to operate, and has low manufacturing and maintenance costs. It can precisely process large workpieces 13, and the processing waste gas (argon) can be directly discharged, which is environmentally friendly. It can effectively solve the problems mentioned above. In the future, the fiber laser processing device 100 can be densely integrated to further improve processing efficiency.

[0096] The actual operation of this invention in the processing of large-size workpiece 13 can be divided into four main steps. Each step is an important link in realizing the function of this invention.

[0097] The first step is to determine the processing method. Based on the characteristics of the large workpiece 13 to be processed (such as material type, geometry and cutting requirements), determine the appropriate processing method, and plan the construction method and specific parameters of the fiber laser processing device 100 accordingly.

[0098] The second step is to manufacture a fiber laser processing device (100). Based on the specific size requirements of the large workpiece 13, the length of the cutting plate 1 and the gas path structure in the fiber laser processing device 100 are adjusted to manufacture the fiber laser processing device 100, and the fiber 2 is precisely inserted into the fiber laser processing device 100 to ensure that the function of the fiber laser processing device 100 meets the processing requirements.

[0099] The third step involves installing the fiber laser processing device 100 and fixing it to the workpiece 13. The fiber laser processing device 100 is installed on the vertical motion platform 8 of the machine tool, and the large workpiece 13 is clamped on the horizontal motion platform 7 to ensure that the relative positional relationship between the workpiece 13 and the fiber laser processing device 100 meets the processing design requirements.

[0100] The fourth step is equipment debugging and processing operation. The indicator light of the fiber laser 101 is activated to pre-adjust the position of the fiber laser processing device 100, ensuring it is precisely aligned with the processing position of the workpiece 13. Subsequently, all equipment except the high-pressure gas path is activated sequentially. After preparation, the high-pressure gas path is opened to ensure stable gas flow. Finally, the fiber laser 101 is activated to output energy and cut the workpiece 13. During processing, the position of the fiber laser processing device 100 is adjusted in real time by the control system, and the processing depth is monitored in real time by sensors. This ensures that the distance between the end face of the fiber 2 and the processing area of ​​the workpiece 13 remains constant, and that the angle between the line connecting the point where the fiber 2 laser beam lands at the bottom of the cutting groove 14 and the center of the workpiece 13's cross-section is perpendicular to the vertical direction. Maintain this constant pressure until the cutting operation is complete.

[0101] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0102] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0103] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0104] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "beneath" of the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0105] In this invention, the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0106] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A fiber laser processing device, characterized in that, include: A cutting plate having an air inlet hole extending through the cutting plate in a vertical direction, so that high-pressure gas can be introduced into the air inlet hole; An optical fiber is disposed within the cutting plate. The optical fiber is adapted to carry a laser. After the laser is emitted through the optical fiber, it irradiates the workpiece to form a cutting groove. The thickness of the cutting plate is less than the width of the cutting groove so that the cutting plate passes through the cutting groove to continuously cut the workpiece. The outlet of the air inlet is disposed adjacent to the optical fiber so that the high-pressure gas blows through the air inlet to the cutting groove. The lower end face of the optical fiber is flat and flush with the lower end face of the cutting plate. Wherein, the diameter of the fiber core is The thickness of the cutting plate is The divergence angle of the laser emitted from the optical fiber is . The laser beam exits from the lower end face of the optical fiber at point [point number]. The intersection point of the laser beam and the bottom of the cutting groove is a point. , the point and the points mentioned The distance between them is The laser is positioned directly below the lower end face of the optical fiber. The diameter of the light spot on the plane parallel to the lower end face of the optical fiber is The width of the cutting groove is The power of the laser is The workpiece ablation energy threshold is The ratio between the width of the cutting groove and the thickness of the cutting plate is: The width of the cutting groove and the thickness of the cutting plate Satisfying the formula: ， The Satisfy the following formula: 。 2. The fiber laser processing apparatus according to claim 1, characterized in that, The cutting plate includes a first plate and a second plate, and the air inlet is formed on at least one of the first plate and the second plate by electrical discharge wire cutting or etching. The high-pressure gas is an inert gas.

3. The fiber laser processing apparatus according to claim 1, characterized in that, The air inlet extends from top to bottom and is tilted toward the direction adjacent to the optical fiber.

4. The fiber laser processing apparatus according to claim 1, characterized in that, There are multiple air inlets, which are spaced apart along the length of the cutting plate.

5. The fiber laser processing apparatus according to claim 1, characterized in that, It also includes a mounting base, the cutting plate is disposed below the mounting base, the upper end of the optical fiber is disposed inside the mounting base, and the mounting base is provided with an air inlet chamber communicating with the air inlet, so that the high-pressure gas flows into the air inlet through the air inlet.

6. The fiber laser processing apparatus according to claim 1, characterized in that, In a projection plane parallel to the width direction of the cutting plate, the intersection point of the laser at the bottom of the cutting groove is a point. The center of rotation of the workpiece is point . ,straight line Angle between the vertical and horizontal directions Constant, the included angle Less than or equal to 30°.

7. A fiber laser processing system, characterized in that, include: Mounting rack; A fiber laser processing apparatus, wherein the fiber laser processing apparatus is the fiber laser processing apparatus according to any one of claims 1-6, and the laser processing apparatus is disposed on the mounting frame and is movable relative to the mounting frame in the vertical direction; A clamping assembly is disposed on the mounting frame and located below the laser processing device. The clamping assembly is used to clamp a workpiece. The clamping assembly is rotatable relative to the mounting frame about the length of the mounting frame and is movable relative to the mounting frame in the horizontal direction.

8. The fiber laser processing system according to claim 7, characterized in that, It also includes a monitoring component for monitoring the depth of the cutting groove of the workpiece, so that when the relative position between the lower end face of the optical fiber and the bottom surface of the cutting groove of the workpiece directly below it exceeds a preset requirement, at least one of the fiber laser processing device and the clamping component moves on the mounting frame.

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