一种晶圆干燥装置及干燥方法
By using lifting, flipping, and supporting mechanisms within the drying chamber, the wafer is flipped and lifted simultaneously, solving the problems of water stain accumulation at the bottom of the wafer and discontinuous operation, thus improving the drying effect and efficiency and ensuring the cleanliness of the wafer surface.
CN122191936BActive Publication Date: 2026-07-17HANGZHOU ZHONGGUI ELECTRONICS TECH CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- HANGZHOU ZHONGGUI ELECTRONICS TECH CO LTD
- Filing Date
- 2026-04-24
- Publication Date
- 2026-07-17
AI Technical Summary
Technical Problem
In existing wafer drying equipment, water stains tend to accumulate on the bottom of the wafer during the ejection process, and the operation is not continuous, which affects the drying effect. The mechanism is complex and the movement speed is slow.
Method used
The system employs lifting, flipping, and supporting mechanisms within the drying chamber. Through the coordination of multi-angle flipping and lifting mechanisms, the wafer is flipped and lifted simultaneously, utilizing the Marangoni effect for drying and reducing liquid accumulation.
Benefits of technology
This technology ensures the continuity and uniformity of the wafer drying process, improves drying efficiency, reduces mechanical impact, extends service life, and guarantees the cleanliness of the wafer surface.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN122191936B_ABST
Abstract
本发明公开了一种晶圆干燥装置及干燥方法，晶圆干燥装置包括干燥箱体；抬升机构；翻转机构，包括滑轨和翻转臂，其至少具有第一、第二、第三翻转角度，第三翻转角度用于将晶圆转动切换至水平状态；支撑机构，滑动设于滑轨上，在晶圆作用下可沿滑轨移动，具有支撑面；提升机构，位于清洁溶液液面以上，用于倾斜承托并向上提升晶圆，设有可与晶圆相抵的承托面；喷淋机构；在第一翻转角度下，抬升机构的运动轨迹与滑轨的延伸方向平行；自第一翻转角度切换至第二翻转角度，晶圆倾斜地抵接于支撑面和承托面，晶圆在提升机构和支撑机构的共同作用下持续上升，至晶圆整体脱离液面。本发明晶圆干燥过程中实现了边翻转边提升的功能，达到了最佳的干燥效果。
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