A high-temperature soldering furnace and a die bonding production process using the same

Abstract

The application relates to the field of die bonding production, and discloses a high-temperature welding furnace and a die bonding production process applied thereto. The high-temperature welding furnace comprises a furnace body, an insulating plate, a transfer mechanism and a temperature control system. A material channel is arranged in the furnace body, one side of the material channel is an inlet, and the other side is an outlet. The material channel is sequentially divided into a preheating cavity, a constant-temperature cavity, a reflow cavity and a cooling cavity. The temperature control system comprises a temperature adjusting device and a temperature monitoring device. Independent temperature adjusting devices are arranged in the preheating cavity, the constant-temperature cavity, the reflow cavity and the cooling cavity. The temperature monitoring device is fixedly arranged on a transfer table. The temperature monitoring device and each temperature adjusting device are electrically connected in feedback mode. The temperature monitoring device and the transfer track are electrically connected in feedback mode. The temperature control precision is improved, the substrate processing time is accurately ensured, the temperature uniformity is improved, the process adaptability is enhanced, and the production efficiency is improved.

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