Ultraviolet irradiation device

Abstract

This invention provides an ultraviolet irradiation device that can suppress particles from entering the interior of a chamber through the opening when the opening of the chamber is exposed. The ultraviolet irradiation device of an embodiment includes: a chamber having a space for receiving a processed object inside, and an opening at one end; a light source capable of irradiating the interior of the chamber with ultraviolet light through a window provided in the chamber; a conveying section, cylindrical in shape, with one end facing the opening of the chamber; and a baffle, movable between the end of the chamber and the end of the conveying section via a gap, plate-shaped, and having a hole extending through its thickness. When the hole of the baffle faces the opening of the chamber, the peripheral portion of the hole of the baffle is located between the end of the chamber and the end of the conveying section.

Description

Technical Field

[0001] Embodiments of the present invention relate to an ultraviolet irradiation device. Background Technology

[0002] There are ultraviolet irradiation devices that treat materials by irradiating them with ultraviolet light. For example, an ultraviolet irradiation device has been proposed that irradiates ultraviolet-curing resins, ultraviolet-curing adhesives, adhesive sheets containing ultraviolet-curing resins with ultraviolet light, thereby curing the ultraviolet-curing resins or ultraviolet-curing adhesives, or adjusting the adhesive strength of the adhesive sheets.

[0003] Here, when UV-curable resin is irradiated with ultraviolet light, the photoinitiator contained in the resin becomes excited, thereby generating free radicals. The generated free radicals combine with oxygen at a faster rate than they combine with the monomers that form the main component of the UV-curable resin. Therefore, when UV-curable resin is irradiated with ultraviolet light in an oxygen-containing gas such as air, the reaction on the surface of the resin is hindered by oxygen. This phenomenon is called oxygen-inhibited polymerization.

[0004] Therefore, the ultraviolet irradiation device is equipped with a chamber for storing the processed items. When the processed items are irradiated with ultraviolet light, the air inside the chamber is removed by purge gas.

[0005] In addition, the chamber is provided with an opening for the loading and unloading of processed materials. Furthermore, the ultraviolet irradiation device is also provided with a baffle for opening and closing the opening.

[0006] When the contents of the chamber are irradiated with ultraviolet light, a baffle moves to close the chamber opening and purge gas is supplied to the chamber. If the chamber opening is closed by the baffle, air or particles in the atmosphere can be prevented from entering the chamber through the opening.

[0007] However, when moving pre-processed materials into or out of the chamber, the baffle needs to be moved to expose the chamber opening. As a result, air or particles in the atmosphere can sometimes enter the chamber through the exposed opening.

[0008] In this case, as described above, the air that has entered the chamber can be removed by supplying purge gas into the chamber. However, particles that have entered the chamber cannot be removed even by supplying purge gas. If the particles that have entered the chamber adhere to the processed material, there is a concern that the quality of the processed material may be reduced.

[0009] Therefore, it is desirable to develop an ultraviolet irradiation device that can suppress particles from entering the cavity through the opening when the opening of the cavity is exposed.

[0010] [Existing Technical Documents]

[0011] [Patent Literature]

[0012] [Patent Document 1] Japanese Patent No. 5324130 Summary of the Invention

[0013] [The problem the invention aims to solve]

[0014] The problem to be solved by the present invention is to provide an ultraviolet irradiation device that can suppress particles from entering the interior of the chamber through the opening when the opening of the chamber is exposed.

[0015] [Technical means to solve the problem]

[0016] The ultraviolet irradiation device of the embodiment includes: a chamber having a space for receiving a processed object inside, and an opening at one end; a light source capable of irradiating ultraviolet light into the interior of the chamber through a window provided in the chamber; a conveying section, cylindrical in shape, with one end facing the opening of the chamber; and a baffle, plate-shaped and having a hole extending through its thickness, configured to move between the end of the chamber and the end of the conveying section via a gap. When the hole of the baffle faces the opening of the chamber, the peripheral portion of the hole of the baffle is located between the end of the chamber and the end of the conveying section.

[0017] [The effects of the invention]

[0018] According to the embodiments of the present invention, an ultraviolet irradiation device can be provided that can suppress particles from entering the interior of the chamber through the opening of the chamber when the opening of the chamber is exposed. Attached Figure Description

[0019] Figure 1 It is a schematic plan view used to illustrate the processed object.

[0020] Figure 2 This is a schematic cross-sectional view illustrating the ultraviolet irradiation device of this embodiment.

[0021] Figure 3 This is a schematic cross-sectional view used to illustrate the opening and closing parts of the comparative example.

[0022] Figure 4 This is a schematic diagram of the baffle when viewed from the direction of the self-conveying section toward the opening of the chamber.

[0023] Figure 5 It is a schematic cross-sectional view used to illustrate the function of the opening and closing parts.

[0024] Figure 6It is a schematic cross-sectional view used to illustrate the function of the opening and closing parts.

[0025] Explanation of icon numbers

[0026] 1: Ultraviolet irradiation device

[0027] 2. 301: Frame

[0028] 2a, 2b, 2c: Social strata

[0029] 2c1: Hole

[0030] 2D: Feet

[0031] 3: Processing Department

[0032] 4: Reflector

[0033] 5: Light source section

[0034] 6: Shading part

[0035] 7: Exhaust section

[0036] 8: Controller

[0037] 31: Chamber

[0038] 31a, 31b: Opening

[0039] 32: Window

[0040] 33: Loading section

[0041] 34: Gas Supply Department

[0042] 34a: Gas source

[0043] 34b: On / off valve

[0044] 34c: Control valve

[0045] 35: Conveying Department

[0046] 36, 136: Opening and closing parts

[0047] 36a, 136a: baffles

[0048] 36a1: Hole

[0049] 36b, 136b: Mobility Unit

[0050] 51: Discharge lamp

[0051] 52: Reflector

[0052] 61: Shade

[0053] 62: Arm

[0054] 63: Rotation axis

[0055] 64: Drive Unit

[0056] 71: Pipeline

[0057] 72: Exhaust pump

[0058] 100: Items to be processed

[0059] 101: Framework

[0060] 102: Semiconductor wafers

[0061] 103: Adhesive sheet

[0062] 200: Ultraviolet light

[0063] 201: Infrared rays (thermal rays)

[0064] 202: Particle

[0065] 300: Conveying device

[0066] S1, S2: Gap Detailed Implementation

[0067] Hereinafter, embodiments will be illustrated with reference to the accompanying drawings. Furthermore, in each drawing, the same symbols are used to denote the same components, and detailed descriptions are omitted where appropriate.

[0068] The ultraviolet irradiation device of this embodiment can, for example, irradiate ultraviolet light to harden ultraviolet-curing resin or ultraviolet-curing adhesive, or adjust the adhesive force of adhesive sheets containing ultraviolet-curing resin.

[0069] Here, as an example, we will describe an ultraviolet irradiation device that reduces the adhesive strength of an adhesive sheet placed on a semiconductor wafer by irradiating it with ultraviolet light.

[0070] First, let's take an example of a treated object 100 that has been irradiated with ultraviolet light.

[0071] Figure 1 This is a schematic plan view used to illustrate the processed object 100.

[0072] like Figure 1 As shown, the processed object 100 includes: a frame 101, a semiconductor wafer 102, and an adhesive sheet 103.

[0073] The frame 101 is, for example, plate-shaped and formed of a material that can transmit ultraviolet light 200. The frame 101 is, for example, formed of quartz glass.

[0074] Semiconductor wafer 102 may be disposed in the central region of frame 101. Semiconductor wafer 102 has multiple chip-shaped semiconductor elements monolithically obtained by dicing.

[0075] An adhesive sheet 103 is disposed between the frame 101 and the semiconductor wafer 102. The adhesive sheet 103 is bonded to the side of the semiconductor wafer 102 on the frame 101 side. The adhesive sheet 103 contains a UV-curable resin.

[0076] Figure 2 This is a schematic cross-sectional view illustrating the ultraviolet irradiation device 1 of this embodiment.

[0077] like Figure 2 As shown, the ultraviolet irradiation device 1 includes, for example, a frame 2, a processing unit 3, a reflector 4, a light source 5, a light-shielding unit 6, an exhaust unit 7, and a controller 8.

[0078] The frame 2 is, for example, box-shaped, and has internal space for housing the processing unit 3, the reflector 4, the light source 5, the light shield 6, the exhaust unit 7, and the controller 8. The interior of the frame 2 can be divided into, for example, three levels. Figure 2 As shown, an exhaust unit 7 and a controller 8 can be installed on the lowest layer 2a of the frame 2. A light source unit 5 and a light-shielding unit 6 can be installed on the layer 2b above layer 2a. A processing unit 3 and a reflective unit 4 can be installed on the highest layer 2c of the frame 2.

[0079] The frame 2 may be rectangular in shape, for example. The frame 2 may have a skeleton structure using steel profiles or square tubing. A cover may be provided on the outer surface of the frame 2, for example. The frame 2 may be made of metal, for example. Adjustable feet or other feet 2d may be provided on the bottom surface of the frame 2.

[0080] The processing unit 3 includes, for example, a chamber 31, a window 32, a mounting unit 33, a gas supply unit 34, a conveying unit 35, and an opening and closing unit 36.

[0081] The chamber 31 is, for example, located at the end of the reflector 4 opposite to the light source 5. The chamber 31 is, for example, box-shaped. The chamber 31 has an interior space for housing the processed item 100. An opening 31a may be provided at the end of the chamber 31 for the loading of the processed item 100 into the chamber 31 before processing and for the unprocessed processed item 100 out of the chamber 31. The opening 31a may be located opposite the conveyor 35. Additionally, an opening 31b is provided at the end of the chamber 31 on the reflector 4 side for the entry of ultraviolet light 200 irradiated from the light source 5. The chamber 31 is, for example, made of metal.

[0082] If a chamber 31 is provided, ultraviolet light 200 irradiating toward the processed object 100 can be suppressed from irradiating into the interior of the frame 2, or the atmosphere of the purge gas described later can be maintained, or particles present inside the frame 2 can be suppressed from adhering to the processed object 100 during processing.

[0083] The window 32 is plate-shaped and blocks the opening 31b of the chamber 31. The window 32 can be located anywhere on the outside of the chamber 31, inside the opening 31b, or inside the chamber 31. The window 32 is formed of a material that allows ultraviolet light 200 irradiated from the light source 5 to pass through. For example, the window 32 can be formed of quartz glass.

[0084] A mounting portion 33 is disposed inside the chamber 31. The mounting portion 33 is disposed around the opening 31b of the chamber 31. A processing item 100 is mounted on the mounting portion 33. The periphery of the processing item 100 (frame 101) is supported by the mounting portion 33. When the processing item 100 supported by the mounting portion 33 is viewed from the direction of the processing item 100 toward the mounting portion 33, the mounting portion 33 is positioned at least not overlapping with the semiconductor wafer 102. Therefore, ultraviolet light 200 passing through the window 32 can irradiate the adhesive sheet 103 bonded to the side of the frame 101 of the semiconductor wafer 102 through the frame 101.

[0085] Here, since the adhesive sheet 103 contains a UV-curable resin, when the adhesive sheet 103 is irradiated with UV light in an oxygen-containing gas such as air, oxygen inhibition may sometimes occur. If oxygen inhibition occurs, there are concerns that the processing time may increase or the adhesive force of the adhesive sheet 103 may become uneven. Therefore, a gas supply unit 34 is provided in the processing unit 3.

[0086] The gas supply unit 34 supplies purge gas to the interior of the chamber 31. The purge gas can be a gas that does not contain oxygen. For example, the purge gas can be an inert gas such as nitrogen or a rare gas.

[0087] The gas supply unit 34 includes, for example, a gas source 34a, an on / off valve 34b, and a control valve 34c.

[0088] The gas source 34a can be configured to house high-pressure gas cylinders containing purging gas or factory piping, etc.

[0089] The on / off valve 34b switches between starting and stopping the supply of purge gas. For example, during the processing of the workpiece 100, the on / off valve 34b supplies purge gas into the chamber 31. For example, when the processing of the workpiece 100 is completed, the on / off valve 34b stops supplying purge gas into the chamber 31.

[0090] Control valve 34c controls at least one of the flow rate and pressure of the purge gas supplied to the interior of chamber 31. Furthermore, control valve 34c may also function as an on / off valve 34b. If control valve 34c functions as an on / off valve 34b, then on / off valve 34b may be omitted.

[0091] Here, as Figure 2As shown, the transfer of the pre-processed material 100 into the chamber 31 and the transfer of the processed material 100 out of the chamber 31 can be performed using a conveying device 300. The conveying device 300 can be, for example, a multi-joint robot. Figure 2 The conveyor 300 illustrated is a horizontal multi-joint robot.

[0092] In this situation, when the processed item 100 held by the conveying device 300 is conveyed inside the frame 2, particles present inside the frame 2 may sometimes adhere to the processed item 100. If particles adhere to the processed item 100, there is a concern that the quality of the processed item 100 may be reduced.

[0093] Therefore, a conveying section 35 is provided inside the frame 2. The conveying section 35 extends between the opening 31a of the chamber 31 and the frame 301 on which the conveying device 300 is provided. The conveying section 35 is cylindrical, with one end facing the opening 31a of the chamber 31. The conveying section 35 is formed, for example, of metal.

[0094] like Figure 2 As shown, the internal space of the conveying unit 35 is connected to the internal space of the frame 301 on which the conveying device 300 is installed. The internal space of the frame 301 is formed as a space where cleanliness (number of particles) is managed.

[0095] If a conveying unit 35 is provided, particles present inside the frame 2 can be prevented from adhering to the processed material 100 conveyed between the frame 301 and the chamber 31, where the cleanliness is managed.

[0096] Here, as described above, purge gas is supplied to the interior of chamber 31. If the purge gas supplied to the interior of chamber 31 flows into the delivery section 35 or the frame 301 through the opening 31a of chamber 31, there is a concern that particles may enter the delivery section 35 or the frame 301.

[0097] Therefore, an opening and closing part 36 is provided between the end of the conveying part 35 on the chamber 31 side and the end of the chamber 31 that is provided with the opening 31a.

[0098] Furthermore, details regarding the opening and closing section 36 will be described later.

[0099] Here, as described later, the light source unit 5 includes a discharge lamp 51. The discharge lamp 51 irradiates ultraviolet light 200 radially across all directions, but the intensity of ultraviolet light 200 at the irradiated location decreases with increasing distance from the irradiated location. Therefore, as... Figure 2As shown, the intensity of ultraviolet 200 directly incident on the adhesive sheet 103 bonded to the central region of the semiconductor wafer 102 is higher than the intensity of ultraviolet 200 directly incident on the adhesive sheet 103 bonded to the peripheral region of the semiconductor wafer 102. Furthermore, the discharge lamp 51 has a shape extending in one direction. Therefore, a linear region with the highest intensity of directly incident ultraviolet 200 is generated in the central region of the adhesive sheet 103 bonded to the semiconductor wafer 102.

[0100] That is, if only ultraviolet light 200 is directly incident on the adhesive sheet 103 bonded to the semiconductor wafer 102, the intensity deviation of the ultraviolet light 200 incident on the adhesive sheet 103 becomes larger. When the intensity deviation of the incident ultraviolet light 200 becomes larger, there is a concern that the adhesive force of the adhesive sheet 103 will become larger or that the adhesive force will become uneven. Therefore, there is a concern that the monolithic chip-shaped semiconductor device may easily detach from the adhesive sheet 103 or be difficult to separate from the adhesive sheet 103.

[0101] Furthermore, when the discharge lamp 51 of the light source section 5 is lit, heat is generated along with the ultraviolet light 200. The generated heat is emitted from the discharge lamp 51 as infrared rays (heat rays) 201. In the case of infrared rays 201, they also radiate across the entire omnidirectional area of ​​the discharge lamp 51. In addition, the shorter the distance from the irradiation position, the higher the intensity of the infrared rays 201 at the irradiation position. Therefore, there is a concern that the temperature of the adhesive sheet 103 bonded to the semiconductor wafer 102 may locally increase. If the temperature of the adhesive sheet 103 locally increases, there is a concern that the adhesive sheet 103 may locally deform due to heat. If the adhesive sheet 103 locally deforms due to heat, it may be difficult to separate the semiconductor element bonded to the deformed portion.

[0102] Therefore, a reflector 4 is provided in the ultraviolet irradiation device 1. The reflector 4 is cylindrical and is disposed between the chamber 31 (processed object 100) and the light source 5 (discharge lamp 51). The reflector 4 has openings at both ends. One of the openings of the reflector 4 faces the window 32 of the processing unit 3. The other opening of the reflector 4 faces the discharge lamp 51 of the light source 5 through a hole 2c1 in the bottom plate of the layer 2c of the frame 2.

[0103] like Figure 2 As shown, a portion of the ultraviolet light 200 irradiated from the discharge lamp 51 and directed toward the workpiece 100 is incident through the hole 2c1 onto the inner wall of the reflector 4, reflected by the inner wall of the reflector 4, and then incident onto the workpiece 100. The reflected ultraviolet light 200 can then incident onto substantially the entire area of ​​the adhesive sheet 103 bonded to the semiconductor wafer 102. As a result, deviations in the intensity of the ultraviolet light 200 on the adhesive sheet 103 can be mitigated.

[0104] The inner wall of the reflective part 4 can be formed of a material with high reflectivity to ultraviolet light 200. For example, the reflective part 4 can be formed of aluminum alloy, or a film or layer containing aluminum alloy can be provided on the inner wall of the reflective part 4, or a white film or layer can be provided on the inner wall of the reflective part 4.

[0105] Additionally, irregularities can be provided on the inner wall of the reflective portion 4. For example, the inner wall of the reflective portion 4 can be embossed. If irregularities are provided on the inner wall of the reflective portion 4, the ultraviolet rays 200 incident on the inner wall of the reflective portion 4 can be diffusely reflected. Therefore, it is easy to make the reflected ultraviolet rays 200 incident approximately evenly on the entire area of ​​the adhesive sheet 103 bonded to the semiconductor wafer 102. If the reflected ultraviolet rays 200 incident approximately evenly on the adhesive sheet 103, the intensity deviation of the ultraviolet rays 200 on the adhesive sheet 103 can be further mitigated.

[0106] Furthermore, if a reflective portion 4 is provided, a portion of the infrared rays 201 irradiated from the discharge lamp 51 can be reflected by the reflective portion 4 and incident on the entire area of ​​the adhesive sheet 103. Therefore, the situation where the temperature of the adhesive sheet 103 locally increases or the adhesive sheet 103 locally deforms can be suppressed.

[0107] Furthermore, the temperature rise of the discharge lamp 51 can be suppressed by the exhaust section 7 described later, thereby reducing the overall intensity of the infrared radiation 201 incident on the adhesive sheet 103. In this case, if the intensity of the infrared radiation 201 incident on the adhesive sheet 103 does not locally increase, thermal deformation of the adhesive sheet 103 can be suppressed.

[0108] Furthermore, if the inner wall of the reflective portion 4 has irregularities, the infrared rays 201 incident on the inner wall of the reflective portion 4 can be diffusely reflected. Therefore, it is easy to make the reflected infrared rays 201 incident approximately evenly on the entire area of ​​the adhesive sheet 103. If the reflected infrared rays 201 are incident approximately evenly on the adhesive sheet 103, localized thermal deformation of the adhesive sheet 103 can be effectively suppressed.

[0109] The light source 5 faces the semiconductor wafer 102 of the processed object 100 placed on the mounting section 33 through the window 32 of the reflector 4 and the processing section 3. The light source 5 irradiates ultraviolet light into the interior of the chamber 31 through the window 32 provided in the chamber 31. The light source 5 also irradiates ultraviolet light onto the adhesive sheet 103 of the processed object 100 through the window 32.

[0110] The light source unit 5 includes, for example, a discharge lamp 51 and a reflector 52.

[0111] The discharge lamp 51 irradiates ultraviolet light 200. The discharge lamp 51 is disposed inside the reflector 52. There are no particular limitations on the discharge lamp 51 as long as it irradiates ultraviolet light of a wavelength that reduces the bonding strength of the adhesive sheet 103. The discharge lamp 51 can be, for example, a low-pressure mercury lamp. The discharge lamp 51 has a shape that extends in one direction. The luminous length of the discharge lamp 51 can be longer than the planar dimension of the semiconductor wafer 102. For example, if the diameter of the semiconductor wafer 102 is 300 mm, the luminous length of the discharge lamp 51 can be set to approximately 400 mm.

[0112] Reflector 52 surrounds discharge lamp 51 and has an opening on the side facing the workpiece 100. The inner surface of reflector 52 is inclined in a direction away from discharge lamp 51 as the opening side of reflector 52 becomes. Alternatively, the inner surface of reflector 52 may be curved, for example, or it may be parabolic. The inner surface of reflector 52 may be formed of a material with high reflectivity to ultraviolet light 200. For example, reflector 52 may be formed of aluminum alloy, or a film or layer containing aluminum alloy may be provided on the inner surface of reflector 52, or a white film or layer may be provided on the inner surface of reflector 52.

[0113] If reflector 52 is provided, then as follows Figure 2 As shown, ultraviolet rays 200 irradiated from the discharge lamp 51 that are not directed toward the reflector 4 and the processed object 100 can be reflected toward the reflector 4 and the processed object 100. Therefore, the utilization efficiency of ultraviolet rays 200 irradiated from the discharge lamp 51 can be improved.

[0114] Furthermore, while the above example illustrates a discharge lamp 51 that irradiates ultraviolet light 200, light-emitting elements such as light-emitting diodes that irradiate ultraviolet light 200 can also be provided. For example, multiple light-emitting elements can be arranged in one direction or in a matrix. In other words, the light source 5 only needs to be able to irradiate ultraviolet light.

[0115] Here, when the pre-processed item 100 is moved into the chamber 31 or the processed item 100 is moved out of the chamber 31, the opening 31a of the chamber 31 is exposed. Therefore, there is a concern that ultraviolet light 200 may leak to the outside of the frame 2 through the chamber 31 and the conveying section 35. In this case, if the discharge lamp 51 is turned off, the ultraviolet light 200 will not leak to the outside of the frame 2. However, if this is done, the discharge lamp 51 needs to be turned on again when processing the next item 100. If the discharge lamp 51 is turned on again, a certain amount of time is required before the discharge stabilizes, thus increasing the processing time.

[0116] Therefore, a light-shielding part 6 is provided in the ultraviolet irradiation device 1. The light-shielding part 6 switches between transmitting and blocking ultraviolet rays 200 irradiated from the light source part 5 (discharge lamp 51) to the reflector part 4 (processed object 100).

[0117] like Figure 2 As shown, for example, a pair of light-shielding parts 6 may be provided. When viewed from the direction along the central axis (tube axis) of the discharge lamp 51, the pair of light-shielding parts 6 face each other across the light source part 5. The pair of light-shielding parts 6 are provided in positions that are symmetrical to each other with respect to the central axis of the discharge lamp 51.

[0118] The light-shielding part 6 includes, for example, a light-shielding plate 61, an arm 62, a rotating shaft 63, and a drive part 64.

[0119] When viewed from the direction along the central axis of the discharge lamp 51, the light-shielding plate 61 has, for example, a shape that curves outward toward the discharge lamp 51. The outline of the outer surface of the light-shielding plate 61 when viewed from the direction along the central axis of the discharge lamp 51 can, for example, be part of a circle. The light-shielding plate 61 can be formed of a material capable of blocking ultraviolet light 200 irradiated from the light source 5. The light-shielding plate 61 is, for example, formed of a metal such as stainless steel or aluminum alloy.

[0120] When viewed from the direction along the central axis of the discharge lamp 51, the arm 62 has, for example, a shape that curves outward toward the discharge lamp 51. A light-shielding plate 61 is provided on the outer surface of the arm 62. The arm 62 may be formed of a metal such as an aluminum alloy.

[0121] When viewed from the direction along the central axis of the discharge lamp 51, the rotation shaft 63 is located near the end of the arm 62 opposite to the side of the discharge lamp 51. The rotation shaft 63 is cylindrical and extends in the direction along the central axis of the discharge lamp 51.

[0122] The drive unit 64 is connected to the rotating shaft 63. The drive unit 64 causes the light-shielding plate 61 to swing and move via the rotating shaft 63 and the arm 62, thereby switching between the transmission and blocking of ultraviolet light 200 irradiated from the light source unit 5 (discharge lamp 51). The drive unit 64 may include, for example, a control motor such as a servo motor, a cylinder or hydraulic cylinder, a motor and crank mechanism, etc. When the light-shielding plate 61 swings and moves, the front end of the light-shielding plate 61 swings and moves in an arc shape around the rotating shaft 63.

[0123] Furthermore, the light-shielding part 6 is not limited to the example shown. The light-shielding part 6 can simply be used to switch between the transmission and blocking of ultraviolet light 200 from the discharge lamp 51 toward the workpiece 100.

[0124] If a light-shielding part 6 is provided, the discharge lamp 51 can be kept lit when the processed workpiece 100 is removed from the chamber 31 or when the unprocessed workpiece 100 is moved into the chamber 31. Therefore, the processing time when processing multiple workpieces 100 sequentially can be shortened. In addition, even if the discharge lamp 51 is kept lit, ultraviolet rays 200 can be prevented from leaking to the outside of the frame 2 through the chamber 31 and the conveying part 35.

[0125] Furthermore, compared to the discharge lamp 51, the time required for the light-emitting element to achieve stable illumination is shorter. Therefore, when using a light-emitting element instead of the discharge lamp 51, the light-shielding part 6 can be omitted, and the light-emitting element can be switched on / off.

[0126] The exhaust section 7 exhausts gas from the space surrounded by a pair of light-shielding sections 6 (light-shielding plates 61), thereby suppressing the temperature rise of the discharge lamp 51. If the temperature rise of the discharge lamp 51 can be suppressed, the intensity of the infrared radiation 201 irradiated from the discharge lamp 51 can be reduced. Therefore, thermal deformation caused by the temperature rise of the adhesive sheet 103 can be suppressed.

[0127] The exhaust section 7 includes, for example, a pipe 71 and an exhaust pump 72.

[0128] One end of the pipe 71 is connected to a space surrounded by a pair of light-shielding parts 6 (light-shielding plates 61). An exhaust pump 72 is connected to the other end of the pipe 71. The pipe 71 may be, for example, a flexible pipe.

[0129] The exhaust pump 72 exhausts gas from the space surrounded by a pair of light-shielding parts 6 (light-shielding plates 61) via the pipe 71. At this time, the exhaust pump 72 can also exhaust gas from the internal space of the reflector 4. The exhaust pump 72 can be, for example, a blower.

[0130] The controller 8 may include, for example, an arithmetic unit such as a central processing unit (CPU) and a storage unit such as memory. The controller 8 may be, for example, a computer. Based on a control program stored in the storage unit, the controller 8 controls the operation of each component installed in the ultraviolet irradiation device 1. Additionally, the controller 8 may include, for example, a lighting circuit or power supply for the discharge lamp 51.

[0131] Next, the opening and closing part 36 will be explained further.

[0132] Figure 3 This is a schematic cross-sectional view of the opening and closing part 136 used to illustrate the comparative example.

[0133] like Figure 3 As shown, the opening and closing part 136 has a baffle 136a and a moving part 136b.

[0134] Baffle 136a is a plate-shaped body.

[0135] Viewed from the direction of the self-conveying unit 35 toward the opening 31a of the chamber 31, the moving unit 136b moves the baffle 136a between a position where the opening 31a of the chamber 31 is covered by the baffle 136a and a position where the opening 31a of the chamber 31 is exposed from the baffle 136a.

[0136] For example, when the workpiece 100 is irradiated with ultraviolet light 200, the moving part 136b moves the baffle 136a to a position where the opening 31a of the chamber 31 is blocked by the baffle 136a. Therefore, it is possible to suppress the ultraviolet light 200 irradiating into the interior of the chamber 31 from irradiating into the interior of the frame 2, or to maintain the atmosphere of the purging gas, or to suppress the adhesion of particles present inside the frame 2 to the workpiece 100 being processed.

[0137] However, as Figure 3 As shown, when the pre-processed material 100 is moved into the cavity 31 or the processed material 100 is moved out of the cavity 31, the moving part 136b moves the baffle 136a to a position where the opening 31a of the cavity 31 is exposed from the baffle 136a. Figure 3 This refers to the situation where the opening 31a of chamber 31 is exposed through the baffle 136a. For example... Figure 3 As shown, since there is space between the chamber 31 and the conveying section 35 for moving the baffle 136a, there is a concern that during the period from the removal of the processed workpiece 100 to the removal of the next workpiece 100 to be processed, particles 202 present inside the frame 2 may enter the interior of the chamber 31 through the space between the chamber 31 and the conveying section 35 and the opening 31a of the chamber 31.

[0138] In this situation, air present inside the frame 2 also intrudes into the interior of the chamber 31, but the air that has intruded into the chamber 31 can be removed by supplying purge gas into the chamber 31 using the gas supply unit 34. In contrast, particles 202 that have intruded into the chamber 31 cannot be removed even by supplying purge gas into the chamber 31. If particles 202 that have intruded into the chamber 31 adhere to the processed product 100, there is a concern that the quality of the processed product 100 may be reduced.

[0139] Therefore, in the opening and closing part 36 of this embodiment, when the opening 31a of the chamber 31 is exposed, it is difficult for the particle 202 to invade the interior of the chamber 31 through the opening 31a of the chamber 31.

[0140] like Figure 2 As shown, the opening / closing part 36 has, for example, a baffle 36a and a moving part 36b.

[0141] Figure 4 This is a schematic diagram of the baffle 36a as viewed from the direction of the self-conveying unit 35 toward the opening 31a of the chamber 31.

[0142] like Figure 2 and Figure 4As shown, the baffle 36a is plate-shaped and has a hole 36a1 extending through the thickness direction. In this case, since the workpiece 100 is plate-shaped, the planar dimension of the workpiece 100 is larger than its thickness dimension. Therefore, as... Figure 4 As shown, the hole 36a1 has a shape that extends in one direction.

[0143] The baffle 36a is configured to move between the end of the chamber 31 and the end of the conveying section 35 via a gap.

[0144] Viewed from the direction of the self-conveying unit 35 toward the opening 31a of the chamber 31, the moving unit 36b moves the baffle 36a between a position where the opening 31a of the chamber 31 is covered by the baffle 36a and a position where the opening 31a of the chamber 31 overlaps with the hole 36a1 of the baffle 36a. The moving unit 36b may include, for example, a control motor such as a servo motor, a cylinder or hydraulic cylinder, a motor and crank mechanism, etc.

[0145] Alternatively, a direct-acting bearing or similar device may be provided in the opening / closing section 36 to guide the movement of the baffle 36a.

[0146] Figure 5 and Figure 6 It is a schematic cross-sectional view used to illustrate the function of the opening and closing part 36.

[0147] When the treated object 100 is irradiated with ultraviolet light 200, such as Figure 5 As shown, the moving part 36b moves the baffle 36a so that the portion of the baffle 36a without the hole 36a1 faces the opening 31a of the chamber 31. That is, when viewed from the direction from the conveying part 35 toward the opening 31a of the chamber 31, the moving part 36b moves the baffle 36a to a position where the opening 31a of the chamber 31 is blocked by the baffle 36a.

[0148] In this way, ultraviolet rays 200 that irradiate the interior of chamber 31 through window 32 can be prevented from leaking to the outside through opening 31a of chamber 31. Furthermore, the leakage of purge gas supplied to the interior of chamber 31 from opening 31a of chamber 31 can be prevented. Additionally, if the leakage of purge gas from opening 31a of chamber 31 can be prevented, the pressure inside chamber 31 becomes higher than the pressure inside the frame 2. Therefore, the intrusion of particles into the interior of chamber 31 through the gap between the end of chamber 31 with opening 31a and baffle 36a can be prevented.

[0149] When the pre-processed material 100 is moved into the chamber 31, or the processed material 100 is moved out of the chamber 31, such as Figure 6As shown, the moving part 36b moves the baffle 36a so that the hole 36a1 of the baffle 36a faces the opening 31a of the chamber 31. That is, viewed from the direction from the conveying part 35 toward the opening 31a of the chamber 31, the moving part 36b moves the baffle 36a to a position where the hole 36a1 of the baffle 36a overlaps with the opening 31a of the chamber 31.

[0150] If so, the process item 100 can be moved in or out through the hole 36a1 of the baffle 36a and the opening 31a of the chamber 31.

[0151] In this case, such as Figure 6 As shown, when the hole 36a1 of the baffle 36a faces the opening 31a of the chamber 31, the portion around the hole 36a1 of the baffle 36a is located between the end of the chamber 31 with the opening 31a and the end of the conveying unit 35 on the chamber 31 side. That is, the portion of the baffle 36a without the hole 36a1 is always located between the end of the chamber 31 with the opening 31a and the end of the conveying unit 35 on the chamber 31 side.

[0152] Therefore, if the baffle 36a of this embodiment is used, the particles 202 present inside the frame 2 can be prevented from entering the interior of the chamber 31 or the interior of the conveying section 35 through the space between the chamber 31 and the conveying section 35.

[0153] For example, after setting Figure 3 In the case of the baffle 136a in the comparative example described herein, the cleanliness level of the interior of chamber 31 is approximately 1000. In contrast, when the baffle 36a of this embodiment is provided, the cleanliness level of the interior of chamber 31 can reach approximately 10.

[0154] In addition, Figure 5 and Figure 6 The example shown illustrates a case where the moving part 36b is positioned on the side of the window 32 in the direction from the light source 5 toward the window 32 provided in the chamber 31. However, the moving part 36b can also be positioned on the opposite side of the window 32. When the moving part 36b is positioned on the opposite side of the window 32, it is sufficient to move the hole 36a1 of the baffle 36a away from the window 32 so that the hole 36a1 of the baffle 36a faces the opening 31a of the chamber 31, and move the hole 36a1 of the baffle 36a toward the window 32 so that the portion of the baffle 36a without the hole 36a1 faces the opening 31a of the chamber 31.

[0155] Alternatively, the baffle 36a can also move in a direction intersecting the direction from the light source 5 toward the window 32 provided in the chamber 31. Furthermore, while an example of the baffle 36a reciprocating in a linear direction has been shown, it can also be oscillating or rotating in a circumferential direction.

[0156] Among them, such as Figure 4 As shown, due to the shape of the processed object 100, the hole 36a1 of the baffle 36a has a shape that extends in one direction. Therefore, the baffle 36a is preferably moved in a direction that intersects the direction in which the hole 36a1 extends. If so, miniaturization of the baffle 36a can be achieved.

[0157] There are no particular limitations on the material of the baffle 36a, as long as it has a certain degree of rigidity and resistance to ultraviolet 200. The material of the baffle 36a can be, for example, metals such as aluminum alloy, or fluororesin.

[0158] There is no particular limitation on the thickness of the baffle 36a, but it can be set to approximately 3 mm to 6 mm.

[0159] Furthermore, if at least one of the baffle 36a comes into contact with the end of the chamber 31 or the end of the conveying section 35 when the baffle 36a is moved, there is a concern that particles may be generated.

[0160] Therefore, as Figure 5 and Figure 6 As shown, a gap S1 is provided between the baffle 36a and the end of the chamber 31. A gap S2 is provided between the baffle 36a and the end of the conveying section 35. In this case, if the gaps S1 and S2 are too small, the aforementioned contact may easily occur. On the other hand, if the gaps S1 and S2 are too large, there is a concern that the purging gas may easily leak from the inside of the chamber 31, or that particles may easily enter the inside of the chamber 31. Therefore, the gaps S1 and S2 are preferably set to about 0.5 mm to 2 mm.

[0161] The above embodiments of the present invention have been illustrated, but these embodiments are provided as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, modifications, etc., can be made without departing from the spirit of the invention. These embodiments or variations thereof are included within the scope or spirit of the invention, and are included within the scope of the invention as described in the claims and its equivalents. Furthermore, the various embodiments can be implemented in combination with each other.

[0162] The following are notes related to the described embodiments.

[0163] (Note 1)

[0164] An ultraviolet irradiation device, comprising:

[0165] The chamber has an internal space for storing and processing items, and has an opening at one end;

[0166] The light source is capable of irradiating ultraviolet light into the interior of the chamber through a window provided in the chamber;

[0167] A conveying section, cylindrical in shape, with one end facing the opening of the chamber; and

[0168] The baffle, configured to move between the end of the chamber and the end of the conveying section via a gap, is plate-shaped and has a hole extending through the thickness direction.

[0169] When the hole in the baffle faces the opening of the chamber, the surrounding portion of the hole in the baffle is located between the end of the chamber and the end of the conveying part.

[0170] (Note 2)

[0171] According to the ultraviolet irradiation device described in Appendix 1, the hole in the baffle has a shape that extends in one direction.

[0172] The baffle is configured to move in a direction that intersects the direction in which the hole extends.

[0173] (Note 3)

[0174] The ultraviolet irradiation device according to Appendix 1 or 2 further includes a gas supply unit capable of supplying purge gas to the interior of the chamber.

[0175] (Note 4)

[0176] According to any one of Appendices 1 to 3, the ultraviolet irradiation apparatus, wherein the processed object comprises a semiconductor wafer and an adhesive sheet comprising an ultraviolet-curable resin,

[0177] The light source can irradiate the adhesive sheet with ultraviolet light through the window.

Claims

1. An ultraviolet irradiation device, comprising: The chamber has an internal space for storing and processing items, and has an opening at one end; The light source is capable of irradiating ultraviolet light into the interior of the chamber through a window provided in the chamber; The conveying section is cylindrical, with one end facing the opening of the chamber; as well as The baffle, configured to move between the end of the chamber and the end of the conveying section via a gap, is plate-shaped and has a hole extending through the thickness direction. When the hole in the baffle faces the opening of the chamber, the surrounding portion of the hole in the baffle is located between the end of the chamber and the end of the conveying part.

2. The ultraviolet irradiation device according to claim 1, wherein the hole in the baffle has a shape extending in one direction. The baffle is configured to move in a direction that intersects the direction in which the hole extends.

3. The ultraviolet irradiation device according to claim 1 or 2 further includes a gas supply unit capable of supplying purge gas to the interior of the chamber.

4. The ultraviolet irradiation apparatus according to claim 1 or 2, wherein the processed object comprises a semiconductor wafer and an adhesive sheet comprising an ultraviolet-curable resin. The light source can irradiate the adhesive sheet with ultraviolet light through the window.

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